MINI RGB LED lamp bead

Abstract

The utility model discloses a MINI RGB (Red, Green, Blue) LED (Light Emitting Diode) lamp bead, which relates to the technical field of LEDs and comprises a substrate, a first chip, a second chip and a third chip, the front surface of the substrate is provided with a front surface circuit, the back surface of the substrate is provided with a back surface circuit, and the front surface circuit and the back surface circuit are connected through a through hole; the front circuit comprises a die bonding area, a wire bonding area and an insulating area, and the die bonding area and the wire bonding area are electrically connected through a bonding wire; the die bonding area comprises a first die bonding area, a second die bonding area and a third die bonding area which are separated from one another, the first chip is arranged in the first die bonding area, the second chip is arranged in the second die bonding area, and the third chip is arranged in the third die bonding area. According to the utility model, burning of the lamp beads and caterpillars on the display screen caused by water vapor permeation of the lamp beads can be reduced, so that the process yield and the display effect are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, and in particular to a MINI RGB LED lamp bead. Background Art

[0002] With technological advancements and cost reductions, Mini RGB LED technology is becoming increasingly popular in the display field. Thanks to its excellent display quality and color performance, it has been adopted in products such as high-end TVs, outdoor advertising displays, stage rental screens, and professional display equipment.

[0003] The core principle of Mini RGB LED lies in the use of tiny RGB (red, green, and blue) primary color LEDs as pixels or backlight sources. These LEDs are typically smaller in size and can significantly improve screen brightness and contrast. By independently controlling the brightness of each RGB bead, Mini RGB LED technology enables more precise local dimming and a wider dynamic range, providing higher-quality images and color accuracy.

[0004] like Figure 1 As shown, the existing Mini RGB LED device uses a flat BT substrate as a bracket. The substrate is a single-layer board with a front circuit and a back circuit. The front circuit and the back circuit are connected and conducted through through holes. Among them, the back circuit is used for welding with the LED display module PCB; the front circuit is used to bind the light-emitting chip and realize electrical interconnection. The front circuit is divided into a solid crystal functional area, a welding wire functional area and an insulating isolation area. During the manufacturing process of the lamp beads, silver glue is used to fix the red light chip on the red light solid crystal functional area, and insulating glue or silver glue is used to fix the blue and green light chips on the corresponding solid crystal functional areas. However, in the actual operation process, due to the instability of the solid crystal machine, the amount of glue fluctuates, and the solid crystal area is not isolated as a whole, the solid crystal is likely to affect the adjacent chips, resulting in a low process yield; secondly, when water vapor penetrates the blue light chip or the red light, it is also easy for the water vapor to easily penetrate into other chips directly along the solid crystal area, and the display screen is prone to caterpillar phenomenon (see Figure 2 ), affecting the display effect of the display. Utility Model Content

[0005] The technical problem to be solved by the present invention is to provide a MINI RGB LED lamp bead that can improve the process yield and display effect.

[0006] In order to solve the above technical problems, the utility model provides a MINI RGB LED lamp bead, including a substrate, a first chip, a second chip and a third chip; the front side of the substrate is provided with a front circuit, the back side of the substrate is provided with a back circuit, and the front circuit and the back circuit are connected through a through hole; the front circuit includes a die-bonding area, a wire bonding area and an insulating area, and the die-bonding area and the wire bonding area are electrically interconnected through bonding wires; the die-bonding area includes a first die-bonding area, a second die-bonding area and a third die-bonding area separated from each other, the first chip is arranged in the first die-bonding area, the second chip is arranged in the second die-bonding area, and the third chip is arranged in the third die-bonding area.

[0007] As an improvement to the above solution, the front circuit also includes a chip resistor and a resistance area, the operating voltage of the first chip is lower than the operating voltage of the second chip and the operating voltage of the third chip; a groove is provided in the resistance area, the chip resistor is arranged in the groove and is connected in series with the first chip.

[0008] As an improvement of the above solution, the groove is opened below the first bonding area and the second bonding area, one end of the chip resistor is located below the first bonding area, and the other end of the chip resistor is located below the second bonding area.

[0009] As an improvement of the above solution, the groove is opened below the first bonding area, the second bonding area and the third bonding area, one end of the chip resistor is located below the first bonding area, the other end of the chip resistor is located below the third bonding area, and the middle insulating area of the chip resistor is located below the second bonding area.

[0010] As an improvement to the above solution, the first crystal-bonding region, the second crystal-bonding region and the third crystal-bonding region are sequentially arranged in the same direction.

