Semiconductor refrigeration magnetic attraction wireless power bank

Abstract

The utility model discloses a semiconductor refrigeration magnetic attraction wireless power bank in the technical field of magnetic attraction wireless power banks, which comprises a shell, and a semiconductor cooling module, a magnetic attraction wireless charging and discharging assembly and a battery which are arranged in the shell, in the semiconductor cooling module, the cold end of a semiconductor refrigeration sheet is tightly attached to a cold expansion sheet, and the hot end of the semiconductor refrigeration sheet is tightly attached to a fan assembly; the cavity where the fan assembly is located is connected with the air inlet of the shell through the air inlet channel and connected with the air outlet of the shell through the air outlet channel, the magnetic attraction wireless charging and discharging assembly is arranged on the cold expansion piece, part / all of the battery is flatly laid on the air inlet side of the fan assembly, and the air inlet channel bypasses the battery. According to the utility model, the internal space of the power bank is fully utilized to place the battery, the application of the large-capacity battery is realized, the defect that the coil part cannot be effectively cooled by utilizing a heat dissipation channel in the existing magnetic wireless power bank can be solved, and the magnetic wireless charging and discharging part is integrally mounted on the cold expansion sheet on the basis, so that the heat dissipation effect is improved. Therefore, uniform cooling is realized.

Description

Technical Field

[0001] The utility model relates to the technical field of magnetic wireless charging treasures, and in particular to a semiconductor refrigeration magnetic wireless charging treasure. Background Art

[0002] As we all know, the current flowing through the coil in a magnetic wireless power bank creates a magnetic field, which easily generates a large amount of heat. This in turn causes the temperature of the magnets and coils in the magnetic power bank to rise. This heated electromagnetic charging and discharging process affects the efficiency of charging and discharging. The charged device is usually equipped with over-temperature protection. Traditional magnetic wireless power banks can cause excessive heat during charging of Apple phones, causing the charging to pause and displaying a message such as "Charging Paused Due to Overtemperature" on the phone screen. Therefore, the high temperature problem faced by magnetic wireless power banks was an initial challenge.

[0003] In order to solve this defect, fans are often placed in existing magnetic wireless power banks to dissipate heat; for high-power magnetic power banks, semiconductor refrigerators are also required for cooling. A semiconductor refrigerator is a device that uses the thermoelectric effect of a semiconductor for cooling. It has a cold end and a hot end. The cold end can be used to cool the magnetic power bank, and the heat from the hot end can be dissipated by a fan. For example, the utility model patent with the authorization announcement number CN218276149U discloses a wireless mobile power supply, in which a circuit board is fixed on one side of the body, a battery is provided on one side of the circuit board, a mounting plate is provided on the outside of the battery, a charging coil is fixed on the mounting plate, and a semiconductor cooling plate is installed on one side of the mounting plate; a heat dissipation fan is installed on the other side of the base, and the heat generated by the semiconductor cooling plate is discharged through the heat dissipation fan.

[0004] In this structure, the cooling fan is used to extract and dissipate heat from the semiconductor refrigeration chip, but the cooling fan is located on the shell, and there is no dedicated air duct for heat dissipation in the entire mobile power supply, resulting in the high-temperature gas cannot be effectively dissipated.

[0005] Furthermore, in magnetic wireless power banks, the hottest part is the magnetic wireless charging and discharging assembly, and the semiconductor cooling plate of this structure cannot accurately cool this part. Even though some products can attach the semiconductor cooling plate to the coil, the current semiconductor cooling plates are prone to the defect of cold energy concentration during cooling. This results in the power bank being extremely cold at the coil position, while the temperature in other parts remains high, resulting in uneven cooling.

[0006] Existing power banks have low internal space utilization and limited battery placement, making it difficult to install and place large-capacity batteries.

[0007] The above defects deserve improvement. Utility Model Content

[0008] In order to overcome the shortcomings of the existing technology, the utility model provides a semiconductor refrigeration magnetic wireless power bank. The utility model can make full use of the internal space of the power bank to place batteries, thereby realizing the use of large-capacity batteries; the utility model can solve the defect that the existing magnetic wireless power bank cannot use the heat dissipation channel to effectively cool the coil part, and on this basis, the magnetic wireless charging and discharging part is mounted as a whole on the cooling plate to achieve uniform cooling.

