Wafer bearing device and semiconductor equipment

Abstract

The utility model provides a wafer bearing device and semiconductor equipment, the wafer bearing device comprises a vacuum platform deck, a vacuum pipeline, a pressure relief pipeline, a vacuum valve and a pressure relief valve, the vacuum valve is arranged on the vacuum pipeline, the pressure relief valve is arranged on the pressure relief pipeline, and the opening and closing states of the vacuum valve and the pressure relief valve are opposite; the vacuum carrying table is provided with an adsorption cavity and a plurality of through holes, the adsorption cavity comprises a plurality of adsorption holes which are communicated with one another, the adsorption holes penetrate through the upper surface of the vacuum carrying table, and the through holes penetrate through the upper surface and the lower surface of the vacuum carrying table and are formed by avoiding the adsorption cavity; one end of the vacuum pipeline is communicated with the adsorption cavity, and the other end of the vacuum pipeline is communicated with a vacuum pump; one end of the pressure relief pipeline is communicated with the adsorption cavity, and the other end of the pressure relief pipeline is communicated with the atmosphere. According to the utility model, the pressure on the front and back surfaces of the wafer can be quickly balanced when the semiconductor equipment breaks down, so that the wafer can be taken out more conveniently, the downtime of the semiconductor equipment is reduced, and the running time of the semiconductor equipment is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer carrying device and semiconductor equipment. Background Art

[0002] In the semiconductor manufacturing process, processing a wafer into a wafer filled with integrated circuit devices requires multiple steps. The main processes involved in these processes include photolithography, dry etching, physical vapor deposition, chemical vapor deposition, etc., which all require the automatic conveying system in the semiconductor equipment to complete the wafer transportation. During the operation of the equipment, failures are often inevitable, resulting in interruptions in the automatic conveying system, leaving the wafer stranded in the equipment, usually on the equipment's vacuum stage. In this case, manual removal is usually the only way to remove the wafer from the vacuum stage.

[0003] When the wafer needs to be removed, the vacuum valve must be closed to stop the negative pressure supplied to the vacuum stage. However, since the pipeline area from the vacuum valve to the vacuum stage still has a certain degree of negative pressure, and the external atmospheric pressure acts on the front of the wafer, the wafer will still be tightly attached to the surface of the vacuum stage and difficult to move, making it difficult to remove the wafer. The existing technology often relies on equipment engineers to use external force to forcibly lift the wafer to remove it, which can easily cause irreversible damage to the wafer and the vacuum stage.

[0004] It should be noted that the information disclosed in the background technology section of this utility model is only intended to deepen the understanding of the general background technology of the utility model, and should not be regarded as an admission or in any form of implication that the information constitutes prior art already known to those skilled in the art. Utility Model Content

[0005] The purpose of the present utility model is to provide a wafer carrier and semiconductor equipment, which can quickly balance the pressure on the front and back sides of the wafer when a fault occurs in the semiconductor equipment, so as to facilitate the removal of the wafer, reduce the downtime of the semiconductor equipment, and improve the operating time of the semiconductor equipment.

[0006] In order to achieve the above-mentioned purpose, the utility model provides a wafer carrying device, which includes a vacuum carrier, a vacuum pipeline, a pressure relief pipeline, a vacuum valve and a pressure relief valve, the vacuum valve is arranged on the vacuum pipeline, the pressure relief valve is arranged on the pressure relief pipeline, and the opening and closing states of the vacuum valve and the pressure relief valve are opposite; the vacuum carrier has an adsorption chamber and a plurality of through holes, the adsorption chamber includes a plurality of adsorption holes connected to each other, the adsorption holes pass through the upper surface of the vacuum carrier, the through holes pass through the upper and lower surfaces of the vacuum carrier, and the through holes are arranged to avoid the adsorption chamber; one end of the vacuum pipeline is connected to the adsorption chamber, and the other end of the vacuum pipeline is used to connect to a vacuum pump; one end of the pressure relief pipeline is connected to the adsorption chamber, and the other end of the pressure relief pipeline is used to connect to the atmosphere.

[0007] Optionally, the wafer carrying device also includes a controller, and the vacuum valve and the pressure relief valve are electrically connected to the controller, and the controller is used to control the opening and closing states of the vacuum valve and the pressure relief valve so that the opening and closing states of the vacuum valve and the pressure relief valve are opposite.

[0008] Optionally, the wafer carrying device further includes a lifting member, which includes a support rod and a plurality of ejector pins connected to the top of the support rod, the ejector pins are arranged in a one-to-one correspondence with the through holes, and the ejector pins can move up and down in the through holes.

[0009] Optionally, a plurality of connecting rods extending radially outward are provided on the top of the support rod, and the connecting rods are connected to the ejector pins in a one-to-one correspondence.

