Temperature vibration sensor

Abstract

The utility model is suitable for the technical field of batteries, and provides a temperature vibration sensor, which comprises an equipment main body, a mounting part and a temperature probe, the equipment main body is used for receiving and sending temperature signals and vibration signals; the equipment main body is arranged at one end of the mounting part, the other end of the mounting part is arranged on a functional component needing to be monitored so as to transmit vibration to the equipment main body, the mounting part is a heat dissipation piece, and the mounting part is provided with a through hole and / or a groove so as to increase the heat dissipation area; the temperature probe is electrically connected to the device body and used for detecting the temperature of the functional component. The risk that the temperature vibration sensor is damaged due to high temperature is reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of sensor devices, and in particular relates to a temperature vibration sensor. Background Art

[0002] A temperature and vibration sensor is a device that can monitor temperature and vibration at the same time. Generally, temperature and vibration sensors are used in some functional components that require temperature and vibration monitoring, such as steam pipes. Generally, steam pipes require both temperature and vibration monitoring. When performing vibration monitoring, direct contact between the temperature and vibration sensor and the steam pipe is required. The part of the temperature and vibration sensor that contacts the steam pipe is generally made of metal material, because metal materials are cheap and low in cost, and have high structural strength, stability and good vibration conductivity. However, due to the high temperature of the steam pipe, the risk of the sensor being damaged by the high temperature caused by heat transfer is also increased. Utility Model Content

[0003] In view of the above problems, the present application provides a temperature vibration sensor, aiming to reduce the risk of the temperature vibration sensor being damaged due to high temperature.

[0004] To solve the above problems, the present application provides a temperature vibration sensor, which is characterized by comprising:

[0005] The device body is used to receive and send temperature signals and vibration signals;

[0006] A mounting portion, the device body is disposed at one end of the mounting portion, and the other end of the mounting portion is disposed on a functional component to be monitored to transmit vibration to the device body. The mounting portion is a heat sink, and is provided with through holes and / or grooves to increase the heat dissipation area; and

[0007] A temperature probe is electrically connected to the device body and is used to detect the temperature of the functional component. The mounting portion is a heat sink. To increase the heat dissipation area, through holes and / or grooves are provided on the mounting portion. This increases the surface area of the mounting portion and the heat dissipation area, significantly reducing the heat transferred from the functional component to the device body and reducing the risk of damage to the device body.

[0008] In some embodiments, the mounting portion is an elongated rod-shaped structure. The mounting portion has a certain length, which increases the distance between the device body and the functional components, making the distance between the two relatively far, making it difficult for heat to be transferred to the device body, further improving the heat dissipation effect.

[0009] In some embodiments, the mounting portion is made of metal, which has a certain strength, can increase the reliability of the connection, and has excellent stability.

[0010] In some embodiments, the mounting portion includes a first portion and a second portion coaxially connected in a longitudinal direction, wherein the length of the first portion is greater than the length of the second portion, the density of the second portion is greater than the density of the first portion, the end of the first portion remote from the second portion is connected to the device body, and the end of the second portion remote from the first portion contacts the functional component. The first and second portions are structurally simple and convenient to set up. The longer length of the first portion increases the distance of heat conduction and reduces heat conduction efficiency. The second portion, which has a larger seal, is closer to the functional component, thereby improving stability after installation and better transmitting vibration.

[0011] In some embodiments, the first portion is a hollow shell-like structure, and the second portion is a solid structure. The hollow shell-like structure of the first portion reduces its thermal conductivity, reducing heat transfer from the functional components to the device body. The solid structure of the second portion facilitates vibration transmission, reduces jitter during vibration transmission, and improves the accuracy of vibration monitoring.

[0012] In some embodiments, a plurality of first through holes are formed on the first portion, and the first through holes are elongated holes formed along the length of the first portion, thereby improving heat dissipation.

[0013] In some embodiments, the second portion is provided with a second through hole and the groove, wherein the second through hole is provided in a direction perpendicular to the length direction of the second portion, and the groove is provided on the surface of the second portion and extends circumferentially, thereby further enhancing the heat dissipation effect.

[0014] In some embodiments, the second portion has a truncated cone-shaped structure on the side facing the functional component, with the smaller end surface of the truncated cone-shaped structure being used to contact the functional component. Contact with the functional component via the smaller end surface reduces the contact area, lowers heat transfer efficiency, and reduces the risk of high-temperature damage to the device body.