[0009] The technical solution of this utility model is as follows:

[0010] A semiconductor refrigeration magnetic wireless charging treasure, characterized by comprising:

[0011] a housing, wherein the housing is provided with an air inlet and an air outlet;

[0012] A semiconductor cooling module, comprising a fan assembly, a semiconductor cooling sheet, and a cooling expansion sheet, wherein the cooling expansion sheet is in close contact with the cold end of the semiconductor cooling sheet, and the hot end of the semiconductor cooling sheet is in close contact with the fan assembly. The chamber where the fan assembly is located is connected to the air inlet via an air inlet channel, and the chamber is connected to the air outlet via an air outlet channel.

[0013] A magnetic wireless charging and discharging component, the magnetic wireless charging and discharging component is placed on the cooling expansion plate;

[0014] The battery is partially / entirely laid on the air inlet side of the fan assembly, and the air inlet channel bypasses the battery and connects to the chamber where the fan assembly is located and the air inlet.

[0015] The utility model according to the above solution is characterized in that the battery includes a first battery and a second battery, the second battery is located beside the semiconductor cooling module, and the first battery is located below the second battery and the semiconductor cooling module.

[0016] The utility model according to the above solution is characterized in that the magnetic wireless charging and discharging component includes a magnet, a coil, and a magnetic sheet, the coil is placed on the magnetic sheet, and the magnetic sheet and the magnet are both in close contact with the cooling plate.

[0017] The utility model according to the above solution is characterized in that a circuit board and a heat conducting sheet are further provided in the housing, the heat conducting sheet is laid flat on the circuit board, and the heat conducting sheet is closely attached to the surface of the cooling fin.

[0018] The utility model according to the above solution is characterized in that the air inlet is a plurality of air inlet holes located at the corners of the shell, and two adjacent air inlet holes are arranged at intervals from each other.

[0019] The utility model according to the above solution is characterized in that the air inlet is an air inlet groove located at the corner of the shell, and the air inlet groove is formed by the side wall of the shell and the bottom plate of the shell being spaced apart from each other.

[0020] The utility model according to the above scheme is characterized in that the shell includes a bottom shell, an inner shell, and a panel, the bottom shell is provided with a first air inlet and a first air outlet, the inner shell is provided with a second air inlet and a second air outlet, the second air inlet is connected to the first air inlet, and the second air outlet is connected to the first air outlet.

[0021] Furthermore, the first air inlet is located at a corner of the bottom shell, and the first air outlet is located on a side surface of the bottom shell.

[0022] Furthermore, the second air inlet is located at a corner of the inner shell, so that the second air inlet corresponds to the position of the first air inlet.

[0023] Furthermore, the second air inlet is located on the bottom surface of the inner shell, and the second air inlet corresponds to the air inlet surface of the fan assembly, and the first air inlet is connected to the second air inlet via an air inlet channel.

[0024] The utility model according to the above solution has the following beneficial effects:

[0025] The utility model has a built-in semiconductor refrigeration sheet, which cools the magnetic wireless charging and discharging part through refrigeration to achieve a rapid cooling effect. In addition, by mounting the magnetic wireless charging and discharging part as a whole on the cooling sheet, the coil and magnet can undergo rapid heat exchange, thereby achieving uniform cooling.

[0026] The utility model can fully utilize the internal space of the power bank to place batteries (including the positions of the first battery and the second battery), can realize the use of large-capacity batteries, and can realize the small-volume design of the power bank.

[0027] The utility model solves the defect that the existing magnetic wireless power bank cannot use the heat dissipation channel to effectively cool the coil part by connecting the space where the fan assembly is located with the air inlet of the shell through the air inlet channel and connecting it with the air outlet of the shell through the air outlet channel. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a schematic structural diagram of the first embodiment of the present utility model;

[0029] Figure 2 This is an exploded view of the first embodiment of the present utility model;

[0030] Figure 3 This is a side sectional view of the first embodiment of the present utility model;

[0031] Figure 4 This is a schematic diagram of the heat dissipation channel in Example 1 of the present utility model;

[0032] Figure 5 This is a cross-sectional view of the cooling portion in Example 1 of the present utility model;

[0033] Figure 6 This is a schematic structural diagram of the second embodiment of the present utility model;

[0034] Figure 7 This is an exploded view of the second embodiment of the present utility model;

[0035] Figure 8 This is a side sectional view of the second embodiment of the present invention.

