Dotting machine for semiconductor chip test probe production

Abstract

The utility model discloses a dotting machine for semiconductor chip test probe production. The dotting machine comprises a box body, supporting legs are installed at the bottom end of the box body, a workbench is installed at the top end of the box body, a moving mechanism is installed in the workbench, a hydraulic rod is installed in a top plate, and a dust collection mechanism is installed at the bottom end of an installation frame. The moving groove is formed in the moving plate, the limiting plate can slide along the moving groove, the threaded rod can be driven to rotate by screwing the screwing block, the threaded rod rotates to drive the limiting plate in threaded connection with the threaded rod to move, and threads on the threaded rod are symmetrically distributed, so that the limiting plate can be driven to move conveniently. The threaded rod rotates to drive the limiting plate to move in the opposite direction, the positioning plate can position the two ends of the semiconductor chip, then the semiconductor chip can be limited and fixed through the limiting plate, and therefore the purpose that the dotting machine for semiconductor chip test probe production can conveniently limit the semiconductor chip is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip processing, in particular to a dotting machine for producing semiconductor chip test probes. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between that of conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Semiconductor chips are made by etching and wiring on semiconductor sheets to form semiconductor devices that can realize certain functions. When processing and testing semiconductor chips, a dotting machine for the production of semiconductor chip test probes is required. A dotting machine is a special equipment for marking metal materials. It is mainly used for room temperature tensile testing of metal materials. It is used to mark round steel, flat steel, steel pipes, steel sections and other non-ferrous metal materials for tensile testing.

[0003] To this end, the patent specification with publication number CN212845776U discloses an automatic test and dotting machine, which belongs to the technical field of electrical testing machines. The utility model includes a box, a robotic arm, a clamping jaw assembly, an electrical testing probe, and a dotting box, wherein the robotic arm is installed above the box, the clamping jaw assembly is connected to the bottom of the robotic arm, the electrical testing probe is provided on the left side of the robotic arm, and the dotting box is provided on the right side of the robotic arm. The clamping jaw assembly includes a movable splint, a guide groove, and an annular groove roller, wherein the movable splint is distributed on the four corners of the clamping jaw assembly, a guide groove is provided between the movable splint and the clamping jaw assembly, the movable splint is connected to the clamping jaw assembly through the guide groove, and the slide groove roller is installed inside the movable splint. The utility model can position the workpiece while clamping it through the clamping jaw assembly, and the robotic arm can complete the detection and dotting actions in an extremely short material transportation route, which not only simplifies the structural complexity of the device, but also saves space and improves production efficiency.

[0004] Today's semiconductor chip test probe production dotting machines can basically meet people's needs, but there are still some problems. The specific problems are as follows:

[0005] 1. The dotting machine used in the production of semiconductor chip test probes has difficulty in limiting the position of semiconductor chips. During processing, semiconductor chips are prone to deviation, resulting in errors in the dotting position.

[0006] 2. It is difficult to adjust the dotting position of the dotting machine used in the production of semiconductor chip test probes. When the semiconductor chip is dotting, it is difficult to adjust the dotting position, and the device is not convenient to use. Utility Model Content

[0007] The utility model aims to provide a dotting machine for producing semiconductor chip test probes, so as to solve the defects of existing dotting machines for producing semiconductor chip test probes, that is, it is difficult to limit the semiconductor chip and adjust the dotting position.

[0008] In order to solve the above technical problems, the present utility model provides the following technical solutions: a dotting machine for producing semiconductor chip test probes, comprising a box;

[0009] The bottom end of the box is equipped with supporting legs, the top end of the box is equipped with a workbench, and the interior of the workbench is equipped with a moving mechanism;

[0010] A movable plate is installed on the top of the workbench, a limiting structure is installed on the top of the movable plate, a mounting frame is installed on one end of the top of the workbench, and a top plate is installed on the top of the mounting frame;

[0011] A hydraulic cylinder is installed on the top of the top plate, a needle is installed on the bottom of the hydraulic cylinder, a hydraulic rod is installed inside the top plate, and a dust suction mechanism is installed on the bottom of the mounting frame.

