Inductor and power over Ethernet system

Abstract

The utility model discloses an inductor and a power over Ethernet system. Exemplary embodiments of a multi-channel EMI inductor are disclosed. In an exemplary embodiment, the inductor includes a magnetic core and at least eight or more signal lines. The magnetic core includes opposite first and second sides. The magnetic core defines an opening extending through the magnetic core from the first side to the second side. At least eight or more signal lines extend through the same single opening of the magnetic core. The at least eight or more signal lines include pins partially embedded within the dielectric such that ends of the pins are exposed without being embedded within the dielectric. An end portion of the pin is configured to have a non-linear shape.

Description

Technical Field

[0001] The present disclosure generally relates to multi-channel EMI (electromagnetic interference) inductors. Background Art

[0002] This section provides background information related to the present disclosure which is not necessarily prior art.

[0003] Traditional local area network (LAN) common mode choke (CMC) components face challenges in Power over Ethernet (POE) applications. For example, increased power capacity can be problematic because the small enameled wire and its winding process can struggle to support the higher currents associated with POE applications.

[0004] Common-mode chokes are an integral part of LAN magnetics between the MAC and PHY ICs (Media Access Control (MAC) and Physical Layer (PHY) Integrated Circuits) and the input / output (I / O) ports. Common-mode chokes are responsible for suppressing common-mode noise, including electrostatic discharge (ESD) protection. According to the LAN 802.XX protocol, eight wires are traditionally reserved in the twisted-pair cable to transmit and receive data in differential mode. As an example, Figure 12 、 Figure 13 and Figure 14 Three different types of traditional LAN-CMC product platforms 1401, 1501 and 1601 are shown respectively. Utility Model Content

[0005] The utility model provides an inductor, which includes: a magnetic core including a first side and a second side that are opposite, the magnetic core defining an opening extending through the magnetic core from the first side to the second side; and at least eight or more signal lines extending through the same single opening of the magnetic core, characterized in that the at least eight or more signal lines include pins partially embedded in a dielectric body, such that ends of the pins are exposed and not embedded in the dielectric body, and the ends of the pins are configured to have a non-linear shape.

[0006] According to the aforementioned inductor, it is characterized in that the at least eight or more signal lines all extend through the same single opening of the magnetic core, whereby the inductor is able to operate to suppress all common-mode noise through a single magnetic ring, so that differential-mode signals cancel each other in the single magnetic ring, thereby avoiding the risk of magnetic saturation of the magnetic core.

[0007] According to the aforementioned inductor, it is characterized in that:

[0008] The ends of the pins are bent into L-shaped ends, thereby defining a surface mount technology (SMT) land pattern;

[0009] each leg includes a middle portion extending between the L-shaped ends, the middle portion of each leg extending through a same single opening in the core; and

[0010] The pins are partially embedded in the dielectric body to maintain the pin pitch without deformation, thereby providing a precise SMT land pattern, and / or maintaining good coplanarity.

[0011] The inductor according to the foregoing is characterized in that the end portions of the pins are bent into an L-shape so that the pins have an overall seagull or winged shape.

[0012] The inductor according to the foregoing is characterized in that the dielectric body is made of injection-molded plastic configured to ensure a pin pitch without deformation.

[0013] The inductor according to the foregoing is characterized in that the pins are made of phosphor bronze to balance conductivity and mechanical strength.

[0014] The inductor according to the foregoing is characterized in that the pin comprises a phosphor bronze wire having a rectangular cross-sectional profile.

[0015] According to the aforementioned inductor, it is characterized in that:

[0016] The dielectric body includes a dielectric head defining an orientation hole along the first side and the second side of the magnetic core; and

[0017] The pins are inserted into the orientation holes of the dielectric header.

[0018] According to the aforementioned inductor, it is characterized in that the magnetic core comprises:

[0019] U-shaped magnetic core;

[0020] I-shaped core; or

[0021] A first U-shaped magnetic core half and a second U-shaped magnetic core half are coupled together to cooperatively define the opening therebetween.

[0022] According to the aforementioned inductor, it is characterized in that the inductor is configured to be used in a Power over Ethernet (POE) system.

[0023] According to the aforementioned inductor, it is characterized in that the at least eight or more signal lines include:

[0024] Four signal lines configured to operate as POE positive S wires; and

[0025] Configured as four signal lines that can operate as the POE negative N wire.

[0026] The inductor according to the foregoing embodiment is characterized in that the inductor is configured to have a thermal resistance of less than 0.5 degrees Celsius per watt.

[0027] According to the aforementioned inductor, it is characterized in that the magnetic core is a monolithic single-component structure.

