Display substrate and display device

Abstract

According to the display substrate and the display device, the display substrate comprises a display area and a hole area, the display area is arranged around the hole area, and the hole area comprises a first area and a second area which are sequentially arranged away from the display area; a plurality of isolation columns are arranged in any one of the first area and the second area; the at least one isolation column located in the second area comprises at least two conductive structures and at least one insulation structure, the at least one insulation structure is arranged between the at least two conductive structures, and at least one side of the at least one conductive structure is in a groove shape.

Description

Technical Field

[0001] This article relates to the field of display technology, and in particular to a display substrate and a display device. Background Art

[0002] Organic light-emitting diodes (OLEDs) and quantum-dot light-emitting diodes (QLEDs) are active light-emitting display devices with advantages such as self-luminescence, wide viewing angles, high contrast, low power consumption, extremely fast response times, thinness, flexibility, and low cost. With the continuous advancement of display technology, displays using OLEDs as light-emitting elements and thin-film transistors (TFTs) for signal control have become mainstream products in the display field. Utility Model Content

[0003] The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.

[0004] The present disclosure provides a display substrate and a display device.

[0005] In a first aspect, the present disclosure provides a display substrate comprising: a display area and a hole area, wherein the display area is arranged around the hole area, and the hole area comprises: a first area and a second area arranged sequentially away from the display area; a plurality of isolation columns are provided in either the first area or the second area;

[0006] The at least one isolation column located in the second region includes at least two conductive structures and at least one insulating structure. The at least one insulating structure is arranged between the at least two conductive structures. At least one side of the at least one conductive structure is in a groove shape.

[0007] In an exemplary embodiment, a display substrate includes: a base and a circuit structure layer disposed on the base, the circuit structure layer including: a plurality of gate metal layers and a plurality of source / drain metal layers, at least one film layer of an organic insulating layer and an inorganic insulating layer being disposed between at least two metal layers;

[0008] At least one isolation column among the plurality of isolation columns comprises: a first conductive structure, a first insulating structure, and a second conductive structure;

[0009] At least one side of at least one of the first conductive structure and the second conductive structure is groove-shaped, and an orthographic projection of at least part of the second conductive structure on the substrate is within the range of an orthographic projection of the first insulating structure and the first conductive structure on the substrate;

[0010] The first conductive structure is located in one of the multiple gate metal layers, and the second conductive structure is located in another film layer among the multiple gate metal layers, or the first conductive structure is located in one of the multiple gate metal layers, and the second conductive structure is located in one of the multiple source / drain metal layers, and the first insulating structure is arranged in at least one inorganic insulating layer between the film layer where the first conductive structure is located and the film layer where the second conductive structure is located.

[0011] In an exemplary embodiment, at least one of the plurality of isolation pillars further comprises: a third conductive structure, the third conductive structure being located on a side of the second conductive structure away from the substrate;

[0012] At least one side of at least one conductive structure from the first conductive structure to the third conductive structure is in a groove shape, and an orthographic projection of at least part of the third conductive structure on the substrate is located within the range of an orthographic projection of the second conductive structure on the substrate;

[0013] Any one of the first conductive structure and the second conductive structure is located in one of the multiple gate metal layers, the third conductive structure is located in one of the multiple source / drain metal layers, and the first insulating structure is arranged in at least one inorganic insulating layer between the film layer where the first conductive structure is located and the film layer where the second conductive structure is located.

[0014] In an exemplary embodiment, at least one of the plurality of isolation columns further includes: a second insulating structure and a third conductive structure, wherein the second insulating structure is located on a side of the second conductive structure away from the substrate, and the third conductive structure is located on a side of the second insulating structure away from the substrate;

[0015] At least one side of at least one conductive structure from the first conductive structure to the third conductive structure is groove-shaped, an orthographic projection of at least part of the third conductive structure on the substrate is located within the range of an orthographic projection of the second insulating structure on the substrate, and an orthographic projection of at least part of the third conductive structure on the substrate is located within the range of an orthographic projection of the second conductive structure on the substrate;

[0016] Any one of the first conductive structure, the second conductive structure and the third conductive structure is arranged in one of the film layers of the multiple gate metal layers, or any one of the first conductive structure and the second conductive structure is located in one of the film layers of the multiple gate metal layers, the third conductive structure is located in one of the film layers of the multiple source / drain metal layers, the first insulating structure is arranged in at least one inorganic insulating layer located between the film layer where the first conductive structure is located and the film layer where the second conductive structure is located, and the second insulating structure is arranged in at least one inorganic insulating layer located between the film layer where the second conductive structure is located and the film layer where the third conductive structure is located.

[0017] In an exemplary embodiment, an insulating filling structure is provided between at least two adjacent isolation pillars;

[0018] The insulating filling structure covers a side of two adjacent isolation columns close to the insulating filling structure and a portion of the surface away from the substrate.

[0019] In an exemplary embodiment, the display substrate further includes: a covering structure including an organic structure and a cathode structure;

[0020] The covering structure is disconnected at the grooves of at least two conductive structures included in the isolation column;

[0021] The covering structure includes: a first covering structure, which is arranged on the surface of the isolation column away from the substrate, and the first covering structures on at least two isolation columns with insulating filling structures are connected to each other, and the orthographic projection of the first covering structure on the substrate at least partially overlaps with the orthographic projection of the insulating filling structure on the substrate.

[0022] In an exemplary embodiment, a surface of at least one of the plurality of isolation pillars away from the substrate is provided with an isolation insulating structure, and at least one of the first conductive structure and the second conductive structure includes: a first sidewall and a second sidewall;

[0023] The isolation insulating structure at least partially covers the surface and the second sidewall of the second conductive structure away from the substrate, and the isolation insulating structure is provided on at least one inorganic insulating layer located on a side of the second conductive structure away from the substrate;

[0024] The structures of adjacent isolation pillars are the same, or the structures of adjacent isolation pillars are symmetrically arranged with respect to a straight line perpendicular to the substrate.

[0025] In an exemplary embodiment, the insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation column along a centerline perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation column along a centerline perpendicular to the substrate;

[0026] The isolation insulating structure also covers the second sidewall of the first conductive structure and the second sidewall of the first insulating structure;

[0027] The display substrate further includes: a covering structure, the covering structure including an organic structure and a cathode structure, the covering structure being disconnected at the grooves of the first conductive structure and the second conductive structure;

[0028] The covering structure includes a first covering structure, wherein the first covering structure covers the surface of the isolation insulating structure away from the substrate and the second sidewall, and the first covering structure further extends between adjacent isolation pillars.

[0029] In an exemplary embodiment, the first insulating structure covers the second sidewall of the first conductive structure, and the isolation insulating structure is partially disposed on a surface of the first insulating structure away from the substrate;

[0030] The display substrate further includes: a covering structure, the covering structure including an organic structure and a cathode structure, the covering structure being disconnected at the grooves of the first conductive structure and the second conductive structure;

[0031] The covering structure includes a first covering structure, which covers a surface and a second sidewall of the isolation insulating structure away from the substrate and the second sidewall of the first insulating structure, and further extends between adjacent isolation pillars.

[0032] In an exemplary embodiment, at least one of the first conductive structure and the second conductive structure includes: a first sidewall and a second sidewall;

[0033] An orthographic projection of at least a portion of the first sidewall of the first conductive structure on the substrate is located within the range of an orthographic projection of the first insulating structure on the substrate, and the first insulating structure covers the second sidewall of the first conductive structure;

[0034] The structures of adjacent isolation pillars are the same, or the structures of adjacent isolation pillars are symmetrically arranged with respect to a straight line perpendicular to the substrate.

[0035] In an exemplary embodiment, the display substrate further includes: a covering structure including an organic structure and a cathode structure, the covering structure being disconnected at the grooves of the first conductive structure and the second conductive structure;

[0036] The covering structure includes: a first covering structure, which is arranged on a surface of the second conductive structure away from the substrate.

[0037] In an exemplary embodiment, when any one of the first conductive structure, the second conductive structure, and the third conductive structure is provided in one of the plurality of gate metal layers, an isolation insulating structure is provided on a surface of at least one of the plurality of isolation pillars away from the substrate; and at least one of the first conductive structure to the third conductive structure includes: a first sidewall and a second sidewall;

[0038] The orthographic projection of at least a portion of the first sidewall of the first conductive structure on the substrate is located within the range of the orthographic projection of the first insulating structure on the substrate, and the orthographic projection of at least a portion of the first sidewall of the second conductive structure on the substrate is located within the range of the orthographic projection of the second insulating structure on the substrate. The isolation insulating structure at least partially covers the surface of the third conductive structure away from the substrate and the second sidewall. The isolation insulating structure is provided on at least one inorganic insulating layer located on a side of the third conductive structure away from the substrate.

[0039] The structures of adjacent isolation pillars are the same, or the structures of adjacent isolation pillars are symmetrically arranged with respect to a straight line perpendicular to the substrate.

[0040] In an exemplary embodiment, the insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation column along a centerline perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation column along a centerline perpendicular to the substrate;

[0041] The orthographic projection of the second sidewall of the first conductive structure on the substrate does not overlap with the orthographic projection of the first insulating structure on the substrate, the orthographic projection of the second sidewall of the second conductive structure on the substrate does not overlap with the orthographic projection of the second insulating structure on the substrate, and the isolation insulating structure further covers the second sidewall of the first conductive structure, the second sidewall of the first insulating structure, the second sidewall of the second conductive structure, and the second sidewall of the second insulating structure;

[0042] The display substrate further includes: a covering structure, the covering structure including an organic structure and a cathode structure, the covering structure being disconnected at the grooves of the first conductive structure and the second conductive structure;

[0043] The covering structure includes a first covering structure, which covers the surface of the isolation insulating structure away from the substrate and the second sidewall, and further extends between adjacent isolation pillars.

