Tray for detecting scribed chip

Abstract

The utility model provides a tray for detecting a scribed chip, which comprises a tray body made of stainless steel. A circle of protruding frame is arranged on the edge of the upper surface of the tray body. A round hole is formed in the tray body and penetrates through the upper surface and the lower surface of the tray body, and the round hole and the tray body share the same axis. The inner diameter of the raised frame is greater than the outer diameter of a wafer ring for loading a wafer; the diameter of the circular hole is larger than that of the wafer and smaller than the outer diameter of a wafer ring for loading the wafer; the outer wall of the tray body extends inwards to form at least one notch. According to the utility model, the chip is suspended, contamination and scratch cannot be caused, the inspection is convenient, the paper consumption is reduced, and the design requirement is met.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor chip processing, in particular to a tray for detecting chips after dicing. Background Art

[0002] Die dicing is the process of cutting a single wafer onto a ring and then dicing it into multiple individual chips. This process is performed after all semiconductor manufacturing processes have been completed on the wafer, allowing for subsequent packaging and testing. After dicing, the cut wafers are placed on a workbench for inspection.

[0003] Currently, wafer inspection after dicing requires sticking a piece of yellow glossy paper on the workbench before inspection to prevent wear and tear caused by contact between the chip and the workbench. However, the yellow glossy paper can easily cause chip contamination. In addition, the yellow glossy paper needs to be replaced every 10-20 wafers inspected, which increases losses.

[0004] In view of the above-mentioned prior art, it is desired to provide a tray for testing chips after dicing. Utility Model Content

[0005] The purpose of the utility model is to provide a tray for testing chips after dicing, in which the chips are suspended in the air and will not cause contamination or scratches. The lightened inspection tray not only makes inspection convenient, but also reduces paper consumption, thus meeting design requirements.

[0006] A tray for chip testing after dicing, comprising a tray body, wherein the tray body is made of stainless steel;

[0007] A raised frame is provided on the edge of the upper surface of the tray body;

[0008] The tray body has a circular hole, which passes through the upper and lower surfaces of the tray body, and the circular hole and the tray body share the same axis;

[0009] The inner diameter of the raised frame is larger than the outer diameter of the wafer ring;

[0010] The diameter of the circular hole is larger than the diameter of the wafer and smaller than the outer diameter of the ring on which the wafer is loaded;

[0011] The outer wall of the tray body extends inwardly and has at least one notch.

[0012] Specifically, there are two notches, and the two notches are symmetrically arranged on the outer wall of the tray body.

[0013] Preferably, a circle of elastic rubber layer is provided on the inner wall of the raised frame.

[0014] Preferably, the upper surface of the tray body is recessed downward to form a circular recessed area, the circular recessed area and the circular hole share the same axis, and a distance is left between the circular recessed area and the inner wall of the raised frame.

[0015] Furthermore, the distance between the circular recessed area and the inner wall of the raised frame is 1 / 2 of the distance between the raised frame and the edge of the circular hole.

[0016] Furthermore, the back side of the tray body has a plurality of plug posts.

[0017] Compared with the prior art, the semiconductor chip mounting machine conveying device of the present invention has the following advantages:

[0018] (1) After the wafer ring is placed on the tray body, the chips on the wafer are suspended in the air, which will not cause contamination or scratches. The inspection tray is not only convenient for inspection, but also reduces paper consumption, meeting the design requirements;

[0019] (2) Simple structure and easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of a tray for chip testing after dicing in this embodiment. Figure 1 ;

[0021] Figure 2 This is a schematic diagram of the structure of a tray for chip testing after dicing in this embodiment. Figure 2 ;

[0022] Figure 3 This is a structural diagram of a tray for chip inspection after dicing in this embodiment after loading a wafer ring. DETAILED DESCRIPTION

[0023] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0024] like Figure 1 As shown, a tray for chip detection after dicing includes a tray body 1, and the material of the tray body 1 is stainless steel; a circle of raised frame 2 is provided at the edge of the upper surface of the tray body 1; the tray body 1 has a circular hole 3, and the circular hole 3 passes through the upper and lower surfaces of the tray body 1, and the circular hole 3 and the tray body 1 share the same axis.

