Chip thickness detection device

Abstract

The utility model provides a chip thickness detection device. The chip thickness detection device comprises a supporting table, the top of the supporting table is fixedly connected with a case, the top of an inner cavity of the case is fixedly connected with a limiting rod, the limiting rod is movably sleeved with a lifting plate, the bottom of the lifting plate is fixedly sleeved with a positioning pipe, and the bottom of the positioning pipe is fixedly sleeved with an adsorption sleeve. According to the chip thickness detection device provided by the utility model, through arranging the laser thickness detector, when chip thickness detection is carried out, the plurality of adsorption sleeves are tightly extruded at the tops of the plurality of chips, at the moment, the positioning pipe is lifted and the control host is started; according to the chip thickness detection device, the plurality of positioning pipes can drive the plurality of chips to move to the right front of the laser thickness detectors, so that the control host can control the plurality of laser thickness detectors to detect the plurality of chips at the same time, the problem that the efficiency is low when a single chip is detected is avoided, and the detection efficiency of the chip thickness is improved.

Description

Technical Field

[0001] The utility model relates to the field of thickness detection, in particular to a chip thickness detection device. Background Art

[0002] Chip is a general term for semiconductor component products, that is, integrated circuits, or microcircuits, microchips, wafers, and chips. In electronics, it is a way to miniaturize circuits and is often manufactured on the surface of semiconductor wafers. Currently, photolithography machines are needed in the chip production process, and many existing photolithography machines can automatically detect thickness. Existing chip processing thickness detection devices generally include a base, an airbag is provided inside the base, and the support member is inserted into the inside of the airbag. The tooling is shock-absorbing through the airbag, reducing the impact of external vibrations on the measurement of the thickness gauge. A thickness detector body is installed in the device, and the chip thickness can be detected by manually placing the chip on the lower side of the thickness detector body. However, this chip processing thickness detection device requires hand support during the measurement process. In the process of using the hand support, there is a disadvantage of adding a detection process and inconvenient data recording.

[0003] In the existing technology, such as the "A Chip Processing Thickness Detection Device" with the Chinese Authorization Announcement No. CN218179914U, it includes a tool body, a sliding assembly and a reciprocating assembly. When the thickness of the chip is detected, the thickness detector body is turned on by placing the chip in the tool body. The sliding assembly is turned on, and the sliding assembly can drive the thickness detector body to slide back and forth horizontally in the tool body. When the sliding assembly moves to the right, the sliding assembly can drive the suction cup to slide downward through the reciprocating assembly, so that the suction cup can absorb and fix the chip. When the sliding assembly moves to the left, the sliding assembly can drive the suction cup to slide upward through the reciprocating assembly, and the sliding assembly will also synchronously drive the thickness detector body to move to the left, so that the thickness detector body can move to the lower side of the chip. At this time, the thickness detector body can detect the thickness of the chip.

[0004] When performing chip testing in existing technologies, due to the relatively simple number of fixed components, the number of single tests that can be performed by the tester is limited, which leads to the problem of low chip thickness detection efficiency.

[0005] Therefore, it is necessary to provide a chip thickness detection device to solve the above technical problems. Utility Model Content

[0006] The utility model provides a chip thickness detection device, which solves the problem that the number of fixed components is relatively simple, resulting in a limited number of single detections by a detector, and thus causing low chip thickness detection efficiency.

[0007] In order to solve the above technical problems, the utility model provides a chip thickness detection device, including a support table, the top of the support table is fixedly connected to a chassis, the top of the inner cavity of the chassis is fixedly connected to a limit rod, the outer movably sleeve of the limit rod is provided with a lifting plate, the bottom of the lifting plate is fixedly sleeved with a positioning tube, the bottom of the positioning tube is fixedly sleeved with an adsorption sleeve, a control host is fixedly installed on the top of the chassis, a cylinder is fixedly installed on the top of the inner cavity of the chassis, a laser thickness detector is fixedly installed on the front of the inner wall of the chassis, a control mechanism is provided on the top of the positioning tube, a positioning seat is fixedly connected to the top of the support table, an auxiliary mechanism is provided on the front of the chassis, and a moving mechanism is provided at the bottom of the support table.

[0008] Preferably, the number of the laser thickness detectors is six, and the six laser thickness detectors are evenly distributed on the front side of the inner wall of the chassis.

[0009] Preferably, the limiting rods and the lifting plate are perpendicular to each other, and there are four limiting rods.

[0010] Preferably, the cylinder is located directly above the lifting plate, and the bottom of the cylinder is fixedly connected to the top of the lifting plate.