[0028] According to the aforementioned inductor, it is characterized in that:

[0029] The ends of the pins are bent into an L-shape to define a surface mount technology (SMT) land pattern, and such that each pin includes opposing L-shaped ends between a straight or mid-portion, the L-shaped ends cooperatively defining an overall seagull or winged shape;

[0030] The straight or straight middle portion of each leg extends through the same single opening of the core; and

[0031] The pins are partially embedded in the dielectric body to maintain the pin pitch without deformation, thereby providing a precise SMT land pattern, and / or maintaining good coplanarity.

[0032] According to the aforementioned inductor, it is characterized in that:

[0033] The ends of the pins include opposing L-shaped ends between a straight or mid-portion, the L-shaped ends cooperatively defining an overall seagull or winged shape and defining a surface mount technology (SMT) land pattern; and

[0034] The dielectric body is made of injection molded plastic, wherein the pins are partially embedded so that the opposite L-shaped ends of the pins are exposed and not embedded in the injection molded plastic, whereby the pins are partially embedded in the injection molded plastic to maintain the pin pitch without deformation, thereby providing a precise SMT land pattern, and / or providing good coplanarity.

[0035] The present invention also provides an Ethernet power supply system, characterized in that the Ethernet power supply system includes the aforementioned inductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.

[0037] Figure 1 A first exemplary embodiment of a multi-channel EMI inductor is shown that can be configured for use as a high power, compact size filter inductor in Power over Ethernet (POE) applications.

[0038] Figure 2 A second exemplary embodiment of a multi-channel EMI inductor is shown, which may be configured for use as a high power, compact size filter inductor in Power over Ethernet (POE) applications.

[0039] Figure 3 and Figure 4 A third exemplary embodiment of a multi-channel EMI inductor is shown, which may be configured for use as a high-power, compact filter inductor in Power over Ethernet (POE) applications.

[0040] Figure 5 (a) to (d) include exemplary dimensions (mm) according to exemplary embodiments of the present disclosure. Figure 4 The inductor is shown in top, end, bottom, and side views. Figure 5 The dimensions provided in (a) through (d) are merely examples and are provided for illustration purposes only, as inductors in other exemplary embodiments may be configured differently (eg, having smaller or larger dimensions, etc.).

[0041] Figure 6 Shows an exemplary embodiment of the present disclosure with exemplary dimensions (in millimeters) Figure 3 and Figure 4 Recommended or preferred land patterns for inductors are shown. Figure 6 The dimensions provided in are examples for illustrative purposes only, as inductors in other exemplary embodiments may be configured differently (eg, having smaller or larger dimensions, etc.).

[0042] Figure 7 A fourth exemplary embodiment of a multi-channel EMI inductor is shown, which may be configured for use as a high-power, compact filter inductor in Power over Ethernet (POE) applications.

[0043] Figure 8 (a) to (e) include exemplary dimensions (mm) according to exemplary embodiments of the present disclosure. Figure 7 The inductor is shown in top, end, bottom, and side views. Figure 8 The dimensions provided in (a) through (e) are merely examples and are provided for illustration purposes only, as inductors in other exemplary embodiments may be configured differently (eg, having smaller or larger dimensions, etc.).

[0044] Figure 9 Shows an exemplary embodiment of the present disclosure with exemplary dimensions (in millimeters) Figure 7 Recommended or preferred land patterns for inductors are shown. Figure 9The dimensions provided in are examples for illustrative purposes only, as inductors in other exemplary embodiments may be configured differently (eg, having smaller or larger dimensions, etc.).

[0045] Figure 10 Showing an exemplary embodiment according to the present disclosure Figure 3 and Figure 4 The inductor shown and / or Figure 7 The equivalent circuit of the inductor is shown.

[0046] Figure 11 is a diagram showing an exemplary embodiment according to the present disclosure Figure 3 and Figure 4 The inductor shown and / or Figure 7 A line graph showing recommended or preferred soldering conditions for inductors is shown.

[0047] Figure 12 A conventional Ethernet LAN common mode choke is shown, which may be installed in a line card or network adapter card in a switch close to the MAC & PHY IC and external data ports.

[0048] Figure 13 A conventional Ethernet LAN common mode choke is shown, which may include some or all of the LAN magnetic components integrated into the common mode choke.

[0049] Figure 14 shows a traditional Ethernet LAN common mode choke, which is Figure 12 and Figure 13 The conventional Ethernet LAN common mode choke shown can have better manufacturing efficiency and lower cost than the conventional Ethernet LAN common mode choke shown.

[0050] Figure 15 A conventional LAN common mode choke comprising a plurality of insulating cores connected in parallel is shown.

