Wafer jaw structure and wafer chuck

Abstract

The utility model provides a wafer clamping jaw structure and a wafer chuck. The wafer clamping jaw structure comprises a connecting rod, a transmission member, a rotating shaft, a bearing platform and a clamping jaw. Wherein the transmission part is fixed at one end of the connecting rod; the rotating shaft is fixed at one end of the connecting rod away from the transmission part; the bearing table is fixed at one end, far away from the connecting rod, of the rotating shaft, and the bearing table is conical to provide an inclined conical surface for bearing a wafer; and the clamping jaw is fixed at one end, far away from the connecting rod, of the rotating shaft, is positioned on the side edge of the bearing table, and rotates by a specified included angle along a first direction or a second direction opposite to the first direction through the transmission part, so that the clamping jaw synchronously operates to clamp or release the wafer. The wafer clamping jaw structure and the wafer chuck provided by the utility model have the advantages of simple structure, strong operation convenience and firm clamping, and can avoid damage to the back surface of the wafer.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor equipment and relates to a wafer clamping claw structure and a wafer chuck. Background Art

[0002] During the processing of semiconductor devices, it is usually necessary to rotate the wafer, such as during the wafer cleaning process, the spin-drying process, etc. Among them, when the wafer is rotated, the wafer is rotated by the rotation of the wafer chuck. For example, in the wafer cleaning process, the wafer is clamped by the wafer chuck and the wafer on the wafer chuck is rotated when the wafer chuck rotates, so that the chemical solution can be evenly sprayed on the wafer surface, improving the uniformity of the chemical solution distribution; or in the wafer spin-drying process, the wafer is clamped by the wafer chuck and the centrifugal force is used to drive the wafer on the wafer chuck to rotate when the wafer chuck rotates, so as to achieve rapid wafer drying.

[0003] Based on different processes, the way to hold the wafer is also different. For example, when the wafer needs to be cleaned on the front side of the wafer, if there is a precision circuit on the back side, the back side of the wafer must not touch the wafer chuck during the cleaning process to prevent damage to the circuit. In this scenario, the wafer needs to be suspended on the wafer chuck and fixed to achieve the purpose of cleaning without touching the circuit on the back side of the wafer. The claws that clamp and release the wafer must not only meet the basic requirements of firm clamping, but also meet the requirements of easy operation and low damage to the wafer. The existing wafer claw structure is difficult to meet these requirements.

[0004] Therefore, it is necessary to provide a wafer clamping claw structure and a wafer chuck. Utility Model Content

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a wafer clamping claw structure and a wafer chuck, which are used to solve the problem that the wafer chuck in the prior art is difficult to meet application requirements.

[0006] To achieve the above-mentioned and other related purposes, the present invention provides a wafer clamping claw structure, which includes:

[0007] Connecting rod;

[0008] a transmission member fixed to one end of the connecting rod;

[0009] a rotating shaft, the rotating shaft being fixed to an end of the connecting rod away from the transmission member;

[0010] A carrying platform, the carrying platform is fixed to an end of the rotating shaft away from the connecting rod, and the carrying platform is conical to provide an inclined conical surface for carrying the wafer;

[0011] The clamping claw is fixed to one end of the rotating shaft away from the connecting rod, and the clamping claw is located on the side of the supporting platform. The transmission member is rotated along a first direction or a second direction opposite thereto by a specified angle to make the clamping claw run synchronously to clamp or release the wafer.

[0012] Optionally, a waist-shaped hole is provided on the connecting rod, and the transmission member and / or the rotating shaft is fixed to the connecting rod through the waist-shaped hole.

[0013] Optionally, the transmission member includes a roller or a gear.

[0014] Optionally, the clamping claw includes a clamping claw with a clamping groove at the end or a clamping claw with a clamping plate at the end.

[0015] Optionally, the clamping slot or the clamping plate has an inclined surface, so that when clamping the wafer, the inclined surface can contact the wafer.

[0016] Optionally, the claw comprises a rigid core layer and a flexible cladding layer.

[0017] Optionally, the core layer includes a carbon fiber core layer, and the cladding layer includes a PCTEF cladding layer, an ETFE cladding layer or a PFA cladding layer.

[0018] Optionally, the rotating shaft is further provided with a rotating shaft collar, which is connected to the housing via the rotating shaft collar, and the rotating shaft collar comprises a silicon carbide collar or a silicon nitride collar.