[0012] During use, before processing the semiconductor chip, the fan inside the bellows can work to suck the dust on the semiconductor chip through the inlet into the bellows to prevent the dust on the semiconductor chip from affecting the dotting. The filter can prevent dust from entering the fan and the dust can be discharged through the outlet. After the semiconductor chip moves to the bottom of the needle, the hydraulic cylinder can work to drive the needle to rise and fall, and the lifting of the needle can perform dotting processing on the semiconductor chip.

[0013] Furthermore, the moving mechanism includes a latch, a moving block, a servo motor and a chain. The chain is arranged inside the workbench, a servo motor is installed at one end of the chain, and a latch is arranged on the outside of the chain. The servo motor can drive the chain to rotate when it is working, and the movement of the chain will drive the latch to move. The latch and the moving block are engaged with each other, and the movement of the latch will drive the moving block to move. The movement of the moving block can adjust the movement of the top moving plate, and the movement of the moving plate can adjust the position of the top semiconductor chip. In this way, the servo motor and the hydraulic rod can cooperate to adjust the position of the dot.

[0014] Furthermore, a moving block is provided at the top end of the latching tooth, and the moving block and the latching tooth are engaged with each other, and the movement of the latching tooth drives the moving block to move.

[0015] Furthermore, the limiting structure includes a movable groove, a limiting plate, a twisting block, a positioning plate and a threaded rod. The positioning plate is installed at the top of the movable plate, the movable groove is arranged at the top of the movable plate, the internal movably connected to the movable groove is provided with a threaded rod, twisting blocks are installed on both sides of the threaded rod, and the top of the threaded rod is movably connected to the limiting plate. Twisting the twisting block can drive the threaded rod to rotate, and the rotation of the threaded rod will drive the limiting plate threadedly connected to it to move. The threads on the threaded rod are symmetrically distributed, and the rotation of the threaded rod will drive the limiting plate to move in opposite directions. The positioning plate can position the two ends of the semiconductor chip, and then the semiconductor chip can be limited and fixed by the limiting plate.

[0016] Furthermore, external threads are evenly provided on the outer side wall of the threaded rod, and internal threads that cooperate with the external threads are evenly provided on the inner side wall of the limiting plate. The threaded rod and the limiting plate are threadedly connected, and the threaded rod can be driven to rotate by twisting the twist block.

[0017] Furthermore, a slider is provided at the bottom end of the limiting plate, a sliding groove is provided inside the movable groove, and the limiting plate and the movable groove constitute a sliding structure, and the limiting plate can slide along the movable groove.

[0018] Furthermore, the dust suction mechanism includes a bellows, a fan, a filter, an outlet and an inlet. The bellows is installed at the bottom end of the mounting frame. An inlet is provided on one side of the bellows. An outlet is installed at the bottom end of the bellows. A bellows is installed on one side inside the bellows. A filter is installed on one side of the bellows. The fan inside the bellows can suck dust on the semiconductor chip into the bellows through the inlet to prevent dust on the semiconductor chip from affecting the dot.

[0019] The semiconductor chip test probe production marking machine provided by the present invention has the following advantages: by arranging a movable groove inside the movable plate, the limit plate can slide along the movable groove, and the threaded rod can be driven to rotate by twisting the twisting block. The rotation of the threaded rod will drive the limit plate threadedly connected with it to move. The threads on the threaded rod are symmetrically distributed, and the rotation of the threaded rod will drive the limit plate to move in opposite directions. The positioning plate can position the two ends of the semiconductor chip, and then the semiconductor chip can be limited and fixed by the limit plate, so as to achieve the purpose of facilitating the limitation of semiconductor chips by the semiconductor chip test probe production marking machine.

[0020] By installing a hydraulic rod inside the top plate, the movement of the hydraulic rod can drive the hydraulic cylinder to move, and the movement of the hydraulic cylinder can adjust the front and rear position of the needle. The operation of the servo motor can drive the chain to rotate, and the movement of the chain will drive the movement of the card teeth. The card teeth and the moving block are engaged with each other, and the movement of the card teeth will drive the moving block to move. The movement of the moving block can adjust the movement of the top moving plate, and the movement of the moving plate will adjust the position of the top semiconductor chip. In this way, the servo motor and the hydraulic rod can cooperate to adjust the dotting position, so as to achieve the purpose of facilitating the adjustment of the dotting position of the dotting machine used in the production of semiconductor chip test probes. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0022] Figure 2 This is a schematic diagram of the front cross-sectional structure of the present utility model;

[0023] Figure 3 It is a side cross-sectional structural schematic diagram of the utility model;

[0024] Figure 4 This is a side structural diagram of the dust collection mechanism of the present invention;

[0025] Figure 5 This is a schematic diagram of a partial cross-sectional structure of the moving mechanism of the present utility model.

