Annular heating film shrinking device and wafer expanding equipment

Abstract

The utility model discloses an annular heating film shrinking device and wafer expanding equipment. The annular heating film shrinking device comprises a driving assembly, a mounting seat and an annular heater, the driving end of the driving assembly is connected with the mounting base, the annular heater is connected to the mounting base, and the driving assembly can drive the mounting base to move in the first direction so as to drive the annular heater to move towards or away from a wafer; the annular heater comprises an annular heating element, at least one circle of annular heating element uniformly extends in the circumferential direction of the annular heater, and the annular heating element is used for heating and shrinking the edge film. The edge film is radiated, heated and baked through the annular heater, only heat radiation is achieved, no obvious hot air exists, it can be guaranteed that the edge film is not affected by external hot air as far as possible, the stretching and unfolding state after heat expansion is kept, and then the film shrinking quality is guaranteed.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductors, and in particular to an annular heating film shrinking device and a wafer expansion device. Background Art

[0002] In the wafer back-end processing technology, the wafer thermal expansion film is SDBG (Stea l th Di ic ing Before Gr in ， Wafer thinning before hidden cutting, DBG (Dicing Before Grinding) is an important part of the process. After the wafer is split at low temperature, the film needs to be expanded again at room temperature or above room temperature. After thermal expansion, the kerf (cut) width between the two independent units of the wafer can reach the expected width. After cold expansion and thermal expansion, the edge carrier film of the wafer will be stretched and deformed. Utilizing the thermal shrinkage characteristics of the film, after the thermal expansion is completed, the edge film between the wafer and the iron ring will be heated and shrunk, and the deformed edge film on the periphery of the wafer will be heated and retracted, and changed from a deformed and relaxed state back to a tensioned state, which is convenient for recycling and subsequent processing.

[0003] Currently, the most common shrinking method on the market is to heat the film around the wafer edge with a rotating hot air gun. The number of hot air guns is generally two or four, and they are evenly distributed. However, in the actual shrinking process, the actual shrinkage effect of the film is affected by the parameters such as the starting position angle of the hot air gun, the shape and size of the air outlet, and the rotation speed. This can lead to abnormalities such as different shrinkage degrees in different areas of the film, deviations in the shrinkage direction, shrinkage wrinkles, and excessive kerf width shrinkage after standing, seriously affecting the shrinkage quality. Utility Model Content

[0004] The purpose of the embodiments of the present application is to provide a ring-shaped heating film shrinking device and a wafer expansion device, which bakes the edge film through radiation heating by a ring heater, with only heat radiation but no obvious hot air, so as to ensure that the edge film is not affected by external hot air as much as possible, maintain the stretched and expanded state after thermal expansion, and thus ensure the quality of the shrinkage film.

[0005] To achieve the above objectives, this application adopts the following technical solutions:

[0006] On the one hand, an annular heating and shrinking device is provided for heating and shrinking the edge film between a wafer and an iron ring. The annular heating and shrinking device includes: a driving component, a mounting seat, and an annular heater; the driving end of the driving component is connected to the mounting seat, and the annular heater is connected to the mounting seat. The driving component can drive the mounting seat to move in a first direction, thereby driving the annular heater to move toward or away from the wafer; the annular heater includes an annular heating element, and the annular heating element is evenly extended along the circumference of the annular heater. At least one circle is arranged, and the annular heating element is used to heat and shrink the edge film.

[0007] Furthermore, the annular heater also includes an outer shell, an annular groove is provided in the outer shell, the annular heating element is wound in the annular groove, an annular opening is formed on the lower end side of the annular groove, and a vent joint connected to the annular groove is provided on the outer shell, so that gas can enter the annular groove and flow out from the annular opening after passing through the annular heating element.

[0008] Furthermore, the annular heating element is arranged at the annular opening.

[0009] Furthermore, the annular heating element is a heating wire.

[0010] Furthermore, it also includes a first mounting plate and a plurality of adjustment locking members, the first mounting plate is connected to the mounting seat, the annular heater is installed on the lower side of the first mounting plate through the plurality of adjustment locking members, and the horizontality of the annular heater can be adjusted by the adjustment locking members.

