Wafer clamping and carrying device

Abstract

The utility model discloses a wafer clamping and carrying device which comprises a rack, a lifting module is arranged on the right side of the rack, the lifting module is connected with a horizontally-arranged support, the left end of the support is connected with a clamping mechanism, and a centering mechanism is arranged on the rack. The centering mechanism comprises a motor, the motor is fixed to the rear side of the rack, the motor is connected with a horizontally-rotating belt, the belt is connected with two vertically-arranged centering track assemblies, the two centering track assemblies are connected with the upper side and the lower side of the belt respectively, and a horizontally-arranged second linear guide rail is connected between the two centering track assemblies and the rack. The beneficial effects of the utility model are that the clamping and vertical carrying of the wafer are realized, the wafer can be centered and positioned after the wafer moves to a set position, and the accuracy of the carrying position of the wafer is ensured; according to the clamping and carrying device, the possibility that dust particles above equipment are attached to the surface of a wafer can be reduced, smudginess generated by friction is effectively reduced, and meanwhile the carrying stability is high.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor wafers, in particular to a wafer clamping and transporting device. Background Art

[0002] A wafer is a silicon chip used in the manufacture of semiconductor integrated circuits. Due to its round shape, it is called a wafer. Various circuit components can be fabricated on the wafer, resulting in integrated circuit products with specific electrical functions. During wafer production, a metal ring is attached to the outside of the wafer to secure it securely, preventing damage or scratches during transportation during the production process.

[0003] During the wafer production process, wafers need to be transported between different workstations. The existing wafer transport method is to remove the wafer with an iron ring from the horizontal direction through the clamping claws and transport it to the carrying rails on both sides. When transporting wafers horizontally, dust particles directly above the equipment are likely to fall on the surface of the wafer, causing the product to be dirty. For example, the wafer box, wafer handling equipment, wafer handling control method, electrical equipment and storage medium disclosed in patent application number 202210355328.X transport the wafers horizontally, which is prone to the risk of dust particles falling on the surface of the wafer. Utility Model Content

[0004] The purpose of the present invention is to provide a wafer clamping and transporting device to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned objectives, the utility model provides the following technical solutions: a wafer clamping and handling device, comprising a frame, a lifting module is provided on the right side of the frame, the lifting module is connected to a horizontally arranged bracket, the left end of the bracket is connected to a clamping mechanism, and the frame is provided with a centering mechanism; the centering mechanism comprises a motor, the motor is fixed to the rear side of the frame, the motor is connected to a horizontally rotating belt, the belt is connected to two vertically arranged centering rail assemblies, the two centering rail assemblies are respectively connected to the upper and lower sides of the belt, and a horizontally arranged second linear guide rail is connected between the two centering rail assemblies and the frame; the centering rail assembly comprises a vertically arranged mounting plate connected to the second linear guide rail, a vertically arranged first centering substrate is provided on the mounting plate, a horizontally arranged third cylinder is provided in the middle of the mounting plate, the third cylinder is connected to a vertically arranged second centering substrate, the first centering substrate and the second centering substrate are symmetrically arranged front and back, and the first centering substrate and the second centering substrate are both provided with a plurality of rollers spaced apart in an upper and lower manner.

[0006] Further preferably, the clamping mechanism includes a first connecting plate connected to the bracket, a first cylinder arranged vertically downward is provided on the first connecting plate, the lower end of the first cylinder is connected to an adapter plate, the adapter plate is rotatably connected to the second connecting plate, the second connecting plate is slidably connected to the third connecting plate, the rear side of the third connecting plate is installed with a second cylinder arranged front and back, the lower end of the third connecting plate is connected to a vertically arranged first clamping plate, the front end piston rod end of the second cylinder is connected to the second clamping plate, and the second clamping plate is arranged in coordination with the first clamping plate. The first connecting plate is used to connect with the bracket, and the first cylinder can drive the adapter plate, the second connecting plate, the third connecting plate, the second cylinder, the first clamping plate and the second clamping plate to rise and fall, thereby ensuring that the first clamping plate and the second clamping plate can clamp the iron ring on the outside of the wafer; the adapter plate facilitates the first clamping plate and the second clamping plate to make slight rotations, ensuring that the first clamping plate and the second clamping plate can accurately clamp the wafer and adapt to the micro-movement during wafer centering and positioning; the second cylinder is used to drive the second clamping plate to move back and forth, and the second clamping plate cooperates with the first clamping plate to clamp the iron ring on the outside of the wafer.