[0044] In an exemplary embodiment, the insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation column along a centerline perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation column along a centerline perpendicular to the substrate;

[0045] The orthographic projections of the second sidewall of the isolation insulating structure, the second sidewall of the first conductive structure, and the second sidewall of the second conductive structure on the substrate are located within the range of the orthographic projection of the first insulating structure on the substrate; the first insulating structure covers the second sidewall of the first conductive structure; the second insulating structure covers the second sidewall of the second conductive structure; and the isolation insulating structure is partially provided on the surface of the second insulating structure away from the substrate;

[0046] The display substrate further includes: a covering structure, the covering structure including an organic structure and a cathode structure, the covering structure being disconnected at the grooves of the first conductive structure and the second conductive structure;

[0047] The covering structure includes: a first covering structure, which covers the surface and the second sidewall of the isolation insulating structure away from the substrate, the second sidewall of the first insulating structure, and the second sidewall of the second insulating structure, and the first covering structure also extends between adjacent isolation pillars.

[0048] In an exemplary embodiment, when any one of the first conductive structure and the second conductive structure is disposed in one of the plurality of gate metal layers, and the third conductive structure is disposed in one of the plurality of source / drain metal layers, an isolation insulating structure is disposed on a surface of at least one of the plurality of isolation pillars away from the substrate, and at least one of the first conductive structure to the third conductive structure includes: a first sidewall and a second sidewall;

[0049] The second insulating structure covers the portion of the surface and the second sidewall of the second conductive structure away from the substrate, the second sidewall of the first conductive structure, and the second sidewall of the first insulating structure. A portion of the third conductive structure is connected to the portion of the surface of the second conductive structure away from the substrate. The third conductive structure is stepped. The isolation insulating structure covers the second sidewall of the third conductive structure and the second sidewall of the isolation insulating structure. The isolation insulating structure is provided in at least one inorganic insulating layer located between a plurality of source and drain metal layers.

[0050] Adjacent isolation columns have the same structure, or adjacent isolation columns are symmetrically arranged with respect to a straight line perpendicular to the substrate.

[0051] In an exemplary embodiment, the insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation column along a centerline perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation column along a centerline perpendicular to the substrate;

[0052] An orthographic projection of the second sidewall of the first conductive structure on the substrate does not overlap with an orthographic projection of the first insulating structure on the substrate;

[0053] The display substrate further includes: a covering structure, the covering structure including an organic structure and a cathode structure, the covering structure being disconnected at the grooves of the first conductive structure, the second conductive structure, and the third conductive structure;

[0054] The covering structure includes a first covering structure, wherein the first covering structure covers a surface of the isolation insulating structure away from the substrate and a second sidewall, and the first covering structure further extends between adjacent isolation pillars.

[0055] In an exemplary embodiment, at least one of the plurality of isolation pillars is provided with an isolation insulating structure on a surface away from the substrate, and at least one of the first to third conductive structures includes: a first sidewall and a second sidewall;

[0056] The orthographic projection of at least a portion of the first sidewall of the first conductive structure on the substrate is located within the range of the orthographic projection of the first insulating structure on the substrate, and the orthographic projection of at least a portion of the first sidewall of the second conductive structure on the substrate is located within the range of the orthographic projection of the second insulating structure on the substrate. The isolation insulating structure at least partially covers the surface of the third conductive structure away from the substrate and the second sidewall. The isolation insulating structure is provided in at least one inorganic insulating layer located between a plurality of source and drain metal layers.

[0057] The structures of adjacent isolation pillars are the same, or the structures of adjacent isolation pillars are symmetrically arranged with respect to a straight line perpendicular to the substrate.

[0058] In an exemplary embodiment, the insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation column along a centerline perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation column along a centerline perpendicular to the substrate;

[0059] The orthographic projection of the second sidewall of the first conductive structure on the substrate does not overlap with the orthographic projection of the first insulating structure on the substrate, and the isolation insulating structure further covers the second sidewall of the first conductive structure, the second sidewall of the first insulating structure, and the second sidewall of the second conductive structure;

[0060] The display substrate further includes: a covering structure, the covering structure including an organic structure and a cathode structure, the covering structure being disconnected at the grooves of the first conductive structure, the second conductive structure, and the third conductive structure;

[0061] The covering structure includes a first covering structure, wherein the first covering structure covers the surface of the isolation insulating structure away from the substrate and the second sidewall, and the first covering structure further extends between adjacent isolation pillars.

[0062] In an exemplary embodiment, the insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation column along a centerline perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation column along a centerline perpendicular to the substrate;

[0063] The orthographic projections of the second sidewall of the isolation insulating structure, the second sidewall of the first conductive structure, and the second sidewall of the second conductive structure on the substrate are located within the range of the orthographic projection of the first insulating structure on the substrate, the first insulating structure covers the second sidewall of the first conductive structure, and the isolation insulating structure is partially provided on the surface of the first insulating structure away from the substrate;

[0064] The display substrate further includes: a covering structure, the covering structure including an organic structure and a cathode structure, the covering structure being disconnected at the grooves of the first conductive structure, the second conductive structure, and the third conductive structure;

[0065] The covering structure includes a first covering structure, wherein the first covering structure covers a surface of the isolation insulating structure away from the substrate and a second sidewall, and the first covering structure further extends between adjacent isolation pillars.

[0066] In an exemplary embodiment, when the structures of adjacent isolation pillars located in the second region are symmetrically arranged with respect to a line perpendicular to the substrate, the isolation insulating structure arranged on the isolation pillar and the isolation insulating structure arranged on the adjacent isolation pillar are spaced apart or connected to each other.

[0067] In an exemplary embodiment, when the structures of adjacent isolation pillars in the second region are symmetrically arranged with respect to a line perpendicular to the substrate, at least one insulating structure of an isolation pillar is spaced apart from or connected to at least one insulating structure of an adjacent isolation pillar.

[0068] In an exemplary embodiment, the hole region further includes: a third region, the third region being located between the first region and the second region, the display substrate further includes: a base and a circuit structure layer disposed on the base, the circuit structure layer including: a plurality of gate metal layers and a plurality of source / drain metal layers, at least one film layer selected from an organic insulating layer and an inorganic insulating layer being disposed between at least two metal layers, at least one inorganic insulating layer disposed on a side of the plurality of gate metal layers close to the base being referred to as a first composite insulating layer, and a plurality of inorganic insulating layers disposed between the plurality of gate metal layers and the plurality of source / drain metal layers being referred to as a second composite insulating layer;

[0069] The first composite insulating layer extends from the display area to the second area, the second composite insulating layer is located in the display area and does not extend to the first area, or extends from the display area to the third area;

[0070] When the second composite insulating layer is located in the display area and does not extend to the first area, the isolation columns located in the first area have the same shape as the isolation columns located in the second area.

[0071] In an exemplary embodiment, when the second composite insulating layer extends from the display area to the third area, the isolation column located in the first area includes: a first conductive structure located in one of the plurality of source and drain metal layers.

[0072] In an exemplary embodiment, the isolation column located in the first region further includes at least: at least one conductive structure from the second conductive structure to the K+1th conductive structure, wherein an orthographic projection of at least one of the second isolation structure to the K+1th isolation structure on the substrate overlaps with an orthographic projection of the first isolation structure;

[0073] The k+1th conductive structure is located in the kth gate metal layer, 1≤k≤K.

[0074] In an exemplary embodiment, the isolation column located in the second region includes: a first conductive structure, a first insulating structure and a second conductive structure, the first conductive structure is located in a gate metal layer close to the substrate among the multiple gate metal layers, the second conductive structure is located in a source / drain metal layer on a side away from the substrate among the multiple source / drain metal layers, and the thickness of the first insulating structure is in the range of 0.7 microns to 0.9 microns.

[0075] In an exemplary embodiment, a conductive structure of at least one film layer in the plurality of source / drain metal layers includes: a first isolation portion, a second isolation portion, and a third isolation portion, wherein the first isolation portion is located on a side of the second isolation portion close to the substrate, and the third isolation portion is located on a side of the second isolation portion away from the substrate;

[0076] The orthographic projection of the surface of the second isolation portion close to the substrate on the substrate is within the range of the orthographic projection of the surface of the first isolation portion away from the substrate on the substrate, and the orthographic projection of the surface of the second isolation portion away from the substrate on the substrate is within the range of the orthographic projection of the surface of the third isolation portion close to the substrate on the substrate.

[0077] In an exemplary embodiment, an angle between a surface of the insulating filling structure disposed on a surface of at least one of the plurality of isolation pillars away from the substrate and the surface of the isolation pillar away from the substrate is in a range of 30 to 60 degrees.

[0078] In a second aspect, the present disclosure further provides a display device, comprising: the above-mentioned display substrate.

[0079] Other features and advantages of the present application will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present application. Other advantages of the present application can be realized and obtained through the solutions described in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0080] The accompanying drawings are used to provide an understanding of the technical solution of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the technical solution of the present application and do not constitute a limitation on the technical solution of the present application.