[0011] Furthermore, the mounting seat includes a connecting plate, a plurality of first waist holes are opened on the connecting plate, and a plurality of locking holes are provided on the first mounting plate. The plurality of locking holes correspond to the plurality of first waist holes, and can all move along the second direction within the projection range of the corresponding first waist holes and be locked by fasteners.

[0012] Furthermore, the mounting base also includes a second mounting plate and a reinforcement member, the second mounting plate is connected to the driving end of the driving assembly along the first direction, the connecting plate is arranged at the lower part of the second mounting plate, and the reinforcement member is arranged between the second mounting plate and the connecting plate.

[0013] Furthermore, it also includes an adapter plate, which is provided with a plurality of second waist holes, the length direction of the second waist holes is parallel to the third direction, and the driving assembly is installed on the adapter plate through a fixing piece inserted into the second waist hole.

[0014] Furthermore, the driving assembly includes a servo motor and a linear module, the servo motor is installed on the adapter plate, the linear module is connected to the servo motor, the servo motor drives the linear module to move along the first direction, and the mounting seat is installed on the linear module.

[0015] On the other hand, a wafer expansion device is also provided, comprising the annular heating shrinking device described above.

[0016] The beneficial effects of the present application are as follows: the driving component can drive the mounting base to move precisely in a direction perpendicular to the surface of the wafer through precise mechanical structure and design. The bottom of the mounting base is cleverly configured with a ring heater, and the ring heater is evenly surrounded by ring heating elements. The ring heating elements can heat the edge film to shrink the film. This design not only ensures uniform heat radiation, but also avoids the hot air interference that may be caused by traditional hot air guns, thereby maximally maintaining the stretched and expanded state of the wafer edge film after thermal expansion.

[0017] During operation, the ring-shaped heating element uses its radiant heating properties to gently and evenly bake the wafer edge film. The lack of significant hot air flow during this process allows the edge film to shrink without external interference, ensuring stable and consistent shrinking quality. Furthermore, the ring-shaped heater design simplifies the tedious parameter adjustments required with traditional hot air guns, such as outlet shape, size, and rotation speed, further improving production efficiency and process controllability.

[0018] In general, this annular heating shrink film device not only significantly improves the quality of shrink film and reduces the complex adjustment of process parameters, but also brings substantial improvements to the wafer back-end processing technology by improving production efficiency and reducing production costs. This innovative design effectively enhances the shrinkage uniformity and stability of the wafer edge film. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present application is further described in detail below with reference to the accompanying drawings and examples.

[0020] Figure 1 This is a three-dimensional diagram of the annular heating shrink film device according to an embodiment of the present application;

[0021] Figure 2 This is an exploded view of the annular heating shrink film device according to an embodiment of the present application;

[0022] Figure 3 This is a front view of the annular heating shrink film device according to an embodiment of the present application;

[0023] Figure 4 This is a side view of the annular heating shrink film device according to an embodiment of the present application;

[0024] Figure 5 A bottom view of the annular heater according to an embodiment of the present application;

[0025] Figure 6 For the embodiment of this application Figure 5 Cross-section view at AA in the middle.

[0026] In the figure: 1. Adapter plate; 101. Second waist hole; 2. Drive assembly; 201. Servo motor; 202. Linear module; 3. Mounting seat; 301. Connecting plate; 302. Second mounting plate; 303. Reinforcement member; 3011. First waist hole; 4. Ring heater; 401. Housing; 402. Ring heating element; 4011. Ring groove; 5. First mounting plate; 501. Locking hole; 6. Adjustment locking member; 7. Drag chain assembly; 701. Support plate; 702. Bracket; 703. Drag chain; 704. Friction pad. DETAILED DESCRIPTION

[0027] To make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved more clearly, the technical solutions of the embodiments of this application are further described in detail below. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of this application.

[0028] In the description of this application, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and can refer to internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0029] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0030] like Figures 1-4As shown, this embodiment provides an annular heating shrinking device for heating and shrinking the edge film between the wafer and the iron ring, and the annular heating shrinking device includes: a driving component 2, a mounting seat 3 and an annular heater 4; the driving end of the driving component 2 is connected to the mounting seat 3, and the annular heater 4 is connected to the mounting seat 3, and the driving component 2 can drive the mounting seat 3 to move along the first direction, thereby driving the annular heater 4 to move toward or away from the wafer; the annular heater 4 includes an annular heating element 402, and the annular heating element 402 is evenly extended along the circumference of the annular heater 4. At least one circle is arranged, and the annular heating element 402 is used to heat and shrink the edge film.