[0019] Optionally, the transmission mode of the transmission member includes bearing transmission, gear transmission, belt transmission, chain transmission, hydraulic transmission or pneumatic transmission.

[0020] The present application also provides a wafer chuck, which includes any of the above-mentioned wafer claw structures, wherein the number of the wafer claw structures arranged on the wafer chuck is N, 3≤N, and the N wafer claw structures are distributed at equal intervals along the circumferential direction.

[0021] As described above, the wafer clamping claw structure and wafer chuck of the present invention include a connecting rod, a transmission member, a rotating shaft, a supporting platform, and a clamping claw. The transmission member is fixed to one end of the connecting rod; the rotating shaft is fixed to the end of the connecting rod away from the transmission member; the supporting platform is fixed to the end of the rotating shaft away from the connecting rod, and the supporting platform is conical to provide an inclined conical surface for supporting the wafer; the clamping claw is fixed to the end of the rotating shaft away from the connecting rod, and the clamping claw is located on the side of the supporting platform. The transmission member is rotated in a first direction or a second direction opposite thereto by a specified angle, so that the clamping claw operates synchronously to clamp or release the wafer.

[0022] The utility model can provide a wafer clamping claw structure and a wafer chuck which have simple structure, convenient operation and firm clamping, and can avoid damage to the back side of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Shown is a schematic diagram of the three-dimensional structure of the wafer clamping claw structure in an embodiment of the present utility model.

[0024] Figure 2 Shown is another three-dimensional structural schematic diagram of the wafer clamping claw structure in an embodiment of the present invention.

[0025] Figure 3 Shown is a schematic diagram of the top view of the wafer chuck in an embodiment of the present invention.

[0026] Figure 4 Display as Figure 3 Schematic diagram of the cross-sectional structure along the C-C' line.

[0027] Description of Reference Numerals

[0028] 100 Shell

[0029] 200 wafer claw structure

[0030] 201 Transmission parts

[0031] 202 connecting rod

[0032] 203 Shaft

[0033] 204 Loading Platform

[0034] 205 claws

[0035] 300 shaft collar DETAILED DESCRIPTION

[0036] The following describes the embodiments of the present invention through specific examples. Those skilled in the art will readily understand the other advantages and benefits of the present invention from the disclosure herein. The present invention may also be implemented or applied through various other specific embodiments, and the details in this specification may be modified or altered based on different perspectives and applications without departing from the spirit of the present invention.

[0037] See also Figures 1 to 4 It should be noted that the illustrations provided in this embodiment are merely schematic illustrations of the basic concept of the present invention. Therefore, the illustrations only show components relevant to the present invention and are not drawn according to the number, shape, and size of components in actual implementation. In actual implementation, the type, quantity, and proportion of each component may be arbitrarily changed, and the component layout may also be more complex.

[0038] This embodiment provides a wafer clamping claw structure 200, which includes:

[0039] Connecting rod 202;

[0040] A transmission member 201, the transmission member 201 being fixed to one end of the connecting rod 202;

[0041] a rotating shaft 203 , the rotating shaft 203 being fixed to an end of the connecting rod 202 away from the transmission member 201 ;

[0042] The carrying platform 204 is fixed to the end of the rotating shaft 203 away from the connecting rod 202. The carrying platform 204 is conical to provide an inclined conical surface for carrying wafers;

[0043] The claw 205 is fixed to one end of the rotating shaft 203 away from the connecting rod 202, and the claw 205 is located on the side of the supporting platform 204. The transmission member 201 is rotated along a first direction or a second direction opposite thereto by a specified angle, so that the claw 205 runs synchronously to clamp or release the wafer.

[0044] This embodiment can provide a wafer clamping claw structure with a simple structure, convenient operation, and firm clamping, and can avoid damage to the back side of the wafer.

[0045] Specifically, such as Figure 3 and Figure 4 When the supporting platform 204 is conical, the inclined conical surface of the supporting platform 204 can contact the edge of the wafer, so that the wafer can be suspended by supporting the wafer through the multiple supporting platforms 204. The inclined conical surface can prevent the supporting platforms 204 from rubbing against the back of the wafer when rotating, thereby avoiding damage to the back of the wafer.

[0046] As an example, the transmission member 201 may include a roller or a gear, and the transmission method of the transmission member 201 may include bearing transmission, gear transmission, belt transmission, chain transmission, hydraulic transmission or pneumatic transmission.