[0036] In the drawings, the reference numerals are:

[0037] 10. Bottom shell; 11. First air inlet; 12. First air outlet; 13. Connecting beam;

[0038] 20. Inner shell; 21. Second air inlet; 22. Second air outlet; 23. Guide arm; 24. Inner shell opening;

[0039] 31. First battery; 32. Second battery; 33. Battery heat shield;

[0040] 41. Fan assembly; 42. Semiconductor cooling fin; 43. Cooling fin; 44. Heat conducting fin;

[0041] 50. Circuit board;

[0042] 60. Magnetic wireless charging and discharging components;

[0043] 70. Panel. DETAILED DESCRIPTION

[0044] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0045] like Figures 1 to 8 As shown, in order to solve the defects of the existing magnetic wireless power bank that the internal space is limited and large-capacity batteries cannot be installed, and to solve the defects that the wireless magnetic part cannot be effectively dissipated, or even if it can dissipate heat, the temperature distribution is uneven, the utility model proposes a semiconductor refrigeration magnetic wireless power bank, which can use the layout of the internal space to place the battery to achieve large-capacity battery installation, and at the same time, the magnetic wireless charging and discharging component part is targeted cooled by the semiconductor refrigeration plate, and the temperature distribution of the cooling surface can be uniform, and the hot air can be discharged through the internal air flow channel, thereby achieving the purpose of efficient cooling.

[0046] The semiconductor refrigeration magnetic wireless power bank includes a housing and a semiconductor cooling module, a magnetic wireless charging and discharging component 60, and a battery disposed within the housing. The housing is provided with an air inlet and an air outlet for air intake and outlet, forming an airflow within the housing. The semiconductor cooling module includes a fan assembly 41, a semiconductor cooling sheet 42, and a cooling fin 43. The magnetic wireless charging and discharging component 60 is placed on the cooling fin 43, and the cooling fin 43 is in close contact with the cold end of the semiconductor cooling sheet 42, while the hot end of the semiconductor cooling sheet 42 is in close contact with the fan assembly 41. The chamber where the fan assembly 41 is located is connected to the air inlet via an air inlet channel, and the chamber is connected to the air outlet via an air outlet channel. Part or all of the battery is laid flat on the air inlet side of the fan assembly 41, and the air inlet channel bypasses the battery and connects the chamber where the fan assembly 41 is located and the air inlet.

[0047] Preferably, the housing includes a bottom shell 10, an inner shell 20, and a panel 70, wherein the bottom shell 10 and the panel 70 are connected to form a space for accommodating all components, and the inner shell 20 is placed in the space for isolating and installing the internal structure.

[0048] To achieve circuit control, the housing of the present invention also includes a circuit board 50, which is used to manage charge and discharge and control temperature. In a preferred embodiment, the housing also includes a heat conducting sheet 44, which is laid flat on the circuit board 50 and closely adheres to the surface of the cooling fins 43. This design allows the cooling energy of the semiconductor cooling sheet 42 to be transferred to the surface of the circuit board 50 via the cooling fins 43 and the heat conducting sheet 44, thereby cooling the circuit board 50.

[0049] In the present invention, the circuit board 50 is located on one side of the magnetic wireless charging and discharging assembly 60. The design of the heat conducting sheet 44 not only cools the circuit board 50, but also keeps the entire surface of the panel 70 in a cooled state, making the surface temperature of the panel 70 more uniform. This also cools the surfaces of electronic products such as mobile phones that come into contact with it. Preferably, the heat conducting sheet 44 is made of graphene, which not only reduces the weight of the component but also allows for high-speed temperature transfer. It also has strong deformation capabilities and is not affected by the internal space layout.

[0050] In this utility model, the battery includes a first battery 31 and a second battery 32. The second battery 32 is located next to the semiconductor cooling module, and the first battery 31 is located below the second battery 32 and the semiconductor cooling module. The use and layout design of the first and second batteries 31, 32 can increase the battery capacity compared to traditional power banks. The thin design of the first battery 31 also reduces the thickness of the entire power bank, facilitating the design and application of miniaturized, high-capacity power banks.

[0051] In the structure for realizing magnetic wireless charging and discharging, the magnetic wireless charging and discharging component 60 includes a magnet, a coil, and a magnetic sheet. The coil is placed on the magnetic sheet, and the magnetic sheet and the magnet are both in close contact with the cooling sheet 43. By arranging the magnet, coil, and magnetic sheet on the cooling sheet 43, and contacting the cooling sheet 43 with the cold end of the semiconductor cooling sheet 42, the cooling sheet 43 can be used to evenly diffuse the cold of the semiconductor cooling sheet 42, which can not only cool the coil, but also the magnet (the magnet is also a high-temperature component in the wireless charging and discharging process). In addition, the utility model can also use the cooling sheet to cool the surface of the power bank as a whole, so that electronic products such as mobile phones can be cooled during the charging process.