[0081] Figure 1 is a schematic diagram of a display substrate according to at least one embodiment of the present disclosure;

[0082] Figure 2 A partial cross-sectional view of the display area of at least one embodiment of the present disclosure Figure 1 ;

[0083] Figure 3 A partial cross-sectional view of the display area of at least one embodiment of the present disclosure Figure 2

[0084] Figure 4 A partial cross-sectional view of the display area of at least one embodiment of the present disclosure Figure 3 ;

[0085] Figure 5 A partial cross-sectional view of the display area of at least one embodiment of the present disclosure Figure 4 ;

[0086] Figure 6 Schematic diagram of the structure of the display substrate provided in the embodiment of the present disclosure Figure 1 ;

[0087] Figure 7 Schematic diagram of the structure of the display substrate provided in the embodiment of the present disclosure Figure 2 ;

[0088] Figure 8 is a partial cross-sectional schematic diagram of a conductive structure of at least one film layer in a plurality of source / drain metal layers;

[0089] Figure 9 is a structural diagram of the covering structure;

[0090] Figure 10 A partial cross-sectional view of the display substrate located in the second area Figure 1 ;

[0091] Figure 11 A partial cross-sectional view of the display substrate located in the second area Figure 2 ;

[0092] Figure 12 A partial cross-sectional view of the display substrate located in the second area Figure 3 ;

[0093] Figure 13 A partial cross-sectional view of the display substrate located in the second area Figure 4 ;

[0094] Figure 14 A partial cross-sectional view of the display substrate located in the second area Figure 5 ;

[0095] Figure 15 A partial cross-sectional view of the display substrate located in the second area Figure 6 ;

[0096] Figure 16 A partial cross-sectional view of the display substrate located in the second area Figure 7 ;

[0097] Figure 17 A partial cross-sectional view of the display substrate located in the second area Figure 8;

[0098] Figure 18 A partial cross-sectional view of the display substrate located in the second area Figure 9 ;

[0099] Figure 19 A partial cross-sectional view of the display substrate located in the second area Figure 10 ;

[0100] Figure 20 A partial cross-sectional view of the display substrate located in the second area Figure 10 one;

[0101] Figure 21 A partial cross-sectional view of the display substrate located in the second area Figure 10 two;

[0102] Figure 22 A partial cross-sectional view of the display substrate located in the second area Figure 10 three;

[0103] Figure 23 A partial cross-sectional view of the display substrate located in the second area Figure 10 Four;

[0104] Figure 24 A partial cross-sectional view of the display substrate located in the second area Figure 10 five;

[0105] Figure 25 A partial cross-sectional view of the display substrate located in the second area Figure 10 six;

[0106] Figure 26 A partial cross-sectional view of the display substrate located in the second area Figure 10 seven;

[0107] Figure 27 A partial cross-sectional view of the display substrate located in the second area Figure 10 eight;

[0108] Figure 28 A partial cross-sectional view of the display substrate located in the second area Figure 10 Nine;

[0109] Figure 29 A partial cross-sectional view of the display substrate located in the second area Figure 2 ten;

[0110] Figure 30 A partial cross-sectional view of the display substrate located in the second area Figure 2 eleven;

[0111] Figure 31A partial cross-sectional view of the display substrate located in the second area Figure 2 twelve;

[0112] Figure 32 A partial cross-sectional view of the display substrate located in the second area Figure 2 Thirteen;

[0113] Figure 33 A partial cross-sectional view of the display substrate located in the second area Figure 2 fourteen;

[0114] Figure 34 A partial cross-sectional view of the display substrate located in the second area Figure 2 fifteen;

[0115] Figure 35 A partial cross-sectional view of the display substrate located in the second area Figure 2 sixteen;

[0116] Figure 36 A partial cross-sectional view of the display substrate located in the second area Figure 2 Seventeen;

[0117] Figure 37 A partial cross-sectional view of the display substrate located in the second area Figure 2 eighteen;

[0118] Figure 38 A partial cross-sectional view of the display substrate located in the second area Figure 2 nineteen;

[0119] Figure 39 A partial cross-sectional view of the display substrate located in the second area Figure 3 ten;

[0120] Figure 40 A partial cross-sectional view of the display substrate located in the second area Figure 3 eleven;

[0121] Figure 41 A partial cross-sectional view of the display substrate located in the second area Figure 3 twelve;

[0122] Figure 42 A partial cross-sectional view of the display substrate located in the second area Figure 3 Thirteen;

[0123] Figure 43 A partial cross-sectional view of the display substrate located in the second area Figure 3 fourteen;

[0124] Figure 44 A partial cross-sectional view of the display substrate located in the second area Figure 3 fifteen;

[0125] Figure 45 A partial cross-sectional view of the display substrate located in the second area Figure 3 sixteen;

[0126] Figure 46 A partial cross-sectional view of the display substrate located in the second area Figure 3 Seventeen;

[0127] Figure 47 A partial cross-sectional view of the display substrate located in the second area Figure 3 eighteen;

[0128] Figure 48 A partial cross-sectional view of the display substrate located in the second area Figure 3 nineteen;

[0129] Figure 49 A partial cross-sectional view of the display substrate located in the second area Figure 4 ten;

[0130] Figure 50 A partial cross-sectional view of the display substrate located in the second area Figure 4 eleven;

[0131] Figure 51 A partial cross-sectional view of the display substrate located in the second area Figure 4 twelve;

[0132] Figure 52 A partial cross-sectional view of the display substrate located in the second area Figure 4 Thirteen;

[0133] Figure 53 A partial cross-sectional view of the display substrate located in the second area Figure 4 fourteen;

[0134] Figure 54 A partial cross-sectional view of the display substrate located in the second area Figure 4 fifteen;

[0135] Figure 55 A partial cross-sectional view of the display substrate located in the second area Figure 4 sixteen;

[0136] Figure 56 A partial cross-sectional view of the display substrate located in the second area Figure 4 Seventeen;

[0137] Figure 57 A partial cross-sectional view of the display substrate located in the second area Figure 4 eighteen;

[0138] Figure 58A partial cross-sectional view of the display substrate located in the second area Figure 4 nineteen;

[0139] Figure 59 A partial cross-sectional view of the display substrate located in the second area Figure 5 ten;

[0140] Figure 60 A partial cross-sectional view of the display substrate located in the second area Figure 5 eleven;

[0141] Figure 61 A partial cross-sectional view of the display substrate located in the second area Figure 5 twelve;

[0142] Figure 62 A partial cross-sectional view of the display substrate located in the second area Figure 5 Thirteen;

[0143] Figure 63 A partial cross-sectional view of the display substrate located in the second area Figure 5 fourteen;

[0144] Figure 64 A partial cross-sectional view of the display substrate located in the second area Figure 5 fifteen;

[0145] Figure 65 A partial cross-sectional view of the display substrate located in the second area Figure 5 sixteen;

[0146] Figure 66 A partial cross-sectional view of the display substrate located in the second area Figure 5 Seventeen;

[0147] Figures 67A to 67D for Figure 13 Preparation flow chart of

[0148] Figures 68A to 68C for Figure 14 Preparation flow chart of

[0149] Figures 69A to 69B for Figure 59 Preparation flow chart of

[0150] Figures 70A to 70C for Figure 31 Preparation flow chart of

[0151] Figures 71A to 71D for Figure 55 Preparation flow chart of

[0152] Figures 72A to 72C for Figure 63 Preparation flow chart of

[0153] Figure 73 is a schematic diagram of a display device according to at least one embodiment of the present disclosure. DETAILED DESCRIPTION

[0154] The embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. The embodiments can be implemented in a variety of different forms. A person skilled in the art can easily understand that the method and content can be transformed into other forms without departing from the purpose and scope of the present disclosure. Therefore, the present disclosure should not be interpreted as being limited to the contents described in the following embodiments. In the absence of conflict, the embodiments and features in the embodiments of the present disclosure can be combined with each other in any manner.

[0155] In the drawings, the size of one or more components, layer thicknesses, or regions may be exaggerated for clarity. Therefore, one embodiment of the present disclosure is not necessarily limited to these dimensions, and the shapes and sizes of one or more components in the drawings do not reflect true proportions. Furthermore, the drawings schematically illustrate idealized examples, and one embodiment of the present disclosure is not limited to the shapes or values shown in the drawings.

[0156] In this specification, ordinal numbers such as "first," "second," and "third" are provided to avoid confusion among constituent elements, and are not intended to limit the number. "Multiple" in this disclosure means two or more.

[0157] In this specification, for convenience, words and phrases indicating orientation or positional relationships, such as "middle," "upper," "lower," "front," "back," "vertical," "horizontal," "top," "bottom," "inside," and "outside," are used to illustrate the positional relationships of constituent elements with reference to the accompanying drawings. This is merely for the purpose of facilitating the description of this specification and simplifying the description, and is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present disclosure. The positional relationships of constituent elements may be appropriately changed depending on the orientation of the constituent elements being described. Therefore, the present disclosure is not limited to the words and phrases described in the specification and may be appropriately replaced depending on the circumstances.

[0158] In this specification, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, or a detachable connection, or an integral connection; it can be a mechanical connection, or a connection; it can be a direct connection, or an indirect connection through an intermediate piece, or a connection between two elements. Among them, "connection" can include "electrical connection", and "electrical connection" includes the situation where constituent elements are connected together through an element with some electrical function. There is no special restriction on "elements with some electrical function" as long as they can transmit electrical signals between connected constituent elements. Examples of "elements with some electrical function" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements with multiple functions. For ordinary technicians in this field, the meaning of the above terms in this disclosure can be understood according to the circumstances.

[0159] In this specification, a transistor refers to a device that includes at least three terminals: a gate (gate electrode), a drain, and a source. A transistor has a channel region between the drain (drain electrode terminal, drain region, or drain electrode) and the source (source electrode terminal, source region, or source electrode), and current can flow through the drain, channel region, and source. In this specification, the channel region refers to the region through which current primarily flows.