[0010] Optionally, the pressure relief pipeline includes a first pressure relief sub-pipeline and a second pressure relief sub-pipeline that are interconnected, the first pressure relief sub-pipeline and the second pressure relief sub-pipeline are vertically arranged, the first pressure relief sub-pipeline is connected to the adsorption chamber, the second pressure relief sub-pipeline is used to connect to the atmosphere, and the pressure relief valve is arranged on the second pressure relief sub-pipeline.

[0011] Optionally, the plurality of through holes are evenly arranged along the circumference of the vacuum carrier.

[0012] Optionally, the vacuum pipeline includes a first vacuum sub-pipeline and a second vacuum sub-pipeline that are interconnected, the first vacuum sub-pipeline is connected to the adsorption chamber, the end of the pressure relief pipeline close to the adsorption chamber is connected to the first vacuum sub-pipeline, the second vacuum sub-pipeline is used to connect to a vacuum pump, and the vacuum valve is arranged on the second vacuum sub-pipeline.

[0013] Optionally, the wafer carrying device also includes a three-way joint, which has a first interface, a second interface and a third interface that are interconnected, the first interface and the second interface are arranged in a collinear manner, the third interface is arranged perpendicular to the first interface and the second interface, the first interface is connected to the end of the first vacuum sub-pipeline away from the adsorption chamber, the second interface is connected to the end of the second vacuum sub-pipeline close to the adsorption chamber, and the third interface is connected to the end of the pressure relief pipe close to the adsorption chamber.

[0014] Optionally, the wafer carrying device further includes a pressure sensor for measuring the pressure in the adsorption chamber, and the pressure sensor is disposed on the vacuum pipeline and close to the adsorption chamber.

[0015] In order to achieve the above-mentioned object, the present invention further provides a semiconductor device, which includes the wafer carrying device described in any one of the above items.

[0016] Compared with the prior art, the wafer carrier and semiconductor equipment provided by the present invention have the following beneficial effects:

[0017] The wafer carrying device provided by the present invention includes a vacuum carrier, a vacuum pipeline, a pressure relief pipeline, a vacuum valve and a pressure relief valve, the vacuum valve is arranged on the vacuum pipeline, the pressure relief valve is arranged on the pressure relief pipeline, and the opening and closing states of the vacuum valve and the pressure relief valve are opposite; the vacuum carrier has an adsorption chamber and a plurality of through holes, the adsorption chamber includes a plurality of adsorption holes connected to each other, the adsorption holes pass through the upper surface of the vacuum carrier, the through holes pass through the upper and lower surfaces of the vacuum carrier, and the through holes are arranged to avoid the adsorption chamber; one end of the vacuum pipeline is connected to the adsorption chamber, and the other end of the vacuum pipeline is used to connect to a vacuum pump; one end of the pressure relief pipeline is connected to the adsorption chamber, and the other end of the pressure relief pipeline is used to connect to the atmosphere. Thus, when a wafer needs to be adsorbed, the vacuum valve can be opened and the pressure relief valve closed, so that the vacuum pump can be used to create a vacuum environment in the adsorption chamber through the vacuum pipeline, so that a negative pressure environment is formed in the adsorption chamber. Since the upper surface (front side) of the wafer located above the adsorption chamber is at atmospheric pressure and the lower surface (back side) is at negative pressure, the wafer can be firmly adsorbed on the vacuum stage under the action of the pressure difference. When the equipment fails and the wafer needs to be manually released, the vacuum valve can be closed and the pressure relief valve opened, so that the adsorption chamber is connected to the outside world through the pressure relief pipeline, so that the outside atmosphere can enter the adsorption chamber through the pressure relief pipeline, thereby relieving the negative pressure in the adsorption chamber and balancing the pressure difference between the front and back sides of the wafer, so that the wafer can be smoothly separated from the vacuum stage, and then the operator can easily remove the wafer. This not only avoids irreversible damage to the wafer and the vacuum stage, but also reduces semiconductor equipment downtime and improves semiconductor equipment operation time. In addition, by providing a plurality of through holes on the vacuum carrier that avoid the adsorption chamber, after the negative pressure in the adsorption chamber is released, a pin can be inserted into the through hole to lift the wafer through the pin, so that the wafer can be detached from the vacuum carrier, making it easier for the operator to remove the wafer. In addition, since the adsorption chamber includes a plurality of adsorption holes that are interconnected, not only can the negative pressure provided by the vacuum pipeline be uniformly applied to the wafer through the plurality of adsorption holes that are interconnected when the wafer needs to be sucked, so that the wafer can be firmly adsorbed on the vacuum carrier, but also the negative pressure can be provided to the plurality of adsorption holes that are interconnected through the same vacuum pipeline, and the negative pressure in the plurality of adsorption holes that are interconnected can be released through the same pressure relief pipeline, thereby reducing the number of vacuum pipelines and pressure relief pipelines, and effectively reducing costs.