[0031] Based on the above scheme, the device includes at least the following processes:

[0032] Initial state: the driving assembly 2 is connected to the mounting base 3, and the ring heater 4 is arranged on the lower side of the mounting base 3, ready to heat the edge film of the wafer.

[0033] Heating process: When the wafer completes thermal expansion, its edge membrane is in a stretched and expanded state, and the drive assembly 2 is started to drive the mounting base 3 and the annular heater 4 at the bottom to move along the first direction (specifically the Z-axis direction) so that the annular heater 4 is close to the edge membrane of the wafer. The annular heating element 402 starts to work and bakes the edge membrane of the wafer by radiation heating. Since the annular heating element 402 is evenly extended along the circumference of the annular heater 4 with at least one circle, in simple terms, the annular heating element 402 is at least around the annular heater 4. In this way, the heat emitted by the annular heating element 402 toward the edge membrane can be more uniform, and there is only heat radiation without obvious hot air, which can minimize the impact of external hot air on the edge membrane and maintain its stretched and expanded state after thermal expansion.

[0034] Shrinking Process: As the annular heating element 402 continues to heat, the edge film of the wafer begins to shrink. During this shrinking process, the uniform heating characteristics of the annular heating element 402 allow the edge film to shrink evenly and stably back to its original position, returning from a deformed, relaxed state to a tensioned state. Once the desired shrinking effect is achieved, the drive assembly 2 drives the mounting base 3 and the annular heater 4 at the bottom to move in the opposite direction of the first direction, away from the wafer, completing the shrinking process.

[0035] In summary, the edge film is baked by the radiation heating generated by the annular heating element 402 in the annular heater 4 instead of the common hot air gun blowing. There is only heat radiation but no obvious hot air, which can ensure that the edge film is not affected by the external hot air as much as possible, maintain the stretched and expanded state after thermal expansion, and thus ensure the quality of the shrink film; at the same time, it also simplifies the tedious parameter adjustment process in the traditional hot air gun heating method, such as the shape, size, rotation speed of the air outlet, etc., further improving the production efficiency and process controllability.

[0036] Further, if Figure 5 、 Figure 6 As shown, the annular heater 4 includes a shell 401, an annular groove 4011 is provided in the shell 401, the annular heating element 402 is wound in the annular groove 4011, and the lower end side of the annular groove 4011 forms an annular opening. The shell 401 is provided with a vent joint connected to the annular groove 4011, and the vent joint can be connected to a blowing device through a pipeline, so that gas can enter the annular groove 4011 and flow out from the annular opening after passing through the annular heating element 402. The shell 401, as the main part of the annular heater 4, not only plays a role in protecting and supporting the annular heating element 402, but also provides a uniform and stable heating environment for the annular heating element 402 through the annular groove 4011 designed inside it. The annular heating element 402 generates heat when powered on, and transfers the heat downward to the wafer from the annular opening through the annular groove 4011, thereby causing the edge film of the wafer to shrink.

[0037] In order to further optimize the heat transfer effect, a vent joint connected to the annular groove 4011 is provided on the housing 401. This vent joint can be connected to the blowing equipment through a pipeline. When the annular heater 4 is working, the blowing equipment will blow gas into the annular groove 4011 through the vent joint. When these gases pass through the annular groove 4011, they will take away the heat generated by the annular heating element 402 and blow it evenly toward the wafer, thereby achieving uniform heat transfer. The design of the vent joint is not limited to use when the annular heater 4 is working. Even if the annular heater 4 is in a non-working state, gas can still be blown into the annular groove 4011 through the vent joint to play a role in heat dissipation. This design not only improves the thermal efficiency of the annular heater 4, but also extends its service life and reduces the risk of damage caused by overheating.

[0038] In addition, the annular heating element 402 can be arranged at the annular opening. The advantage of this design is that the annular heating element 402 can be closer to the edge film, and the heat generated by it can be better transferred to the edge film, thereby achieving a faster, more effective and uniform heating shrinkage effect.

[0039] The annular heating element 402 is a heating wire. The heating wire used as an annular heating element has the characteristics of high efficiency and energy saving, uniform heating, strong adaptability, safety and reliability, and long service life.