[0160] In this specification, the first electrode can be a drain and the second electrode can be a source, or the first electrode can be a source and the second electrode can be a drain. Furthermore, the gate electrode can also be referred to as a control electrode. The functions of "source" and "drain" are sometimes interchangeable when using transistors with opposite polarity or when the direction of current changes during circuit operation. Therefore, in this specification, "source" and "drain" can be interchangeable.

[0161] In this specification, "parallel" refers to a state where the angle formed by two straight lines is greater than -10° and less than 10°, and thus also includes a state where the angle is greater than -5° and less than 5°. Furthermore, "perpendicular" refers to a state where the angle formed by two straight lines is greater than 80° and less than 100°, and thus also includes a state where the angle is greater than 85° and less than 95°.

[0162] In this specification, circles, ellipses, triangles, rectangles, trapezoids, pentagons or hexagons are not in the strict sense, but may be approximate circles, approximate ellipses, approximate triangles, approximate rectangles, approximate trapezoids, approximate pentagons or approximate hexagons, etc. There may be some small deformations caused by tolerances, such as chamfers, arc edges and deformations.

[0163] In this specification, "about" and "substantially" are used without strict limits and allow for process and measurement errors. In this disclosure, "substantially the same" means that the numerical values differ by less than 10%.

[0164] In this specification, "A extends along direction B" means that A may include a main portion and a secondary portion connected to the main portion, the main portion being a line, line segment, or strip, extending along direction B, and the length of the main portion extending along direction B being greater than the length of the secondary portion extending along other directions. Throughout this specification, "A extends along direction B" means "the main portion of A extends along direction B."

[0165] As used herein, "A and B are in the same layer" means that A and B are formed simultaneously through the same patterning process. "Same layer" does not always mean that the thickness or height of the layers is the same in a partial cross-sectional schematic diagram. "The orthographic projection of A includes the orthographic projection of B" means that the orthographic projection of B falls within the orthographic projection of A, or that the orthographic projection of A covers the orthographic projection of B.

[0166] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be understood to indicate or imply relative importance or to implicitly specify the quantity of the technical features being referred to. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include at least one of the features.

[0167] In the embodiments of the present disclosure, the thickness of a component refers to the dimension of the component in a direction perpendicular to the substrate.

[0168] The display substrate includes a display area and a hole area. When the isolation column located in the hole area is energized, electrochemical corrosion will occur, and there will be residual glue on the isolation column. When the display substrate is opened, water vapor will enter the display area along the residual glue, which may cause black spots to appear on the display substrate, affecting the display effect of the display substrate.

[0169] Figure 1 FIG. 1 is a schematic diagram of a display substrate according to at least one embodiment of the present disclosure. Figure 1As shown, the shape of the display substrate can be a closed polygon including linear edges. The display substrate may include: a display area AA, a hole area VV at least partially surrounded by the display area AA, a binding area BB located on one side of the display area AA, and a frame area CC located on at least one side of the display area AA. For example, the display area AA may include: a first display edge (lower display edge) and a second display edge (upper display edge) arranged opposite to each other in the first direction D1, and a third display edge (left display edge) and a fourth display edge (right display edge) arranged opposite to each other in the second direction D2. The first display edge and the second display edge may be linear edges parallel to each other, and the third display edge and the fourth display edge may be linear edges parallel to each other. Adjacent linear edges may be connected by curved edges (e.g., arcuate edges).

[0170] In an exemplary embodiment, the hole region VV may be circular. The hole region VV may also be in other suitable shapes, not limited to a circular shape. Furthermore, the location of the hole region VV is not limited to the center of the display area and may be set as needed.

[0171] In an exemplary embodiment, at least part of the structure in the hole region VV is removed. For example, all structures in the hole region VV of the display substrate are removed. For example, after forming the encapsulation layer, a hole is dug to remove the portion of the display substrate located in the hole region VV.

[0172] In an exemplary embodiment, the display device may further include: a sensor, which may be disposed in the hole area VV or may be entirely disposed in the hole area. For example, the sensor may include a camera.

[0173] In an exemplary embodiment, Figure 1 As shown, the binding area BB may connect the first display edge.

[0174] In an exemplary embodiment, Figure 1 As shown, the frame area CC may include: an upper frame area of the display substrate, a left frame area of the display substrate, and a right frame area of the display substrate. However, this embodiment is not limited to this.

[0175] In an exemplary embodiment, Figure 1 As shown, the binding area BB may include: a first sub-area B11, a bending area B12, and a second sub-area B13 arranged in sequence along a side away from the display area AA in the first direction D1. The first sub-area B11 can also be referred to as a first fan-out area. The first sub-area B11 can be connected to the left and right border areas and connected to the display area AA. The bending area B12 can be connected between the first sub-area B11 and the second sub-area B13. The bending area B12 can be configured to bend the second sub-area B13 to the back of the display area AA.

[0176] In an exemplary embodiment, the second sub-area B13 of the binding area BB may include: a second fan-out area, a circuit setting area, a third fan-out area, a first signal access area B134 and a second signal access area B135, which are arranged in sequence in the first direction D1 along a direction away from the bending area B12.

[0177] In an exemplary embodiment, Figure 1 As shown, the display area AA of the display substrate may include at least: a plurality of sub-pixels PX, a plurality of gate lines GL, and a plurality of data lines DL. The plurality of gate lines GL may extend along the second direction D2 and be arranged along the first direction D1; the plurality of data lines DL may extend along the first direction D1 and be arranged along the second direction D2. The plurality of data lines DL may be electrically connected to the plurality of sub-pixels PX, and the plurality of data lines DL may be configured to provide data signals to the plurality of sub-pixels PX. The plurality of gate lines GL may be electrically connected to the plurality of sub-pixels PX, and the plurality of gate lines GL may be configured to provide pixel control signals to the plurality of sub-pixels PX. For example, the pixel control signal may include a scan signal, or may include a scan signal and a light-emitting control signal, or may include a scan signal, a reset control signal, and a light-emitting control signal.

[0178] In an exemplary embodiment, the second direction D2 may be an extending direction (e.g., a row direction) of the gate lines GL in the display area AA; the first direction D1 may be an extending direction (e.g., a column direction) of the data lines in the display area AA. The first direction D1 and the second direction D2 may intersect each other, for example, may be perpendicular to each other.

[0179] In an exemplary embodiment, a pixel unit of the display area AA may include three sub-pixels, and the three sub-pixels may be a first sub-pixel emitting a first color light (e.g., red light), a second sub-pixel emitting a second color light (e.g., blue light), and a third sub-pixel emitting a third color light (e.g., green light). However, this embodiment is not limited to this. In an exemplary embodiment, a pixel unit may include four sub-pixels, and the four sub-pixels may be a sub-pixel emitting red light, a sub-pixel emitting green light, a sub-pixel emitting blue light, and a sub-pixel emitting white light. For another example, a pixel unit may include four sub-pixels, and the four sub-pixels may include one sub-pixel emitting red light, one sub-pixel emitting blue light, and two sub-pixels emitting green light.

[0180] In an exemplary embodiment, a sub-pixel may include: a pixel driving circuit and a light-emitting element electrically connected to the pixel driving circuit. The pixel driving circuit may include a plurality of transistors and at least one capacitor. For example, the pixel driving circuit may be a 3T1C, 4T1C, 5T1C, 5T2C, 6T1C, 7T1C or 8T1C structure. In the above circuit structure, T refers to a thin film transistor, C refers to a capacitor, the number before T represents the number of thin film transistors in the circuit, and the number before C represents the number of capacitors in the circuit. In an exemplary embodiment, the plurality of transistors in the pixel driving circuit may include P-type transistors and N-type transistors. In other examples, the plurality of transistors in the pixel driving circuit may be P-type transistors or may be N-type transistors. Using transistors of the same type in the pixel driving circuit can simplify the process flow, reduce the process difficulty of the display substrate, and improve the yield of the product.

[0181] In an exemplary embodiment, the shape of the light-emitting elements of a sub-pixel can be a rectangle, a rhombus, a pentagon, or a hexagon. When a pixel unit includes three sub-pixels, the light-emitting elements of the three sub-pixels can be arranged horizontally, vertically, or in a triangular pattern. When a pixel unit includes four sub-pixels, the light-emitting elements of the four sub-pixels can be arranged horizontally, vertically, or in a square pattern. However, this embodiment is not limited to this.

[0182] In an exemplary embodiment, the light-emitting element may be any one of a light-emitting diode (LED), an organic light-emitting diode (OLED), a quantum dot light-emitting diode (QLED), a micro-LED (including mini-LED or micro-LED), etc. For example, the light-emitting element may be an OLED, and the light-emitting element may emit red light, green light, blue light, or white light, etc. when driven by its corresponding pixel driving circuit. The color of the light emitted by the light-emitting element may be determined as needed. In an exemplary embodiment, the light-emitting element may include: an anode, a cathode, and an organic light-emitting layer located between the anode and the cathode. The anode of the light-emitting element may be electrically connected to the corresponding pixel driving circuit. However, this embodiment is not limited to this.

[0183] The display substrate of this example may be integrated with a touch structure, for example, an integrated mutual capacitance touch structure, to form an FMLOC structure.

[0184] In an exemplary embodiment, the display substrate may include a base, and a circuit structure layer and a light emitting structure layer sequentially disposed on the base, wherein the circuit structure layer includes a pixel driving circuit located in the display area, and the light emitting structure layer includes a light emitting element located in the display area.

[0185] In an exemplary embodiment, the display substrate may further include at least one film layer of an encapsulation structure layer and a touch structure layer, which is not limited in the present disclosure.