[0018] Since the semiconductor device provided by the present invention includes the wafer carrier provided by the present invention, the semiconductor device provided by the present invention has at least all the beneficial effects of the wafer carrier provided by the present invention. Therefore, the relevant content about the beneficial effects of the semiconductor device provided by the present invention can refer to the relevant description of the beneficial effects of the wafer carrier provided by the present invention in the above text, and will not be repeated here one by one. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic structural diagram of the wafer carrier device provided by the first embodiment of the present invention when adsorbing a wafer;

[0020] Figure 2 A schematic structural diagram of the wafer carrying device provided by the first embodiment of the present invention when releasing a wafer;

[0021] Figure 3 A front view of a lifting member provided in one embodiment of the present utility model;

[0022] Figure 4 A top view of a lifting member provided in one embodiment of the present utility model;

[0023] Figure 5 A schematic structural diagram of a wafer carrier device according to a second embodiment of the present invention when adsorbing a wafer;

[0024] Figure 6 This is a structural schematic diagram of the wafer carrying device provided in the second embodiment of the present invention when releasing the wafer.

[0025] The accompanying drawings are numerals as follows:

[0026] Vacuum stage-100; adsorption chamber-110; adsorption hole-111; through hole-120;

[0027] Vacuum pipeline-210; first vacuum sub-pipeline-211; second vacuum sub-pipeline-212;

[0028] Pressure relief pipeline-220; first pressure relief sub-pipeline-221; second pressure relief sub-pipeline-222;

[0029] Vacuum valve-310; pressure relief valve-320;

[0030] Vacuum pump-400;

[0031] Controller-500;

[0032] Lifting member-600; Support rod-610; Ejector pin-620; Connecting rod-630;

[0033] Pressure sensor-700;

[0034] Three-way connector-800; first interface-810; second interface-820; third interface-830;

[0035] Wafer-10. DETAILED DESCRIPTION

[0036] The following is a further detailed description of the wafer carrier and semiconductor equipment proposed in the present invention in conjunction with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation of the present invention. In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, please refer to the drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the conditions for the implementation of the present invention. Any modification of the structure, change in the proportional relationship or adjustment of the size, as long as it is the same or similar to the effect that can be produced by the present invention and the purpose that can be achieved, should still fall within the scope of the technical content disclosed in the present invention. The specific design features of the present invention disclosed herein, including, for example, specific dimensions, directions, positions and shapes, will be determined in part by the specific environment in which they are to be applied and used. Also, in the embodiments described below, sometimes the same reference numerals are used in common between different drawings to represent the same parts or parts having the same functions, and their repeated descriptions are omitted. In this specification, similar reference numerals and letters are used to represent similar items, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings. In addition, if the method described herein includes a series of steps, the order of these steps presented herein is not necessarily the only order in which these steps can be performed, and some of the steps described may be omitted and / or some other steps not described herein may be added to the method.

[0037] It should be noted that, in this document, relational terms such as first and second, etc., are merely used to distinguish one entity or operation from another, and do not necessarily require or imply any actual relationship or order between these entities or operations, nor should they be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Moreover, the terms "comprises," "includes," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprises a..." does not exclude the presence of other identical elements in the process, method, article, or device that includes the element. The singular forms "a", "an" and "the" include plural referents, the term "or" is generally used in a sense including "and / or", the term "several" is generally used in a sense including "at least one", the term "at least two" is generally used in a sense including "two or more", and the term "multiple" is generally used in a sense including "at least two".

[0038] In the description of the present invention, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limiting the present invention. In the description of the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can mean fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific contexts. In addition, in the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0039] The core idea of the present invention is to provide a wafer carrier and semiconductor equipment, which can quickly balance the pressure on the front and back sides of the wafer when a fault occurs in the semiconductor equipment, so as to facilitate the removal of the wafer, reduce the downtime of the semiconductor equipment, and improve the operating time of the semiconductor equipment.

