Transfer mechanism suitable for ultrathin wafer

Abstract

A transfer mechanism suitable for ultra-thin wafers comprises a bearing mechanism and a connecting rod mechanism, the bearing mechanism comprises a mounting rod, four supporting plates symmetrically arranged on the mounting rod and four elastic limiting blocks, the elastic limiting block comprises two rubber pads arranged at the ends, away from the mounting rod, of the supporting plates and two rubber blocking rods arranged at the ends, close to the mounting rod, of the supporting plates. According to the transfer mechanism suitable for the ultrathin wafer, the four supporting plates are arranged and symmetrically arranged at the two ends and the two sides of the mounting rod, the gravity center of the wafer can be stable when the wafer is placed on the mounting rod, the supporting plates are provided with the four elastic limiting blocks, the wafer is placed on the tops of the four elastic limiting blocks, and therefore the wafer can be placed on the mounting rod. Therefore, the impact force during placement can be buffered, and the wafer is prevented from being damaged during taking and placing.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafers, in particular to a transport mechanism suitable for ultra-thin wafers. Background Art

[0002] With the rapid development of semiconductor technology, wafers, as the basic materials of integrated circuits, have become increasingly important in the transportation process of their manufacturing. As the key equipment connecting different production processes, the performance of the wafer transportation mechanism directly affects the production efficiency, quality and cost of the wafer. Traditional wafer transportation mechanisms mostly use devices such as robotic arms or manipulators. The manipulator grabs the wafer and places it on a tray, which moves horizontally to transport it to the next processing area.

[0003] However, this method of transport has some shortcomings when used: during the placement process of the robot, the wafer is easily broken by the impact of the tray, and the position of the ultra-thin wafer on the tray is unstable, and it is easy to move in the tray during the transport process, thereby affecting the subsequent robot's fixed-point grasping of the ultra-thin wafer, and there is a risk of the ultra-thin wafer falling off during the transport process. Utility Model Content

[0004] In view of this, the present invention provides a transfer mechanism suitable for ultra-thin wafers to solve the above problems.

[0005] A transport mechanism suitable for ultra-thin wafers, comprising a carrying mechanism and a connecting rod mechanism arranged at the bottom of the carrying mechanism to drive the carrying mechanism to move. The carrying mechanism comprises a mounting rod, four support plates symmetrically arranged on the mounting rod, and four elastic limit blocks arranged on each of the support plates. The wafer is placed on top of the four elastic limit blocks. The elastic limit blocks include two rubber pads arranged at one end of the support plate away from the mounting rod, and two rubber stop rods arranged at one end of the support plate close to the mounting rod. Each of the rubber pads is provided with an arc-shaped baffle for limiting the translation of the wafer, and the wafer is placed between the four elastic limit blocks.

[0006] Furthermore, the rubber lever includes a base and a column arranged on the top of the base.

[0007] Furthermore, the top surface of the base and the top surface of the rubber pad are respectively higher than the supporting plate.

[0008] Furthermore, the support plate is a frame structure, and the support plate includes two horizontal and spaced-apart first support rods, and two second support rods arranged in three first support rod brackets, and the three second support rods are spaced-apart.

[0009] Furthermore, the elastic limiting blocks are symmetrically arranged on the top of the first support rods.

[0010] Furthermore, the connecting rod mechanism includes a first base, a first connecting rod rotatably set on the first base, a second connecting rod rotatably set on the first base, a second base rotatably set at the ends of the first connecting rod and the second connecting rod, a third connecting rod whose two ends are respectively hinged to the end of the first connecting rod and the mounting rod, and a fourth connecting rod whose two ends are respectively hinged to the second connecting rod and the mounting rod.

[0011] Furthermore, the widths of the first connecting rod and the second connecting rod are greater than the widths of the third connecting rod and the fourth connecting rod.

[0012] Compared with the prior art, the transfer mechanism for ultra-thin wafers provided by the present invention can stabilize the center of gravity of the wafer when it is placed on the mounting rod by setting four support plates and symmetrically arranging the support plates at both ends and both sides of the mounting rod. Four elastic limit blocks are provided on the support plate, and the wafer is placed on the top of the four elastic limit blocks, so as to buffer the impact force during placement and avoid damage to the wafer during taking and placing. The elastic limit blocks include two rubber pads and two rubber gear rods. The rubber pads are provided with arc-shaped blocking pieces, so as to limit the horizontal movement of the wafer. The column of the rubber gear rod can also limit the horizontal movement of the wafer, and the tops of the rubber pads and the rubber gear rods are respectively higher than the support plates, so as to buffer the impact force when the wafer is placed and avoid damage to the wafer during placement. The rubber material can also increase the friction of the wafer in the horizontal direction, thereby ensuring the stability of the wafer during transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic structural diagram of a transfer mechanism for ultra-thin wafers provided by the present invention.