[0015] In some embodiments, the area of the end face connecting the second portion and the first portion is larger than the area of the end face connecting the first portion and the second portion. The temperature-vibration sensor further includes an auxiliary plate and a binding strap. The auxiliary plate has a perforation, and the auxiliary plate is mounted on the first portion through the perforation and contacts the second portion. The binding strap is configured to simultaneously pass through the auxiliary plate and the functional component to maintain contact between the smaller end face and the functional component. This provides a stable and secure mounting structure for the mounting portion and the functional component, reducing the contact area for heat conduction while not hindering vibration conduction.

[0016] In some embodiments, a receiving notch is provided at the edge of the auxiliary plate, and the strap is confined within the receiving notch, thereby limiting the movement of the strap on the auxiliary plate, preventing it from being misplaced, and effectively ensuring the stability of the installation.

[0017] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the embodiments below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present application. The same reference numerals are used throughout the accompanying drawings to represent the same components.

[0019] In the attached figure:

[0020] Figure 1 This is a schematic structural diagram of a temperature vibration sensor according to some embodiments of the present application;

[0021] Figure 2 for Figure 1 A side structural diagram of

[0022] Figure 3 for Figure 1 Schematic diagram of the structure after removing the auxiliary plate;

[0023] Figure 4 for Figure 3 A side structural diagram of

[0024] Figure 5 for Figure 1 Schematic diagram of the structure of the auxiliary board;

[0025] Figure 6 for Figure 5 Schematic diagram of the top view of the auxiliary plate;

[0026] Figure 7 for Figure 1 Schematic diagram of the structure of the medium temperature vibration sensor in use.

[0027] The accompanying drawings in the specific implementation manner are as follows:

[0028] 10. Equipment body;

[0029] 20. Mounting portion; 201. First portion; 202. First through hole; 203. Second portion; 204. Second through hole; 205. Groove; 206. Smaller end surface;

[0030] 30. Temperature probe;

[0031] 40. Auxiliary plate; 401. Perforation; 402. Accommodation notch;

[0032] 50. Straps;

[0033] 60. Functional components. DETAILED DESCRIPTION

[0034] The following embodiments of the technical solution of the present application will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application and are therefore only examples and are not intended to limit the scope of protection of the present application.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0036] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0037] References to "embodiments" herein mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0038] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0039] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0040] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0041] In the description of the embodiments of the present application, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components or interactions between two components. Those skilled in the art can understand the specific meanings of the above terms in the embodiments of the present application based on specific circumstances.

[0042] In industrial production, automated monitoring equipment is becoming increasingly popular to ensure product quality and process parameter accuracy. Temperature and vibration sensors are playing an increasingly important role as a monitoring device. They can monitor the temperature and vibration of equipment in real time, ensuring smooth production.

[0043] In some cases, temperature and vibration sensors are required to monitor temperature and vibration simultaneously. When performing vibration monitoring, the temperature and vibration sensor needs to have a certain contact with the device under test to accurately monitor the vibration. However, the temperature of the device may be high at this time, and heat is continuously transferred to the temperature and vibration sensor during the monitoring process, which causes the temperature of the temperature and vibration sensor itself to rise, increasing the risk of damage to the temperature and vibration sensor.

[0044] For example, monitoring steam pipelines requires both temperature and vibration monitoring. Typically, steam pipelines have a built-in anomaly alarm system. When an anomaly is detected, a pendulum hammer strikes the pipe at a certain frequency. This triggers a vibration signal from a temperature and vibration sensor and transmits it to the platform. Therefore, when monitoring steam pipelines, temperature and vibration sensors must monitor both temperature and vibration. Because steam pipelines are hot, there's a risk that the high temperature could damage the temperature and vibration sensors.

[0045] In view of this, please see Figures 1-4 as well as Figure 7The present application provides a temperature vibration sensor, including a device body 10, a mounting portion 20, and a temperature probe 30.

[0046] The device body 10 is used to receive and transmit temperature and vibration signals. The device body 10 is mounted on one end of a mounting portion 20. The other end of the mounting portion 20 is mounted on a functional component 60 to be monitored to transmit vibrations to the device body 10. The mounting portion 20 is a heat sink and has through-holes and / or grooves 205 to increase the heat dissipation area.

[0047] The temperature probe 30 is electrically connected to the device body 10 and is used to detect the temperature of the functional component 60 .

