Anti-collision multi-layer PCB
By using a solid copper plate reinforcement layer, carbon fiber wire and waterproof layer structure in the multi-layer PCB board, the problems of degradation of waterproof performance and structural instability caused by bumps and impacts of multi-layer PCB boards are solved, and higher collision resistance and service life are achieved.
Patent Information
- Application Number
- CN202421550912.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-03
- Publication Date
- 2025-08-08
- Estimated Expiration
- 2034-07-03
AI Technical Summary
During use, existing multi-layer PCB boards are prone to damage the waterproof layer due to bumps and impacts, resulting in degradation of waterproof performance, unstable structure, and reduced service life.
The first and second reinforcement layers made of solid copper plates are provided with carbon fiber wires and connecting rods on the inside, and the protective layer and waterproof layer on the outside are provided with a protective layer and a waterproof layer to reduce moisture intrusion through the aluminum oxide layer, and reserve a cavity to avoid extrusion caused by thermal expansion and contraction. Combined with the protection of the copper foil layer and epoxy resin, it improves structural stability and collision resistance.
It enhances the collision resistance of multi-layer PCB boards, improves waterproof performance and structural stability, extends service life, and is easy to install.
Smart Images

Figure CN223207299U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of PCB boards, in particular to an anti-collision multi-layer PCB board. Background Art
[0002] PCB board, whose Chinese name is printed circuit board, also known as printed circuit board, is an important electronic component. PCB board generally includes circuit board layer and base layer. Multi-layer PCB board mainly includes two or more circuit board layers. It is bonded together by glue layer during the manufacturing process. It can be connected with wires on both sides and is more suitable for use in more complex circuits than single-sided boards.
[0003] For example, a multi-layer PCB board with authorization announcement number CN212573073U has a prestressed wire layer arranged in the middle part of the PCB board. The prestressed wire layer includes multiple carbon fiber wires. The multiple carbon fiber wires are stretched between the two thermal conductive support frames, so that it has good tensile strength.
[0004] However, the above-mentioned multi-layer PCB board still has some problems during use. For example, the above-mentioned multi-layer PCB board uses carbon fiber tension wires that can run through the interior of the PCB board to improve its tensile strength. However, the PCB board itself has a certain toughness. When used, the PCB board needs to be installed and used together with electronic products. Since electronic products are easily picked up and moved during use, this causes certain bumps and collisions between the PCB board and the electronic products. The surface of the PCB board is a waterproof layer, which is easily damaged by bumps and collisions, resulting in a decrease in waterproof performance. In addition, bumps and collisions can easily make the PCB board structure unstable, thereby reducing the service life of the multi-layer PCB board. Summary of the Invention
[0005] The present invention aims to solve the problems existing in the prior art and provide a collision-proof multi-layer PCB board to achieve the function and effect of extending the service life.
[0006] The utility model solves its technical problem by adopting the following technical solution: an anti-collision multi-layer PCB board, comprising a side panel and a PCB circuit board, wherein the inner sides of the two PCB circuit boards are provided with a multi-layer PCB board anti-collision structure, wherein the multi-layer PCB board anti-collision structure comprises a first reinforcement layer, a carbon fiber wire and a second reinforcement layer, wherein the first reinforcement layer is fixedly connected to the inner side of the PCB circuit board, and the second reinforcement layer is fixedly connected to the inner side of the other side of the PCB circuit board, an inner core board is fixedly installed inside the first reinforcement layer and the second reinforcement layer, a plurality of carbon fiber wires are fixedly connected to the inner sides of the two PCB circuit boards, and a connecting rod is fixedly connected to the outside of the plurality of carbon fiber wires, and the first reinforcement layer and the second reinforcement layer are both made of relatively strong and sturdy copper plates, and the heat dissipation and strength of the metal copper plates are relatively high, and the two reinforcement layers are added on both sides of the inner core board, thereby improving the anti-collision effect of the multi-layer PCB board, and the inner core board is made of FR-based material, which has good electrical, mechanical and thermal properties, and a plurality of carbon fiber wires are fixedly connected to the two PCBs On the inner side of the circuit board, multiple carbon fiber lines are fixedly connected to the outside with connecting rods. The multiple connecting rods are also made of thicker carbon fiber materials. Multiple carbon fiber lines run through the inside of the two PCB circuit boards, and then the outer connecting rods will strengthen the connectivity between the carbon fiber lines, thereby improving the firmness of the multi-layer PCB board.
[0007] For further improvement, the inner sides of the plurality of connecting rods are fixedly connected to the outer wall of the first reinforcement layer, the inner sides of the plurality of connecting rods are fixedly connected to the outer wall of the second reinforcement layer, and the plurality of connecting rods are arranged parallel to each other.
