Vapor chamber with high compression resistance structure

Abstract

The utility model discloses a vapor chamber with a high compression resistance structure, which comprises an upper cover plate, an upper cover capillary layer, a lower cover capillary layer and a lower cover plate, the upper cover capillary layer and the lower cover capillary layer are arranged in a cavity between the upper cover plate and the lower cover plate, and a strip support structure is arranged between the upper cover capillary layer and the lower cover capillary layer. The long-strip-shaped supporting structure is transversely placed and has a set height in the cross section direction of the long-strip-shaped supporting structure, and the upper side and the lower side of the long-strip-shaped supporting structure make contact with the upper cover capillary layer and the lower cover capillary layer in an abutting mode respectively. By means of the structure, the overall structure of the vapor chamber in the longitudinal direction and the transverse direction is strengthened, and the overall vapor chamber is higher in anti-pressure capacity, so that structural deformation caused by large assembling pressure is prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a temperature equalizing plate with a high pressure resistance structure. Background Art

[0002] With the development of electronic devices, the requirements for their heat dissipation performance are becoming increasingly stringent. Vapor chambers, as efficient heat transfer devices, are widely used in various electronic devices. However, existing vapor chambers are prone to structural deformation when subjected to high assembly pressure, affecting their performance and even disrupting the normal operation of the device. Therefore, it is necessary to develop a vapor chamber with a highly stress-resistant structure. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a temperature equalizing plate with a high pressure resistance structure.

[0004] The technical solution of the utility model is: it includes an upper cover plate, an upper cover capillary layer, a lower cover capillary layer and a lower cover plate, the upper cover capillary layer and the lower cover capillary layer are arranged in a cavity between the upper cover plate and the lower cover plate, and a long support structure is further provided between the upper cover capillary layer and the lower cover capillary layer. The long support structure is placed horizontally and has a set height along its cross-sectional direction. The upper side and the lower side of the long support structure are in contact with the upper cover capillary layer and the lower cover capillary layer respectively. The long support structure is provided in multiple groups, and the multiple groups of the long support structures extend outward in a star shape with the heat source area as the center.

[0005] Furthermore: the long strip supporting structure is a long cylindrical body, and the long cylindrical body is in line contact with the upper cover capillary layer.

[0006] Furthermore: the lower cover capillary layer is a porous structure layer formed by sintering copper powder, and the end faces of the lower cover capillary layer opposite to the upper cover capillary layer are provided with multiple evenly arranged cylindrical rings, and the free ends of the cylindrical rings are in contact with the upper cover capillary layer.

[0007] Furthermore: a cylinder is provided in the cylindrical ring, and two ends of the cylinder are respectively in contact with and connected to the upper cover capillary layer and the lower cover plate.

[0008] Furthermore: the end surfaces of the lower cover capillary layer and the upper cover capillary layer opposite to each other are further provided with a slot, and the long strip supporting structure is placed in the slot.

[0009] Furthermore: the upper cover plate is in the shape of a flat plate, and the lower cover plate is provided with a groove, and the groove forms a cavity between the upper cover plate and the lower cover plate, and the liquid working medium is filled in the cavity.

[0010] Furthermore: the four corners of the groove are respectively provided with mounting parts, the upper end surfaces of the mounting parts are in contact with the upper cover plate, and the upper cover plate and the lower cover plate are fixedly connected by the mounting parts.

[0011] Furthermore: the capillary layer of the lower cover and the capillary layer of the upper cover and the corresponding positions of the mounting portion are all provided with avoidance openings, and the mounting portion is allowed to pass through the avoidance openings when the upper cover plate and the lower cover plate are fixed.

[0012] Furthermore: the long strip supporting structure is a stainless steel column or an alloy copper column.

[0013] The beneficial technical effect of the present invention is that by arranging a long support structure between the upper cover capillary layer and the lower cover capillary layer, the overall structure of the temperature equalizing plate in the longitudinal and transverse directions is strengthened, so that the temperature equalizing plate as a whole has higher pressure resistance, effectively preventing the structural deformation of the temperature equalizing plate caused by high assembly pressure, and significantly improving its service life and reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 It is an overall exploded view of the utility model;

[0016] Figure 3 This is a schematic diagram of the capillary layer structure of the lower cover of the utility model;

[0017] Among them: 1. Upper cover; 2. Upper cover capillary layer; 3. Lower cover capillary layer; 31. Cylindrical ring; 32. Card slot; 4. Lower cover; 41. Groove; 42. Mounting part; 5. Support column structure; 6. Liquid injection hole; 7. Long strip support structure. DETAILED DESCRIPTION

[0018] In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the specific implementation methods of the present invention are further described in detail below in conjunction with the drawings and examples. The following examples are used to illustrate the present invention but are not used to limit the scope of the present invention.