[0048] Specifically, the device body 10 can receive temperature signals and vibration signals, has a processing chip inside, and can transmit the signals to the terminal display platform, which can be wireless or wired transmission.

[0049] Among them, the temperature signal comes from the temperature probe 30, which is electrically connected to the device body 10. When in use, the temperature probe 30 needs to contact the functional component 60 and transmit the temperature signal to the device body 10. The functional component 60 can be a steam pipe, etc.

[0050] The vibration signal is transmitted by contact between the mounting portion 20 and the functional component 60. A vibration sensor can be installed in the main device to receive the vibration signal. Since the mounting portion 20 is installed on the functional component 60, the heat of the functional component 60 will be transferred to the device body 10 through the mounting portion 20, which may damage the device body 10 due to the high temperature. Therefore, in this case, the mounting portion 20 is configured as a heat sink in this embodiment. The mounting portion 20 is provided with through holes and / or grooves 205 to increase the heat dissipation area.

[0051] The effect of this embodiment is that the mounting portion 20 is a heat sink. In order to increase the heat dissipation area, through holes and / or grooves 205 are opened on the mounting portion 20, which increases the surface area of the mounting portion 20 and the heat dissipation area, greatly reducing the heat transferred from the functional component 60 to the device body 10 and reducing the risk of damage to the device body 10.

[0052] In some embodiments, see Figure 3 and Figure 4 The mounting portion 20 is a long rod-shaped structure. Specifically, the mounting portion 20 has a certain length, which increases the distance between the device body 10 and the functional component 60, making the distance between the two relatively far, making it difficult for heat to be transferred to the device body 10, further increasing the heat dissipation effect.

[0053] In some embodiments, the mounting portion 20 is made of metal.

[0054] Specifically, the metal can be copper, steel, etc. The mounting portion 20 is made of metal, which has a certain strength, can increase the reliability of the connection, and has excellent stability.

[0055] In some embodiments, please refer to Figure 3 and Figure 4 The mounting portion 20 includes a first part 201 and a second part 203 coaxially connected in the length direction, the length of the first part 201 is greater than the length of the second part 203, the density of the second part 203 is greater than the density of the first part 201, the end of the first part 201 is connected to the device body 10, and the end of the second part 203 contacts the functional component 60.

[0056] Specifically, the mounting portion 20 includes a first part 201 and a second part 203. The mounting portion 20 has a certain length and includes the first part 201 and the second part 203 in the length direction. Both can be columnar structures, wherein the length of the first part 201 is greater than the length of the second part 203, and the density of the second part 203 is greater than the density of the first part 201. The first part 201 is closer to the device body 10, and the end of the first part 201 that is not connected to the second part 203 is used to connect the device body 10, while the second part 203 is closer to the functional component 60. The second part 203 can be installed on the functional component 60 and contact the functional component 60. The first part 201 and the second part 203 are coaxially arranged, and the axial direction of the two is the length direction of the two.

[0057] The effect of this embodiment is that the structural arrangement of the first part 201 and the second part 203 is simple and convenient, the length of the first part 201 is relatively large, which can increase the distance of heat conduction and reduce the heat conduction efficiency, and the second part 203 with a larger seal is closer to the functional component 60, so that the stability after installation is better and the vibration is better transmitted.

[0058] In some embodiments, the first portion 201 is a hollow shell structure, and the second portion 203 is a solid structure.

[0059] Specifically, the first portion 201 can be rod-shaped, with a hollow shell-like structure, specifically a hollow rod-shaped structure. This reduces the thermal conductivity of the first portion 201, reducing the conduction of heat from the functional component 60 to the device body 10. The hollow structure also increases the heat dissipation area, resulting in a better heat dissipation effect. The second portion 203 is closer to the functional component 60 and can be mounted on and in contact with the functional component 60. To increase stability, the second portion 203 adopts a solid structure, which is more effective. The solid structure also facilitates the conduction of vibration, reduces jitter during the vibration conduction process, and improves the accuracy of vibration monitoring.

[0060] In some embodiments, see Figure 3 and Figure 4 A plurality of first through holes 202 are provided on the first portion 201 , and the first through holes 202 are long strip holes provided along the length direction of the first portion 201 .

