Wafer edge breakage detection mechanism

Abstract

The utility model relates to a wafer edge breakage detection mechanism which comprises a carrying table, a first detection camera, a second detection camera, a first light source, a second light source and a third light source, the first detection camera and the first light source are located above the carrying table, and the second detection camera and the second light source are located below the carrying table. The third light source is located on the side edge of the carrying table, and the irradiation direction of the third light source faces the carrying table. The first detection camera is matched with the first light source, the second detection camera is matched with the second light source, whether the edge of the wafer has scratches and edge breakage notches or not can be detected, the third light source which emits light to the carrying table is arranged on the side edge of the carrying table, and when the wafer is placed on the carrying table, the side edge of the wafer is irradiated through the third light source, so that the edge breakage of the wafer is avoided. Therefore, cracks which are not easy to find on the edge of the wafer can be highlighted, so that the cracks can be clearly imaged on the first detection camera or the second detection camera, and the reliability of wafer appearance detection is further ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer detection equipment, in particular to a wafer edge chipping detection mechanism. Background Art

[0002] Before entering production, chips need to undergo rigorous verification tests. The first step in the verification test is often to inspect the appearance of the wafer, usually to detect whether there are defects such as chipping, scratches, and cracks on the wafer. At present, the device for detecting chipping of wafers usually has two cameras and two light sources. The light sources illuminate the edge of the wafer, and the cameras take pictures and feed back to the controller. The controller analyzes the pictures and then determines whether there are chipping, scratches, and cracks on the wafer. However, the current detection level can usually only detect cracks when they are large, and some cracks on the wafer are extremely difficult to detect when viewed from the direction facing the wafer surface, such as Figure 1 The cracks shown are likely to go undetected, resulting in defective products being mixed with qualified products. Utility Model Content

[0003] The purpose of the utility model is to provide a wafer edge chipping detection mechanism, which can effectively detect cracks on the wafer that are difficult to find, and ensure the reliability of wafer appearance detection.

[0004] To achieve the above-mentioned purpose, the utility model discloses a wafer edge chipping detection mechanism, which includes a carrier, a first detection camera, a second detection camera, a first light source, a second light source and a third light source. The first detection camera and the first light source are located above the carrier, the second detection camera and the second light source are located below the carrier, and the third light source is located on the side of the carrier, and the irradiation direction of the third light source is set toward the carrier.

[0005] Preferably, it also includes a rotation drive component for driving the carrier to rotate.

[0006] Preferably, a vacuum hole for adsorbing wafers is provided on the carrier, and the vacuum hole is connected to an external vacuum pumping device.

[0007] Preferably, it also includes a first moving platform for driving the first detection camera and the first light source to move up and down and / or horizontally, and a second moving platform for driving the second detection camera and the second light source to move up and down and / or horizontally.

[0008] Preferably, the first moving platform also drives the third light source to move, and the first detection camera, the first light source and the third light source move synchronously.

[0009] Preferably, the first movable platform is further provided with a linear driving member for independently driving the third light source to move horizontally.

[0010] Preferably, the first light source is coaxially arranged with the first detection camera.

[0011] Preferably, the first light source and / or the second light source is a multi-angle light source, which includes an arched lampshade with several steps. Each step is provided with several lamp beads at intervals, and the illumination directions of all the lamp beads point to the same point.

[0012] Preferably, the lamp beads are RGB lamp beads.

[0013] Preferably, the third light source is a white light source.

[0014] The utility model has the following beneficial effects:

[0015] The utility model can detect whether there are scratches and chipped edges on the edge of the wafer by cooperating with the first detection camera and the first light source, and the second detection camera and the second light source. By arranging a third light source on the side of the carrier to emit light toward it, when the wafer is placed on the carrier, the side edge of the wafer is illuminated by the third light source, which can highlight the cracks on the edge of the wafer that are not easy to find, so that they can be clearly imaged on the first detection camera or the second detection camera, thereby ensuring the reliability of the wafer appearance detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a cross-sectional view of a wafer with an edge crack that is difficult to detect.