[0011] Preferably, the control mechanism includes an air pipe, which is fixedly sleeved on the top of the positioning pipe. A solenoid valve is fixedly installed on the outside of the air pipe, and the input end of the solenoid valve is electrically connected to the output end of the control host.

[0012] Preferably, the positioning seat is made of rubber material, and the positioning seat is located directly below the adsorption sleeve.

[0013] Preferably, the auxiliary mechanism includes a backlight cover, which is fixedly sleeved on the front side of the chassis, and an LED lamp head is fixedly installed inside the backlight cover.

[0014] Preferably, the moving mechanism includes a support column, the support column is fixedly connected to the bottom of the support platform, and a sliding wheel is installed at the bottom of the support column.

[0015] Compared with related technologies, the chip thickness detection device provided by the present invention has the following beneficial effects:

[0016] The utility model provides a chip thickness detection device. By setting a laser thickness detector, when performing chip thickness detection, multiple adsorption sleeves are tightly squeezed on the top of multiple chips. At this time, the positioning tubes are lifted and the control host is started, so that the multiple positioning tubes can drive the multiple chips to move directly in front of the laser thickness detector, so that the control host can control the multiple laser thickness detectors to detect multiple chips at the same time, thereby avoiding the problem of slow efficiency when detecting a single chip, thereby improving the detection efficiency of chip thickness;

[0017] By setting up a cylinder, when the chip is fixed and lifted, the chip is placed inside the positioning seat. At this time, the cylinder is started, so that the cylinder can drive the positioning tube to move downward through the lifting plate, and then drive the adsorption sleeve to be tightly squeezed on the top of the chip, thereby achieving the adsorption and fixing effect of multiple chips, which brings convenience to the fixation and movement of multiple chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic structural diagram of a preferred embodiment of a chip thickness detection device provided by the present invention;

[0019] Figure 2 for Figure 1 A front view of a chip thickness detection device is shown;

[0020] Figure 3 for Figure 1 A front view of a lifting plate in a chip thickness detection device is shown;

[0021] Figure 4 for Figure 1 A front view of a laser thickness detector in a chip thickness detection device is shown.

[0022] Numbers in the figure: 1. Support platform; 2. Chassis; 3. Limit rod; 4. Lifting plate; 5. Positioning tube; 6. Adsorption sleeve; 7. Control host; 8. Cylinder; 9. Laser thickness detector; 10. Control mechanism; 101. Gas pipe; 102. Solenoid valve; 11. Positioning seat; 12. Auxiliary mechanism; 121. Backlight cover; 122. LED lamp head; 13. Moving mechanism; 131. Support column; 132. Sliding wheel. DETAILED DESCRIPTION

[0023] The present invention will be further described below with reference to the accompanying drawings and implementation examples.

[0024] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 ,in, Figure 1 A schematic structural diagram of a preferred embodiment of a chip thickness detection device provided by the present invention; Figure 2 for Figure 1 A front view of a chip thickness detection device is shown; Figure 3 for Figure 1 A front view of a lifting plate in a chip thickness detection device is shown; Figure 4 for Figure 1A front view of a laser thickness detector in a chip thickness detection device is shown. A chip thickness detection device includes a support platform 1, the top of the support platform 1 is fixedly connected to a chassis 2, the top of the inner cavity of the chassis 2 is fixedly connected to a limit rod 3, the outer portion of the limit rod 3 is movably sleeved with a lifting plate 4, the bottom of the lifting plate 4 is fixedly sleeved with a positioning tube 5, the bottom of the positioning tube 5 is fixedly sleeved with an adsorption sleeve 6, a control host 7 is fixedly installed on the top of the chassis 2, a cylinder 8 is fixedly installed on the top of the inner cavity of the chassis 2, a laser thickness detector 9 is fixedly installed on the front of the inner wall of the chassis 2, a control mechanism 10 is provided on the top of the positioning tube 5, a positioning seat 11 is fixedly connected to the top of the support platform 1, an auxiliary mechanism 12 is provided on the front of the chassis 2, and a moving mechanism 13 is provided on the bottom of the support platform 1.

[0025] There are six laser thickness detectors 9, and the six laser thickness detectors 9 are evenly distributed on the front of the inner wall of the chassis 2; by setting up the laser thickness detector 9, when performing chip thickness detection, multiple adsorption sleeves 6 are tightly squeezed on the top of multiple chips. At this time, the positioning tube 5 is lifted and the control host 7 is started, so that the multiple positioning tubes 5 can drive the multiple chips to move to the front of the laser thickness detector 9, so that the control host 7 can control the multiple laser thickness detectors 9 to detect multiple chips at the same time, thereby avoiding the problem of slow efficiency when detecting a single chip, thereby improving the detection efficiency of the chip thickness.