[0007] It is further preferred that the adapter plate is provided with a first connecting hole and a second connecting hole passing through the front and back for connecting to the second connecting plate, the first connecting hole is a circular hole, and there are two second connecting holes which are arc-shaped waist holes, and the two second connecting holes are symmetrically arranged on the left and right sides of the first connecting hole. The structural setting of the first connecting hole with a circular hole structure ensures that the adapter plate and the second connecting plate can rotate relative to each other, and the structural setting of the first connecting hole with an arc-shaped waist hole structure ensures that the rotation of the adapter plate and the second connecting plate is stable, and has a limit on the rotation angle, and can only rotate to a certain angle, thereby ensuring that the first clamping plate and the second clamping plate can effectively clamp the iron ring on the outside of the wafer, and ensuring the safety of the wafer clamping by the clamping mechanism.

[0008] It is further preferred that a first linear guide rail is provided between the second connecting plate and the third connecting plate, and a spring is provided between the upper end of the third connecting plate and the second connecting plate. Through the structural arrangement of the first linear guide rail and the spring, the third connecting plate can move relative to the second connecting plate, ensuring that the first clamping plate and the second clamping plate effectively clamp the iron ring on the outside of the wafer, ensuring fine-tuning of the displacement when the wafer is centered, and having an elastic buffering effect, which can protect the wafer.

[0009] Further preferably, a boss is provided at the lower end of the second clamping plate near the side of the first clamping plate, which can hook the inner ring of the iron ring to prevent the iron ring from falling.

[0010] It is further preferred that a guide plate is connected to the lower end of the first pair of centering substrates and the second pair of centering substrates, and the two guide plates of the first pair of centering substrates and the second pair of centering substrates are arranged correspondingly, and the upper and lower ends of the guide plates are provided with inclined surfaces, and the guide plates are used to clamp and guide the wafer, and the inclined surfaces at both ends of the guide plates can prevent the wafer from being scratched.

[0011] It is further preferred that the rollers on the first pair of centering substrates and the second pair of centering substrates are arranged in a one-to-one correspondence to ensure support for the two side surfaces of the iron ring on the outside of the wafer, ensure the verticality of the wafer rising, and reduce dirt caused by friction; a calibration plate is provided on the first pair of centering substrates, and a calibration groove for engaging the rollers is provided on the calibration plate to ensure one-to-one correspondence between the rollers on the first pair of centering substrates and the second pair of centering substrates, thereby ensuring the supporting effect of the rollers on the wafer.

[0012] It is further preferred that a plurality of guide members are provided between the second centering substrate and the mounting plate, and the guide members are composed of guide rods and linear bearings. The guide members are used to guide the movement of the second centering substrate, which is achieved through the guide rods and linear bearings to ensure that the second centering substrate moves forward and backward smoothly, accurately and steadily.

[0013] Further preferably, a limiter is provided in the middle of the mounting plate to limit the descent of the wafer and prevent the wafer from falling and being damaged. The limiter comprises a fourth cylinder mounted on the mounting plate. The fourth cylinder is arranged front and back, and its front piston rod end is connected to a limiter rod, which is movably inserted into the side of the first and second centering substrates. The fourth cylinder can drive the limiter rod to move forward and backward. When the limiter rod extends forward, it can extend to the side of the second centering substrate. At this time, the limiter rod is located below the two rollers on the first and second centering substrates, which can prevent the wafer from falling along the gap between the rollers.