[0040] Furthermore, the system also includes a first mounting plate 5 and a plurality of adjustment locks 6. The first mounting plate 5 is connected to the mounting base 3. The annular heater 4 is mounted on the underside of the first mounting plate 5 via the plurality of adjustment locks 6. The adjustment locks 6 can also be used to adjust the level of the annular heater 4. The first mounting plate 5 is a key component connecting the mounting base 3 and the annular heater 4. Its top surface is tightly connected to the bottom of the mounting base 3, ensuring the structural stability of the entire heating system. The bottom surface of the first mounting plate 5 serves as the reference surface for the installation of the annular heater 4, allowing for subsequent precise adjustment. The annular heater 4 is carefully mounted on the bottom surface of the first mounting plate 5 via a plurality of adjustment locks 6. These adjustment locks 6 not only secure and support the annular heater 4, but more importantly, they allow the operator to fine-tune the level of the annular heater 4. By adjusting these locks, the annular heater 4 can be ensured to remain completely level after installation, thereby ensuring its parallelism with the wafer. Adjusting parallelism is crucial to ensuring uniform heating of the wafer edge film. During the heating process, if the ring heater 4 is tilted or non-parallel to the wafer, different locations on the edge film will receive different degrees of heat radiation, resulting in uneven heating and affecting the shrinking effect. By adjusting the level of the ring heater 4, it can be ensured that it remains completely parallel to the wafer, so that the edge film can be heated evenly during the heating process, avoiding shrinking quality problems caused by uneven heating.

[0041] Furthermore, the introduction of an adjustable locking member 6 provides the device with greater flexibility and adaptability. In practice, operators can flexibly adjust the position and angle of the ring heater 4 based on factors such as the wafer type and size, and the material of the edge film, to achieve optimal heating results. This high degree of customizability enables the ring-shaped heating shrink film device to be widely used in various wafer back-end processing processes, meeting the needs and expectations of diverse customers.

[0042] In some embodiments, the mounting base 3 includes a connecting plate 301, on which a plurality of first waist holes 3011 are provided, and a plurality of locking holes 501 are provided on the first mounting plate 5. The plurality of locking holes 501 correspond to the plurality of first waist holes 3011, and are all able to move along the second direction (i.e., the Y-axis direction) within the projection range of the corresponding first waist holes 3011 and be locked by fasteners. The connecting plate 301 serves as a bridge between the annular heater 4 and the mounting base 3, playing a connecting role. On the connecting plate 301, a plurality of first waist holes 3011 are cleverly provided. The design of these first waist holes 3011 not only reduces the weight of the connecting plate 301, but more importantly, they provide the possibility of fine-tuning the annular heater 4 in the Y-axis direction. At the same time, the first mounting plate 5 is provided with locking holes 501 corresponding to the plurality of first waist holes 3011. These locking holes 501 fit closely with the first waist holes 3011, and together constitute the basis for fine-tuning the annular heater 4 in the Y-axis direction. In practice, workers can adjust the position of the ring heater 4 in the Y-axis direction by adjusting the position of the fastener in the first waist hole 3011 and the locking hole 501. Because the first waist hole 3011 has a certain length and width, the fastener can move in the second direction (i.e., the Y-axis direction) within its projection range, and the locking function can secure the ring heater 4 in the desired position. This design provides the ring heater 4 with greater flexibility and adaptability in the Y-axis direction.

[0043] In addition, the mounting base 3 also includes a second mounting plate 302 and a reinforcement 303. The second mounting plate 302 is connected to the driving end of the driving assembly 2 along the first direction, the connecting plate 301 is arranged at the lower part of the second mounting plate 302, and the reinforcement 303 is arranged between the second mounting plate 302 and the connecting plate 301. As an important component of the mounting base 3, the second mounting plate 302 is tightly connected to the driving end of the driving assembly 2 along the first direction (i.e., the Z-axis direction). This design ensures that the driving assembly 2 can stably and accurately drive the mounting base 3 and the annular heater 4 thereunder to move. The second mounting plate 302 not only plays a role of connection and support, but also provides a stable mounting platform for the connecting plate 301 and the annular heater 4. In order to further enhance the strength and stability of the mounting base 3, a reinforcement 303 is arranged between the second mounting plate 302 and the connecting plate 301. The design of the reinforcement 303 can be customized according to actual needs and is usually made of high-strength materials such as steel or aluminum alloy. They are firmly connected between the second mounting plate 302 and the connecting plate 301 by welding, bolting or other means, forming a stable tripod structure, which effectively improves the anti-torsion and anti-bending capabilities of the mounting base 3. The introduction of the reinforcement 303 not only improves the overall strength of the mounting base 3, but also enhances its ability to resist external interference. In the wafer back-end processing technology, the mounting base 3 needs to withstand the forces and torques from the annular heater 4 and the drive assembly 2. Through the reinforcement effect of the reinforcement 303, it can be ensured that the mounting base 3 can still maintain a stable structure and precise position under the action of these forces, thereby ensuring that the annular heater 4 can accurately heat and shrink the edge film of the wafer.