[0186] Figure 2 A partial cross-sectional view of the display area of at least one embodiment of the present disclosure Figure 1 , Figure 2 In this example, the structure of a sub-pixel in the display area is used as an example for illustration. In this example, the pixel driving circuit includes a low-temperature polysilicon thin film transistor as an example for description.

[0187] In an exemplary embodiment, Figure 2 As shown, the circuit structure layer 12 may include: a semiconductor layer, a first gate metal layer, a second gate metal layer, a first source-drain metal layer, and a second source-drain metal layer, disposed on a substrate 10. A first insulating layer 101 (which may be referred to as a buffer layer) may be disposed between the substrate and the semiconductor layer; a second insulating layer 102 (which may be referred to as a first gate insulating layer) may be disposed between the semiconductor layer and the first gate metal layer; a third insulating layer 103 (which may be referred to as a second gate insulating layer) may be disposed between the first gate metal layer and the second gate metal layer; a fifth insulating layer 105 (which may be referred to as an interlayer insulating layer) may be disposed between the second gate metal layer and the first source-drain metal layer; a sixth insulating layer 106 (which may also be referred to as a passivation layer) and a seventh insulating layer 107 (which may also be referred to as a first planarizing layer) may be disposed between the first source-drain metal layer and the second source-drain metal layer; the seventh insulating layer 107 may be located on a side of the sixth insulating layer 106 away from the substrate 10; and an eighth insulating layer 108 (which may also be referred to as a second planarizing layer) may be disposed on a side of the second source-drain metal layer away from the substrate 10. Among them, the first insulating layer 101, the second insulating layer 102, the third insulating layer 103, the fifth insulating layer 105 and the sixth insulating layer 106 can be inorganic insulating layers, and the seventh insulating layer 107 and the eighth insulating layer 108 can be organic insulating layers. The present disclosure is illustrated by taking the display substrate as an example including two gate metal layers and two source and drain metal layers. However, this embodiment is not limited to this. In other examples, a bottom shielding metal layer (BSM) can be further provided on the side of the first insulating layer close to the substrate, and the bottom shielding metal layer can be configured to at least partially cover the active layer of the transistor of the pixel driving circuit to prevent external light from affecting the performance of the transistor. In other examples, only the sixth insulating layer or the seventh insulating layer can be provided between the first source and drain metal layer and the second source and drain metal layer.

[0188] In an exemplary embodiment, Figure 2 As shown, the semiconductor layer may include at least a first active layer 210 of the transistor 21 located in the display area. The first active layer 210 of the transistor 21 may include a first region 2101, a second region 2102, and a channel region 2100 located between the first region 2101 and the second region 2102. The first gate metal layer may include at least a first gate electrode 213 of the transistor 21 located in the display area and a first plate 231 of the capacitor 23. The orthographic projection of the first gate electrode 213 of the transistor 21 on the substrate 10 may cover the orthographic projection of the channel region 2100 of the first active layer 210 on the substrate 10. The second gate metal layer may include at least a second plate 232 of the capacitor 23 located in the display area and a third gate electrode 224 of the second-type transistor 22. The orthographic projections of the second plate 232 and the first plate 231 of the capacitor 23 on the substrate 10 may at least partially overlap, for example, the two may coincide.

[0189] In an exemplary embodiment, Figure 2 As shown, the first source-drain metal layer in the display area may include at least: a first source electrode 211 and a first drain electrode 212 of the transistor 21 located in the display area. The fifth insulating layer 105 may have multiple pixel vias (e.g., including a first pixel via and a second pixel via) in the display area. The fifth insulating layer 105, the third insulating layer 103, the second insulating layer 102, and the first insulating layer 101 within the first pixel via can be removed to expose at least a portion of the surface of the first region 2101 of the first active layer 210. The fifth insulating layer 105, the third insulating layer 103, the second insulating layer 102, and the first insulating layer 101 within the second pixel via can be removed to expose at least a portion of the surface of the second region 2102 of the first active layer 210. The first source electrode 211 of the transistor 21 may be electrically connected to the first region 2101 of the first active layer 210 via the first pixel via, and the first drain electrode 212 may be electrically connected to the second region 2102 of the first active layer 210 via the second pixel via. The second source-drain metal layer may include at least a first switching electrode 241. The first switching electrode 241 may be electrically connected to the first drain electrode 212 of the transistor 21 of the pixel driving circuit through a fifth pixel via hole defined by the sixth insulating layer 106 and the seventh insulating layer 107. In this example, the first switching electrode 241 may be used to achieve electrical connection between the pixel driving circuit and the light-emitting element.

[0190] In an exemplary embodiment, the gate line of the display area may be located in the first gate metal layer and the second gate metal layer, the data line of the display area may be located in the second source / drain metal layer, and the first power line of the display area may be located in the second source / drain metal layer. This embodiment is not limited to this.

[0191] In an exemplary embodiment, Figure 2 As shown, the light-emitting structure layer 13 may include a pixel definition layer 134 and multiple light-emitting elements located in the display area. For example, each light-emitting element may include a stacked first electrode 131, an organic light-emitting layer 132, and a second electrode 133. The first electrode 131 of the light-emitting element may be an anode. The first electrode 131 may be disposed on the eighth insulating layer 108 and electrically connected to the first transfer electrode 241 through a sixth pixel via provided in the eighth insulating layer 108. The pixel definition layer 134 is disposed on the first electrode 131 and the eighth insulating layer 108. The pixel definition layer 134 may have multiple pixel openings, each of which may expose at least a portion of the surface of a corresponding first electrode 131. At least a portion of the organic light-emitting layer 132 may be disposed within a pixel opening and connected to the corresponding first electrode 131. The second electrode 133 may be disposed on and connected to the organic light-emitting layer 132. Driven by the first electrode 131 and the second electrode 133, the organic light-emitting layer 132 may emit light of a corresponding color.

[0192] In an exemplary embodiment, the light-emitting structure layer may include: an anode layer, an organic material layer and a cathode layer, the anode layer includes: a first electrode of at least one light-emitting element located in the display area, the organic material layer includes: an organic light-emitting layer of at least one light-emitting element located in the display area, and the cathode layer includes: a second electrode of at least one light-emitting element located in the display area.

[0193] In an exemplary embodiment, the organic light-emitting layer 132 of the light-emitting element may include an emitting layer (EML) and at least one of the following film layers: a hole injection layer (HIL), a hole transport layer (HTL), a hole blocking layer (HBL), an electron blocking layer (EBL), an electron injection layer (EIL), and an electron transport layer (ETL). Driven by the voltage of the first electrode 131 and the second electrode 133, the light-emitting properties of the organic material can be utilized to emit light according to the desired grayscale.

[0194] In an exemplary embodiment, the light-emitting layers of light-emitting elements of different colors may be different. For example, the red light-emitting element includes a red light-emitting layer, the green light-emitting element includes a green light-emitting layer, and the blue light-emitting element includes a blue light-emitting layer. In order to reduce the difficulty of the process and improve the yield, the hole injection layer and the hole transport layer on one side of the light-emitting layer may adopt a common layer, and the electron injection layer and the electron transport layer on the other side of the light-emitting layer may adopt a common layer. In an exemplary embodiment, any one or more layers of the hole injection layer, the hole transport layer, the electron injection layer and the electron transport layer can be prepared by a one-time process (a one-time evaporation process or a one-time inkjet printing process), and isolation is achieved by means of a surface step difference of the formed film layer or by surface treatment. For example, any one or more layers of the hole injection layer, the hole transport layer, the electron injection layer and the electron transport layer corresponding to adjacent sub-pixels can be isolated. In an exemplary embodiment, the organic light-emitting layer can be formed by evaporation using a fine metal mask (FMM) or an open mask (Open Mask), or by inkjet technology.

[0195] In an exemplary embodiment, Figure 2 As shown, the encapsulation structure layer 14 may include a stacked first encapsulation layer 141, a second encapsulation layer 142, and a third encapsulation layer 143. The first and third encapsulation layers 141 and 143 may be made of inorganic materials, such as silicon nitride, silicon oxide, or silicon oxynitride. Inorganic materials have high density and can prevent the intrusion of water, oxygen, and the like. The second encapsulation layer 142 may be disposed between the first and third encapsulation layers 141 and 143 to prevent external moisture from entering the light-emitting element. The second encapsulation layer 142 may be made of an organic material, such as a polymer material containing a desiccant or a polymer material that can block moisture, or a polymer resin to planarize the surface of the display substrate and relieve stress in the first and third encapsulation layers 141 and 143. It may also include a desiccant or other absorbent material to absorb intrusive water, oxygen, and other substances. However, this embodiment is not limited to this. For example, the encapsulation structure layer may have a five-layer stacked structure: inorganic / organic / inorganic / organic / inorganic.

[0196] In an exemplary embodiment, the touch structure layer of the display area may include: a plurality of first touch electrodes, a plurality of first connecting portions, a plurality of second touch electrodes, and a plurality of second connecting portions. The plurality of first touch electrodes may be arranged in the same layer, and adjacent first touch electrodes may be connected via the first connecting portions. The plurality of second touch electrodes may be arranged in the same layer, and adjacent second touch electrodes may be connected via the second connecting portions.