[0019] like Figure 1 As shown, a temperature equalizing plate with a high pressure-resistant structure includes an upper cover plate 1, an upper cover capillary layer 2, a lower cover capillary layer 3 and a lower cover plate 4. The upper cover capillary layer 2 and the lower cover capillary layer 3 are arranged in a cavity between the upper cover plate 1 and the lower cover plate 4, and a support column structure 5 is provided between the upper cover capillary layer 2 and the lower cover capillary layer 3.

[0020] Specifically, such as Figure 2 As shown, the upper cover plate 1 is flat, and the lower cover plate 4 is provided with a groove 41. The groove 41 forms a cavity between the upper cover plate 1 and the lower cover plate 4. The cavity is filled with liquid working medium and is in a vacuum-sealed state.

[0021] Furthermore, the opposite end surfaces of the upper cover plate 1 and the lower cover plate 4 are provided with a liquid injection hole 6 for connecting the cavity with the outside world. The liquid injection hole 6 is pressed and sealed after the cavity is filled with liquid and vacuumed.

[0022] The upper capillary layer 2 is a copper mesh layer, located below the upper cover plate 1, and is used to absorb and conduct heat. The upper capillary layer 2 is sintered with the copper mesh layer and the upper cover plate 1 in a diffusion furnace. The capillary structure of the copper mesh layer enhances capillary force, driving the working fluid to flow, resulting in a simple structure and low cost. The lower capillary layer 3 is a copper powder layer, located on the lower cover plate 4. The lower capillary layer 3 has a porous capillary structure formed by sintering copper powder. This porous capillary structure further increases the circulation speed of the working fluid and improves heat dissipation efficiency.

[0023] The support column structure 5 is a plurality of cylinders evenly arranged between the copper mesh layer and the copper powder layer, and the two ends of the cylinders are respectively in contact with the copper mesh layer and the lower cover plate 4; under the action of external force, the cylinders play a uniform supporting role to prevent the cavity between the upper cover plate 1 and the lower cover plate 4 from collapsing and deforming under force, thereby ensuring the evaporation space between the copper mesh layer and the copper powder layer. The cylinders can be copper columns, which are simultaneously burned into shape during the sintering process of the copper powder layer.

[0024] Further, such as Figure 3 The copper powder layer comprises multiple evenly spaced cylindrical rings 31 formed from sintered copper powder. The cylinder is contained within these rings, which prevent it from twisting, rotating, or shifting. Furthermore, the porous capillary structure of the cylinder's sidewalls further increases the evaporative heat exchange area, enhancing the evaporative heat transfer effect and improving heat transfer efficiency.

[0025] Furthermore, the free end of the cylindrical ring 31 contacts the capillary layer 2 of the upper cover to maximize the evaporation heat exchange area. At the same time, the cylindrical ring 31 also guides the cooled working liquid, allowing the liquid to reflux faster to form a cycle and improve the guidance effect.

[0026] Furthermore, mounting portions 42 are respectively provided at the four corners of the groove 41, and the upper end surfaces of the mounting portions 42 are in contact with the upper cover plate 1. Fixing holes are respectively provided at corresponding positions of the mounting portions 42 and the upper cover plate 1, and fasteners are passed through the fixing holes to achieve fixed connection between the upper cover plate 1 and the lower cover plate 4.

[0027] The copper mesh layer and the copper powder layer are both provided with avoidance openings at positions corresponding to the mounting portion 42 , and the avoidance openings are provided for the mounting portion 42 to pass through when the upper cover plate 1 and the lower cover plate 4 are fixed.

[0028] Furthermore, a long support structure 7 is provided between the copper mesh layer and the copper powder layer. This support structure 7 is positioned horizontally and has a set height along its cross-section. Its upper and lower sides respectively contact the copper mesh layer and the copper powder layer. This support structure 7 strengthens the overall structure of the vapor chamber in both the longitudinal and transverse directions, providing the entire chamber with greater compressive strength and preventing structural deformation caused by high assembly pressure.

[0029] Furthermore, the long support structure 7 is in the form of a long cylinder, so that a line contact is formed between the long support structure 7 and the copper mesh layer, thereby minimizing the capillary structure occupancy of the copper mesh layer while ensuring the compressive resistance.