[0047] Specifically, such as Figure 1 The structure of using a roller as the transmission member 201 is shown, so that the transmission member 201 is rotated along a first direction or a second direction opposite thereto by a specified angle through a bearing drive or a belt drive, and referring to Figure 3 and Figure 4Since the rotating shaft 203 is connected to the shell 100, when the transmission member 201 rotates, the connecting rod 202 swings in a first direction or a second direction opposite thereto, so that the rotating shaft 203 connected to the other end of the connecting rod 202 and the supporting platform 204 and the clamping claw 205 located at the end of the rotating shaft 203 rotate synchronously, so that the wafer located on the supporting platform 204 can be clamped and released by the rotation of the clamping claw 205.

[0048] Of course, as required, the transmission member 201 may also be Figure 2 The gear in the transmission member 201 is used to rotate at a specified angle along a first direction or a second direction opposite thereto through a gear transmission, a chain transmission, etc.

[0049] The transmission method of the transmission member 201 is not particularly limited here, and the rotation of the transmission member 201 can also be achieved through hydraulic transmission or pneumatic transmission, etc., which is not particularly limited here.

[0050] To facilitate the installation, replacement, and maintenance of components, in this embodiment, the housing 100 may include an upper housing and a lower housing to provide a cavity for mounting components. This protects the components mounted in the cavity from damage by, for example, cleaning fluids. The material and assembly of the housing 100 are not limited herein.

[0051] As an example, a waist-shaped hole may be provided on the connecting rod 202 , and the transmission member 201 and / or the rotating shaft 203 are fixed to the connecting rod 202 through the waist-shaped hole.

[0052] Specifically, after the waist-shaped hole is set on the connecting rod 202, the transmission member 201 and / or the rotating shaft 203 can be fixed to the connecting rod 202 through the waist-shaped hole, and the distance between the transmission member 201 and the rotating shaft 203 can be conveniently changed through the waist-shaped hole, so that the position of the transmission member 201 can be conveniently adjusted, so that the transmission member 201 can be in good contact with its adapted parts, thereby extending its service life.

[0053] As an example, the clamping claw 205 includes a clamping claw with a clamping groove at the end or a clamping claw with a clamping plate at the end.

[0054] Specifically, when the clamping claw 205 is provided with a clamping slot or a clamping plate at its end, the clamping slot or the clamping plate can be used to clamp the edge of the wafer to fix the wafer on the carrier 204. In this embodiment, a clamping claw with a relatively simple structure and a clamping slot at the end is used, but the type of the clamping claw 205 is not limited to this.

[0055] Furthermore, it is preferred that the card slot or the card plate has an inclined surface, so that when the card slot or the card plate clamps the wafer, the inclined surface set on the card slot or the card plate can contact the wafer to apply downward pressure to the wafer, so that after combined with the support of the carrier 204, the wafer can be firmly clamped.

[0056] As an example, the clamping jaw 205 includes a rigid core layer and a flexible cladding layer, wherein the core layer may include a carbon fiber core layer, and the cladding layer may include a PCTEF cladding layer, an ETFE cladding layer, or a PFA cladding layer.

[0057] Specifically, when the clamping claw 205 is composed of a rigid core layer and a flexible cladding layer, the rigid core layer can provide sufficient supporting force, and the flexible cladding layer located on the outside can avoid damage to the wafer when clamping the wafer.

[0058] In this embodiment, the core layer is made of a carbon fiber core layer, and the cladding is made of a flexible and corrosion-resistant material to improve the corrosion resistance of the clamping claw 205 while avoiding damage to the wafer, thereby extending the service life and reducing contamination to the wafer. For example, the cladding can be made of PCTEF cladding, ETFE cladding or PFA cladding, but the types of the core layer and the cladding are not limited to this.

[0059] As an example, the shaft 203 may also be provided with a shaft collar 300, which is connected to the housing 100 through the shaft collar 300. The shaft collar 300 may include a silicon carbide collar or a silicon nitride collar.

[0060] Specifically, such as Figure 3 and Figure 4 In this embodiment, the carrier 204 for carrying the wafer and the clamping claw 205 for clamping the wafer are both arranged above the housing 100, and the rotating shaft 203 passes through the housing 100 and is movably connected to the housing 100. Figure 4 In this embodiment, the outer side of the rotating shaft 203 is preferably provided with a rotating shaft ring 300, so that the rotating shaft 203 is movably connected to the shell 100 through the rotating shaft ring 300, wherein the rotating shaft ring 300 is preferably made of a wear-resistant and corrosion-resistant high-hardness material, such as a silicon carbide rotating shaft or a silicon nitride rotating shaft, so as to extend the service life and reduce the amount of pollutants generated by friction.