[0051] Corresponding reference numerals may indicate corresponding (but not necessarily identical) parts throughout the several views of the drawings. DETAILED DESCRIPTION

[0052] Example embodiments will now be described more fully with reference to the accompanying drawings.

[0053] For POC, POE, POE+, and POH in cables and strands used in external sensors in the automotive, exploration, robotics, and AI industrial branches, the trend is to have no independent power supply for these sensors. And the power capacity of POE devices (such as sensors) has increased from 13 watts (W) (protocol 802.3AF, type 1) to 90W (protocol 802.3BT, type 3) in the past few years. Although the supply voltage remains stable at 12-72Vdc (normal 48Vdc), the required current has increased from 0.35Adc (protocol 802.3AF, type 1) to 2.5Adc (protocol 802.3BT, type 3). And it seems that this trend of increasing current will continue for a long time.

[0054] The original EMI magnetic component design lacked POE functionality. The coil wire served solely as LAN signal transmission. If small-gauge wire (e.g., AWG 36-40, 0.08-0.2mm diameter) were sufficient for microampere differential-mode signal currents and voltages (up to 2.5Vrms), there would be no additional heat dissipation issues. Furthermore, small-gauge enameled wire advantageously allows for compact and well-managed coils that can be assembled into favorable magnetic circuit geometries and core shapes (e.g., toroidal, etc.).

[0055] However, as recognized herein, for POE applications, wires are not only used to send and receive data with differential mode signals, but the wires are also responsible for power transmission. For popular modes, two of the eight wires serve as POE positive conductors (S conductors), and the other two of the eight wires serve as POE negative conductors (N conductors). For this arrangement, each wire will support more than 1.0 ampere (A) current. In recent years, due to higher current requirements, four of the eight wires serve as POE positive conductors (S conductors), and the remaining four serve as POE negative conductors (N conductors). In this example, each wire can be assigned 0.5A current. The rated voltage between the S conductor group and the N conductor group can be up to 72Vdc, so it is not limited to a signal voltage of up to 2.5Vrms. And if the voltage exceeds the 36V safety level according to IEC, UL and TUV standards, necessary insulation and safety design are required.

[0056] In these situations, LAN common mode chokes must address the following challenges or issues:

[0057] ● Thicker wires must be used to support higher currents (e.g., from microamps to several amps)

[0058] ●Sufficient insulation and safety distance between POE S wire and N wire;

[0059] ●Heat issues must be considered;

[0060] ●For traditional LAN magnetic components, cost and automated manufacturing are challenges;

[0061] ESD protection becomes even more important for the smaller MOSFET oxide layers in IC packages. As a special type of common-mode noise, ESD is distributed across all channels. How to best suppress ESD pulses is a key consideration.

[0062] With the foregoing in mind, exemplary embodiments of multi-channel EMI inductors have been developed and / or disclosed herein that may be configured to address and / or solve the following problems associated with conventional Ethernet LAN common-mode noise chokes / inductors, including:

[0063] Traditional Ethernet LAN common-mode noise chokes / inductors cannot support higher Power over Ethernet (PoE) currents due to their small enameled wire and wire winding process limitations.

[0064] ● Traditional Ethernet LAN common-mode noise chokes / inductors have low safety and insulation levels;

[0065] Thermal issues associated with traditional Ethernet LAN common-mode noise chokes / inductors;

[0066] Automated manufacturing process challenges associated with traditional Ethernet LAN common-mode noise chokes / inductors; and

[0067] ●Electrostatic discharge (ESD) issues associated with traditional Ethernet LAN common-mode noise chokes / inductors.

[0068] The exemplary embodiments disclosed herein may provide or include one or more (but not necessarily any or all) of the following advantageous effects or features, including:

[0069] Stamped metal (e.g., tinned phosphor bronze) pins, rather than enameled wire, to accommodate high current requirements and balance conductivity and mechanical strength;

[0070] Multiple channels / lines in a single configuration to accommodate high-power, smaller filter inductors in PoE+ applications;

[0071] ●Good heat dissipation due to the flat structure;

[0072] ● Allows for 100% automated manufacturing process;

[0073] ●At least eight or more channels / lines in a core hole / a magnetic ring to maintain optimal ESD noise suppression;

[0074] ●Use injection molding to ensure pin pitch and no deformation; and

[0075] ●Apply and embed “L”, “seagull” or “winged” shapes in injection molded bodies (e.g., liquid crystal polymer (LCP) grades reinforced with 40% glass fiber, plastic, etc.) to achieve precise SMT (surface mount technology) pad patterns and good coplanarity, even with many pins.