[0014] Beneficial effects: The wafer clamping and transporting device of the utility model realizes the clamping and vertical transport of the wafer through the cooperation of the lifting module and the clamping mechanism, and when the clamping mechanism clamps the iron ring on the outside of the wafer, it can hook the inner ring of the iron ring to prevent the iron ring from falling; the verticality of the wafer transportation can be guaranteed by the centering mechanism, and the wafer can be centered and positioned after it moves to the set position to ensure the accuracy of the wafer transportation position; the clamping and transporting device realizes the vertical transport of the wafer, which can reduce the possibility of dust particles above the equipment adhering to the wafer surface, and uses rollers to support the iron ring on the side, which effectively reduces the dirt caused by friction and ensures the stability of the vertical transport of the wafer; the clamping and transporting device has a wide application and can adapt to the clamping and transport of wafers of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the axial structure of the wafer clamping and handling device disclosed in an embodiment of the present utility model;

[0016] Figure 2 This is a schematic diagram of the front structure of the wafer clamping and handling device disclosed in an embodiment of the present utility model;

[0017] Figure 3 This is a schematic structural diagram of the clamping mechanism disclosed in an embodiment of the present utility model;

[0018] Figure 4 This is a schematic structural diagram of the second splint disclosed in an embodiment of the present utility model;

[0019] Figure 5 This is a structural diagram of the centering mechanism disclosed in an embodiment of the present utility model;

[0020] Figure 6 This is a schematic diagram of the state structure of the wafer clamping and transporting device disclosed in an embodiment of the present utility model when transporting a wafer.

[0021] Figure markings: 1-frame, 2-lifting module, 3-bracket, 4-clamping mechanism, 41-first connecting plate, 42-first cylinder, 43-adapter plate, 44-second connecting plate, 441-first connecting hole, 442-second connecting hole, 45-third connecting plate, 46-second cylinder, 47-first clamping plate, 48-second clamping plate, 481-boss, 49-first linear guide, 5-centering mechanism, 51-motor, 52-belt, 53-centering track assembly, 531-mounting plate, 532-first centering base plate, 533-third cylinder, 534-second centering base plate, 535-roller, 536-guide plate, 537-calibration plate, 538-guide member, 539-limiting member, 5391-fourth cylinder, 5392-limiting rod, 54-second linear guide. DETAILED DESCRIPTION

[0022] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0023] like Figure 1-6As shown, a wafer clamping and transporting device is used for vertical transport of wafers with iron rings, which can greatly reduce the possibility of dust particles above the equipment adhering to the surface of the wafer, and can effectively reduce the dirt caused by friction. The clamping and transporting device includes a frame 1, a lifting module 2 is provided on the right side of the frame 1, the lifting module 2 is connected to a horizontally arranged bracket 3, the left end of the bracket 3 is connected to a clamping mechanism 4, and a centering mechanism 5 is provided on the frame 1. Among them, the lifting module 2 can drive the bracket 3 and the clamping mechanism 4 connected to the bracket 3 to rise and fall, the clamping mechanism 4 is used to hook the iron ring on the outside of the wafer, and the vertical transport of the wafer is achieved by lifting and lowering the clamping mechanism 4; the centering mechanism 5 is used to locate the position of the wafer, ensure the verticality and vertical lifting of the wafer, and reduce the adhesion of dust particles to the surface of the wafer.