[0026] Explanation of the reference numerals in the figure: 1. workbench; 2. moving mechanism; 201. latching gear; 202. moving block; 203. servo motor; 204. chain; 3. box; 4. support leg; 5. limiting structure; 501. moving groove; 502. limiting plate; 503. screw block; 504. positioning plate; 505. threaded rod; 6. moving plate; 7. dust suction mechanism; 701. bellows; 702. fan; 703. filter; 704. outlet; 705. inlet; 8. mounting frame; 9. hydraulic cylinder; 10. top plate; 11. needle; 12. hydraulic rod. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] See also Figure 1-Figure 5 The present invention provides an embodiment of a dotting machine for producing semiconductor chip test probes, comprising a box 3 .

[0029] A support leg 4 is installed at the bottom end of the box body 3, a workbench 1 is installed at the top end of the box body 3, a moving mechanism 2 is installed inside the workbench 1, the moving mechanism 2 includes a latch 201, a moving block 202, a servo motor 203 and a chain 204, the chain 204 is arranged inside the workbench 1, a servo motor 203 is installed at one end of the chain 204, a latch 201 is provided on the outside of the chain 204, a moving block 202 is provided at the top end of the latch 201, and the moving block 202 and the latch 201 are engaged with each other.

[0030] Refer to the attached Figure 2 and attached Figure 5 As shown, the movement of the hydraulic rod 12 can drive the hydraulic cylinder 9 to move, and the movement of the hydraulic cylinder 9 can adjust the front and rear position of the needle 11. The operation of the servo motor 203 can drive the chain 204 to rotate. The movement of the chain 204 will drive the tooth 201 to move. The tooth 201 and the moving block 202 are engaged with each other. The movement of the tooth 201 will drive the moving block 202 to move. The movement of the moving block 202 can adjust the movement of the top moving plate 6. The movement of the moving plate 6 will adjust the position of the top semiconductor chip. In this way, the servo motor 203 and the hydraulic rod 12 can cooperate to adjust the position of the dotting.

[0031] A movable plate 6 is installed at the top of the workbench 1, and a limiting structure 5 is installed at the top of the movable plate 6. The limiting structure 5 includes a movable groove 501, a limiting plate 502, a screw block 503, a positioning plate 504 and a threaded rod 505. The positioning plate 504 is installed at the top of the movable plate 6. The movable groove 501 is arranged at the top of the movable plate 6. The internal movability of the movable groove 501 is connected with a threaded rod 505. The outer side wall of the threaded rod 505 is evenly provided with external threads, and the inner side wall of the limiting plate 502 is evenly provided with internal threads that cooperate with the external threads. The threaded rod 505 and the limiting plate 502 are threadedly connected.

[0032] Twist blocks 503 are installed on both sides of the threaded rod 505. The top of the threaded rod 505 is movably connected to the limit plate 502. The bottom end of the limit plate 502 is provided with a slider. The inside of the movable groove 501 is provided with a sliding groove. The limit plate 502 and the movable groove 501 constitute a sliding structure.

[0033] Refer to the attached Figure 1-3 As shown, the limit plate 502 can slide along the movable groove 501, and twisting the screw block 503 can drive the threaded rod 505 to rotate. The rotation of the threaded rod 505 will drive the limit plate 502 with which it is threadedly connected to move. The threads on the threaded rod 505 are symmetrically distributed. The rotation of the threaded rod 505 will drive the limit plate 502 to move in the opposite direction. The positioning plate 504 can position the two ends of the semiconductor chip, and then the semiconductor chip can be limited and fixed by the limit plate 502.

[0034] A mounting frame 8 is installed at one end of the top of the workbench 1 , and a top plate 10 is installed at the top of the mounting frame 8 .