[0052] Preferably, the cooling plate 43 can be made of aluminum, which can reduce the weight of the entire power bank and conduct heat more quickly.

[0053] In order to prevent the heat from the fan assembly 41 from causing the battery to heat up during the air circulation process, the battery is isolated from the chamber where the fan assembly 41 is located by a battery insulation plate 33 in the present invention.

[0054] Example 1

[0055] like Figures 1 to 5 As shown, this embodiment provides a semiconductor refrigeration magnetic wireless power bank, wherein the fan assembly 41 includes a turbofan, a heat sink fin, and a fan mounting plate. The heat sink fin base plate is in contact with the hot end of the semiconductor refrigeration fin 42, so that the heat of the semiconductor refrigeration fin 42 is transferred to the heat sink fin. The turbofan is placed on the other side of the heat sink fin, and the turbofan is placed in the annular fin of the heat sink fin, so that the air outlet from the side of the turbofan can blow out the heat of the annular fin. Preferably, the heat sink fin is made of aluminum, which is light in weight and can reduce the weight of the power bank, and can also absorb and dissipate the heat from the hot end of the semiconductor refrigeration fin 42 more quickly.

[0056] In this embodiment, the turbofan is embedded in the bottom of the heat sink fins, and the heat sink fins are in contact with the hot end of the semiconductor refrigeration chip 42. The heat sink fins can be used to absorb the heat of the semiconductor refrigeration chip 42, and then the heat on the heat sink fins is blown out through the air outlet by the turbofan, thereby increasing the speed at which the turbofan blows out heat.

[0057] In this embodiment, the turbofan is mounted on a fan mounting plate. A circular opening is provided at the bottom of the fan mounting plate, connecting the air inlet duct to the turbofan's air inlet surface. Furthermore, the side surfaces of the fan mounting plate in this embodiment also provide insulation between the space where the fan assembly 41 is located and the space where the second battery 32 is located.

[0058] The bottom shell 10 is provided with a first air inlet 11 and a first air outlet 12, while the inner shell 20 is provided with a second air inlet 21 and a second air outlet 22. The second air inlet 21 is connected to the first air inlet 11, and the second air outlet 22 is connected to the first air outlet 12. Specifically, the first air inlet 11 is located at the corner of the bottom shell 10, and the first air outlet 12 is located on the side of the bottom shell 10. The positioning of the first air inlet 11 prevents the bottom air vent from being blocked when the power bank is placed horizontally, which would affect the air intake. The first air outlet 12 is designed to align with the position of the turbofan, ensuring efficient air discharge.

[0059] During implementation, the second air inlet 21 is located at a corner of the inner housing 20, such that the second air inlet 21 corresponds to the first air inlet 11. Specifically, a guide arm 23 is provided on the side of the inner housing 20, and an air inlet channel is formed between the guide arm 23 and the inner side wall. The second air inlet 21 is connected to the air inlet surface of the fan assembly 41 through the air inlet channel.

[0060] Preferably, the air inlet is a plurality of air inlet holes located at the corners of the housing, with adjacent air inlet holes spaced apart from each other. Specifically, the bottom housing 10 is provided with a plurality of air inlet holes at the three corners thereof as the first air inlet 11, and the inner housing 20 is provided with a plurality of air inlet holes at the three corners thereof as the second air inlet 21.

[0061] In this embodiment, the inner shell 20 is further provided with an inner shell opening 24 which passes through the inner shell 20 from top to bottom. The inner shell opening 24 can be used to accommodate the placement of the first battery 31 .

[0062] Example 2

[0063] like Figures 6 to 8 As shown, unlike the first embodiment, in this embodiment, the fan assembly 41 includes a turbofan and a heat sink fin. The heat sink fin base plate contacts the hot end of the semiconductor refrigeration fin 42, so that the heat of the semiconductor refrigeration fin 42 is transferred to the heat sink fin. The turbofan is placed on the other side of the heat sink fin, and the turbofan is placed inside the annular fin of the heat sink fin, so that the air discharged from the side of the turbofan can blow out the heat of the annular fin. Preferably, the heat sink fin is made of aluminum, which is light in weight and can reduce the weight of the power bank, and can also absorb and dissipate the heat from the hot end of the semiconductor refrigeration fin 42 more quickly.