[0024] In the present application, the centering mechanism 5 includes a motor 51 and a belt 52. The motor 51 and the belt 52 form a horizontal conveyor line, which can drive the two centering track assemblies 53 connected to the belt 52 to move in opposite directions, thereby driving the two centering track assemblies 53 to move closer or farther away from each other, clamping the wafer with the iron ring, and adapting to the centering of wafers of different sizes. A horizontally arranged second linear guide 54 is connected between the two centering track assemblies 53 and the frame 1 to facilitate the smooth and stable left and right movement of the centering track assemblies 53. The centering track assembly 53 includes a vertically arranged mounting plate 531 connected to the second linear guide 54, a vertically arranged first centering base plate 532 is provided on the mounting plate 531, a horizontally arranged third cylinder 533 is provided in the middle of the mounting plate 531, and the third cylinder 533 is connected to a vertically arranged second centering base plate 534. The first centering base plate 532 and the second centering base plate 534 are symmetrically arranged front to back, and the first centering base plate 532 and the second centering base plate 534 are both provided with a plurality of rollers 535 spaced apart from each other. The mounting plate 531 is connected to the belt 52, and is driven by the belt 52 to move the mounting plate 531 along the second linear guide rail 54. The mounting plate 531 is used to mount the first and second centering base plates 532, 534. The third cylinder 533 drives the second centering base plate 534 back and forth, adjusting the spacing between the second and first centering base plates 534, and thereby adjusting the spacing between the corresponding rollers 535 on the first and second centering base plates 532, 534. This ensures that wafers passing between the rollers 535 are positioned and maintained vertically. The second centering base plate 534 can be moved back and forth by the third cylinder 533, adapting to the iron rings connected to wafers of different sizes and thicknesses, ensuring the adaptability of the centering mechanism 5.

[0025] In the present application, the clamping mechanism 4 includes a first connecting plate 41, a first cylinder 42, an adapter plate 43, a second connecting plate 44 and a third connecting plate 45. The first connecting plate 41 is used to connect to the bracket 3 and the installation of the first cylinder 42. The first cylinder 42 can drive the adapter plate 43 to rise and fall, and then drive the second connecting plate 44 and the third connecting plate 45 to rise and fall, so as to facilitate the lifting of the first clamping plate 47, the second cylinder 46 and the second clamping plate 48 connected to the third connecting plate 45, so as to clamp the iron ring outside the wafer after the material is divided. The adapter plate 43 facilitates the rotation adjustment of the second connecting plate 44, thereby ensuring that the first clamping plate 47 and the second clamping plate 48 effectively clamp the iron ring outside the wafer. The second cylinder 46 connected to the third connecting plate 45 is used to drive the second clamping plate 48 to move back and forth, so as to clamp the iron ring outside the wafer together with the first clamping plate 47, that is, to realize the clamping action.

[0026] Based on the above scheme, the adapter plate 43 is provided with a first connecting hole 441 and a second connecting hole 442 that pass through the front and back for connection with the second connecting plate 44. The first connecting hole 441 is a circular hole, and the second connecting hole 442 is an arc-shaped waist hole and there are two of them. The two second connecting holes 442 are symmetrically arranged on the left and right sides of the first connecting hole 441, that is, the adapter plate 43 can rotate relative to the second connecting plate 44 with the first connecting hole 441 as a reference, and form a rotation angle limit through the two second connecting holes 442, ensuring that the second connecting plate 44 can rotate within a limited range relative to the adapter plate 43, ensuring the fine adjustment of the first clamping plate 47 and the second clamping plate 48 when clamping the iron ring, which can not only ensure the stability of the first clamping plate 47 and the second clamping plate 48 in clamping the wafer, but also ensure the effectiveness of the clamping.

[0027] Based on the above scheme, a first linear guide rail 49 is provided between the second connecting plate 44 and the third connecting plate 45, and a spring is provided between the upper end of the third connecting plate 45 and the second connecting plate 44. Through the setting of the first linear guide rail 49 and the spring, the third connecting plate 45 can move downward relative to the second connecting plate 44, thereby realizing fine-tuning of the height position of the first clamping plate 47 and the second clamping plate 48 connected to the third connecting plate 45, and having an elastic buffering effect, thereby ensuring that the first clamping plate 47 and the second clamping plate 48 effectively clamp the wafer; ensuring that fine-tuning of the displacement of the wafer during centering positioning can be realized, and that the first clamping plate 47 and the second clamping plate 48 can continuously and effectively clamp the iron ring on the outside of the wafer during centering positioning.

[0028] Based on the above solution, a boss 481 is provided at the lower end of the second clamping plate 48 near the side of the first clamping plate 47, which can hook the inner ring of the iron ring to prevent the iron ring from falling, that is, to prevent the wafer from falling.