[0017] Figure 2 It is a schematic diagram of the present utility model.

[0018] Figure 3 for Figure 2 Schematic diagram after the wafer is hidden.

[0019] Figure 4 This is a schematic diagram from another perspective of the present invention.

[0020] Figure 5 Schematic diagram of the carrier.

[0021] Figure 6 is a schematic diagram of the first light source.

[0022] Figure 7 This is the optical path diagram when the third light source highlights the crack.

[0023] Description of main components symbols:

[0024] Wafer 10, crack 11;

[0025] Mounting base 20, first movable platform 21, second movable platform 22, linear drive member 23;

[0026] Rotating motor 31, rotating shaft 32, stage 33, vacuum hole 34;

[0027] a first detection camera 40;

[0028] A first light source 50, an arched lampshade 51, and an aperture 52;

[0029] a second detection camera 60;

[0030] a second light source 70;

[0031] The third light source 80 . DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

[0033] like Figures 2 to 7 As shown, the utility model discloses a wafer edge chipping detection mechanism, which includes a mounting seat 20, a rotation drive assembly, a first movable platform 21, a second movable platform 22, a carrier 33, a first detection camera 40, a second detection camera 60, a first light source 50, a second light source 70 and a third light source 80. The rotation drive assembly includes a rotary motor 31 and a rotating shaft 32. The rotating shaft 32 is rotatably connected to the mounting seat 20, and the rotating shaft 32 is limited by a retaining spring and other limiting members with the mounting seat 20, that is, the rotating shaft 32 can only remain in the same position relative to the mounting seat 20. The rotary motor 31 is in transmission connection with the rotating shaft 32, and the rotary motor 31 drives the rotating shaft 32 to rotate. The carrier 33 is installed at the top of the rotating shaft 32, and the carrier 33 rotates synchronously with the rotating shaft 32. The carrier 33 is used to position and place the wafer 10 to be detected. When the wafer 10 is placed on the carrier 33, the edge of the wafer 10 is exposed outside the carrier 33 for easy detection. It should be noted that this novel mechanism is only used to inspect the edge area of the wafer 10. Therefore, the first inspection camera 40 and the second inspection camera 60 are not directly facing the center of the carrier 33. The rotation drive assembly can rotate the wafer 10 on the carrier 33 so that the edge periphery of the wafer 10 can sequentially enter the field of view of the inspection cameras. To prevent the wafer 10 from shifting during the rotation process, multiple vacuum holes 34 are provided on the carrier 33. These vacuum holes 34 are connected to an external vacuum pump. Activating the external vacuum pump can vacuum-adsorb the wafer 10 onto the carrier 33.

[0034] The first detection camera 40 and the first light source 50 are located above the carrier 33. The first detection camera 40 and the first light source 50 can be driven by the first mobile platform 21 and the first light source 50 and the first detection camera 40 move synchronously. In this case, the first mobile platform 21 can drive the horizontal movement and the vertical movement of the first detection camera 40 and the first light source 50. At this time, the first mobile platform 21 is a two-axis mobile platform. The two-axis mobile platform is a prior art and will not be described in detail. The first mobile platform 21 is set to adapt to wafers 10 of different sizes and adjust the distance between the first detection camera 40 and the first light source 50 and the wafer 10. In addition, it can also cooperate with the automated production line to play an avoidance role, such as avoiding the robot that loads and unloads the wafer 10 to the carrier 33.

[0035] The first light source 50 is coaxially arranged with the first inspection camera 40. This multi-angle light source includes an arched lampshade 51. The first inspection camera 40 is connected to the top of the arched lampshade 51. The arched lampshade 51 is provided with several steps, each of which is spaced apart and equipped with a number of RGB lamp beads, all oriented toward the same point. The lamp beads on the same step can be integrated into an aperture 52 for easier installation. The multi-angle light source can better illuminate and highlight difficult-to-find wafers 10 and surface scratches, making surface defects on the wafer 10 more visible to the inspection camera.