[0014] Figure 2 for Figure 1 Schematic diagram of the structure of the connecting rod mechanism of the transfer mechanism suitable for ultra-thin wafers. DETAILED DESCRIPTION

[0015] The following is a further detailed description of specific embodiments of the present invention. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the scope of protection of the present invention.

[0016] like Figure 1 and Figure 2As shown, it is a schematic structural diagram of the transfer mechanism for ultra-thin wafers provided by the present invention. The transfer mechanism for ultra-thin wafers includes a carrier mechanism 10, and a connecting rod mechanism 20 disposed at the bottom of the carrier mechanism 10 and used to drive the carrier mechanism 10 to move horizontally. The transfer mechanism for ultra-thin wafers also includes other functional modules, such as a driver and controller that are transmission-connected to the connecting rod mechanism 20 and used to drive the connecting rod mechanism 20 to rotate, a material placement mechanism disposed at the bottom of the carrier mechanism 10 and used to lift the wafer, etc. These should be technologies well known to those skilled in the art and will not be described in detail here.

[0017] The supporting mechanism 10 includes a mounting rod 11 , four supporting plates 12 symmetrically arranged on the mounting rod 11 , and four elastic limiting blocks 13 respectively arranged on each supporting plate 12 .

[0018] The mounting rod 11 is used to support and position the support plate 12 .

[0019] The four support plates 12 are symmetrically arranged in pairs on both sides of the mounting rod 11, and the support plates 12 on each side are respectively located at both ends of the mounting rod 11, so that the four support plates 12 are distributed in a rectangular shape on the mounting rod 11. The support plates 12 are a frame structure.

[0020] The pallet 12 includes two horizontally arranged first support rods 121, and three second support rods 122 arranged between the two first support rods 121. The provision of the first support rods 121 and the second support rods 121 can reduce the weight of the pallet 12 and reduce the influence of the inertia of the pallet 12 on the moving position during transportation. The plurality of first support rods 121 are arranged at intervals, and the first support rods 121 are respectively connected vertically to the mounting rods 11. The length of the first support rods 121 is greater than the length of the wafer, so that the wafer is stably placed on the top of the pallet 12. The second support rods 122 are arranged at intervals and are perpendicular to the first support rods 121, so that each of the pallets 12 has two rectangular frames, thereby improving the structural strength of the pallet 12.

[0021] The elastic stoppers 13 are respectively arranged on the top of the first support rods 121. The elastic stoppers 13 include two rubber pads 131 and two rubber stoppers 132. When a wafer is placed on the tray 12, the four elastic stoppers 13 respectively contact the bottom and side of the wafer.

[0022] The rubber pad 131 is provided at the end of the first support rod 121 away from the mounting rod 11. An arc-shaped baffle 133 is provided on the top of the rubber pad 131. The baffle 13 is located at the end of the rubber pad 131 away from the mounting rod 11. The arc shapes of the two baffles 133 are respectively the same as the arc-shaped contours of the wafers placed on the support plate 12. The baffles 133 abut against the arc-shaped contours of the wafers, thereby limiting the horizontal movement of the wafers. The top of the main part of the rubber pad 131 is flush with the top of the first support rod 121, and the top of the baffle 133 is higher than the top of the first support rod 121.

[0023] The rubber stopper 132 includes a base 134 and a column 135 disposed at the center of the base 134. The base 134 is circular. The top surface of the base 134 is higher than the first support rod 121, separating the wafer from the first support rod 121 when the wafer is placed, providing a shock-absorbing effect. The column 135 is used to limit the horizontal movement of the wafer.

[0024] The connecting rod mechanism 20 includes a first base 21, a first connecting rod 22 hinged at the top of the first base 21, a second connecting rod 23 hinged on the first base 21, a second base 24 hinged to the end of the first connecting rod 22 and the end of the second connecting rod 23 respectively, a third connecting rod 25 hinged to the end of the first connecting rod 22 and the mounting rod 11 respectively, and a fourth connecting rod 26 hinged to the end of the second connecting rod 23 and the mounting rod 11 respectively.

[0025] The first connecting rod 22 and the third connecting rod 25 are combined to form a main rod group, which stably drives the supporting mechanism 10 to move. The second connecting rod 23 and the fourth connecting rod 26 are combined to form a secondary rod group, which assists the main rod group in driving the supporting mechanism 10 to improve the stability of the connecting rod mechanism 20 during driving.