[0040] In order to realize the above idea, the present invention provides a wafer carrying device, please refer to Figure 1 and Figure 2 ,in, Figure 1 This is a schematic structural diagram of the wafer carrying device provided by the first embodiment of the present invention when adsorbing the wafer 10; Figure 2 This is a schematic structural diagram of the wafer carrier device provided by the first embodiment of the present invention when releasing the wafer 10. Figure 1 and Figure 2As shown, the wafer carrying device provided by the present invention includes a vacuum stage 100, a vacuum line 210, a pressure relief line 220, a vacuum valve 310 and a pressure relief valve 320, wherein the vacuum valve 310 is arranged on the vacuum line 210, and the pressure relief valve 320 is arranged on the pressure relief line 220, and the opening and closing states of the vacuum valve 310 and the pressure relief valve 320 are opposite; the vacuum stage 100 has an adsorption chamber 110 and a plurality of through holes 120, and the adsorption chamber 110 includes a plurality of adsorption holes 120 that are interconnected. The attached hole 111, the adsorption hole 111 passes through the upper surface of the vacuum carrier 100, the through hole 120 passes through the upper and lower surfaces of the vacuum carrier 100, and the through hole 120 is set to avoid the adsorption chamber 110; one end of the vacuum pipeline 210 is connected to the adsorption chamber 110, and the other end of the vacuum pipeline 210 is used to connect to the vacuum pump 400; one end of the pressure relief pipeline 220 is connected to the adsorption chamber 110, and the other end of the pressure relief pipeline 220 is used to connect to the atmosphere.

[0041] Therefore, when the wafer 10 needs to be adsorbed, the vacuum valve 310 can be opened and the pressure relief valve 320 can be closed, so that the vacuum pump 400 can be used to form a vacuum environment in the adsorption chamber 110 through the vacuum pipe 210, so that a negative pressure environment is formed in the adsorption chamber 110. Since the upper surface (front side) of the wafer 10 located above the adsorption chamber 110 is at atmospheric pressure and the lower surface (back side / reverse side) is at negative pressure, the wafer 10 can be firmly adsorbed on the vacuum carrier 100 under the action of the pressure difference. When the equipment fails and the wafer 10 needs to be released manually, the vacuum valve 310 can be closed and the pressure relief valve 320 can be opened to connect the adsorption chamber 110 with the outside world via the pressure relief pipe 220, so that the outside atmosphere can enter the adsorption chamber 110 through the pressure relief pipe 220, thereby releasing the negative pressure in the adsorption chamber 110 to balance the pressure difference between the front and back sides of the wafer 10, so that the wafer 10 can be smoothly separated from the vacuum stage 100, and the operator can easily remove the wafer 10, thereby not only avoiding irreversible damage to the wafer 10 and the vacuum stage 100, but also reducing the downtime of semiconductor equipment and improving the operating time of semiconductor equipment. In addition, by providing a plurality of through holes 120 on the vacuum carrier 100 that are arranged away from the adsorption chamber 110, after the negative pressure in the adsorption chamber 110 is released, the ejector pin 620 can be inserted into the through hole 120 to lift the wafer 10 through the ejector pin 620, so that the wafer 10 can be separated from the vacuum carrier 100, making it easier for the operator to remove the wafer 10. In addition, since the adsorption chamber 110 includes a plurality of interconnected adsorption holes 111, not only can the negative pressure provided by the vacuum pipeline 210 act evenly on the wafer 10 through the plurality of interconnected adsorption holes 111 when the wafer 10 needs to be sucked, so that the wafer 10 can be firmly adsorbed on the vacuum carrier 100, but also the same vacuum pipeline 210 can provide negative pressure for the plurality of interconnected adsorption holes 111, and the negative pressure in the plurality of interconnected adsorption holes 111 can be released through the same pressure relief pipeline 220, thereby reducing the number of vacuum pipelines 210 and pressure relief pipelines 220, and effectively reducing costs.

[0042] Specifically, the vacuum valve 310 and the pressure relief valve 320 are preferably solenoid valves. Of course, in some other embodiments, the vacuum valve 310 and the pressure relief valve 320 can also be other structures that can realize the opening and closing of the pipeline, such as manual valves, pipe clamps, etc.

[0043] Please continue to refer to Figure 1 and Figure 2 ,like Figure 1 and Figure 2As shown, in some exemplary embodiments, the wafer carrier provided in this embodiment further includes a controller 500, and the vacuum valve 310 and the pressure relief valve 320 are both electrically connected to the controller 500. The controller 500 is used to control the opening and closing states of the vacuum valve 310 and the pressure relief valve 320, so that the opening and closing states of the vacuum valve 310 and the pressure relief valve 320 are opposite. Therefore, by configuring the vacuum valve 310 and the pressure relief valve 320 to be electrically connected to the same controller 500, the opening and closing states of the vacuum valve 310 and the pressure relief valve 320 can be simultaneously controlled by the same controller 500, which helps to achieve automated control of the wafer carrier provided by the utility model.