[0026] The limiting rod 3 and the lifting plate 4 are perpendicular to each other, and there are four limiting rods 3; by setting the limiting rod 3, when the height of the lifting plate 4 is adjusted, the limiting rod 3 can limit the lifting plate 4 moving up and down, thereby avoiding the problem of tilting of the lifting plate 4 during lifting and lowering, resulting in a large deviation in the position of the adsorption sleeve 6, thereby improving the position stability of the adsorption sleeve 6 during lifting and lowering.

[0027] The cylinder 8 is located directly above the lifting plate 4, and the bottom of the cylinder 8 is fixedly connected to the top of the lifting plate 4; by setting the cylinder 8, when the chip is fixed and lifted, the chip is placed inside the positioning seat 11, and the cylinder 8 is started at this time, so that the cylinder 8 can drive the positioning tube 5 to move downward through the lifting plate 4, and then drive the adsorption sleeve 6 to be tightly squeezed on the top of the chip, thereby achieving the adsorption and fixing effect of multiple chips, and thus bringing convenience to the fixation and movement of multiple chips.

[0028] The control mechanism 10 includes an air pipe 101, which is fixedly sleeved on the top of the positioning tube 5. An electromagnetic valve 102 is fixedly installed on the outside of the air pipe 101, and the input end of the electromagnetic valve 102 is electrically connected to the output end of the control host 7. By setting the control mechanism 10, when the chip thickness detection is completed, the control host 7 is started, so that the control host 7 can control the electromagnetic valve 102 to open. At this time, the gas outside the air pipe 101 can enter the interior of the adsorption sleeve 6 through the positioning tube 5, so that the chip can fall off from the bottom of the adsorption sleeve 6, thereby achieving the opening and closing control effect of the adsorption sleeve 6.

[0029] The positioning seat 11 is made of rubber material, and the positioning seat 11 is located directly below the adsorption sleeve 6; by setting the positioning seat 11, when performing chip fixing detection, multiple chips are placed inside multiple positioning seats 11. At this time, multiple positioning seats 11 can locate the placement positions of multiple chips, so that multiple adsorption sleeves 6 can be accurately squeezed on the top of multiple chips, thereby improving the accuracy of the chip placement position.

[0030] The auxiliary mechanism 12 includes a backlight cover 121, which is fixedly sleeved on the front of the chassis 2, and an LED lamp head 122 is fixedly installed inside the backlight cover 121; by setting the auxiliary mechanism 12, when the chip thickness is detected, the LED lamp head 122 is started so that the LED lamp head 122 can illuminate the inside of the backlight cover 121, so that the backlight cover 121 can greatly improve the brightness contrast during chip detection, thereby avoiding the problem of slow chip thickness detection speed due to dark light around the chip.

[0031] The moving mechanism 13 includes a support column 131, which is fixedly connected to the bottom of the support platform 1, and a sliding wheel 132 is installed at the bottom of the support column 131; by setting up the moving mechanism 13, when the detection device is moved and transported, the support platform 1 is pushed, so that the sliding wheel 132 can drive the support platform 1 to move horizontally through the support column 131, that is, drive the chassis 2 to move horizontally, thereby achieving the movement effect of the chip thickness detection device, and thus bringing convenience to the adjustment of the working position of the chip thickness detection device.

[0032] The working principle of a chip thickness detection device provided by the utility model is as follows:

[0033] Step 1: First, when performing chip thickness detection, multiple adsorption sleeves 6 are tightly squeezed on the top of multiple chips. At this time, the positioning tube 5 is lifted and the control host 7 is started, so that the multiple positioning tubes 5 can drive multiple chips to move to the front of the laser thickness detector 9, so that the control host 7 can control multiple laser thickness detectors 9 to detect multiple chips at the same time, thereby avoiding the problem of slow efficiency when detecting a single chip, thereby improving the detection efficiency of chip thickness. When adjusting the height of the lifting plate 4, the limit rod 3 can limit the lifting plate 4 moving up and down, so as to avoid the lifting plate 4 from tilting when lifting and lowering, resulting in a large deviation in the position of the adsorption sleeve 6, thereby improving The stability of the position of the adsorption sleeve 6 during lifting and lowering is improved. When the chip is fixed and lifted, the chip is placed inside the positioning seat 11. At this time, the cylinder 8 is started, so that the cylinder 8 can drive the positioning tube 5 to move downward through the lifting plate 4, and then drive the adsorption sleeve 6 to be tightly squeezed on the top of the chip, thereby achieving the adsorption and fixing effect of multiple chips, thereby bringing convenience to the fixing and movement of multiple chips. When the chip thickness detection is completed, the control host 7 is started, so that the control host 7 can control the solenoid valve 102 to open. At this time, the gas outside the gas pipe 101 can enter the interior of the adsorption sleeve 6 through the positioning tube 5, so that the chip can fall off from the bottom of the adsorption sleeve 6, thereby achieving the opening and closing control effect of the adsorption sleeve 6;