[0061] Specifically, to enhance heat dissipation, this embodiment provides a plurality of first through-holes 202 on the first portion 201. When the first portion 201 is hollow, the first through-holes 202 are formed on the surface of the first portion 201, connecting the interior and exterior of the first portion 201. This interconnected structure further enhances heat dissipation. Furthermore, the first through-holes 202 extend along the length of the first portion 201, extending the length of the first through-holes 202 and enhancing the heat dissipation effect of the first portion 201 along the length.

[0062] A plurality of first through holes 202 can also be provided. The plurality of first through holes 202 can be arranged in sequence along the length direction of the first part 201, or can also be arranged in sequence along the circumference of the first part 201. In this way, the first through holes 202 are provided in multiple locations of the first part 201, thereby improving the heat dissipation effect.

[0063] In some embodiments, see Figure 3 and Figure 4 The second portion 203 is provided with a second through hole 204 and a groove 205 . The second through hole 204 is opened in a direction perpendicular to the length direction of the second portion 203 . The groove 205 is opened on the surface of the second portion 203 and extends circumferentially.

[0064] Specifically, to enhance the heat dissipation effect, this embodiment provides that a through hole, specifically a second through hole 204, is also provided in the second portion 203, and a groove 205 is also provided. When the second portion 203 is a solid structure, the second through hole 204 is a hole that passes through the second portion 203. However, a plurality of second through holes 204 can also be provided, and the plurality of second through holes 204 can intersect, that is, interconnected, thereby further enhancing the heat dissipation effect. In addition, to increase the heat dissipation surface of the second portion 203, this embodiment also provides a groove 205 on the surface of the second portion 203, that is, a groove-shaped groove structure is opened on the surface of the second portion 203, and the inner wall of the groove is completely exposed, greatly increasing the heat dissipation area.

[0065] In this embodiment, the second through hole 204 is formed perpendicular to the length of the second portion 203. Since the temperature and vibration sensor is generally located above the functional component 60 and the length is generally vertical, the direction of the second through hole 204 is horizontal. The groove 205 is formed along the surface of the second portion 203 and extends circumferentially, specifically around the circumference of the second portion 203. The number of grooves 205 can also be multiple, i.e., multiple circles of grooves 205 are arranged along the axial direction of the second portion 203.

[0066] The effect of this embodiment is that the opening of the second through hole 204 and the groove 205 greatly increases the surface area of the second part 203, enhances the heat dissipation effect, greatly reduces the heat transferred to the device body 10, and reduces the risk of damage to the device body 10.

[0067] In some embodiments, see Figure 3 and Figure 4 The second portion 203 has a truncated cone-shaped structure on the side facing the functional component 60 , and the smaller end surface 206 of the truncated cone-shaped structure is used to contact the functional component 60 .

[0068] Specifically, the side of the second part 203 facing the functional component 60, that is, the side away from the first part 201, is in a frustum shape, wherein the smaller end face 206 of the frustum structure is the end face of the second part 203 away from the first part 201, and the functional component 60 is contacted through the smaller end face 206.

[0069] Specifically, the truncated cone-shaped structure includes a larger end face, referred to as the larger end face, and a smaller end face 206, referred to as the smaller end face 206. The terms "larger" and "smaller" refer to a comparison between the two. In some cases, the larger end face may be referred to as the first end face, and the smaller end face 206 may be referred to as the second end face. The area of the first end face is greater than the area of the second end face. The second portion 203 may include a cylindrical segment and a truncated cone segment. The end face area of the cylindrical segment is equal to the larger end face area of the truncated cone segment, and the two are joined together to form an integrated structure. The first portion 201 may also be cylindrical, with its cross-sectional area also being smaller than the end face area of the cylindrical segment.

[0070] The effect of this embodiment is that the smaller end surface 206 contacts the functional component 60 , which reduces the contact area, reduces the heat conduction efficiency, and reduces the risk of high-temperature damage to the device body 10 .

[0071] In one embodiment, see Figure 1 、 Figure 2 as well as Figure 5-Figure 7The end surface area where the second part 203 is connected to the first part 201 is larger than the end surface area where the first part 201 is connected to the second part 203. The temperature vibration sensor also includes an auxiliary plate 40 and a strap 50. A through-hole 401 is provided on the auxiliary plate 40. The auxiliary plate 40 is sleeved on the first part 201 through the through-hole 401 and contacts the second part 203. The strap 50 is used to bypass the auxiliary plate 40 and the functional component 60 at the same time so that the smaller end surface 206 remains in contact with the functional component 60.