[0044] It should be noted that the vacuum valve 310 and the pressure relief valve 320 electrically connected to the controller 500 are both solenoid valves, and when not powered, the vacuum valve 310 and the pressure relief valve 320 are both in an open state. Thus, when the vacuum valve 310 needs to be closed, an electrical signal of a certain voltage (e.g., a +12V electrical signal) is fed into the vacuum valve 310 under the action of the controller 500, thereby controlling the vacuum valve 310 to close. Similarly, when the pressure relief valve 320 needs to be closed, an electrical signal of a certain voltage is fed into the pressure relief valve 320, thereby controlling the pressure relief valve 320 to close. It should also be noted that, in the present invention, controlling the opening and closing states of the vacuum valve 310 and the pressure relief valve 320 by the controller 500 can be implemented using solutions in the prior art, and the controller 500 can be a common PLC controller.

[0045] Please continue to refer to Figure 1 and Figure 2 ,like Figure 1 and Figure 2 As shown, in some exemplary embodiments, the pressure relief pipeline 220 includes a first pressure relief sub-pipeline 221 and a second pressure relief sub-pipeline 222 that are interconnected. The first pressure relief sub-pipeline 221 and the second pressure relief sub-pipeline 222 are arranged vertically. The first pressure relief sub-pipeline 221 is connected to the adsorption chamber 110, and the second pressure relief sub-pipeline 222 is used to communicate with the atmosphere. The pressure relief valve 320 is disposed on the second pressure relief sub-pipeline 222. Therefore, by configuring the pressure relief pipeline 220 to include the first pressure relief sub-pipeline 221 and the second pressure relief sub-pipeline 222 that are interconnected and arranged vertically, not only can the layout of the pressure relief pipeline 220 be more convenient, saving space, but also the circulation of the atmosphere can be more convenient.

[0046] Please continue to refer to Figure 1 and Figure 2 ,like Figure 1 and Figure 2As shown, in some exemplary embodiments, one end of the pressure relief line 220 (specifically, one end of the first pressure relief sub-line 221) is connected to one end of the vacuum line 210 that is connected to the adsorption chamber 110. Thus, by connecting one end of the pressure relief line 220 (specifically, one end of the first pressure relief sub-line 221) to one end of the vacuum line 210 that is connected to the adsorption chamber 110, the adsorption chamber 110 and one end of the pressure relief line 220 can be connected via the end of the vacuum line 210 that is connected to the adsorption chamber 110, thereby further facilitating the arrangement of the vacuum line 210 and the pressure relief line 220.

[0047] Please continue to refer to Figures 2 to 4 ,in, Figure 3 A front view of a lifting member 600 provided in one embodiment of the present utility model; Figure 4 FIG. 6 is a top view of a lifting member 600 provided in one embodiment of the present invention. Figures 2 to 4 As shown, in some exemplary embodiments, the wafer carrying device provided in this embodiment also includes a lifting member 600, and the lifting member 600 includes a support rod 610 and a plurality of ejector pins 620 connected to the top of the support rod 610, and the ejector pins 620 are arranged in a one-to-one correspondence with the through holes 120, and the ejector pins 620 can move up and down in the through holes 120. Therefore, by providing a support rod 610 and a plurality of ejector pins 620 connected to the top of the support rod 610, when the equipment fails and the wafer 10 needs to be manually released, the vacuum valve 310 can be closed first and the pressure relief valve 320 can be opened, so that the adsorption chamber 110 and the outside world can be connected by using the pressure relief pipe 220, so that the outside atmosphere can enter the adsorption chamber 110 through the pressure relief pipe 220 to release the negative pressure in the adsorption chamber 110. After the pressure in the adsorption chamber 110 is balanced with the outside atmospheric pressure, the operator can hold the support rod 610 of the lifting member 600 and insert the ejector pins 620 on the support rod 610 into the corresponding through holes 120 one by one. By moving the support rod 610 upward, the operator can drive the ejector pins 620 on the support rod 610 to lift the wafer 10 to separate from the vacuum carrier 100, so that the operator can easily remove the wafer 10.

[0048] It should be noted that, as those skilled in the art will appreciate, the outer diameter of the ejector pin 620 is slightly smaller than the inner diameter of the through hole 120 to ensure that the ejector pin 620 can smoothly move up and down in the through hole 120 .

[0049] Please continue to refer to Figure 3 and Figure 4 ,like Figure 3 and Figure 4As shown, in some exemplary embodiments, the top of the support rod 610 is provided with a plurality of connecting rods 630 extending radially outward, and the connecting rods 630 are connected one-to-one with the ejector pins 620. Thus, by providing a plurality of connecting rods 630 extending radially outward at the top of the support rod 610 and connecting the connecting rods 630 to the ejector pins 620 one-to-one, it is possible to more easily fix the ejector pins 620 to the top of the support rod 610.