[0076] Referring now to the accompanying drawings, Figure 1 A first exemplary embodiment of a multi-channel EMI inductor 100 is shown, which can be configured for use as a high-power, compact filter inductor in Power over Ethernet (POE) applications. In this exemplary embodiment, the inductor 100 includes a magnetic core 104 configured as a monolithic, single-component structure with perfect magnetic loop and properties.

[0077] Inductor 100 includes at least eight or more conductive (e.g., metal, etc.) pins 108. Pins 108 are preferably formed of tin-plated phosphor bronze to balance conductivity and mechanical strength. Pins 108 may have a rectangular cross-sectional profile. Pins 108 are stamped from a frame 112 and electroplated.

[0078] Pin 108 is only along one side (at Figure 1 The frame 112 comprising the pins 108 and the dielectric header 116 (e.g., a grade of liquid crystal polymer (LCP) reinforced with 40% glass fiber, plastic, etc.) is slidably inserted into the magnetic core 104 (e.g., a ferrite core, etc.). Injection molding ensures a safe pitch and no deformation of the pins. The pins 108 are then bent along the other / opposite side (on the Figure 1 The pins 108 are bent into an "L" pin shape (center, right side). Each pin 108 thus includes opposing L-shaped ends between a straight or straight middle portion, which, in conjunction with the fixture, define a "gull" or "winged" shape, ultimately resulting in an SMD (surface mount device) land pattern. The ends of the frame 112 are trimmed, cut, or otherwise removed so that only the pins 108 remain.

[0079] Thus, this exemplary embodiment of inductor 100 includes at least eight or more signal lines within a single core. Using a material injection process to maintain pin pitch and distortion-free operation, the pins are shaped like "L," "seagull," or "wings" and embedded in a dielectric (e.g., a liquid crystal polymer (LCP) grade reinforced with 40% glass fiber, plastic, etc.) to achieve a precise SMT pad pattern and good coplanarity, even with numerous pins. In this exemplary embodiment, inductor 100 includes metal pins made of phosphor bronze to balance conductivity and mechanical strength. Furthermore, inductor 100 includes at least eight or more lines / channels within a single component structure, making it suitable for use as a high-power, compact filter inductor in PoE+ applications.

[0080] Figure 2A second exemplary embodiment of a multi-channel EMI inductor 200 is shown, which can be configured for use as a high-power, compact filter inductor in Power over Ethernet (POE) applications. Advantageously, this exemplary embodiment of the inductor 200 provides a cost-competitive and flexible solution for responding to customization requests within a short timeframe, without requiring any additional tooling and material investments to support prototypes and small sample orders.

[0081] Inductor 200 includes a magnetic core 204 (e.g., a ferrite core, etc.), which includes first and second core sections or halves (e.g., a U-shaped core, an I-shaped core, a U-shaped core half, etc.) assembled to achieve sufficient impedance as required. Inductor 200 includes at least ten or more enameled wires 208 having a circular cross-sectional profile. The enameled wires 208 are directly inserted along both sides into the orientation holes of a dielectric header 216 (e.g., a liquid crystal polymer (LCP) grade reinforced with 40% glass fiber, plastic, etc.), thereby ensuring the pin pitch. The pin terminals or ends of the enameled wires 208 are bent into an "L" shape to serve as SMT (surface mount technology) pads.

[0082] Thus, this exemplary embodiment of inductor 200 includes at least eight or more signal lines within a core hole. A material injection process is used to ensure pin pitch and distortion-free operation. The pins are shaped like "L," "seagull," or "wings" and embedded in a dielectric (e.g., a liquid crystal polymer (LCP) grade reinforced with 40% glass fiber, plastic, etc.) to achieve a precise SMT land pattern and good coplanarity, even with many pins. In this exemplary embodiment, inductor 200 includes at least eight or more lines / channels within a single component structure, making it useful as a high-power, compact filter inductor in PoE+ applications.

[0083] Figure 3 A third exemplary embodiment of a multi-channel EMI inductor 300 is shown, which can be configured for use as a high-power, compact filter inductor in Power over Ethernet (POE) applications. Advantageously, this exemplary embodiment of inductor 300 combines the construction advantages of inductors 100 and 200 to achieve an optimal SMD platform solution for automotive manufacturing requirements. Advantages achievable with inductor 300 include a more precise land pattern, a smaller package size, and higher mounting density.

[0084] In this exemplary embodiment, the inductor 300 includes a magnetic core 304 (e.g., a ferrite core, etc.) and at least ten or more conductive (e.g., metal, etc.) pins 308. Pins 308 are preferably formed of tin-plated phosphor bronze. Pins 308 may have a rectangular cross-sectional profile.