[0044] At the same time, it also includes an adapter plate 1, on which a plurality of second waist holes 101 are provided, and the length direction of the second waist holes 101 is parallel to the third direction, and the drive assembly 2 is installed on the adapter plate 1 by means of a fixing member (such as a screw or screw) inserted into the second waist hole 101. One side of the adapter plate 1 can be connected to the equipment (machine) to play a role of stable installation and flexible adjustment, and the other side is used to install the drive assembly 2. On the adapter plate 1, a plurality of second waist holes 101 are provided, and the length direction of these second waist holes 101 is parallel to the third direction (i.e., the X-axis direction). This design allows the staff to change the position of the annular heater 4 in the X-axis direction by adjusting the position of the fastener in the second waist hole 101. Since the second waist hole 101 has a certain length and width, the fastener can move along the X-axis direction within its projection range and fix the annular heater 4 in the desired position through the locking function. This fine-tuning function is crucial to ensure precise alignment between the annular heater 4 and the wafer. During the wafer back-end processing, the placement of the wafer may deviate slightly due to various reasons. By adjusting the position of the ring heater 4 in the X-axis direction, we can ensure that it maintains the best alignment with the wafer, thereby avoiding problems such as uneven heat distribution or poor shrinking effect.

[0045] Furthermore, the design of the second scalloped hole 101 makes adjustment of the ring heater 4 in the X-axis direction simple and quick. Workers no longer need to perform complex disassembly and reinstallation of the entire device; fine-tuning can be achieved simply by adjusting the position of the fastener in the second scalloped hole 101. This design not only improves work efficiency but also reduces operational difficulty and costs.

[0046] In some embodiments, the device further includes a drag chain assembly 7 mounted on the adapter plate 1. The drag chain assembly 7, as a mechanical auxiliary component, protects flexible components such as wires and cables from wear, pulling, or squeezing during movement. The drag chain assembly 7 plays an equally important role in the annular heating shrink film device. Because the drive assembly 2 needs to drive the mounting base 3 and the annular heater 4 below it to move, the wires and cables connected between them will also continuously expand and contract and bend with movement. Without proper protection, these wires and cables can easily become damaged, affecting the normal operation of the entire device. Installing the drag chain assembly 7 on the adapter plate 1 effectively solves this problem. The drag chain assembly 7 tightly wraps around the wires and cables, providing them with a solid protective layer. When the mounting base 3 and the annular heater 4 move under the drive of the drive assembly 2, the drag chain assembly 7 also moves with them, but the wires and cables inside remain relatively stationary under its protection, avoiding wear and damage caused by movement. Furthermore, the drag chain assembly 7 provides guidance and support. It helps to arrange the wires and cables more neatly on the adapter plate 1, avoiding entanglement and interference caused by disorder. At the same time, the sturdy structure of the drag chain assembly 7 can also provide a certain amount of support for the wires and cables, preventing them from falling or swinging due to gravity during movement, thereby further improving the stability and reliability of the device.