[0064] In this embodiment, the second air inlet 21 is located on the bottom surface of the inner housing 20, corresponding to the air inlet surface of the fan assembly 41. The first air inlet 11 communicates with the second air inlet 21 via an air inlet duct. A turbofan is mounted on the inner housing 20. The second air inlet 21 is a circular opening that connects the air inlet duct with the air inlet surface of the turbofan. Furthermore, the side surfaces of the inner housing 20 in this embodiment also provide insulation between the space where the fan assembly 41 is located and the space where the second battery 32 is located.

[0065] Preferably, the air inlet is an air inlet slot located at the corner of the shell, and the air inlet slot is formed by the side wall of the shell and the bottom plate of the shell being spaced apart from each other. Figure 6 In the schematic diagram shown, the air inlet slot surrounds half of the bottom shell 10, the area enclosed by the three sides corresponds to the position of the fan assembly 41, and the bottom plate and the side wall of the bottom shell in the remaining area are connected by a connecting beam 13.

[0066] This embodiment eliminates the need for a fan mounting plate, and the inner shell 20 takes into account functions such as fan installation, air inlet channel formation, and battery isolation, making the internal space more compact.

[0067] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to this utility model.

[0068] The above is an exemplary description of the present utility model patent in conjunction with the accompanying drawings. It is obvious that the implementation of the present utility model patent is not limited to the above-mentioned method. As long as various improvements are made using the method concept and technical solution of the present utility model patent, or the concept and technical solution of the present utility model patent are directly applied to other occasions without improvement, they are all within the scope of protection of the present utility model.

Claims

1. A semiconductor refrigeration magnetic wireless charging treasure, characterized in that: include: a housing, wherein the housing is provided with an air inlet and an air outlet; A semiconductor cooling module, comprising a fan assembly, a semiconductor cooling sheet, and a cooling expansion sheet, wherein the cooling expansion sheet is in close contact with the cold end of the semiconductor cooling sheet, and the hot end of the semiconductor cooling sheet is in close contact with the fan assembly. The chamber where the fan assembly is located is connected to the air inlet via an air inlet channel, and the chamber is connected to the air outlet via an air outlet channel. A magnetic wireless charging and discharging component, the magnetic wireless charging and discharging component is placed on the cooling expansion plate; The battery is partially / entirely laid on the air inlet side of the fan assembly, and the air inlet channel bypasses the battery and connects to the chamber where the fan assembly is located and the air inlet.

2. The semiconductor refrigeration magnetic wireless power bank according to claim 1, characterized in that: The battery includes a first battery and a second battery, the second battery is located beside the semiconductor cooling module, and the first battery is located below the second battery and the semiconductor cooling module.

3. The semiconductor refrigeration magnetic wireless power bank according to claim 1, characterized in that: The magnetic wireless charging and discharging component includes a magnet, a coil, and a magnetic sheet. The coil is placed on the magnetic sheet, and the magnetic sheet and the magnet are both in close contact with the cooling sheet.

4. The semiconductor refrigeration magnetic wireless power bank according to claim 1, characterized in that: A circuit board and a heat conducting sheet are further provided in the shell. The heat conducting sheet is laid flat on the circuit board and is in close contact with the surface of the cooling sheet.

5. The semiconductor refrigeration magnetic wireless power bank according to claim 1, characterized in that: The air inlets are a plurality of air inlet holes located at the corners of the shell, and two adjacent air inlet holes are spaced apart from each other.

6. The semiconductor refrigeration magnetic wireless power bank according to claim 1, characterized in that: The air inlet is an air inlet slot located at a corner of the shell, and the air inlet slot is formed by the side wall of the shell and the bottom plate of the shell being spaced apart from each other.

7. The semiconductor refrigeration magnetic wireless power bank according to claim 1, characterized in that: The shell includes a bottom shell, an inner shell, and a panel. The bottom shell is provided with a first air inlet and a first air outlet. The inner shell is provided with a second air inlet and a second air outlet. The second air inlet is connected to the first air inlet, and the second air outlet is connected to the first air outlet.

8. The semiconductor refrigeration magnetic wireless power bank according to claim 7, characterized in that: The first air inlet is located at a corner of the bottom shell, and the first air outlet is located on a side surface of the bottom shell.

9. The semiconductor refrigeration magnetic wireless power bank according to claim 8, characterized in that: The second air inlet is located at a corner of the inner shell, so that the second air inlet corresponds to the position of the first air inlet.

10. The semiconductor refrigeration magnetic wireless power bank according to claim 8, characterized in that: The second air inlet is located on the bottom surface of the inner shell, and the second air inlet corresponds to the air inlet surface of the fan assembly. The first air inlet is connected to the second air inlet via an air inlet channel.

Images