[0085] Pins 308 are inserted directly into the orientation holes of a dielectric header 316 (e.g., a grade of liquid crystal polymer (LCP) reinforced with 40% fiberglass, plastic, etc.) to maintain pin pitch. The terminals or ends of pins 308 are bent into an "L" shape to serve as SMT (surface mount technology) pads.

[0086] Therefore, this exemplary embodiment of inductor 300 includes at least eight or more signal lines within a single core. Using a material injection process to maintain pin pitch and distortion-free operation, the pins are shaped like "L," "seagull," or "wings" and embedded in a dielectric (e.g., a liquid crystal polymer (LCP) grade reinforced with 40% fiberglass, plastic, etc.) to achieve a precise SMT pad pattern and good coplanarity, even with numerous pins. In this exemplary embodiment, inductor 300 includes metal pins made of phosphor bronze to balance conductivity and mechanical strength. Furthermore, inductor 300 includes at least eight or more lines / channels within a single component structure, making it suitable for use as a high-power, compact filter inductor in PoE+ applications.

[0087] Figure 7 A fourth exemplary embodiment of a multi-channel EMI inductor 800 is shown, which can be configured for use as a high-power, compact filter inductor in Power over Ethernet (POE) applications. In this exemplary embodiment, inductor 800 includes a magnetic core 804 (e.g., a ferrite core, etc.) and at least ten or more conductive (e.g., metal, etc.) pins 808. Magnetic core 804 has a monolithic, single-component structure.

[0088] Pins 808 are preferably formed of tin-plated phosphor bronze. Pins 808 may have a rectangular cross-sectional profile. Pins 808 are inserted directly into the orientation holes of a dielectric header 816 (e.g., a grade of liquid crystal polymer (LCP) reinforced with 40% fiberglass, plastic, etc.), thereby maintaining pin pitch. The terminals or ends of pins 808 are bent into an "L" shape to serve as SMT (surface mount technology) pads.

[0089] In this exemplary embodiment, the ends of the pins 808 are bent into an "L" shape to define an SMT (surface mount technology) land pattern, and each pin 808 includes opposing L-shaped ends between a straight or mid-section, the L-shaped ends cooperatively defining an overall seagull or winged shape. The straight or mid-section of each pin 808 extends through the same single opening of the magnetic core 804. The pins 808 are partially embedded in the dielectric to maintain pin pitch without deformation, provide a precise SMT land pattern, and / or maintain good coplanarity.

[0090] Exemplary embodiments of inductors disclosed herein (eg, inductor 100 ( Figure 1 )、Inductor 200( Figure 2)、Inductor 300( Figure 3 )、Inductor 800( Figure 7 ) are configured to provide excellent ESD protection, unexpected pulse isolation, common-mode noise suppression, and "crosstalk" between transmit and receive signal channels. When faced with these challenges in POE applications with increasing power capabilities, the exemplary embodiments of the inductor disclosed herein excel in flexibility and competitiveness.

[0091] Conventional LAN common mode chokes, which include enameled wire wound around a toroidal or other shaped core, have limitations on the cross-sectional shape and gauge (thickness) of the wire due to the type of winding machine. Figure 1 )、Inductor 200( Figure 2 )、Inductor 300( Figure 3 )、Inductor 800( Figure 7 ) do not have these limitations regarding wire selection, as wires with round or rectangular cross-sectional shapes are acceptable. The exemplary embodiments of the inductors disclosed herein also allow for a wide selection of wire gauges; for example, wire diameters ranging from 0.1 millimeter (mm) to 2.0 mm are acceptable. The corresponding rated current can be up to tens of amperes. Designers are free to select the most appropriate wire characteristics based on actual application conditions.

[0092] For conventional LAN common mode chokes, the insulation and corresponding voltage ratings are based on the coating of the enameled wire. The safety rating depends on the insulation according to IEC, UL, 3C, etc. For example, the exemplary embodiments of the inductors disclosed herein (e.g., inductor 100 ( Figure 1 )、Inductor 200( Figure 2 )、Inductor 300( Figure 3 )、Inductor 800( Figure 7 ), the insulation between the pins (e.g., phosphor bronze pins, wires, etc.) is ensured by sufficient air distance and the dielectric itself, so that the insulation level can reach basic insulation or even reinforced insulation. For current and possible future communication voltage applications, this insulation will be sufficient.

[0093] In conventional common mode choke coil configurations, the thermal resistance from the hot spot to the surface is 1 degree Celsius per watt (°C / W) to 20°C / W. In comparison, exemplary embodiments of the inductors disclosed herein (e.g., inductor 100 ( Figure 1 )、Inductor 200( Figure 2 )、Inductor 300( Figure 3 )、Inductor 800( Figure 7 ) etc.) are configured to make almost 100% contact with plastic, core and air. The corresponding thermal resistance is less than 0.5°C / W, and the heat distribution is good with little or no hot spot problem.