[0050] In some exemplary embodiments, the multiple through holes 120 are evenly arranged along the circumference of the vacuum stage 100. Thus, by evenly arranging the multiple through holes 120 along the circumference of the vacuum stage 100, when a device fails and the wafer 10 needs to be manually released, after the pressure in the adsorption chamber 110 is balanced with the external atmospheric pressure, a pin 620 can be inserted into each of the multiple evenly arranged through holes 120 to ensure that the multiple pins 620 can be evenly distributed under the wafer 10, so that the multiple pins 620 can lift the wafer 10 more smoothly, so that the operator can remove the wafer 10 more smoothly.

[0051] Please continue to refer to Figure 1 and Figure 2 ,like Figure 1 and Figure 2 As shown, in some exemplary embodiments, the wafer carrier provided in this embodiment further includes a pressure sensor 700 for measuring the pressure within the adsorption chamber 110. The pressure sensor 700 is disposed on the vacuum line 210 and is disposed near the adsorption chamber 110. Thus, by disposing the pressure sensor 700 near the adsorption chamber 110 on the vacuum line 210, the pressure within the adsorption chamber 110 can be measured by the pressure sensor 700. Thus, after the vacuum valve 310 is closed and the pressure relief valve 320 is opened, the detection result of the pressure sensor 700 can be used to accurately determine whether the pressure within the adsorption chamber 110 is balanced with the external atmospheric pressure. This ensures that the operator only lifts the wafer 10 by moving the ejector pin 620 upward after the pressure within the adsorption chamber 110 is balanced with the external atmospheric pressure. This effectively prevents the wafer 10 from being lifted when the negative pressure is not completely released, thereby preventing the wafer 10 from being damaged.

[0052] Please continue to refer to Figure 5 and Figure 6 ,in, Figure 5 A schematic structural diagram of a wafer carrier device according to a second embodiment of the present invention when adsorbing a wafer 10; Figure 6This is a schematic structural diagram of the wafer carrying device provided in the second embodiment of the present invention when releasing the wafer 10. Figure 5 and Figure 6 As shown, the difference between the wafer carrying device provided by this embodiment and the wafer carrying device provided by the first embodiment is that, in this embodiment, the vacuum pipeline 210 includes a first vacuum sub-pipeline 211 and a second vacuum sub-pipeline 212 that are interconnected, the first vacuum sub-pipeline 211 is connected to the adsorption chamber 110, the end of the pressure relief pipeline 220 close to the adsorption chamber 110 is connected to the first vacuum sub-pipeline 211, the second vacuum sub-pipeline 212 is used to connect to the vacuum pump 400, and the vacuum valve 310 is arranged on the second vacuum sub-pipeline 212. Therefore, by setting the vacuum pipeline 210 to include a first vacuum sub-pipeline 211 and a second vacuum sub-pipeline 212 that are interconnected, and connecting the end of the pressure relief pipeline 220 close to the adsorption chamber 110 (specifically, the end of the first pressure relief sub-pipeline 221 close to the adsorption chamber 110) with the first vacuum sub-pipeline 211, and setting the vacuum valve 310 on the second vacuum sub-pipeline 212, it is not only easier to achieve the connection between the vacuum pipeline 210 and the pressure relief pipeline 220 and the adsorption chamber 110 respectively, but also the length of the pipeline that needs to be depressurized can be shortened, which is conducive to better achieving the effect of quickly balancing the pressure on the front and back sides of the wafer 10 when a failure occurs in the semiconductor equipment.

[0053] Further, if Figure 5 and Figure 6 As shown, the difference between the wafer carrying device provided by this embodiment and the wafer carrying device provided by the first embodiment is that the wafer carrying device provided by this embodiment also includes a three-way joint 800, and the three-way joint 800 has a first interface 810, a second interface 820 and a third interface 830 that are interconnected, the first interface 810 and the second interface 820 are arranged in the same line, and the third interface 830 is arranged vertically to the first interface 810 and the second interface 820, the first interface 810 is connected to the end of the first vacuum sub-pipeline 211 away from the adsorption chamber 110, the second interface 820 is connected to the end of the second vacuum sub-pipeline 212 close to the adsorption chamber 110, and the third interface 830 is connected to the end of the pressure relief pipe 220 close to the adsorption chamber 110. Therefore, by using a three-way connector 800 to connect the first vacuum sub-pipeline 211, the second vacuum sub-pipeline 212 and the pressure relief pipe 220, not only can the connection of the first vacuum sub-pipeline 211, the second vacuum sub-pipeline 212 and the pressure relief pipe 220 be smoothly achieved, but the pipeline structure of the wafer carrying device provided by the utility model can also be further simplified.