[0008] Further improvement, the interior of the two side panels is provided with a multi-layer PCB board sandwich structure;
[0009] The multi-layer PCB sandwich structure includes a protective layer, a waterproof layer and bumps;
[0010] Multiple protrusions are fixedly installed on the inner side of the side panel, and a protective layer is fixedly installed inside the multiple protrusions. A waterproof layer is fixedly connected to the inner sides of two of the protective layers, and a solder resist layer is fixedly installed on the inner sides of the two waterproof layers. A reserved cavity is fixedly installed on the inner sides of the multiple protrusions, and the two reserved cavities are fixedly connected to the inner sides of the side panels. The protective layer is made of a metal aluminum film, and the protective layer is on the outside of the waterproof layer, which can reduce the situation where external impact damages the waterproof layer. The waterproof layer is made of a metal aluminum foil layer, and the aluminum oxide layer is used to reduce the intrusion of moisture into the PCB board. The solder resist layer is fixedly installed on the inner sides of the two waterproof layers, and the solder resist layer is made of epoxy resin material to protect the copper foil layer from corrosion and oxidation. The reserved cavity is opened inside the side panel to reserve a certain space for the PCB circuit board due to thermal expansion and contraction, so as to avoid the PCB circuit board from being easily squeezed and damaged when the temperature is high.
[0011] For further improvement, the two solder resist layers are fixedly mounted on the outside of the PCB circuit board, the inner side of the reserved cavity is arranged opposite to the outer side of the PCB circuit board, and the inner side of the reserved cavity is movably connected to both sides of the first reinforcement layer and the second reinforcement layer.
[0012] For further improvement, a plurality of mounting plates are fixedly installed on the outer walls of the two side panels, mounting holes are fixedly installed inside the plurality of mounting plates, and the plurality of mounting plates are arranged relatively parallel to each other.
[0013] Further improvement, the inner sides of the two protrusions are fixedly connected to the outside of the solder resist layer, the multiple protrusions are arranged relatively parallel to each other, and the multiple carbon fiber wires run through the interior of the PCB circuit board.
[0014] The beneficial effects of the present invention are as follows: in the present invention, the first reinforcement layer and the second reinforcement layer are both made of relatively strong and sturdy copper plates. The metal copper plates have relatively high heat dissipation and strength. The two reinforcement layers are added on both sides of the inner core board, thereby improving the anti-collision effect of the multi-layer PCB board. The connecting rod is also made of a thicker carbon fiber material. A plurality of carbon fiber wires run through the inner sides of the two PCB circuit boards, thereby improving the firmness of the multi-layer PCB board. The multi-layer, stronger, collision-resistant and pressure-resistant structure improves the anti-collision ability of the anti-collision multi-layer PCB board. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a three-dimensional schematic diagram of the utility model;
[0016] Figure 2 for Figure 1 A front cross-sectional schematic diagram of ;
[0017] Figure 3 for Figure 2 Schematic diagram of the top surface;
[0018] Figure 4 for Figure 2 A magnified cross-sectional view of part A;
[0019] Figure 5 for Figure 2 An enlarged cross-sectional view of part B;
[0020] Figure 6 for Figure 3 Enlarged cross-sectional view of part C.
[0021] Explanation of the accompanying drawings: In the figure: 1, side panel, 2, PCB circuit board, 3, multi-layer PCB board sandwich structure, 31, protective layer, 32, waterproof layer, 33, solder mask layer, 34, bump, 35, reserved cavity, 4, multi-layer PCB board collision-resistant structure, 41, first reinforcement layer, 42, inner core board, 43, connecting rod, 44, carbon fiber line, 45, second reinforcement layer, 51, mounting plate, 52, mounting hole. DETAILED DESCRIPTION
[0022] The present invention will be further described below with reference to the accompanying drawings:
[0023] Refer to the attached Figure 1-6 : A collision-proof multi-layer PCB board, including a side panel 1 and a PCB circuit board 2, a multi-layer PCB board collision-resistant structure 4 is provided on the inner side of the two PCB circuit boards 2, and the multi-layer PCB board collision-resistant structure 4 includes a first reinforcement layer 41, a carbon fiber line 44 and a second reinforcement layer 45. The first reinforcement layer 41 is fixedly connected to the inner side of the PCB circuit board 2. The first reinforcement layer 41 and the second reinforcement layer 45 are both made of relatively strong and sturdy copper plates. The heat dissipation and strength of the metal copper plates are relatively high. The two reinforcement layers 41 are added on both sides of the inner core plate 42 to improve the collision-proof effect of the multi-layer PCB board. The second reinforcement layer 45 is fixedly connected to the inside of the other side of the PCB circuit board 2. The inner core plate 42 is fixedly installed inside the first reinforcement layer 41 and the second reinforcement layer 45. The inner core plate 42 is made of FR-4 substrate. FR-4 has good electrical properties, mechanical properties and thermal properties. Multiple carbon fiber lines 44 are fixedly connected to the two PCB On the inner side of the circuit board 2, the outer sides of the multiple carbon fiber wires 44 are fixedly connected to the connecting rods 43. The multiple connecting rods 43 are also made of thicker carbon fiber material. The multiple carbon fiber wires 44 run through the inner sides of the two PCB circuit boards 2. Then the outer connecting rods 43 will strengthen the connectivity between the carbon fiber wires 44, thereby improving the firmness of the multi-layer PCB board. The inner sides of the multiple connecting rods 43 are fixedly connected to the outer wall of the first reinforcement layer 41, and the inner sides of the multiple connecting rods 43 are fixedly connected to the outer wall of the second reinforcement layer 45. The multiple connecting rods 43 are arranged parallel to each other.