[0072] Specifically, the first part 201 and the second part 203 can both be columnar, and the end face area where the second part 203 connects to the first part 201 is larger than the end face area where the first part 201 connects to the second part 203, so that a step is formed at the connection between the two, that is, the second part 203 is larger than the protrusion of the first part 201.

[0073] The auxiliary plate 40 is used to assist the second portion 203 in being installed on the functional component 60. The auxiliary plate 40 may be a rectangular plate structure with a through-hole 401 provided at its center. The inner diameter of the through-hole 401 may be the same as the outer diameter of the first portion 201. The auxiliary plate 40 is sleeved on the first portion 201 through the through-hole 401 and contacts the second portion 203, that is, contacts the protrusion of the second portion 203 that is larger than the first portion 201. During installation, the smaller end face 206 of the second portion 203 may be pre-contacted with the functional component 60. Then, a binding strap 50 is passed around both the auxiliary plate 40 and the functional component 60 to tighten the two, thereby keeping the smaller end face 206 in contact with the functional component 60, thereby achieving installation and positioning of the mounting portion 20 on the functional component 60. Specifically, two binding straps 50 may be used, and the two binding straps 50 are symmetrically bound at symmetrical positions on both sides of the auxiliary plate 40.

[0074] This embodiment provides a mounting form for the mounting portion 20 and the functional component 60 . The mounting structure is stable and reliable, which reduces the contact area of heat conduction and does not hinder the conduction of vibration.

[0075] In some embodiments, see Figure 5 and Figure 6 An accommodating notch 402 is provided at the edge of the auxiliary plate 40 , and the binding strap 50 is limited in the accommodating notch 402 .

[0076] Specifically, an accommodating notch 402 is provided at the edge of the auxiliary plate 40. When the strap 50 passes around the auxiliary plate 40, it passes through the accommodating notch 402 and is limited within the accommodating notch 402. This limits the movement of the strap 50 on the auxiliary plate 40, prevents it from being misplaced, and effectively ensures the stability of the installation.

[0077] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some or all of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A temperature vibration sensor, characterized in that: include: The device body is used to receive and send temperature signals and vibration signals; A mounting portion, the device body is disposed at one end of the mounting portion, and the other end of the mounting portion is disposed on a functional component to be monitored to transmit vibration to the device body. The mounting portion is a heat sink, and is provided with through holes and / or grooves to increase the heat dissipation area; and A temperature probe is electrically connected to the device body and is used to detect the temperature of the functional component.

2. The temperature vibration sensor according to claim 1, wherein: The mounting portion is a long rod-shaped structure.

3. The temperature vibration sensor according to claim 1, wherein: The mounting portion is made of metal.

4. The temperature vibration sensor according to any one of claims 1 to 3, characterized in that: The mounting portion includes a first part and a second part coaxially connected in the length direction, the length of the first part is greater than the length of the second part, the density of the second part is greater than the density of the first part, the end of the first part away from the second part is connected to the device body, and the end of the second part away from the first part contacts the functional component.

5. The temperature vibration sensor according to claim 4, wherein: The first part is a hollow shell structure, and the second part is a solid structure.

6. The temperature vibration sensor according to claim 4, wherein: A plurality of first through holes are provided on the first portion, and the first through holes are long strip holes provided along the length direction of the first portion.

7. The temperature vibration sensor according to claim 4, wherein: The second portion is provided with a second through hole and the groove. The second through hole is opened in a direction perpendicular to the length direction of the second portion. The groove is opened on the surface of the second portion and extends along the circumferential direction.

8. The temperature vibration sensor according to claim 4, wherein: The side of the second portion facing the functional component is in a truncated cone-shaped structure, and the smaller end surface of the truncated cone-shaped structure is used to contact the functional component.

9. The temperature vibration sensor according to claim 8, wherein: The end face area where the second part is connected to the first part is larger than the end face area where the first part is connected to the second part. The temperature vibration sensor also includes an auxiliary plate and a strap. A through-hole is provided on the auxiliary plate. The auxiliary plate is sleeved on the first part through the through-hole and contacts the second part. The strap is used to simultaneously bypass the auxiliary plate and the functional component so that the smaller end face remains in contact with the functional component.

10. The temperature vibration sensor according to claim 9, wherein: An accommodating notch is provided at the edge of the auxiliary plate, and the binding strap is limited to be located in the accommodating notch.

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