[0054] It should be noted that, as those skilled in the art can understand, in order to avoid repetition, this document only describes the differences between the wafer carrier device provided by the second embodiment and the wafer carrier device provided by the first embodiment, while the similarities between the wafer carrier device provided by the second embodiment and the wafer carrier device provided by the first embodiment are not described. For more information about the wafer carrier device provided by the second embodiment, please refer to the relevant information about the wafer carrier device provided by the first embodiment for adaptive understanding, and will not be repeated here one by one.

[0055] To achieve the above-mentioned concept, the present invention further provides a semiconductor device, comprising the wafer carrier device described above. Since the semiconductor device provided by the present invention comprises the wafer carrier device provided by the present invention, the semiconductor device provided by the present invention has at least all the beneficial effects of the wafer carrier device provided by the present invention. For details regarding the beneficial effects of the semiconductor device provided by the present invention, reference can be made to the above description of the beneficial effects of the wafer carrier device provided by the present invention, and no further elaboration is required here.

[0056] In summary, compared with the prior art, the wafer carrier and semiconductor equipment provided by the present invention have the following beneficial effects:

[0057] (1) Since the wafer carrying device provided by the present invention includes a vacuum carrier 100, a vacuum pipeline 210, a pressure relief pipeline 220, a vacuum valve 310 and a pressure relief valve 320, the vacuum valve 310 is arranged on the vacuum pipeline 210, and the pressure relief valve 320 is arranged on the pressure relief pipeline 220, and the opening and closing states of the vacuum valve 310 and the pressure relief valve 320 are opposite; the vacuum carrier 100 has an adsorption chamber 110; one end of the vacuum pipeline 210 is connected to the adsorption chamber 110, and the other end of the vacuum pipeline 210 is used to connect to the vacuum pump 400; one end of the pressure relief pipeline 220 is connected to the adsorption chamber 110, and the other end of the pressure relief pipeline 220 is used to connect to the atmosphere. Therefore, when the wafer 10 needs to be adsorbed, the vacuum valve 310 can be opened and the pressure relief valve 320 can be closed, so that the vacuum pump 400 can be used to form a vacuum environment in the adsorption chamber 110 through the vacuum pipe 210, so that a negative pressure environment is formed in the adsorption chamber 110. Since the upper surface (front side) of the wafer 10 located above the adsorption chamber 110 is at atmospheric pressure and the lower surface (back side / reverse side) is at negative pressure, the wafer 10 can be firmly adsorbed on the vacuum carrier 100 under the action of the pressure difference. When the equipment fails and the wafer 10 needs to be released manually, the vacuum valve 310 can be closed and the pressure relief valve 320 can be opened to connect the adsorption chamber 110 with the outside world via the pressure relief pipe 220, so that the outside atmosphere can enter the adsorption chamber 110 through the pressure relief pipe 220, thereby releasing the negative pressure in the adsorption chamber 110 to balance the pressure difference between the front and back sides of the wafer 10, so that the wafer 10 can be smoothly separated from the vacuum stage 100, and the operator can easily remove the wafer 10, thereby not only avoiding irreversible damage to the wafer 10 and the vacuum stage 100, but also reducing the downtime of semiconductor equipment and improving the operating time of semiconductor equipment.

[0058] (2) By providing a plurality of through holes 120 on the vacuum stage 100 so as to avoid the adsorption chamber 110, after the negative pressure in the adsorption chamber 110 is released, the ejector pins 620 can be inserted into the through holes 120 to lift the wafer 10 through the ejector pins 620, thereby enabling the wafer 10 to be detached from the vacuum stage 100, thereby making it easier for the operator to remove the wafer 10.

[0059] (3) Since the adsorption chamber 110 includes a plurality of interconnected adsorption holes 111, not only can the negative pressure provided by the vacuum pipe 210 act evenly on the wafer 10 through the plurality of interconnected adsorption holes 111 when the wafer 10 needs to be sucked, so that the wafer 10 can be firmly adsorbed on the vacuum carrier 100, but also the negative pressure can be provided to the plurality of interconnected adsorption holes 111 through the same vacuum pipe 210, and the negative pressure in the plurality of interconnected adsorption holes 111 can be released through the same pressure relief pipe 220, thereby reducing the number of vacuum pipes 210 and pressure relief pipes 220, and effectively reducing costs.

[0060] (4) By setting the vacuum valve 310 and the pressure relief valve 320 to be electrically connected to the same controller 500, the opening and closing states of the vacuum valve 310 and the pressure relief valve 320 can be simultaneously controlled by the same controller 500, which helps to realize the automated control of the wafer carrying device provided by the utility model.