[0024] The first reinforcement layer 41 and the second reinforcement layer 45 are both made of relatively strong and sturdy copper plates. The metal copper plates have relatively high heat dissipation and strength. The two reinforcement layers 41 are added on both sides of the inner core board 42 to improve the anti-collision effect of the multi-layer PCB board. The inner core board 42 is made of FR-4 substrate. FR-4 has good electrical, mechanical and thermal properties. Multiple carbon fiber wires 44 are fixedly connected to the inner sides of the two PCB circuit boards 2. The outside of the multiple carbon fiber wires 44 is fixedly connected with a connecting rod 43. The multiple connecting rods 43 are also made of thicker carbon fiber material. Multiple carbon fiber wires 44 run through the inner sides of the two PCB circuit boards 2, and then the outer connecting rods 43 will strengthen the connectivity between the carbon fiber wires 44, thereby improving the firmness of the multi-layer PCB board. Through the multi-layer, more sturdy, collision-resistant and pressure-resistant structure, the anti-collision ability of the anti-collision multi-layer PCB board is improved.
[0025] The interior of the two side panels 1 is provided with a multi-layer PCB board sandwich structure 3, which includes a protective layer 31, a waterproof layer 32 and a bump 34. The multiple bumps 34 are fixedly mounted on the inner side of the side panels 1. The protective layer 31 is fixedly mounted inside the multiple bumps 34. The protective layer 31 is made of a metal aluminum film. The protective layer 31 is on the outside of the waterproof layer 31, which can reduce the situation where the waterproof layer 31 is damaged by external impact. The waterproof layer 32 is fixedly connected to the inside of the two protective layers 31. The waterproof layer 32 is made of a metal aluminum foil layer. The aluminum oxide layer is used to reduce the intrusion of moisture into the PCB board. A solder mask layer 33 is fixedly installed on the inner side of the two waterproof layers 32. The solder mask layer 33 is made of epoxy resin material and is used to protect the copper foil layer from corrosion and oxidation. A reserved cavity 35 is fixedly installed on the inner side of the multiple bumps 34. The reserved cavity 35 is opened inside the side panel 1 to reserve a certain space for the PCB circuit board 2 due to thermal expansion and contraction, so as to avoid the PCB circuit board 2 from being easily squeezed and damaged when the temperature is high. The two reserved cavities 35 are fixedly connected to the inner side of the side panel 1.
[0026] The two solder resist layers 33 are fixedly mounted on the outside of the PCB circuit board 2, the inner side of the reserved cavity 35 is arranged opposite to the outer side of the PCB circuit board 2, the inner side of the reserved cavity 35 is movably connected to both sides of the first reinforcement layer 41 and the second reinforcement layer 45, a plurality of mounting plates 51 are fixedly mounted on the outer walls of the two side panels 1, and mounting holes 52 are fixedly mounted inside the plurality of mounting plates 51, and the plurality of mounting plates 51 are arranged relatively parallel to each other, and threaded grooves are provided inside the mounting holes 52, and the mounting plates 51 can be fixed to the electronic device by screwing in screws and bolts, thereby improving the anti-collision effect of the multi-layer PCB board for easy installation, and welding is not necessarily required to achieve installation and fixation, the inner sides of the two protrusions 34 are fixedly connected to the outside of the solder resist layer 33, the plurality of protrusions 34 are arranged relatively parallel to each other, and a plurality of carbon fiber lines 44 run through the interior of the PCB circuit board 2.