[0061] This embodiment also provides a wafer chuck, which includes the wafer claw structure, wherein the number of the wafer claw structures 200 provided on the wafer chuck is N, 3≤N, and the N wafer claw structures 200 are distributed at equal intervals along the circumferential direction.

[0062] Specifically, such as Figure 3In this embodiment, the wafer chuck is provided with six wafer claw structures 200 above the housing 100, i.e., N is 6. However, the value of N is not limited thereto. Preferably, 3 ≤ N, such as N being 3, 4, 5, 6, etc., and preferably, the N wafer claw structures 200 are evenly spaced along the circumference, so that the subsequently clamped wafers are evenly stressed, thereby avoiding the risk of wafer fragmentation due to uneven stress during the rotation operation. The specific value of N is not excessively limited herein.

[0063] In summary, the wafer clamping claw structure and wafer chuck of the present invention include a connecting rod, a transmission member, a rotating shaft, a supporting platform, and a clamping claw. The transmission member is fixed to one end of the connecting rod; the rotating shaft is fixed to the end of the connecting rod away from the transmission member; the supporting platform is fixed to the end of the rotating shaft away from the connecting rod, and the supporting platform is conical to provide an inclined conical surface for supporting the wafer; the clamping claw is fixed to the end of the rotating shaft away from the connecting rod, and the clamping claw is located on the side of the supporting platform. The transmission member is rotated in a first direction or a second direction opposite thereto by a specified angle, so that the clamping claw operates synchronously to clamp or release the wafer.

[0064] The utility model can provide a wafer clamping claw structure and a wafer chuck which have simple structure, convenient operation and firm clamping, and can avoid damage to the back side of the wafer.

[0065] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed in the present invention are intended to be covered by the claims of the present invention.

Claims

1. A wafer clamping claw structure, characterized in that: The wafer claw structure includes: Connecting rod; a transmission member fixed to one end of the connecting rod; a rotating shaft, the rotating shaft being fixed to an end of the connecting rod away from the transmission member; A carrying platform, the carrying platform is fixed to an end of the rotating shaft away from the connecting rod, and the carrying platform is conical to provide an inclined conical surface for carrying the wafer; The clamping claw is fixed to one end of the rotating shaft away from the connecting rod, and the clamping claw is located on the side of the supporting platform. The transmission member is rotated along a first direction or a second direction opposite thereto by a specified angle to make the clamping claw run synchronously to clamp or release the wafer.

2. The wafer clamping claw structure according to claim 1, wherein: The connecting rod is provided with a waist-shaped hole, and the transmission member and / or the rotating shaft is fixed to the connecting rod through the waist-shaped hole.

3. The wafer clamping claw structure according to claim 1, wherein: The transmission member includes a roller or a gear.

4. The wafer clamping claw structure according to claim 1, wherein: The clamping claw includes a clamping claw with a clamping groove at the end or a clamping claw with a clamping plate at the end.

5. The wafer clamping claw structure according to claim 4, characterized in that: The clamping slot or the clamping plate has an inclined surface, so that when clamping the wafer, the inclined surface contacts the wafer.

6. The wafer clamping claw structure according to claim 1, wherein: The clamping jaw includes a rigid core layer and a flexible covering layer.

7. The wafer clamping claw structure according to claim 6, wherein: The core layer includes a carbon fiber core layer, and the cladding layer includes a PCTEF cladding layer, an ETFE cladding layer or a PFA cladding layer.

8. The wafer clamping claw structure according to claim 1, wherein: The rotating shaft is also provided with a rotating shaft collar, which is connected to the housing through the rotating shaft collar. The rotating shaft collar includes a silicon carbide collar or a silicon nitride collar.

9. The wafer clamping claw structure according to claim 1, wherein: The transmission mode of the transmission member includes bearing transmission, gear transmission, belt transmission, chain transmission, hydraulic transmission or pneumatic transmission.

10. A wafer chuck, characterized in that: The wafer chuck includes the wafer claw structure according to any one of claims 1 to 9, wherein the number of the wafer claw structures arranged on the wafer chuck is N, 3≤N, and the N wafer claw structures are distributed at equal intervals along the circumferential direction.

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