[0036] The second light source 70 and the second detection camera 60 are located below the carrier 33. The second light source 70 and the second detection camera 60 can be driven by the second mobile platform 22 and the second light source 70 and the second detection camera 60 move synchronously. In this case, the second mobile platform 22 only drives the second light source 70 and the second detection camera 60 to move horizontally. At this time, the second mobile platform 22 is a linear motion module. The linear motion module is a prior art and will not be described in detail. The second mobile platform 22 is also set to adapt to wafers 10 of different sizes, and can also cooperate with automated production lines to play an avoidance role. If the distance between the second light source 70 and the second detection camera 60 and the wafer 10 needs to be adjusted, the second mobile platform 22 can be changed to a two-axis mobile platform. The coordination method of the second light source 70 and the second detection camera 60, that is, the configuration, can refer to the first light source 50 and the first detection camera 40 and will not be described in detail.

[0037] The third light source 80 is located on the side of the carrier 33, and the irradiation direction of the third light source 80 is set toward the carrier 33. The third light source 80 is a white light source. In order to adapt to wafers 10 of different sizes, the third light source 80 is also set on the first movable platform 21, and the third light source 80 and the first light source 50 can move synchronously. In order to better adjust the distance between the third light source 80 and the wafer 10, a linear drive member 23, such as a cylinder or an electric push rod, is also provided on the first movable platform 21 for independently driving the third light source 80 to move horizontally. After the above settings, the first light source 50, the first detection camera 40 and the linear drive member 23 can always move synchronously, and when necessary, the linear drive member 23 can also independently push the third light source 80 to move. By setting the third light source 80, it can be well highlighted. Figure 1 The crack on the wafer 10 shown has an optical path as shown in FIG. Figure 7 In addition, the multi-angle light source can also play a certain auxiliary lighting effect. Through the utility model, the crack imaging effect is obvious, which can ensure the reliability of detection.

[0038] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any changes or replacements that can be easily thought of by any technician familiar with this technical field within the technical scope disclosed in the present invention should be covered by the protection scope of the present invention.

Claims

1. A wafer edge chipping detection mechanism, characterized by: It includes a carrier, a first detection camera, a second detection camera, a first light source, a second light source and a third light source. The first detection camera and the first light source are located above the carrier, the second detection camera and the second light source are located below the carrier, and the third light source is located on the side of the carrier. The illumination direction of the third light source is set toward the carrier.

2. The wafer edge chipping detection mechanism according to claim 1, characterized in that: It also includes a rotation drive component for driving the carrier to rotate.

3. The wafer edge chipping detection mechanism according to claim 1, wherein: The carrier is provided with a vacuum hole for adsorbing the wafer, and the vacuum hole is connected to an external vacuum pumping device.

4. The wafer edge chipping detection mechanism according to claim 1, wherein: It also includes a first moving platform for driving the first detection camera and the first light source to move up and down and / or horizontally, and a second moving platform for driving the second detection camera and the second light source to move up and down and / or horizontally.

5. The wafer edge chipping detection mechanism according to claim 4, characterized in that: The first moving platform also drives the third light source to move, and the first detection camera, the first light source and the third light source move synchronously.

6. The wafer edge chipping detection mechanism according to claim 5, characterized in that: The first movable platform is further provided with a linear driving member for independently driving the third light source to move horizontally.

7. The wafer edge chipping detection mechanism according to claim 1, wherein: The first light source is coaxially arranged with the first detection camera.

8. The wafer edge chipping detection mechanism according to claim 1, wherein: The first light source and / or the second light source is a multi-angle light source, which includes an arched lampshade with several steps. Each step is provided with several lamp beads at intervals, and the illumination directions of all the lamp beads point to the same point.

9. The wafer edge chipping detection mechanism according to claim 8, characterized in that: The lamp beads are RGB lamp beads.

10. The wafer edge chipping detection mechanism according to claim 1, wherein: The third light source is a white light source.

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