[0030] To prevent the elongated cylindrical body from shifting during use, a slot 32 is provided on the copper powder layer for receiving the elongated cylindrical body. In this embodiment, the elongated cylindrical body can be a stainless steel column or a copper alloy column, which can be simultaneously burned into and formed during the sintering process of the copper powder layer.

[0031] Furthermore, to ensure a more uniform reinforcement structure for the heat spreader and to prevent interference with the backflow of the working fluid within the copper powder layer, multiple groups of elongated cylinders are provided, each extending outward in a star-shaped pattern from the heat source area. In this embodiment, the heat source is positioned in the center of the lower cover plate 4, and four groups of elongated cylinders are provided, each extending outward from the heat source area toward the four corners.

[0032] During operation, the working liquid is located at the heat source and evaporates to form gas, which then rises. The gas is diffused to the entire upper cover plate 1 through the copper mesh layer. After the gas contacts the upper cover plate 1, it condenses to form liquid. Part of the liquid flows back to the copper powder layer along the cylindrical ring 31. Under the action of the porous capillary structure of the copper powder layer, it flows back to the heat source area and evaporates again, thus completing the cycle.

[0033] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A temperature-equalizing plate with a high-pressure-resistant structure, comprising an upper cover plate (1), an upper cover capillary layer (2), a lower cover capillary layer (3) and a lower cover plate (4), wherein the upper cover capillary layer (2) and the lower cover capillary layer (3) are arranged in a cavity between the upper cover plate (1) and the lower cover plate (4), and characterized in that: A long strip support structure (7) is further provided between the upper capillary layer (2) and the lower capillary layer (3). The long strip support structure (7) is placed transversely and has a set height along its cross-sectional direction. The upper side and the lower side of the long strip support structure (7) are in contact with the upper capillary layer (2) and the lower capillary layer (3) respectively. The long strip support structure (7) is provided in a plurality of groups. The plurality of groups of the long strip support structures (7) extend outward in a star shape with the heat source area as the center.

2. The heat spreader with a high pressure resistance structure according to claim 1, characterized in that: The long strip support structure (7) is in the form of a long cylindrical body, and the long cylindrical body is in line contact with the upper capillary layer (2).

3. The heat spreader with a high pressure resistance structure according to claim 1, characterized in that: The lower cover capillary layer (3) is a porous structure layer formed by sintering copper powder. The end surface of the lower cover capillary layer (3) opposite to the upper cover capillary layer (2) is provided with a plurality of evenly arranged cylindrical rings (31), and the free ends of the cylindrical rings (31) are in contact with the upper cover capillary layer (2).

4. The temperature distribution board with a high pressure resistance structure according to claim 3, characterized in that: A cylinder is provided inside the cylindrical ring (31), and two ends of the cylinder are in contact and connected with the upper capillary layer (2) and the lower cover plate (4) respectively.

5. The temperature homogenizing plate with a high pressure resistance structure according to claim 3, characterized in that: The end surface of the lower cover capillary layer (3) opposite to the upper cover capillary layer (2) is further provided with a slot (32), and the long strip support structure (7) is placed in the slot (32).

6. The temperature distribution board with a high pressure resistance structure according to claim 1, characterized in that: The upper cover plate (1) is in the shape of a flat plate, and the lower cover plate (4) is provided with a groove (41). The groove (41) forms a cavity between the upper cover plate (1) and the lower cover plate (4), and the liquid working medium is filled in the cavity.

7. The temperature distribution board with a high pressure resistance structure according to claim 6, characterized in that: Mounting portions (42) are also provided at the four corners of the groove (41), and the upper end surfaces of the mounting portions (42) are in contact with and cooperate with the upper cover plate (1). The upper cover plate (1) and the lower cover plate (4) are fixedly connected via the mounting portions (42).

8. The temperature homogenizing plate with a high pressure resistance structure according to claim 7, characterized in that: The lower cover capillary layer (3), the upper cover capillary layer (2) and the mounting portion (42) are all provided with avoidance openings at positions corresponding to the upper cover capillary layer (2) and the mounting portion (42). The avoidance openings are provided for the mounting portion (42) to pass through when the upper cover plate (1) and the lower cover plate (4) are fixed.

9. The temperature distribution board with a high pressure resistance structure according to claim 1, characterized in that: The long strip supporting structure (7) is a stainless steel column or an alloy copper column.

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