[0027] Working principle:
[0028] When using anti-collision multi-layer PCB boards installed in electronic products for welding:
[0029] Anti-collision multi-layer PCB board reinforced anti-collision structure:
[0030] The first reinforcement layer 41 and the second reinforcement layer 45 are both made of relatively strong and sturdy copper plates. The metal copper plates have high heat dissipation and strength. The two reinforcement layers 41 are added on both sides of the inner core board 42 to improve the anti-collision effect of the multi-layer PCB board. The inner core board 42 is made of FR-4 substrate. FR-4 has good electrical, mechanical and thermal properties. Multiple carbon fiber wires 44 are fixedly connected to the inner sides of the two PCB circuit boards 2. The outsides of the multiple carbon fiber wires 44 are fixedly connected with connecting rods 43. The multiple connecting rods 43 are also made of thicker carbon fiber material. The multiple carbon fiber wires 44 run through the inner sides of the two PCB circuit boards 2, and then the outer connecting rods 43 will strengthen the connectivity between the carbon fiber wires 44, thereby improving the firmness of the multi-layer PCB board.
[0031] Anti-collision multi-layer PCB board waterproof anti-expansion extrusion structure:
[0032] The protective layer 31 is made of a metal aluminum film. The protective layer 31 is on the outside of the waterproof layer 31, which can reduce the situation where external impact damages the waterproof layer 31. The waterproof layer 32 is made of a metal aluminum foil layer. The aluminum oxide layer can reduce the intrusion of moisture into the PCB board. The inner side of the two waterproof layers 32 is fixedly installed with a solder mask layer 33. The solder mask layer 33 is made of epoxy resin material and is used to protect the copper foil layer from corrosion and oxidation. The reserved cavity 35 is opened inside the side panel 1 to reserve a certain amount of space for the PCB circuit board 2 due to thermal expansion and contraction, so as to prevent the PCB circuit board 2 from being easily squeezed and damaged when the temperature is high.
[0033] While the present invention has been shown and described with reference to preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein within the scope of the claims.
Claims
1. A collision-proof multi-layer PCB board, comprising a side panel (1) and a PCB circuit board (2), characterized in that: A multilayer PCB board crash-resistant structure (4) is provided on the inner sides of the two PCB circuit boards (2), and the multilayer PCB board crash-resistant structure (4) comprises a first reinforcement layer (41), a carbon fiber line (44) and a second reinforcement layer (45), wherein the first reinforcement layer (41) is fixedly connected to the inner side of the PCB circuit board (2), and the second reinforcement layer (45) is fixedly connected to the inside of the other side of the PCB circuit board (2), an inner core board (42) is fixedly installed inside the first reinforcement layer (41) and the second reinforcement layer (45), a plurality of the carbon fiber lines (44) are fixedly connected to the inner sides of the two PCB circuit boards (2), and a connecting rod (43) is fixedly connected to the outside of the plurality of the carbon fiber lines (44).
2. The anti-collision multi-layer PCB according to claim 1, characterized in that: The inner sides of the plurality of connecting rods (43) are fixedly connected to the outer wall of the first reinforcement layer (41), the inner sides of the plurality of connecting rods (43) are fixedly connected to the outer wall of the second reinforcement layer (45), and the plurality of connecting rods (43) are arranged parallel to each other.
3. The anti-collision multi-layer PCB according to claim 1, characterized in that: A multi-layer PCB sandwich structure (3) is provided inside the two side panels (1); The multi-layer PCB sandwich structure (3) comprises a protective layer (31), a waterproof layer (32) and a bump (34); The plurality of protrusions (34) are fixedly mounted on the inner side of the side plate (1); a protective layer (31) is fixedly mounted inside the plurality of protrusions (34); a waterproof layer (32) is fixedly connected inside two of the protective layers (31); a solder resist layer (33) is fixedly mounted inside the two waterproof layers (32); a reserved cavity (35) is fixedly mounted inside the plurality of protrusions (34); and the two reserved cavities (35) are fixedly connected to the inner side of the side plate (1).
4. The anti-collision multi-layer PCB according to claim 3, characterized in that: The two solder resist layers (33) are fixedly mounted on the outside of the PCB circuit board (2), the inner side of the reserved cavity (35) is arranged opposite to the outer side of the PCB circuit board (2), and the inner side of the reserved cavity (35) is movably connected to both sides of the first reinforcement layer (41) and the second reinforcement layer (45).
5. The anti-collision multi-layer PCB according to claim 1, characterized in that: A plurality of mounting plates (51) are fixedly mounted on the outer walls of the two side plates (1), mounting holes (52) are fixedly mounted inside the plurality of mounting plates (51), and the plurality of mounting plates (51) are arranged relatively parallel to each other.
6. The anti-collision multi-layer PCB according to claim 3, characterized in that: The inner sides of the two protrusions (34) are fixedly connected to the outside of the solder resist layer (33), the plurality of protrusions (34) are arranged relatively parallel to each other, and the plurality of carbon fiber lines (44) penetrate the interior of the PCB circuit board (2).
Citation Information
Patent Citations
Multilayer PCB
CN212573073U