[0034] Step 2: When performing chip fixing detection, multiple chips are placed inside multiple positioning seats 11. At this time, multiple positioning seats 11 can locate the placement positions of multiple chips, so that multiple adsorption sleeves 6 can be accurately squeezed on the top of multiple chips, thereby improving the accuracy of chip placement positions. When performing chip thickness detection, start the LED lamp head 122 so that the LED lamp head 122 can illuminate the inside of the backlight cover 121, so that the backlight cover 121 can greatly improve the brightness contrast during chip detection, thereby avoiding the problem of slow chip thickness detection speed caused by dark light around the chip. When the detection device is moved and transported, the support table 1 is pushed so that the sliding wheel 132 can drive the support table 1 to move horizontally through the support column 131, that is, drive the chassis 2 to move horizontally, thereby achieving the movement effect of the chip thickness detection device, thereby bringing convenience to the adjustment of the working position of the chip thickness detection device.

[0035] Compared with related technologies, the chip thickness detection device provided by the present invention has the following beneficial effects:

[0036] By setting up a laser thickness detector 9, when performing chip thickness detection, multiple adsorption sleeves 6 are tightly squeezed on the top of multiple chips. At this time, the positioning tube 5 is lifted and the control host 7 is started, so that the multiple positioning tubes 5 can drive the multiple chips to move to the front of the laser thickness detector 9, so that the control host 7 can control the multiple laser thickness detectors 9 to detect multiple chips at the same time, thereby avoiding the problem of slow efficiency when detecting a single chip, thereby improving the detection efficiency of chip thickness.

[0037] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A chip thickness detection device, comprising a support table (1), characterized in that: The top of the support platform (1) is fixedly connected to the chassis (2), the top of the inner cavity of the chassis (2) is fixedly connected to a limiting rod (3), the outer portion of the limiting rod (3) is movably sleeved with a lifting plate (4), the bottom of the lifting plate (4) is fixedly sleeved with a positioning tube (5), the bottom of the positioning tube (5) is fixedly sleeved with an adsorption sleeve (6), a control host (7) is fixedly installed on the top of the chassis (2), a cylinder (8) is fixedly installed on the top of the inner cavity of the chassis (2), a laser thickness detector (9) is fixedly installed on the front of the inner wall of the chassis (2), a control mechanism (10) is provided on the top of the positioning tube (5), a positioning seat (11) is fixedly connected to the top of the support platform (1), an auxiliary mechanism (12) is provided on the front of the chassis (2), and a moving mechanism (13) is provided on the bottom of the support platform (1).

2. A chip thickness detection device according to claim 1, characterized in that: The number of the laser thickness detectors (9) is six, and the six laser thickness detectors (9) are evenly distributed on the front side of the inner wall of the chassis (2).

3. The chip thickness detection device according to claim 1, characterized in that: The limiting rods (3) and the lifting plate (4) are perpendicular to each other, and there are four limiting rods (3).

4. The chip thickness detection device according to claim 1, characterized in that: The cylinder (8) is located directly above the lifting plate (4), and the bottom of the cylinder (8) is fixedly connected to the top of the lifting plate (4).

5. The chip thickness detection device according to claim 1, characterized in that: The control mechanism (10) includes an air supply pipe (101), the air supply pipe (101) is fixedly sleeved on the top of the positioning pipe (5), and a solenoid valve (102) is fixedly installed on the outside of the air supply pipe (101), and the input end of the solenoid valve (102) is electrically connected to the output end of the control host (7).

6. The chip thickness detection device according to claim 1, characterized in that: The positioning seat (11) is made of rubber material, and the positioning seat (11) is located directly below the adsorption sleeve (6).

7. The chip thickness detection device according to claim 1, characterized in that: The auxiliary mechanism (12) comprises a backlight cover (121), the backlight cover (121) is fixedly sleeved on the front of the chassis (2), and an LED lamp head (122) is fixedly installed inside the backlight cover (121).

8. The chip thickness detection device according to claim 1, characterized in that: The moving mechanism (13) comprises a support column (131), the support column (131) is fixedly connected to the bottom of the support platform (1), and a sliding wheel (132) is installed at the bottom of the support column (131).

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