[0047] Specifically, the drag chain assembly 7 includes a bracket 702, a support plate 701, and a drag chain 703. The support plate 701 is mounted on the side of the adapter plate 1, the bracket 702 is mounted on the mounting base 3, and one end of the drag chain 703 is mounted on the bracket 701, and the other end is mounted on the bracket 702. The bracket 701, serving as the starting point of the drag chain assembly 7, is mounted on the side of the adapter plate 1. This design allows the bracket 701 to move with the movement of the adapter plate 1 while maintaining a fixed relative position with the adapter plate 1. The presence of the bracket 701 provides a stable starting point for the drag chain 703, allowing it to extend neatly along a predetermined path. The bracket 702 is the other end of the drag chain assembly 7 and is securely mounted on the mounting base 3. Similar to the bracket 701, the bracket 702 also serves to secure and support the drag chain 703. But the difference is that the bracket 702 needs to move with the movement of the mounting base 3 and the annular heater 4, so it must have a certain strength and stability to ensure that it will not be deformed or damaged by external forces during the movement. The drag chain 703 is the core part of the drag chain assembly 7, and its two ends are respectively installed on the support plate 701 and the bracket 702. The interior of the drag chain 703 is designed with multiple chain links and guide grooves, which can tightly wrap flexible components such as wires and cables. When the adapter plate 1 and the mounting base 3 move relative to each other, the drag chain 703 will also expand and contract and bend accordingly, but the wires and cables inside can remain relatively stationary under its protection. This design not only effectively prevents wear and damage to the wires and cables, but also ensures their safety and stability during movement.

[0048] In addition, a friction pad 704 is provided between the drag chain 703 and the support plate 701. The friction pad 704 primarily increases the friction between the drag chain 703 and the support plate 701, preventing the drag chain 703 from sliding or shifting due to external forces during movement. Because the outer surface of the drag chain 703 is typically relatively smooth and the contact area with the support plate 701 is limited, the friction may be insufficient to maintain the stable position of the drag chain 703. The friction pad 704, however, addresses this shortcoming. Its rough surface and increased contact area effectively increase the friction between the drag chain 703 and the support plate 701. The material choice for the friction pad 704 is also crucial. To ensure good wear and corrosion resistance, materials with a high coefficient of friction, wear resistance, and corrosion resistance are typically selected, such as rubber, polyurethane, or special alloys. These materials not only provide sufficient friction but also maintain stable performance over long-term use, preventing friction loss due to wear or corrosion.

[0049] In the further design of the annular heating shrink film device, the composition and operation mechanism of the drive assembly 2 have been optimized and clarified. Specifically, the drive assembly 2 mainly includes two parts: a servo motor 201 and a linear module 202. The synergy between them ensures that the mounting base 3 and the annular heater 4 below it can move accurately and stably along a predetermined path. As the core component of the drive assembly 2, the servo motor 201 is cleverly installed on the adapter plate 1. This design enables the servo motor 201 to move with the movement of the adapter plate 1 while maintaining a relatively fixed position with the adapter plate 1. The servo motor 201 has the characteristics of high precision, high stability and high response speed. It can accurately control the moving speed and position of the linear module 202, thereby ensuring that the annular heater 4 can accurately reach the predetermined position. The linear module 202 is the actuator of the servo motor 201. It is closely connected to the servo motor 201 and realizes movement along the first direction (i.e., the Z-axis direction) by receiving instructions from the servo motor 201. The linear module 202 is composed of guide rails, sliders, drive units and other parts, and has the advantages of simple structure, smooth movement, and high positioning accuracy. In the annular heating shrink film device, the function of the linear module 202 is to convert the rotational motion of the servo motor 201 into linear motion, thereby driving the mounting base 3 and the annular heater 4 thereunder to move up and down. The mounting base 3 is firmly mounted on the linear module 202 and serves as a support and fixing component for the annular heater 4. When the linear module 202 moves in the first direction driven by the servo motor 201, the mounting base 3 will also move accordingly, thereby driving the annular heater 4 to adjust up and down. This design not only ensures that the annular heater 4 can accurately reach the predetermined position, but also provides it with stable support and fixation, avoiding shaking or offset caused by movement.

[0050] To sum up, the edge film is baked by infrared radiation heating of the annular heater 4 instead of the common hot air gun blowing. There is only heat radiation but no obvious hot air, which can ensure that the edge film is not affected by external hot air as much as possible, and maintain the stretched and expanded state after thermal expansion, thereby ensuring the quality of shrinkage. In addition, the linear module 202 of the Z axis is used in conjunction with the waist holes in the X and Y axis directions, which can realize the X, Y, and Z three-axis adjustment of the position of the annular heater 4 and control the annular heater 4 to be coaxial with the wafer. At the same time, by adjusting the locking part 6, the parallelism of the annular heater 4 and the wafer can be adjusted to ensure that the temperature of each point on the same circumference of the edge film is the same during shrinkage, thereby ensuring uniform shrinkage.