[0094] Although conventional LAN common mode chokes have been improved to support automated manufacturing, their efficiency is still relatively low, especially for the assembly process. Figure 1 )、Inductor 200( Figure 2 )、Inductor 300( Figure 3 )、Inductor 800( Figure 7 ) etc.) are suitable for 100% automated manufacturing of the entire process. And the automated manufacturing equipment is relatively standard and not too complicated.

[0095] Exemplary embodiments of inductors disclosed herein (eg, inductor 100 ( Figure 1 )、Inductor 200( Figure 2 )、Inductor 300( Figure 3 )、Inductor 800( Figure 7 ) etc.) are conducive to maintenance and the corresponding costs are competitive.

[0096] The smaller MOSFET oxide layers in integrated circuit (IC) packages increase the importance of ESD protection. For common-mode noise in particular, ESD is distributed across all channels. How to best suppress ESD pulses becomes a key consideration.

[0097] For example, Figure 15 A conventional LAN common-mode choke 1701 is shown, which may include a toroidal core or other core shapes. Choke 1701 comprises multiple insulated cores connected in parallel. In such conventional chokes, common-mode noise, particularly ESD suppression, is unbalanced, resulting in additional differential-mode signal noise. Furthermore, as POE current increases, the positive and negative lines in any isolated core cannot be guaranteed to cancel each other out, leading to the risk of core magnetic saturation.

[0098] Traditionally, POE currents travel through multiple lines, which are even worse with isolated lines connected in parallel with common mode chokes, and these lines go into different core holes.

[0099] In the exemplary embodiments of the inductors disclosed herein (eg, inductor 100 ( Figure 1 )、Inductor 200( Figure 2 )、Inductor 300( Figure 3 )、Inductor 800( Figure 7 ), regardless of the number of signal lines, all signal lines are located in the same or a single "core hole." Therefore, all common-mode noise can be suppressed by a single magnetic ring, and differential-mode signals (including the POE power current loop) can completely cancel each other in a single magnetic ring, eliminating the risk of magnetic saturation.

[0100] Thus, exemplary embodiments of a multi-channel EMI inductor are disclosed. In the exemplary embodiment, the inductor includes a magnetic core and at least eight or more signal lines. The magnetic core includes a first side and a second side that are opposite. The magnetic core defines an opening extending through the magnetic core from the first side to the second side. The at least eight or more signal lines extend through the same single opening of the magnetic core. The at least eight or more signal lines include pins partially embedded within a dielectric body, such that ends or terminals of the pins are exposed and not embedded within the dielectric body. The ends of the pins are configured to have a non-linear shape.

[0101] In an exemplary embodiment, at least eight or more signal lines all extend through the same single opening of the magnetic core, such that the inductor is operable to suppress all common-mode noise through the single magnetic ring and such that differential-mode signals cancel each other in the single magnetic ring, thereby avoiding the risk of magnetic saturation of the magnetic core.

[0102] In an exemplary embodiment, the ends of the pins are bent into an "L" shape, thereby defining an SMT (surface mount technology) land pattern. Each pin includes a middle portion extending between the L-shaped ends. The middle portion of each pin extends through the same single opening of the magnetic core. The pins are partially embedded in the dielectric to maintain the pin pitch without deformation, provide a precise SMT land pattern, and / or maintain good coplanarity.

[0103] In an exemplary embodiment, the ends of the pins are bent into an "L" shape so that the pins have an overall seagull or winged shape.

[0104] In an exemplary embodiment, the dielectric body comprises injection molded plastic configured to maintain the pin pitch without deformation.

[0105] In an exemplary embodiment, the pins are made of phosphor bronze to balance electrical conductivity and mechanical strength.

[0106] In an exemplary embodiment, the pins comprise phosphor bronze wires having a rectangular cross-sectional profile.

[0107] In an exemplary embodiment, the dielectric body includes a dielectric header defining orientation holes along first and second sides of the magnetic core. The pins are inserted into the orientation holes of the dielectric header. The pins can thus be embedded within the dielectric material of the dielectric header, which can help ensure pin pitch and lack of deformation for precise SMT (surface mount technology) land patterns and good coplanarity, even with many pins.

[0108] The pins may comprise an enameled wire having a circular cross-sectional profile that is inserted into an orientation hole in the dielectric header such that the ends of the enameled wire protrude outwardly beyond the dielectric header along opposite sides of the magnetic core. The pins may thus be embedded within the dielectric material of the dielectric header, which may help ensure pin pitch and absence of deformation for precise SMT (surface mount technology) land patterns and good coplanarity even with many pins, for example.