[0026] During use, the third connecting rod 25 rotates around the first connecting rod 22, thereby driving the mounting rod 11 in a horizontal circular motion. The fourth connecting rod 26 synchronously rotates around the second connecting rod 23, thereby enhancing transport stability. It should be noted that the rotation of the third and fourth connecting rods 25 and 26 is driven by a linear cylinder or motor in conjunction with a gear set. Since the principles and structure of controlled connecting rod rotation are well known to those skilled in the art, they will not be further elaborated here.

[0027] The width and thickness of the first connecting rod 22 and the third connecting rod 25 are greater than the width and thickness of the third connecting rod 25 and the second connecting rod 26 , thereby providing strong support.

[0028] The first base 21 and the second base 24 are used to connect the main rod group and the auxiliary rod group respectively to increase the stability between the rod bodies.

[0029] The first and second connecting rods 22, 23 are driven by conventional methods, such as linear cylinders or gears at their hinges, and are therefore not described here or shown in the figures. The first connecting rod 22 is controlled to rotate about its hinge point on the first base 21, while the second connecting rod 23 is controlled to rotate about its hinge point on the second base 22.

[0030] The third connecting rod 25 and the fourth connecting rod 26 are not connected to the driving device, and are driven by the rotation of the first connecting rod 22 and the second connecting rod 23 .

[0031] Compared with the prior art, the transfer mechanism for ultra-thin wafers provided by the present invention is provided with four support plates 12 and the support plates 12 are symmetrically arranged at both ends and both sides of the mounting rod 11, so that the center of gravity of the wafer is stable when it is placed on the mounting rod 11, and four elastic limit blocks 13 are provided on the support plate 12, and the wafer is placed on the top of the four elastic limit blocks 13, so as to buffer the impact force during placement and avoid damage to the wafer during placement, and the elastic limit blocks 13 include two rubber pads 131 and two rubber stop rods 132, and the rubber pads 131 are provided with arc-shaped baffles 133, so as to limit the movement of the wafer in the horizontal direction, and the column 135 of the rubber stop rod 132 can also limit the movement of the wafer in the horizontal direction, and the top of the rubber pad 131 and the rubber stop rod 132 are respectively higher than the support plate 12, so as to buffer the impact force when the wafer is placed and avoid damage to the wafer during placement, and the rubber material can also increase the friction of the wafer in the horizontal direction, thereby ensuring the stability of the wafer during transportation.

[0032] The above are only preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent replacements or improvements within the spirit of the present invention are included in the scope of the claims of the present invention.

Claims

1. A transfer mechanism for ultra-thin wafers, characterized by: The transfer mechanism suitable for ultra-thin wafers includes a carrying mechanism and a connecting rod mechanism arranged at the bottom of the carrying mechanism to drive the carrying mechanism to move. The carrying mechanism includes a mounting rod, four support plates symmetrically arranged on the mounting rod, and four elastic limit blocks arranged on each of the support plates. The wafer is placed on the top of the four elastic limit blocks. The elastic limit blocks include two rubber pads arranged at one end of the support plate away from the mounting rod, and two rubber stop rods arranged at one end of the support plate close to the mounting rod. Each of the rubber pads is provided with an arc-shaped baffle for limiting the translation of the wafer, and the wafer is placed between the four elastic limit blocks.

2. The transfer mechanism for ultra-thin wafers according to claim 1, wherein: The rubber gear lever comprises a base and a column arranged on the top of the base.

3. The transfer mechanism for ultra-thin wafers according to claim 2, wherein: The top surface of the base and the top surface of the rubber pad are respectively higher than the supporting plate.

4. The transfer mechanism for ultra-thin wafers according to claim 1, wherein: The support plate is a frame structure, and includes two first support rods that are horizontally and spaced apart, and two second support rods that are arranged in three first support rod brackets, and the three second support rods are spaced apart.

5. The transfer mechanism for ultra-thin wafers according to claim 4, wherein: The elastic limiting blocks are symmetrically arranged on the top of the first support rods.

6. The transfer mechanism for ultra-thin wafers according to claim 1, wherein: The connecting rod mechanism includes a first base, a first connecting rod rotatably set on the first base, a second connecting rod rotatably set on the first base, a second base rotatably set at the ends of the first connecting rod and the second connecting rod, a third connecting rod whose two ends are respectively hinged to the end of the first connecting rod and the mounting rod, and a fourth connecting rod whose two ends are respectively hinged to the second connecting rod and the mounting rod.

7. The transfer mechanism for ultra-thin wafers according to claim 6, wherein: The widths of the first link and the second link are greater than the widths of the third link and the fourth link.

Images