[0061] (5) By providing a support rod 610 and a plurality of ejector pins 620 connected to the top of the support rod 610, when the equipment fails and the wafer 10 needs to be released manually, the vacuum valve 310 is first closed and the pressure relief valve 320 is opened, so that the pressure relief pipe 220 is used to connect the adsorption chamber 110 with the outside world, so that the outside atmosphere can pass into the adsorption chamber 110 through the pressure relief pipe 220 to release the negative pressure in the adsorption chamber 110. After the pressure in the adsorption chamber 110 is balanced with the outside atmospheric pressure, the operator can hold the support rod 610 of the lifting member 600 and insert the ejector pins 620 on the support rod 610 into the corresponding through holes 120 one by one. By moving the support rod 610 upward, the operator can drive the ejector pins 620 on the support rod 610 to lift the wafer 10 to separate from the vacuum carrier 100, so that the operator can easily remove the wafer 10.

[0062] It should be noted that, in the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are mutually inconsistent.

[0063] It should also be noted that the above description is merely a description of preferred embodiments of the present invention and does not limit the scope of the present invention. Any changes or modifications made by persons skilled in the art based on the above disclosure are within the scope of protection of the present invention. Obviously, those skilled in the art may make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations fall within the scope of the present invention and its equivalents, the present invention is intended to include such modifications and variations.

Claims

1. A wafer carrying device, characterized in that: The device comprises a vacuum stage, a vacuum pipeline, a pressure relief pipeline, a vacuum valve and a pressure relief valve, wherein the vacuum valve is arranged on the vacuum pipeline, the pressure relief valve is arranged on the pressure relief pipeline, and the opening and closing states of the vacuum valve and the pressure relief valve are opposite; The vacuum stage has an adsorption cavity and a plurality of through holes, wherein the adsorption cavity includes a plurality of adsorption holes that are interconnected, the adsorption holes penetrate the upper surface of the vacuum stage, and the through holes penetrate the upper and lower surfaces of the vacuum stage, and the through holes are arranged to avoid the adsorption cavity; One end of the vacuum pipeline is connected to the adsorption chamber, and the other end of the vacuum pipeline is used to connect to the vacuum pump; One end of the pressure relief pipeline is connected to the adsorption chamber, and the other end of the pressure relief pipeline is used to communicate with the atmosphere.

2. The wafer carrier device according to claim 1, wherein: A controller is also included, and the vacuum valve and the pressure relief valve are both electrically connected to the controller. The controller is used to control the opening and closing states of the vacuum valve and the pressure relief valve so that the opening and closing states of the vacuum valve and the pressure relief valve are opposite.

3. The wafer carrier device according to claim 1, wherein: It also includes a lifting member, which includes a support rod and a plurality of ejectors connected to the top of the support rod. The ejectors are arranged in a one-to-one correspondence with the through holes, and the ejectors can move up and down in the through holes.

4. The wafer carrying device according to claim 3, characterized in that: A plurality of connecting rods extending radially outward are provided on the top of the support rod, and the connecting rods are connected to the ejector pins in a one-to-one correspondence.

5. The wafer carrying device according to claim 1, wherein: The pressure relief pipeline includes a first pressure relief sub-pipeline and a second pressure relief sub-pipeline which are interconnected. The first pressure relief sub-pipeline and the second pressure relief sub-pipeline are arranged vertically. The first pressure relief sub-pipeline is connected to the adsorption chamber, and the second pressure relief sub-pipeline is used to connect to the atmosphere. The pressure relief valve is arranged on the second pressure relief sub-pipeline.

6. The wafer carrying device according to claim 1, wherein: The plurality of through holes are evenly arranged along the circumference of the vacuum stage.

7. The wafer carrying device according to claim 1, wherein: The vacuum pipeline includes a first vacuum sub-pipeline and a second vacuum sub-pipeline that are interconnected. The first vacuum sub-pipeline is connected to the adsorption chamber. The end of the pressure relief pipeline close to the adsorption chamber is connected to the first vacuum sub-pipeline. The second vacuum sub-pipeline is used to connect to a vacuum pump. The vacuum valve is arranged on the second vacuum sub-pipeline.

8. The wafer carrying device according to claim 7, characterized in that: It also includes a three-way joint, which has a first interface, a second interface and a third interface that are interconnected, the first interface and the second interface are arranged in a collinear manner, the third interface is arranged perpendicular to the first interface and the second interface, the first interface is connected to the end of the first vacuum sub-pipeline away from the adsorption chamber, the second interface is connected to the end of the second vacuum sub-pipeline close to the adsorption chamber, and the third interface is connected to the end of the pressure relief pipeline close to the adsorption chamber.

9. The wafer carrying device according to claim 1, wherein: It also includes a pressure sensor for measuring the pressure in the adsorption chamber. The pressure sensor is arranged on the vacuum pipeline and is close to the adsorption chamber.

10. A semiconductor device, characterized in that: A wafer carrier device comprising the wafer carrier device according to any one of claims 1 to 9.

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