[0109] The pins may be phosphor bronze tin-plated pins having a rectangular cross-sectional profile, which are inserted into the orientation holes of the dielectric header so that the L-shaped ends of the phosphor bronze tin-plated pins protrude outwardly beyond the dielectric header along opposite sides of the magnetic core. The pins may thus be embedded within the dielectric material of the dielectric header, which may help ensure pin pitch and absence of deformation for precise SMT (surface mount technology) land patterns and good coplanarity even with many pins, etc.

[0110] In an exemplary embodiment, the magnetic core comprises a U-shaped core, an I-shaped core, or first and second U-shaped core halves. In the latter case, the first and second U-shaped core halves are coupled together to cooperatively define an opening between the first and second U-shaped core halves.

[0111] In exemplary embodiments, the inductor is configured for use within a Power over Ethernet (POE) system. In these embodiments, the at least eight or more signal lines may include four signal lines configured to operate as POE positive S wires and four signal lines configured to operate as POE negative N wires.

[0112] In an exemplary embodiment, the inductor is configured to have a thermal resistance of less than 0.5 degrees Celsius per Watt (° C. / W).

[0113] In an exemplary embodiment, the magnetic core is a monolithic, single-component structure. The ends of the pins are bent into an "L" shape to define an SMT (surface mount technology) land pattern, and each pin includes opposing L-shaped ends between a straight or straight middle portion, the L-shaped ends cooperatively defining an overall seagull or winged shape. The straight or straight middle portion of each pin extends through the same single opening of the magnetic core. The pins are partially embedded in the dielectric to maintain the pin pitch without deformation, provide a precise SMT land pattern, and / or maintain good coplanarity.

[0114] In an exemplary embodiment, a Power over Ethernet system includes an inductor as disclosed herein.

[0115] Example embodiments are provided so that the present disclosure will be thorough and the scope will be fully conveyed to those skilled in the art. A large number of specific details, such as examples of specific components, devices and methods, are set forth to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be adopted, that the example embodiments can be implemented in many different forms, and that nothing should be construed as limiting the scope of the present disclosure. In some example embodiments, well-known processes, well-known device structures, and well-known technologies are not described in detail. In addition, the advantages and improvements that can be achieved with one or more exemplary embodiments of the present invention are provided for illustrative purposes only and do not limit the scope of the present disclosure (because the exemplary embodiments disclosed herein may provide all or none of the above-mentioned advantages and improvements and still fall within the scope of the present disclosure).

[0116] The specific numerical dimensions and values, specific materials and / or specific shapes disclosed herein are examples in nature, and do not limit the scope of the present disclosure. The disclosure of the specific value and specific value range for a given parameter here is not the exhaustion of other values and value ranges that can be used for one or more of the examples disclosed here. Moreover, it is envisioned that any two specific values for the specific parameters narrated here can limit the endpoints (the disclosure of the first value and the second value for a given parameter can be interpreted as disclosing and can also adopt any value between the first and second values for a given parameter) that can be suitable for the value range of a given parameter. For example, if parameter X is exemplified as having value A and also exemplified as having value Z here, it is envisioned that parameter X can have the value range from about A to about Z. Similarly, it is envisioned that the disclosure of two or more value ranges (no matter this scope is nested, overlapping or different) for a parameter includes all possible combinations of the value range that can be clamped by the endpoints of the disclosed range. For example, if parameter X is illustrated herein as having values within the range 1-10 or 2-9 or 3-8, it is also contemplated that parameter X may have other value ranges including 1-9, 1-8, 1-3, 1-2, 2-10, 2-8, 2-3, 3-10, and 3-9.

[0117] The terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. As used herein, the singular forms "one" and "an" may be intended to also include plural forms, unless the context clearly indicates otherwise. The terms "comprising" and "having" are inclusive, and therefore specify the presence of the described features, integers, steps, operations, elements and / or parts, but do not exclude the presence or increase of one or more other features, integers, steps, operations, elements, parts and / or their groups. The method steps, processes and operations described herein are not to be construed as necessarily requiring their execution in the particular order discussed or illustrated, unless specifically identified as an execution order. It is also to be understood that additional or alternative steps may be adopted.