[0011] As an improvement to the above solution, the bonding wire area is arranged at the periphery of the die-bonding area.

[0012] As an improvement to the above solution, the back circuit includes a pin area, the welding wire area, the through hole and the pin area correspond one to one, and the welding wire area is connected to the corresponding pin area through the corresponding through hole.

[0013] As an improvement to the above solution, the first chip is a red light chip, the second chip is a green light chip, and the third chip is a blue light chip.

[0014] As an improvement to the above solution, the positive electrodes of the first chip, the second chip and the third chip are connected to the same pin area at the same time, and the negative electrodes of the first chip, the second chip and the third chip are connected to different pin areas respectively.

[0015] As an improvement to the above solution, the first chip is fixed in the first die-bonding area by conductive silver glue, the second chip is fixed in the second die-bonding area by conductive silver glue, and the third chip is fixed in the third die-bonding area by conductive silver glue.

[0016] The implementation of this utility model has the following beneficial effects:

[0017] The utility model changes the die-bonding area from an integral form to a split form, thereby forming a first die-bonding area, a second die-bonding area, and a third die-bonding area separated from each other. This can avoid mutual influence between the first die-bonding area, the second die-bonding area, and the third die-bonding area, reduce the risk of lamp bead burnout and display screen caterpillars caused by water vapor infiltration, thereby improving the process yield and display effect.

[0018] Furthermore, the present invention introduces a chip resistor, which is connected in series with the first chip to effectively reduce the operating voltage of the first chip and the heat generated by the first chip, so as to adapt to different chip characteristics.

[0019] In addition, the present invention also introduces a groove. Through the groove design, the chip resistor can be embedded in the groove, so as to facilitate the layout of the first chip, the second chip and the third chip in the same plane without affecting the layout of the first chip, the second chip and the third chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the structure of the existing MINI RGB LED lamp beads;

[0021] Figure 2 This is a short circuit diagram of the existing MINI RGB LED lamp beads;

[0022] Figure 3 This is the front view of the first embodiment of the MINI RGB LED lamp bead of the utility model;

[0023] Figure 4 This is the rear view of the MINI RGB LED lamp bead of this utility model;

[0024] Figure 5 This is the front view of the second embodiment of the MINI RGB LED lamp bead of the utility model;

[0025] Figure 6 yes Figure 5 The main view when the chip and chip resistor are not installed;

[0026] Figure 7 yes Figure 5 Main view when no chip is installed;

[0027] Figure 8 yes Figure 5 Schematic diagram of the structure of the chip resistor;

[0028] Figure 9 This is a cross-sectional view of the second embodiment of the MINI RGB LED lamp bead of the utility model;

[0029] Figure 10 This is a cross-sectional view of the third embodiment of the MINI RGB LED lamp bead of the present utility model. DETAILED DESCRIPTION

[0030] To make the objectives, technical solutions, and advantages of the present invention more clearly apparent, the present invention will be further described in detail below with reference to the accompanying drawings. It is hereby stated that any directional terms such as "up," "down," "left," "right," "front," "back," "inside," and "outside" that appear or will appear in this document are based solely on the accompanying drawings and are not intended to limit the present invention.

[0031] See also Figures 3 and 4 , Figures 3 and 4 The first embodiment of the MINI RGB LED lamp bead of the present invention is shown, which includes a substrate, a first chip 1, a second chip 2 and a third chip 3; a front circuit is provided on the front side of the substrate, and a back circuit is provided on the back side of the substrate, and the front circuit and the back circuit are connected by a through hole 5; the front circuit includes a die-bonding area, a wire bonding area 7 and an insulating area 8, and the die-bonding area and the wire bonding area 7 are electrically interconnected by bonding wires; wherein the die-bonding area includes a first die-bonding area 6a, a second die-bonding area 6b and a third die-bonding area 6c separated from each other, the first chip 1 is arranged in the first die-bonding area 6a, the second chip 2 is arranged in the second die-bonding area 6b, and the third chip 3 is arranged in the third die-bonding area 6c.

[0032] In the prior art, the die-bonding area is a monolithic structure without isolation. This can easily affect adjacent chips during die-bonding, resulting in lower process yields and a tendency for the display screen to experience a caterpillar phenomenon, which affects the display quality. Unlike the prior art, in the present invention, the die-bonding area includes a first die-bonding area 6a, a second die-bonding area 6b, and a third die-bonding area 6c that are separated from each other. This prevents mutual interference between the first, second, and third die-bonding areas 6a, 6b, and 6c, thereby improving process yields and display quality.