[0197] In an exemplary embodiment, Figure 2As shown, in a direction perpendicular to the display substrate, the touch structure layer 15 of the display area may include: a touch buffer layer (TBL) 150, a first touch conductive layer 151, a touch interlayer insulating layer (TLD) 153, a second touch conductive layer 152, and a touch protection layer (TOC) 154, which are arranged in sequence. The touch buffer layer 150 and the touch interlayer insulating layer 153 may be inorganic insulating layers, and the touch protection layer 154 may be an organic insulating layer. For example, the first touch conductive layer 151 may include a plurality of first touch electrodes, a plurality of second touch electrodes, and a plurality of first connecting portions. The first touch electrodes and the first connecting portions may be an integrated structure connected to each other. The second touch conductive layer 152 may include a plurality of second connecting portions. The second connecting portions may be connected to adjacent second touch electrodes through vias provided in the touch interlayer insulating layer 153. However, this embodiment is not limited to this. In other examples, the first touch conductive layer may include: a plurality of first touch electrodes, a plurality of second touch electrodes, and a plurality of second connecting portions, wherein the second touch electrodes and the second connecting portions may be interconnected as an integral structure; the second touch conductive layer may include a plurality of first connecting portions, wherein the first connecting portions may be interconnected with adjacent first touch electrodes via vias defined in the touch interlayer insulating layer. In an exemplary embodiment, the first touch electrodes may be drive (Tx) electrodes, and the second touch electrodes may be sense (Rx) electrodes. Alternatively, the first touch electrodes may be sense (Rx) electrodes, and the second touch electrodes may be drive (Tx) electrodes. This embodiment is not limited to this.

[0198] In an exemplary embodiment, the first touch electrode and the second touch electrode may have a rhombus shape, for example, a regular rhombus, a horizontally elongated rhombus, or a vertically elongated rhombus. In other examples, the first touch electrode and the second touch electrode may have any one or more of a triangle, a square, a trapezoid, a parallelogram, a pentagon, a hexagon, and other polygonal shapes, which are not limited in the present disclosure.

[0199] In an exemplary embodiment, the first and second touch electrodes may be in the form of transparent conductive electrodes. In other examples, the first and second touch electrodes may be in the form of a metal mesh. The metal mesh may be formed by interweaving multiple metal wires. The metal mesh may include multiple mesh patterns, and the mesh pattern may be a polygon formed by multiple metal wires. The metal mesh-type first and second touch electrodes have advantages such as low resistance, small thickness, and fast response speed.

[0200] Figure 3 A partial cross-sectional view of the display area of at least one embodiment of the present disclosure Figure 2 In an exemplary embodiment, as Figure 3As shown, the circuit structure layer 12 may include: a semiconductor layer, a first gate metal layer, a second gate metal layer, a third gate metal layer, a first source-drain metal layer, and a second source-drain metal layer arranged on the substrate 10. A fourth insulating layer 104 (which may be referred to as a third gate insulating layer) may be provided between the second gate metal layer and the third gate metal layer; a fifth insulating layer 105 (which may be referred to as an interlayer insulating layer) may be provided between the third gate metal layer and the first source-drain metal layer. Among them, the fourth insulating layer 104 may be an inorganic insulating layer. The present disclosure is described by taking the display substrate including three gate metal layers and two source-drain metal layers as an example. However, this embodiment is not limited to this. The remaining structures of the display area of the display substrate of this example can be referred to. Figure 2 The description of the embodiment shown is omitted here.

[0201] In an exemplary embodiment, the third gate metal layer may include a third electrode plate 233 of a capacitor located in the display area, the third electrode plate 233 is connected to the first electrode plate 231, and the orthographic projection of the third electrode plate 233 on the substrate 10 at least partially overlaps with the orthographic projection of the second electrode plate 232 on the substrate 10, for example, may coincide.

[0202] In an exemplary embodiment, the gate line of the display area may be located in at least one of the first gate metal layer, the second gate metal layer, and the third gate metal layer, the data line of the display area may be located in the second source / drain metal layer, and the first power line of the display area may be located in the second source / drain metal layer. This embodiment is not limited to this.

[0203] Figure 4 A partial cross-sectional view of the display area of at least one embodiment of the present disclosure Figure 3 In an exemplary embodiment, as Figure 4 As shown, the circuit structure layer 12 may include: a semiconductor layer, a first gate metal layer, a second gate metal layer, a first source-drain metal layer, a second source-drain metal layer and a third source-drain metal layer arranged on the substrate 10. An eighth insulating layer 108 (which may also be called a second flat layer) may be arranged between the second source-drain metal layer and the third source-drain metal layer, and a ninth insulating layer 109 (which may also be called a third flat layer) may be arranged on the side of the third source-drain metal layer away from the substrate 10. The present disclosure is explained by taking the display substrate including two gate metal layers and three source-drain metal layers as an example. This example can realize the electrical connection between the pixel driving circuit and the light-emitting element through the first transfer electrode 241 and the second transfer electrode 242. For the remaining structures of the display area of the display substrate of this example, please refer to Figure 2 The description of the embodiment shown is omitted here.

[0204] In an exemplary embodiment, the gate line of the display area may be located, for example, in the first gate metal layer and the second gate metal layer, the data line of the display area may be located, for example, in the second source / drain metal layer or the third source / drain metal layer, and the first power line of the display area may be located, for example, in the second source / drain metal layer or the third source / drain metal layer. This embodiment is not limited to this.

[0205] Figure 5 A partial cross-sectional view of the display area of at least one embodiment of the present disclosure Figure 4 In an exemplary embodiment, as Figure 5 As shown, the circuit structure layer 12 may include: a semiconductor layer, a first gate metal layer, a second gate metal layer, a third gate metal layer, a first source-drain metal layer, a second source-drain metal layer and a third source-drain metal layer arranged on the substrate 10. A fourth insulating layer 104 (which may be referred to as a third gate insulating layer) may be provided between the second gate metal layer and the third gate metal layer, an eighth insulating layer 108 (which may also be referred to as a second flat layer) may be provided between the second source-drain metal layer and the third source-drain metal layer, and a ninth insulating layer 109 (which may also be referred to as a third flat layer) may be provided on the side of the third source-drain metal layer away from the substrate 10. The fourth insulating layer 104 may be an inorganic insulating layer, and the ninth insulating layer 109 may be an organic insulating layer. The present disclosure is illustrated by taking the display substrate including three gate metal layers and three source-drain metal layers as an example. In this example, the electrical connection between the pixel circuit and the light-emitting element can be achieved through the first transfer electrode 241 and the second transfer electrode 242. For the remaining structures of the display area of the display substrate of this example, reference may be made to Figure 2 and Figure 3 The description of the embodiment shown is omitted here.

[0206] In an exemplary embodiment, the gate line of the display area may be located in at least one of the first gate metal layer, the second gate metal layer, and the third gate metal layer, the data line of the display area may be located in the second source / drain metal layer or the third source / drain metal layer, and the first power line of the display area may be located in the second source / drain metal layer or the third source / drain metal layer. This embodiment is not limited to this.

[0207] Figure 6 Schematic diagram of the structure of the display substrate provided in the embodiment of the present disclosure Figure 1 , Figure 7 Schematic diagram of the structure of the display substrate provided in the embodiment of the present disclosure Figure 2 .like Figure 6 and Figure 7As shown, the display substrate provided by the embodiment of the present disclosure has a display area and a hole area. The hole area includes: a first region R1 and a second region R2 arranged in sequence away from the display area. At least one of the first region R1 and the second region R2 is provided with a plurality of isolation pillars 300. At least one isolation pillar 300 of the plurality of isolation pillars located in at least one of the second region R2 and the first region R1 includes: at least two conductive structures and at least one insulating structure. The at least one insulating structure is arranged between the at least two conductive structures. At least one side of the at least two conductive structures is grooved.

[0208] In the present disclosure, at least one side of at least two conductive structures is groove-shaped, so that an undercut structure can be formed between the conductive structure and the adjacent insulating structure, thereby cutting off the conductive path between adjacent isolation columns and the path along the isolation column perpendicular to the substrate.

[0209] In an exemplary embodiment, when at least one side of at least two conductive structures is in a groove shape, the edge of the side wall may be a smooth curve or a straight line, which is not limited in the present disclosure.

[0210] The present disclosure provides a groove-shaped at least one side of at least one conductive structure in at least one of a plurality of isolation columns located in at least one area of the second area and the first area, so that a plurality of undercut structures can be formed on the display substrate, which can cut off the power supply to the hole area, thereby effectively solving the black spot problem of the display substrate and improving the display effect of the display substrate.

[0211] In an exemplary embodiment, Figure 6 and Figure 7 As shown, the hole area also includes: a third area R3, the third area R3 is located between the first area R1 and the second area R2, and the display substrate also includes: a circuit structure layer arranged on the base 10, the circuit structure layer includes: multiple gate metal layers and multiple source and drain metal layers, at least one film layer of an organic insulating layer and an inorganic insulating layer is arranged between at least two metal layers, at least one inorganic insulating layer arranged on the side of the multiple gate metal layers close to the base 10 is called a first composite insulating layer 20, and the multiple inorganic insulating layers arranged between the multiple gate metal layers and the multiple source and drain metal layers are called a second composite insulating layer 30; the first composite insulating layer 20 extends from the display area AA to the second area R2, and the second composite insulating layer 30 is located in the display area AA and does not extend to the first area R1, or extends from the display area AA to the third area R3. Figure 6 The second composite insulating layer 30 is located in the display area AA and does not extend to the first area R1 as an example for description. Figure 7 The description is made by taking an example where the second composite insulating layer 30 extends from the display area AA to the third area R3 .

[0212] In an exemplary embodiment, the first composite insulating layer 20 may include a first insulating layer, and the second composite insulating layer 30 may include: a plurality of inorganic insulating layers located on a side of a plurality of source and drain metal layers close to the substrate, for example, may include: a second insulating layer, a third insulating layer, a fourth insulating layer and a fifth insulating layer.