[0118] When an element or layer is referred to as being "on," "engaged," "connected," or "coupled" to another element or layer, the element or layer may be directly on, directly engaged, connected, or coupled to the other element or layer, or intervening elements or layers may be present. Conversely, when an element is referred to as being "directly on," "directly engaged," "directly connected," or "directly coupled" to another element or layer, no intervening elements or layers may be present. Other words used to describe the relationship between elements should be interpreted in the same manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0119] The term "approximately" when applied to a value indicates that the calculation or measurement allows for slight imprecision in the value (close to exact in value; approximately or reasonably close to a value; nearly). If, for some reason, the imprecision provided by "approximately" is not otherwise understood in the art in this ordinary sense, then "approximately" as used herein indicates at least the variation that may result from ordinary measurement methods or use of such parameters. For example, the terms "substantially," "about," and "roughly" may be used herein to mean within manufacturing tolerances. Whether or not modified by the term "approximately," the claims include equivalents to the quantities.

[0120] Although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts here, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or part from another region, layer or part. Terms such as "first", "second" and other numerical terms do not imply order when used here unless the context clearly indicates. Thus, a first element, component, region, layer or part can be referred to as a second element, component, region, layer or part when not departing from the teachings of the example embodiments.

[0121] Spatially relative terms (such as "in," "out," "under," "below," "down," "above," "upper," etc.) may be used herein for ease of description to describe the relationship of one element or feature to another element or feature as illustrated in the accompanying drawings. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is flipped, an element described as being "below" or "beneath" other elements or features will be oriented as being "above" the other elements or features. Thus, the example term "below" may encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), so the spatially relative descriptors used herein are interpreted accordingly.

[0122] Table 1 below shows the available Figure 3 and Figure 4 Table 2 below shows the example electrical specifications of the inductor at 25°C according to an exemplary embodiment of the present disclosure. Figure 7 Example electrical specifications of the inductor at 25°C are shown.

[0123]

[0124] Table 1

[0125]

[0126] Table 2

[0127] The foregoing description of the embodiments has been provided for the purpose of illustration and description. It is not intended to be exhaustive or to limit the present disclosure. The independent elements, intended or described uses or features of a particular embodiment are generally not limited to that particular embodiment, but are interchangeable where appropriate and can be used in selected embodiments (even if the embodiment is not specifically shown or described). The same content can also be changed in many ways. Such variations are not considered to be deviations from the present disclosure, and all such modifications are intended to be included within the scope of the present disclosure.

Claims

1. An inductor, comprising: a magnetic core comprising opposing first and second sides, the magnetic core defining an opening extending through the magnetic core from the first side to the second side; as well as at least eight or more signal lines extending through the same single opening of the magnetic core, It is characterized in that the at least eight or more signal lines include pins partially embedded in a dielectric body, so that ends of the pins are exposed and not embedded in the dielectric body, and the ends of the pins are configured to have a non-linear shape.

2. The inductor according to claim 1, wherein The at least eight or more signal lines all extend through the same single opening of the magnetic core, whereby the inductor is operable to suppress all common-mode noise through a single magnetic ring, such that differential-mode signals cancel each other in the single magnetic ring, thereby avoiding the risk of magnetic saturation of the magnetic core.

3. The inductor according to claim 1, wherein: The ends of the pins are bent into L-shaped ends, thereby defining a surface mount technology (SMT) land pattern; each leg including a middle portion extending between the L-shaped ends, the middle portion of each leg extending through a same single opening in the core; and The pins are partially embedded in the dielectric body to maintain the pin pitch without deformation, thereby providing a precise SMT land pattern, and / or maintaining good coplanarity.

4. The inductor according to claim 1, wherein The dielectric body is made of injection molded plastic configured to maintain pin pitch without deformation.

5. The inductor according to claim 1, wherein The pins are made of phosphor bronze to balance electrical conductivity and mechanical strength.

6. The inductor according to claim 1, wherein The pins include phosphor bronze wires having a rectangular cross-sectional profile.

7. The inductor according to claim 1, wherein: The dielectric body includes a dielectric head defining an orientation hole along the first side and the second side of the magnetic core; and The pins are inserted into the orientation holes of the dielectric header.

8. The inductor according to claim 1, wherein The magnetic core comprises: U-shaped magnetic core; I-shaped core; or A first U-shaped magnetic core half and a second U-shaped magnetic core half are coupled together to cooperatively define the opening therebetween.

9. The inductor according to claim 1, wherein: The inductor is configured to be usable within a Power over Ethernet (POE) system.

10. The inductor according to claim 9, wherein: The at least eight or more signal lines include: Four signal lines configured to operate as POE positive S wires; and Configured as four signal lines that can operate as the POE negative N wire.

11. The inductor according to claim 1, wherein The inductor is configured to have a thermal resistance of less than 0.5 degrees Celsius per watt.

12. The inductor according to claim 1, wherein The magnetic core is a monolithic single-component structure.

13. An Ethernet power supply system, characterized in that: The Power over Ethernet system comprises the inductor according to any one of claims 1 to 12.

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