[0029] In the present application, a guide plate 536 is connected to the lower end of the first pair of centering substrates 532 and the second pair of centering substrates 534. The two guide plates 536 of the first pair of centering substrates 532 and the second pair of centering substrates 534 are arranged correspondingly, and the guide plates 536 are used to guide and position the wafers to ensure accurate clamping of the wafers after separation; the upper and lower ends of the guide plates 536 are provided with inclined surfaces to facilitate the smooth insertion of the iron ring connected to the outside of the wafer between the two guide plates 536 without scratching the iron ring or the wafer.

[0030] In this application, rollers 535 on the first and second centering substrates 532, 534 are arranged in a one-to-one correspondence, capable of clamping the iron ring connected to the wafer in the middle, supporting and positioning the iron ring, and ensuring the verticality of the wafer. A calibration plate 537 is provided on the first centering substrate 532, and the calibration plate 537 has a calibration groove for engaging the rollers 535, ensuring that the rollers 535 on the first and second centering substrates 532, 534 are in a one-to-one correspondence, thereby ensuring effective support for the front and back sides of the iron ring.

[0031] In the present application, a plurality of guide members 538 are provided between the second centering substrate 534 and the mounting plate 531. The guide members 538 are composed of guide rods and linear bearings. The setting of the guide members 538 ensures that the second centering substrate 534 moves forward and backward steadily and smoothly.

[0032] In the present application, a limiter 539 is provided in the middle of the mounting plate 531. The limiter 539 includes a fourth cylinder 5391 mounted on the mounting plate 531. The fourth cylinder 5391 is arranged front and back, and its front piston rod end is connected to a limiter rod 5392. The limiter rod 5392 is movably inserted into the sides of the first and second centering substrates 532 and 534. The limiter 539 can limit the position below the clamped wafer to prevent the wafer clamped by the clamping mechanism 4 from falling, thereby preventing the wafer from being damaged and causing great losses. After the clamping mechanism 4 clamps the iron ring on the outside of the wafer, the lifting module 2 drives the wafer to be transported vertically upward. When the wafer is transported to the set height position, the limit member 539 is actuated, and the limit rod 5392 is driven forward by the fourth cylinder 5391, and inserted into the side of the second centering substrate 534, and located between the corresponding rollers 535. The limit rod 5392 is located below the wafer, limiting the downward movement of the wafer, and preventing the wafer from falling.

[0033] In the present application, the working process of the clamping and transporting device is as follows: the wafer material box with the material divided and equipped with the iron ring is transported to the bottom of the clamping and transporting device, the lifting module 2 is actuated, driving the bracket 3 and the clamping mechanism 4 to descend, and the clamping mechanism 4 is moved to the top of the material box; then the clamping mechanism 4 is actuated, the first cylinder 42 is actuated, driving the adapter plate 43, the second connecting plate 44, the third connecting plate 45, the second cylinder 46, the first clamping plate 47 and the second clamping plate 48 to descend synchronously, so that the first clamping plate 47 and the second clamping plate 48 are located on both sides of the wafer to be clamped, and then the second cylinder 46 is actuated to drive the second clamping plate 48 to move backward, clamping the iron ring on the wafer between the first clamping plate and the second clamping plate. Plate 47 and the second clamping plate 48, at this time, the boss 481 on the second clamping plate 48 hooks the inner ring of the iron ring; then the lifting module 2 drives the clamping mechanism 4 to rise, and at this time the iron ring on the outside of the wafer moves upward along the roller gap on the two centering rail assemblies 53, and stops rising when the wafer rises to the set position; finally, the centering mechanism 5 is actuated, and the motor 51 drives the belt 52 to rotate, driving the two centering rail assemblies 53 to move toward each other along the second linear guide rail 54, centering the wafer with the iron ring, and accurately positioning the wafer. After positioning is completed, the limit member 539 is actuated, and the fourth cylinder 5391 drives the limit rod 5392 to move to the bottom of the wafer.

[0034] Finally, it should be noted that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention.