[0213] In an exemplary embodiment, Figure 6 and Figure 7 As shown, the third region R3 may further be provided with an isolation dam 500 , which includes: a plurality of dam bases stacked in sequence in a direction away from the substrate, at least one dam base being located in at least one flat layer, and at least one dam base being located in a pixel definition layer.

[0214] In an exemplary embodiment, Figure 6 As shown, when the second composite insulating layer 30 is located in the display area AA and does not extend to the first area R1, the isolation column 300 located in the first area R1 has the same shape as that located in the second area R2. At this time, at least one isolation dam covers the side of the second composite insulating layer close to the third area.

[0215] Figure 8 FIG. 1 is a partial cross-sectional diagram of a conductive structure of at least one film layer in a plurality of source / drain metal layers. Figure 8 As shown, in an exemplary embodiment, when at least one conductive structure in the isolation column is located in at least one film layer among the multiple source / drain metal layers, the conductive structure located in at least one film layer among the multiple source / drain metal layers includes: a first isolation portion 3011, a second isolation portion 3012, and a third isolation portion 3013. Specifically, the first isolation portion 3011, the second isolation portion 3012, and the third isolation portion 3013 are located on a side of the second isolation portion 3012 close to the substrate 10, and the third isolation portion 3013 is located on a side of the second isolation portion 3012 away from the substrate 10.

[0216] In an exemplary embodiment, the orthographic projection of the surface of the second isolation portion 3012 close to the substrate 10 on the substrate 10 is located within the range of the orthographic projection of the surface of the first isolation portion 3011 away from the substrate 10 on the substrate 10, the orthographic projection of the surface of the second isolation portion 3012 away from the substrate 10 on the substrate 10 is located within the range of the orthographic projection of the surface of the third isolation portion 3013 close to the substrate 10 on the substrate 10, the orthographic projection of the surface of the second isolation portion 3012 away from the substrate 10 on the substrate 10 is located within the range of the orthographic projection of the surface of the second isolation portion 3012 close to the substrate 10 on the substrate 10, and the side wall of the second isolation portion 3012 is set at an acute angle to the surface of the second isolation portion 3012 close to the substrate 10. Exemplarily, the shape of the longitudinal section of the second isolation portion 3012 can be trapezoidal, and the shape of the longitudinal section of the first isolation structure 301 can be I-shaped.

[0217] In an exemplary embodiment, the conductivity of the second isolating portion 3012 is greater than the conductivity of at least one of the first isolating portion 3011 and the third isolating portion 3013. In an exemplary embodiment, the second isolating portion 3012 may be made of aluminum (Al) or copper (Cu), and the first isolating portion 3011 and the third isolating portion 3013 may be made of an inert metal, such as titanium (Ti) or molybdenum (Mo).

[0218] In an exemplary embodiment, the display substrate may further include a cover structure. Figure 9 is a schematic diagram of the covering structure. Figure 9 As shown, the covering structure includes: an organic structure 4011 and a cathode structure 4012 sequentially stacked on a substrate 10, wherein the orthographic projection of the cathode structure 4012 on the substrate 10 coincides with the orthographic projection of the organic structure 4011 on the substrate 10. The covering structure is disconnected at the grooves of at least two conductive structures included in the isolation column.

[0219] In an exemplary embodiment, the organic structure is disposed on the organic light emitting layer, and the cathode structure may be disposed on the cathode conductive layer.

[0220] In an exemplary embodiment, at least one of the plurality of isolation pillars includes: a first conductive structure, a first insulating structure, and a second conductive structure. At least one side of at least one of the first and second conductive structures is grooved, and at least a portion of the second conductive structure is within the range of the orthographic projection of the substrate, the first insulating structure, and the orthographic projection of the first conductive structure on the substrate. Exemplarily, the first conductive structure is located in one of the plurality of gate metal layers, and the second conductive structure is located in another of the plurality of gate metal layers. Alternatively, the first conductive structure is located in one of the plurality of gate metal layers, and the second conductive structure is located in one of the plurality of source / drain metal layers, and the first insulating structure is disposed in at least one inorganic insulating layer located between the film layer containing the first conductive structure and the film layer containing the second conductive structure.

[0221] In an exemplary embodiment, at least one of the plurality of isolation columns further comprises: a first conductive structure, a first insulating structure, a second conductive structure, and a third conductive structure, wherein the third conductive structure is located on a side of the second conductive structure away from the substrate. At least one side of at least one of the first to third conductive structures is groove-shaped, and an orthographic projection of at least a portion of the third conductive structure on the substrate is located within the range of an orthographic projection of the second conductive structure on the substrate. Exemplarily, either the first conductive structure or the second conductive structure is located in one of the plurality of gate metal layers, the third conductive structure is located in one of the plurality of source / drain metal layers, and the first insulating structure is disposed in at least one inorganic insulating layer located between the film layer where the first conductive structure is located and the film layer where the second conductive structure is located.

[0222] In an exemplary embodiment, at least one of the plurality of isolation columns further includes: a first conductive structure, a first insulating structure, a second conductive structure, a second insulating structure, and a third conductive structure. At least one side of at least one of the first to third conductive structures is groove-shaped, and an orthographic projection of at least a portion of the third conductive structure on the substrate is within the range of an orthographic projection of the second insulating structure on the substrate. At least a portion of the orthographic projection of the third conductive structure on the substrate is within the range of an orthographic projection of the second conductive structure on the substrate. Exemplarily, any one of the first, second, and third conductive structures is disposed in one of the plurality of gate metal layers, or any one of the first and second conductive structures is disposed in one of the plurality of gate metal layers, and the third conductive structure is disposed in one of the plurality of source / drain metal layers. The first insulating structure is disposed in at least one inorganic insulating layer between the first conductive structure and the second conductive structure, and the second insulating structure is disposed in at least one inorganic insulating layer between the second conductive structure and the third conductive structure.

[0223] In an exemplary embodiment, at least one conductive structure of at least one isolation pillar includes a first sidewall and a second sidewall, and at least one insulating structure of at least one isolation pillar includes a first sidewall and a second sidewall. The first sidewall of the insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation pillar along a centerline perpendicular to the substrate, and the second sidewall of the insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation pillar along the centerline perpendicular to the substrate.

[0224] In an exemplary embodiment, an insulating filling structure is disposed between at least two adjacent isolation pillars, and the insulating filling structure covers a side of the two adjacent isolation pillars close to the insulating filling structure and a portion of the surface away from the substrate.

[0225] In an exemplary embodiment, at least one of the plurality of isolation pillars is provided with an isolation insulating structure on a surface facing away from the substrate. Exemplarily, when the structures of adjacent isolation pillars among the plurality of isolation pillars are arranged symmetrically with respect to a line perpendicular to the substrate, the isolation insulating structure provided on each isolation pillar is spaced apart from, or interconnected with, the isolation insulating structure provided on the adjacent isolation pillar. When the structures of adjacent isolation pillars among the plurality of isolation pillars are arranged symmetrically with respect to a line perpendicular to the substrate, at least one insulating structure of each isolation pillar is spaced apart from, or interconnected with, at least one insulating structure of each adjacent isolation pillar.

[0226] In an exemplary embodiment, the isolation insulating structure includes: a first side wall and a second side wall, the first side wall of the isolation insulating structure and the first side wall of the conductive structure are located on a first side of the isolation column along a center line perpendicular to the substrate, and the second side wall of the isolation insulating structure and the second side wall of the conductive structure are located on a second side of the isolation column along the center line perpendicular to the substrate.

[0227] In an exemplary embodiment, Figure 10 A partial cross-sectional view of the display substrate located in the second area Figure 1 , Figure 11 A partial cross-sectional view of the display substrate located in the second area Figure 2 .like Figure 10 and Figure 11 As shown, the isolation pillar 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, and a second conductive structure 313 sequentially stacked on the substrate 10. An insulating filling structure 400 is disposed between at least two adjacent isolation pillars 300, and the first and second sidewalls of at least one of the first and second conductive structures 311, 313 are groove-shaped.

[0228] In an exemplary embodiment, Figure 10 and Figure 11 As shown, the orthographic projections of the first conductive structure 311 and the second conductive structure 313 on the substrate 10 are located within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, and the orthographic projection of the second conductive structure 313 on the substrate 10 is located within the range of the orthographic projection of the first conductive structure 311 on the substrate 10. The insulating filling structure 400 covers the sidewalls of two adjacent isolation pillars 300 close to the insulating filling structure 400 and a portion of the surface away from the substrate 10.

[0229] In an exemplary embodiment, the first conductive structure 311 is located in one of the film layers among the multiple gate metal layers, and the second conductive structure 313 is located in another film layer among the multiple gate metal layers, or the first conductive structure 311 is located in one of the film layers among the multiple gate metal layers, and the second conductive structure is located in one of the film layers among the multiple source / drain metal layers, and the first insulating structure 312 is arranged in at least one inorganic insulating layer between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located. Figure 10 The following description is made by taking the example that the first conductive structure 311 is located in one of the multiple gate metal layers and the second conductive structure 313 is located in another of the multiple gate metal layers. Figure 11 The description is made by taking an example where the first conductive structure 311 is located in one of the multiple gate metal layers and the second conductive structure is located in one of the multiple source / drain metal layers.

[0230] In an exemplary embodiment, the first conductive structure 311 is located in a gate metal layer close to the substrate 10 among the multiple gate metal layers, the second conductive structure 313 is located in a source / drain metal layer on a side away from the substrate 10 among the multiple source / drain metal layers, and the thickness of the first insulating structure 312 is in a range of 0.7 micrometers to 0.9 micrometers. For example, the thickness of the first insulating structure 312 may be 0.8 micrometers.