[0033] Furthermore, the first crystal-bonding region 6 a , the second crystal-bonding region 6 b and the third crystal-bonding region 6 c are sequentially arranged in the same direction, which facilitates neat division of regions and facilitates processing.

[0034] At the same time, the wire bonding area 7 is arranged on the periphery of the die-bonding area; the back circuit includes the pin area 10, and the wire bonding area 7, the through-hole 5 and the pin area 10 correspond one to one. The wire bonding area 7 is connected to the corresponding pin area 10 through the corresponding through-hole 5, thereby realizing mutual conduction between the front circuit and the back circuit.

[0035] Preferably, the through hole 5 is provided at the corner of the substrate for easy layout; the substrate is made of BT resin, which has excellent dielectric properties, low thermal expansion coefficient, and good mechanical characteristics; at the same time, the first chip 1 can be fixed in the first solid crystal area 6a by conductive silver glue, the second chip 2 can be fixed in the second solid crystal area 6b by conductive silver glue, and the third chip 3 can be fixed in the third solid crystal area 6c by conductive silver glue; in addition, electrical components (such as the first chip 1, the second chip 2, and the third chip 3) can also be encapsulated by sealing glue to protect the electrical components.

[0036] See also Figures 5 to 9 , Figures 5 to 9 The second embodiment of the MINI RGB LED lamp beads of the utility model is shown. Figure 3 The difference from the first embodiment shown is that this embodiment also introduces a chip resistor 4 and a resistance area 9;

[0037] In the present invention, the operating voltage of the first chip 1 is lower than that of the second chip 2 and the third chip 3. By connecting the chip resistor 4 in series with the first chip 1, the operating voltage of the first chip 1 can be effectively lowered, thereby effectively reducing the heat generated by the first chip 1 to adapt to different chip characteristics.

[0038] At the same time, a groove is provided in the resistance area 9 of the utility model, and the chip resistor 4 is provided in the groove; through the groove design, the chip resistor 4 can be embedded in the groove, so that the first chip 1, the second chip 2 and the third chip 3 are arranged in the same plane without affecting the layout of the first chip 1, the second chip 2 and the third chip 3.

[0039] like Figure 8 and Figure 9 As shown, in this embodiment, the groove is opened below the first die-bonding area 6a and the second die-bonding area 6b, one end 41 of the chip resistor 4 is located below the first die-bonding area 6a, and the other end 42 of the chip resistor 4 is located below the second die-bonding area 6b.

[0040] It should be noted that by forming a groove below the first die-bonding area 6 a and the second die-bonding area 6 b , the series connection of the chip resistor 4 and the first chip 1 can be facilitated, and the area of the groove can be effectively saved.

[0041] Preferably, the chip resistor can be embedded in the groove by applying solder paste. Generally, the resistance of the chip resistor 4 is about 200Ω, but this is not a limitation and can be set according to actual conditions. The height of the groove is preferably 0.1-0.15mm, the width is preferably 0.15-0.25mm, and the length is preferably 0.35-0.45mm, but this is not a limitation and can be adjusted according to the size of the chip resistor 4, as long as it can fully accommodate the chip resistor 4.

[0042] Furthermore, the present invention adopts common anode technology to connect the positive poles of the first chip 1, the second chip 2 and the third chip 3 to the same pin area at the same time, and connect the negative poles of the first chip 1, the second chip 2 and the third chip 3 to different pin areas respectively, thereby effectively reducing the wiring complexity.

[0043] Generally, the first chip 1 is preferably a red light chip, the second chip 2 is preferably a green light chip, and the third chip 3 is preferably a blue light chip.

[0044] In actual applications, the operating voltages of red, green, and blue chips are different, and the operating voltage of the red chip is generally 1V lower than that of the green and blue chips. In the present invention, the red chip is connected in series with the chip resistor 4. By connecting the chip resistor 4 in series, the operating current of the red chip can be effectively reduced, preventing excessive current from causing severe heating of the PN junction, reducing the heating of the lamp beads, thereby protecting the LED chip from damage and extending its service life. At the same time, it can also play a voltage stabilizing role, ensuring the current in the circuit is stable, thereby improving the stability of the entire circuit and reducing faults caused by current fluctuations. In addition, the series resistor in the LED circuit can prevent excessive voltage from causing excessive current, avoiding the LED from burning out due to excessive operating current. It also helps to reduce light decay and maintain the brightness stability of the LED.