[0025] The inner diameter of the raised frame 2 is larger than the outer diameter of the wafer-loading ring; the diameter of the circular hole 3 is larger than the diameter of the wafer and smaller than the outer diameter of the wafer-loading ring; this arrangement can ensure that the wafer-loading ring is placed on the tray body 1, and the lower surface of the wafer does not contact the workbench, and also does not contact the surface of the tray body 1.

[0026] The outer wall of the tray body 1 extends inwardly to form at least one notch 4, which facilitates placement of wafer rings and removal of wafer rings after inspection. In this embodiment, there are two notches 4, symmetrically arranged on the outer wall of the tray body 1, allowing workers to securely grasp the wafer rings with both hands.

[0027] In this embodiment, a circle of elastic rubber layer (not shown in the figure) is provided on the inner wall of the raised frame 2. On the one hand, it ensures that the sheet ring for loading the wafer will not slide after being placed on the tray body 1, thereby improving the accuracy of chip detection on the wafer. On the other hand, the elastic rubber layer has a certain elasticity, which prevents the sheet ring from making rigid contact with the raised frame 2 and crushing the chip on the wafer.

[0028] In this embodiment, the upper surface of the tray body 1 is recessed downward to form a circular recessed area 5. This recessed area 5 shares a common axis with the circular hole 3 and is spaced apart from the inner wall of the raised frame 2. This effectively reduces the weight of the tray body and lowers costs. Furthermore, the spacing between the recessed area 5 and the inner wall of the raised frame 2 is half the spacing between the raised frame 2 and the edge of the circular hole 3. This not only reduces the weight of the tray body 1 but also ensures that the wafer ring loaded with wafers is stably placed on the tray body 1.

[0029] In this embodiment, if Figure 2 As shown, the back of the tray body 1 has a plurality of pins 6, which facilitate the detachable fixing of the tray body 1 on the workbench.

[0030] like Figure 3 As shown, when the wafer 7 is to be inspected, the tray body 1 is plugged into the workbench, and the sheet ring 8 loaded with the wafer 7 is placed on the tray body 1. Since the inner diameter of the raised frame 2 is larger than the outer diameter of the sheet ring 8 loaded with the wafer 7; the diameter of the circular hole 3 is larger than the diameter of the wafer 7 and smaller than the outer diameter of the sheet ring 8 loaded with the wafer 7; such a setting can ensure that the sheet ring 8 loaded with the wafer 7 is placed on the tray body 1, and the lower surface of the wafer 7 does not contact the workbench, and also does not contact the surface of the tray body 1, so as to avoid scratches on the chip on the wafer 7 during inspection. After the inspection is completed, the sheet ring 8 loaded with the wafer 7 is removed from the notch 4 and loaded on the tray body 1 with the reverse side facing up. The back of the wafer 7 is inspected. Finally, after the inspection is completed, the sheet ring 8 loaded with the wafer 7 can be removed. The chip is suspended in the air and will not cause contamination and scratches. The reduced inspection tray is not only convenient for inspection, but also reduces paper consumption, meeting the design requirements.

[0031] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limitations on the present invention. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A tray for chip testing after dicing, characterized in that: It includes a tray body, wherein the material of the tray body is stainless steel; A raised frame is provided on the edge of the upper surface of the tray body; The tray body has a circular hole, which passes through the upper and lower surfaces of the tray body, and the circular hole and the tray body share the same axis; The inner diameter of the raised frame is larger than the outer diameter of the wafer ring; The diameter of the circular hole is larger than the diameter of the wafer and smaller than the outer diameter of the ring on which the wafer is loaded; The outer wall of the tray body extends inwardly and has at least one notch.

2. The chip testing tray after dicing according to claim 1, characterized in that: There are two notches, and the two notches are symmetrically arranged on the outer wall of the tray body.

3. The chip testing tray after dicing according to claim 1, characterized in that: A circle of elastic rubber layer is provided on the inner wall of the raised frame.

4. The chip testing tray after dicing according to claim 1, wherein: The upper surface of the tray body is recessed downward to form a circular recessed area. The circular recessed area and the circular hole share the same axis. A distance is left between the circular recessed area and the inner wall of the raised frame.

5. The chip testing tray after dicing according to claim 4, characterized in that: The distance between the circular recessed area and the inner wall of the raised frame is 1 / 2 of the distance between the raised frame and the edge of the circular hole.

6. A chip testing tray after dicing according to any one of claims 1 to 5, characterized in that: The back side of the tray body is provided with a plurality of inserting posts.

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