[0051] On the other hand, a wafer expansion device is also provided, comprising the annular heating shrinking device described above.

[0052] In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and other positions or relationships are used solely for ease of description and simplified operation, and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meaning.

[0053] Throughout this specification, references to terms such as "an embodiment" or "example" indicate that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example.

[0054] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

[0055] The technical principles of the present application have been described above in conjunction with specific embodiments. These descriptions are intended solely to explain the principles of the present application and are not to be construed in any way as limiting the scope of protection of the present application. Based on the explanations herein, those skilled in the art will be able to devise other specific implementations of the present application without inventive effort, and such implementations will fall within the scope of protection of the present application.

Claims

1. A ring-shaped heating shrinking device for heating and shrinking the edge film between a wafer and an iron ring, characterized in that: The invention comprises a driving component (2), a mounting seat (3) and an annular heater (4); the driving end of the driving component (2) is connected to the mounting seat (3), the annular heater (4) is connected to the mounting seat (3), and the driving component (2) is capable of driving the mounting seat (3) to move along a first direction, thereby driving the annular heater (4) to move toward or away from a wafer; The annular heater (4) comprises an annular heating element (402), wherein the annular heating element (402) is evenly arranged in at least one circle along the circumference of the annular heater (4), and the annular heating element (402) is used to heat the edge film to shrink the film.

2. The annular heating shrink film device according to claim 1, characterized in that: The annular heater (4) further comprises an outer shell (401), an annular groove (4011) is provided in the outer shell (401), the annular heating element (402) is arranged around the annular groove (4011), an annular opening is formed on the lower end side of the annular groove (4011), and a vent joint connected to the annular groove (4011) is provided on the outer shell (401), so that gas can enter the annular groove (4011) and flow out from the annular opening after passing through the annular heating element (402).

3. The annular heating shrink film device according to claim 2, characterized in that: The annular heating element (402) is arranged at the annular opening.

4. The annular heating shrink film device according to claim 1, characterized in that: The annular heating element (402) is a heating wire.

5. The annular heating shrink film device according to any one of claims 1 to 4, characterized in that: It also includes a first mounting plate (5) and a plurality of adjusting locking members (6), wherein the first mounting plate (5) is connected to the mounting seat (3), and the annular heater (4) is mounted on the lower side of the first mounting plate (5) through the plurality of adjusting locking members (6), and the horizontality of the annular heater (4) can be adjusted through the adjusting locking members (6).

6. The annular heating shrink film device according to claim 5, characterized in that: The mounting seat (3) comprises a connecting plate (301), the connecting plate (301) is provided with a plurality of first waist holes (3011), the first mounting plate (5) is provided with a plurality of locking holes (501), the plurality of locking holes (501) correspond to the plurality of first waist holes (3011), and are all capable of moving along the second direction within the projection range of the corresponding first waist holes (3011) and being locked by a fastener.

7. The annular heating shrink film device according to claim 6, characterized in that: The mounting seat (3) further comprises a second mounting plate (302) and a reinforcement member (303), wherein the second mounting plate (302) is connected to the driving end of the driving assembly (2) along the first direction, the connecting plate (301) is arranged at the lower part of the second mounting plate (302), and the reinforcement member (303) is arranged between the second mounting plate (302) and the connecting plate (301).

8. The annular heating shrink film device according to any one of claims 1 to 4, characterized in that: The invention also comprises an adapter plate (1), wherein a plurality of second waist holes (101) are provided on the adapter plate (1), wherein the length direction of the second waist holes (101) is parallel to the third direction, and the drive assembly (2) is mounted on the adapter plate (1) via a fixing piece inserted into the second waist holes (101).

9. The annular heating shrink film device according to claim 8, characterized in that: The drive assembly (2) comprises a servo motor (201) and a linear module (202); the servo motor (201) is mounted on the adapter plate (1); the linear module (202) is connected to the servo motor (201); the servo motor (201) drives the linear module (202) to move along the first direction; and the mounting seat (3) is mounted on the linear module (202).

10. A wafer expansion device, characterized in that: The wafer expansion equipment includes the annular heating shrinking device according to any one of claims 1 to 9.

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