[0045] See also Figure 10 , Figure 10 The third embodiment of the utility model MINI RGB LED lamp beads is shown. Figure 8 The difference from the second embodiment shown is that, in this embodiment, the groove is opened below the first solid crystal area 6a, the second solid crystal area 6b and the third solid crystal area 6c, one end 41 of the chip resistor 4 is located below the first solid crystal area 6a, the other end 42 of the chip resistor 4 is located below the third solid crystal area 6c, and the middle insulating area 43 of the chip resistor 4 is located below the second solid crystal area 6b.

[0046] It should be noted that by recessing a groove below the first die-bonding region 6a, the second die-bonding region 6b and the third die-bonding region 6c, the series connection of the chip resistor 4 and the first chip 1 can be facilitated; at the same time, the middle insulating region 43 of the chip resistor 4 is located below the second die-bonding region 6b (see Figure 9 ), it can also effectively prevent the chip resistor 4 from being conductive with the second die-bonding area 6b, and has high safety.

[0047] In summary, the present invention changes the solid crystal area from an integral form to a split form, which can reduce the risk of lamp beads burning out due to water vapor infiltration and the appearance of caterpillars on the display screen, thereby improving the process yield and display effect; at the same time, the present invention introduces the chip resistor 4, and by connecting the chip resistor 4 in series with the first chip 1, the operating voltage of the first chip 1 can be effectively reduced, and the heat generation of the first chip 1 can be effectively reduced to adapt to different chip characteristics; in addition, the present invention also introduces a groove, and through the groove design, the chip resistor 4 can be embedded in the groove, so as to facilitate the layout of the first chip 1, the second chip 2 and the third chip 3 in the same plane, without affecting the layout of the first chip 1, the second chip 2 and the third chip 3.

[0048] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A MINI RGB LED lamp bead, characterized in that: comprising a substrate, a first chip, a second chip and a third chip; A front circuit is provided on the front side of the substrate, and a back circuit is provided on the back side of the substrate, and the front circuit and the back circuit are connected via a through hole; The front circuit includes a die-bonding area, a wire bonding area, and an insulating area, and the die-bonding area and the wire bonding area are electrically interconnected via bonding wires; The bonding region includes a first bonding region, a second bonding region, and a third bonding region separated from each other. The first chip is disposed in the first bonding region, the second chip is disposed in the second bonding region, and the third chip is disposed in the third bonding region.

2. The MINI RGB LED lamp bead according to claim 1, characterized in that: The front circuit further includes a chip resistor and a resistor area, and the operating voltage of the first chip is lower than the operating voltage of the second chip and the operating voltage of the third chip; A groove is provided in the resistor area, and the chip resistor is arranged in the groove and connected in series with the first chip.

3. The MINI RGB LED lamp bead according to claim 2, characterized in that: The groove is opened below the first die-bonding area and the second die-bonding area. One end of the chip resistor is located below the first die-bonding area, and the other end of the chip resistor is located below the second die-bonding area.

4. The MINI RGB LED lamp bead according to claim 2, characterized in that: The groove is opened below the first bonding area, the second bonding area and the third bonding area. One end of the chip resistor is located below the first bonding area, the other end of the chip resistor is located below the third bonding area, and the middle insulating area of the chip resistor is located below the second bonding area.

5. The MINI RGB LED lamp bead according to claim 1, characterized in that: The first die-bonding region, the second die-bonding region and the third die-bonding region are sequentially arranged along the same direction.

6. The MINI RGB LED lamp bead according to claim 1, characterized in that: The bonding wire area is arranged at the periphery of the die-bonding area.

7. The MINI RGB LED lamp bead according to claim 1, characterized in that: The back circuit includes a pin area, and the wire bonding area, the through hole and the pin area correspond to each other one by one. The wire bonding area is connected to the corresponding pin area through the corresponding through hole.

8. The MINI RGB LED lamp bead according to claim 1, wherein: The first chip is a red light chip, the second chip is a green light chip, and the third chip is a blue light chip.

9. The MINI RGB LED lamp bead according to claim 1, wherein: The positive electrodes of the first chip, the second chip and the third chip are connected to the same pin area at the same time, and the negative electrodes of the first chip, the second chip and the third chip are connected to different pin areas respectively.

10. The MINI RGB LED lamp bead according to claim 1, wherein: The first chip is fixed in the first die-bonding region by conductive silver glue, the second chip is fixed in the second die-bonding region by conductive silver glue, and the third chip is fixed in the third die-bonding region by conductive silver glue.

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