Claims

1. A wafer clamping and transporting device, comprising a frame (1), wherein a lifting module (2) is provided on the right side of the frame (1), characterized in that: The lifting module (2) is connected to a horizontally arranged bracket (3), the left end of the bracket (3) is connected to a clamping mechanism (4), and the frame (1) is provided with a centering mechanism (5); the centering mechanism (5) comprises a motor (51), the motor (51) is fixed to the rear side of the frame (1), the motor (51) is connected to a horizontally rotating belt (52), the belt (52) is connected to two vertically arranged centering rail assemblies (53), the two centering rail assemblies (53) are respectively connected to the upper and lower sides of the belt (52), and a horizontally arranged second straight line is connected between the two centering rail assemblies (53) and the frame (1). The guide rail (54); the centering track assembly (53) comprises a vertically arranged mounting plate (531) connected to the second linear guide rail (54); a vertically arranged first centering base plate (532) is provided on the mounting plate (531); a horizontally arranged third cylinder (533) is provided in the middle of the mounting plate (531); the third cylinder (533) is connected to a vertically arranged second centering base plate (534); the first centering base plate (532) and the second centering base plate (534) are symmetrically arranged front to back; and a plurality of rollers (535) are provided on the first centering base plate (532) and the second centering base plate (534) at intervals in the upper and lower directions.

2. The wafer clamping and transporting device according to claim 1, characterized in that: The clamping mechanism (4) includes a first connecting plate (41) connected to the bracket (3), a first cylinder (42) arranged vertically downward is provided on the first connecting plate (41), the lower end of the first cylinder (42) is connected to an adapter plate (43), the adapter plate (43) is rotatably connected to a second connecting plate (44), the second connecting plate (44) is slidably connected to a third connecting plate (45), a second cylinder (46) arranged front and back is installed on the rear side of the third connecting plate (45), the lower end of the third connecting plate (45) is connected to a first clamping plate (47) arranged vertically, the front end piston rod end of the second cylinder (46) is connected to a second clamping plate (48), and the second clamping plate (48) is arranged in coordination with the first clamping plate (47).

3. The wafer holding and transporting device according to claim 2, characterized in that: The adapter plate (43) is provided with a first connection hole (441) and a second connection hole (442) which pass through the adapter plate (43) and are used for connecting to the second connection plate (44). The first connection hole (441) is a circular hole, and there are two second connection holes (442) which are arc-shaped waist holes. The two second connection holes (442) are symmetrically arranged on the left and right sides of the first connection hole (441).

4. The wafer clamping and transporting device according to claim 2, characterized in that: A first linear guide rail (49) is provided between the second connecting plate (44) and the third connecting plate (45), and a spring is provided between the upper end of the third connecting plate (45) and the second connecting plate (44).

5. The wafer holding and transporting device according to claim 2, characterized in that: A boss (481) is provided at the lower end of the second clamping plate (48) near the side of the first clamping plate (47).

6. The wafer holding and transporting device according to claim 1, characterized in that: The lower ends of the first pair of centering substrates (532) and the second pair of centering substrates (534) are both connected to a guide plate (536), the two guide plates (536) of the first pair of centering substrates (532) and the second pair of centering substrates (534) are arranged correspondingly, and the upper and lower ends of the guide plates (536) are both provided with inclined surfaces.

7. The wafer clamping and transporting device according to claim 1, characterized in that: The rollers (535) on the first centering substrate (532) and the second centering substrate (534) are arranged in a one-to-one correspondence; a calibration plate (537) is provided on the first centering substrate (532); and a calibration groove for engaging the rollers (535) is provided on the calibration plate (537).

8. The wafer holding and transporting device according to claim 1, wherein: A plurality of guide members (538) are provided between the second centering base plate (534) and the mounting plate (531), and the guide members (538) are composed of guide rods and linear bearings.

9. The wafer holding and transporting device according to claim 1, characterized in that: A limiting member (539) is provided in the middle of the mounting plate (531), and the limiting member (539) includes a fourth cylinder (5391) installed on the mounting plate (531). The fourth cylinder (5391) is arranged front and back, and its front end piston rod end is connected to a limiting rod (5392), and the limiting rod (5392) is movably inserted into the side of the first centering base plate (532) and the second centering base plate (534).

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