[0035] A hydraulic cylinder 9 is installed at the top of the top plate 10, a needle 11 is installed at the bottom end of the hydraulic cylinder 9, a hydraulic rod 12 is installed inside the top plate 10, and a dust suction mechanism 7 is installed at the bottom end of the mounting frame 8. The dust suction mechanism 7 includes a bellows 701, a fan 702, a filter 703, an outlet 704 and an inlet 705. The bellows 701 is installed at the bottom end of the mounting frame 8, an inlet 705 is provided on one side of the bellows 701, an outlet 704 is installed at the bottom end of the bellows 701, a bellows 701 is installed on one side inside the bellows 701, and a filter 703 is installed on one side of the bellows 701.

[0036] Refer to the attached Figure 1-4 As shown, before the semiconductor chip is processed, the fan 702 inside the bellows 701 can suck the dust on the semiconductor chip into the bellows 701 through the inlet 705 to prevent the dust on the semiconductor chip from affecting the dotting. The filter 703 can prevent the dust from entering the fan 702, and the dust can be discharged through the outlet 704. After the semiconductor chip moves to the bottom end of the needle 11, the hydraulic cylinder 9 can drive the needle 11 to rise and fall, and the lifting of the needle 11 can perform dotting processing on the semiconductor chip.

[0037] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A dotting machine for producing semiconductor chip test probes, comprising a housing (3); Its characteristics are: The bottom end of the box (3) is equipped with a support leg (4), the top end of the box (3) is equipped with a workbench (1), and the interior of the workbench (1) is equipped with a moving mechanism (2); A movable plate (6) is installed at the top of the workbench (1), a limiting structure (5) is installed at the top of the movable plate (6), a mounting frame (8) is installed at one end of the top of the workbench (1), and a top plate (10) is installed at the top of the mounting frame (8); A hydraulic cylinder (9) is installed at the top end of the top plate (10), a needle (11) is installed at the bottom end of the hydraulic cylinder (9), a hydraulic rod (12) is installed inside the top plate (10), and a dust collection mechanism (7) is installed at the bottom end of the mounting frame (8).

2. The semiconductor chip test probe production marking machine according to claim 1, characterized in that: The moving mechanism (2) comprises a latching tooth (201), a moving block (202), a servo motor (203) and a chain (204); the chain (204) is arranged inside the workbench (1); the servo motor (203) is installed at one end of the chain (204); and the latching tooth (201) is arranged on the outside of the chain (204).

3. The semiconductor chip test probe production marking machine according to claim 2, characterized in that: A moving block (202) is provided at the top end of the latching tooth (201), and the moving block (202) and the latching tooth (201) are engaged with each other.

4. The semiconductor chip test probe production marking machine according to claim 1, characterized in that: The limiting structure (5) comprises a movable groove (501), a limiting plate (502), a screw block (503), a positioning plate (504) and a threaded rod (505); the positioning plate (504) is mounted on the top of the movable plate (6); the movable groove (501) is arranged on the top of the movable plate (6); the movable groove (501) is internally movably connected to a threaded rod (505); screw blocks (503) are mounted on both sides of the threaded rod (505); and the top of the threaded rod (505) is movably connected to the limiting plate (502).

5. The dotting machine for producing semiconductor chip test probes according to claim 4, characterized in that: External threads are evenly arranged on the outer side wall of the threaded rod (505), and internal threads that cooperate with the external threads are evenly arranged on the inner side wall of the limiting plate (502). The threaded rod (505) and the limiting plate (502) are threadedly connected.

6. The dotting machine for producing semiconductor chip test probes according to claim 4, characterized in that: A slider is provided at the bottom end of the limiting plate (502), a sliding groove is provided inside the movable groove (501), and the limiting plate (502) and the movable groove (501) constitute a sliding structure.

7. The dotting machine for producing semiconductor chip test probes according to claim 1, characterized in that: The dust collection mechanism (7) comprises a bellows (701), a fan (702), a filter (703), an outlet (704) and an inlet (705); the bellows (701) is mounted at the bottom end of the mounting frame (8); the inlet (705) is provided on one side of the bellows (701); the outlet (704) is installed at the bottom end of the bellows (701); the bellows (701) is installed on one side of the interior of the bellows (701); and the filter (703) is installed on one side of the bellows (701).

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