[0231] Figure 12 A partial cross-sectional view of the display substrate located in the second area Figure 3 In an exemplary embodiment, as Figure 12 As shown, the isolation pillar 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, a second conductive structure 313, and a third conductive structure 315, which are sequentially stacked on the substrate 10. An insulating filling structure 400 is disposed between at least two adjacent isolation pillars 300, and the first and second sidewalls of at least one of the first to third conductive structures 311, 315 are groove-shaped.

[0232] In an exemplary embodiment, Figure 12 As shown, the orthographic projections of the first conductive structure 311 and the second conductive structure 313 on the substrate 10 are located within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, the orthographic projection of the second conductive structure 313 on the substrate 10 is located within the range of the orthographic projection of the first conductive structure 311 on the substrate 10, the orthographic projection of the third conductive structure 315 on the substrate 10 is located within the range of the orthographic projection of the second conductive structure 313 on the substrate 10, and the insulating filling structure 400 covers the side walls of two adjacent isolation columns 300 close to the insulating filling structure 400 and a portion of the surface away from the substrate 10.

[0233] In an exemplary embodiment, Figure 12 As shown, any one of the first conductive structure 311 and the second conductive structure 313 is located in one of the film layers among the multiple gate metal layers, the third conductive structure 315 is located in one of the film layers among the multiple source and drain metal layers, and the first insulating structure 312 is arranged in at least one inorganic insulating layer between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located.

[0234] In an exemplary embodiment, Figures 10 to 12As shown, the surface of the first insulating structure 312 located in the second region R2 away from the substrate 10 includes: a first surface, a second surface and a third surface, the first surface and the third surface are respectively located on two opposite sides of the second surface, the orthographic projection of the second surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10, and there is no overlapping area between the orthographic projections of the first surface and the third surface on the substrate 10 and the second conductive structure 313, and for at least two isolation columns 300 with an insulating filling structure 400 arranged therebetween, the first surface is located on the side of the second surface away from the insulating filling structure 400, and the third surface is located on the side of the second surface close to the insulating filling structure 400. The covering structure includes: a first covering structure 601, a second covering structure 602 and a third covering structure 603 arranged at intervals. The first covering structure 601 is arranged on the surface of the isolation column 300 away from the substrate 10. The first covering structures 601 on at least two isolation columns 300 with insulating filling structures 400 are connected to each other, and the orthographic projections of the first covering structures 601 on the substrate 10 at least partially overlap with the orthographic projections of the insulating filling structures 400 on the substrate 10. The second covering structure 602 is arranged on the first surface of at least two isolation columns 300 with insulating filling structures 400 arranged therebetween, and on the first surface and the third surface of the isolation columns without insulating filling structures 400 arranged therebetween. The third covering structure 603 is arranged between at least two isolation columns 300 without insulating filling structures 400 arranged therebetween.

[0235] Figure 13 A partial cross-sectional view of the display substrate located in the second area Figure 4 In an exemplary embodiment, as Figure 13 As shown, the isolation column 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, a second conductive structure 313, a second insulating structure 314 and a third conductive structure 315 stacked in sequence on the substrate 10, and an insulating filling structure 400 is arranged between at least two adjacent isolation columns 300.

[0236] like Figure 13 As shown, the orthographic projections of the first conductive structure 311 and the second conductive structure 313 on the substrate 10 are located within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, the orthographic projections of the second conductive structure 313 and the third conductive structure 315 on the substrate 10 are located within the range of the orthographic projection of the second insulating structure 314 on the substrate 10, the orthographic projection of the second conductive structure 313 on the substrate 10 is located within the range of the orthographic projection of the first conductive structure 311 on the substrate 10, the orthographic projection of the third conductive structure 315 on the substrate 10 is located within the range of the orthographic projection of the second conductive structure 313 on the substrate 10, and the insulating filling structure 400 covers the side walls of two adjacent isolation columns 300 close to the insulating filling structure 400 and a portion of the surface away from the substrate 10.

[0237] like Figure 13 As shown, any conductive structure among the first conductive structure 311, the second conductive structure 313 and the third conductive structure 315 is set in one of the film layers of the multiple gate metal layers, the first insulating structure 312 is set in at least one inorganic insulating layer between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located, and the second insulating structure 314 is set in at least one inorganic insulating layer between the film layer where the second conductive structure 313 is located and the film layer where the third conductive structure 315 is located.

[0238] Figure 14 A partial cross-sectional view of the display substrate located in the second area Figure 5 In an exemplary embodiment, as Figure 14 As shown, the isolation column 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, a second conductive structure 313, a second insulating structure 314, a third conductive structure 315 and a fourth conductive structure 317 stacked in sequence on the substrate 10, and an insulating filling structure 400 is arranged between at least two adjacent isolation columns 300.

[0239] like Figure 14 As shown, the orthographic projections of the first conductive structure 311 and the second conductive structure 313 on the substrate 10 are located within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, the orthographic projections of the second conductive structure 313 and the third conductive structure 315 on the substrate 10 are located within the range of the orthographic projection of the second insulating structure 314 on the substrate 10, the orthographic projection of the second conductive structure 313 on the substrate 10 is located within the range of the orthographic projection of the first conductive structure 311 on the substrate 10, the orthographic projection of the third conductive structure 315 on the substrate 10 is located within the range of the orthographic projection of the second conductive structure 313 on the substrate 10, the orthographic projection of the fourth conductive structure 317 on the substrate 10 is located within the orthographic projection of the third conductive structure 315 on the substrate 10, and the insulating filling structure 400 covers the sidewalls of two adjacent isolation columns 300 close to the insulating filling structure 400 and a portion of the surface away from the substrate 10.

[0240] like Figure 14 As shown, any structure among the first conductive structure 311 to the third conductive structure 315 is set in one of the film layers among the multiple gate metal layers, the fourth conductive structure 317 is located in one of the film layers among the multiple source and drain metal layers, the first insulating structure 312 is set in at least one inorganic insulating layer between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located, and the second insulating structure 314 is set in at least one inorganic insulating layer between the film layer where the second conductive structure 313 is located and the film layer where the third conductive structure 315 is located.

[0241] In an exemplary embodiment, Figure 13 and Figure 14 As shown, the surface of the first insulating structure 312 away from the substrate 10 includes: a first surface, a second surface and a third surface, the first surface and the third surface are respectively located on two opposite sides of the second surface, the orthographic projection of the second surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10, and there is no overlapping area between the orthographic projections of the first surface and the third surface on the substrate 10 and the second conductive structure 313, and for at least two isolation columns 300 with an insulating filling structure 400 arranged therebetween, the first surface is located on the side of the second surface away from the insulating filling structure 400, and the third surface is located on the side of the second surface close to the insulating filling structure 400. The surface of the second insulating structure 314 away from the substrate 10 includes: a fourth surface, a fifth surface and a sixth surface. The fourth surface and the sixth surface are respectively located on two opposite sides of the fifth surface. The orthographic projection of the fifth surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10. The orthographic projections of the fourth surface and the sixth surface on the substrate 10 do not overlap with the second conductive structure 313. For at least two isolation columns 300 with an insulating filling structure 400 arranged therebetween, the fourth surface is located on the side of the fifth surface away from the insulating filling structure 400, and the sixth surface is located on the side of the fifth surface close to the insulating filling structure 400.

[0242] In an exemplary embodiment, Figure 13 and Figure 14 As shown, the covering structure includes: a first covering structure 601, a second covering structure 602, a third covering structure 603 and a fourth covering structure 604, the first covering structure 601 is arranged on the surface of the isolation column 300 away from the substrate 10, the first covering structures 601 on at least two isolation columns 300 with insulating filling structures 400 are connected to each other, and the orthographic projections of the first covering structures 601 on the substrate 10 at least partially overlap with the orthographic projections of the insulating filling structures 400 on the substrate 10, the second covering structure 602 is arranged on the first surface of at least two isolation columns 300 with insulating filling structures 400 arranged therebetween, and on the first surface and third surface without insulating filling structures 400 arranged therebetween, the third covering structure 603 is arranged on the fourth surface of at least two isolation columns 300 with insulating filling structures 400, and on the fourth surface and sixth surface without insulating filling structures 400 arranged therebetween, and the fourth covering structure 604 is arranged between at least two isolation columns 300 with no insulating filling structures 400 arranged therebetween.

[0243] In an exemplary embodiment, Figures 10 to 14 As shown, the present disclosure can switch the conductive path between two adjacent isolation pillars by providing an insulating filling structure between at least two adjacent isolation pillars, thereby achieving power cutoff of the hole region along a direction parallel to the substrate.

[0244] Figure 15 A partial cross-sectional view of the display substrate located in the second area Figure 6 , Figure 16 A partial cross-sectional view of the display substrate located in the second area Figure 7 , Figure 17 A partial cross-sectional view of the display substrate located in the second area Figure 8 , Figure 18 A partial cross-sectional view of the display substrate located in the second area Figure 9 In an exemplary embodiment, as Figures 15 to 18 As shown, the isolation column 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, and a second conductive structure 313 stacked sequentially on the substrate 10. An isolation insulating structure 401 is provided on the surface of at least one isolation column 300 away from the substrate 10. The first sidewall of either the first conductive structure 311 or the second conductive structure 313 is groove-shaped, and the second sidewall is sloped. At least a portion of the orthographic projection of the first sidewall of the first conductive structure 311 on the substrate 10 is within the range of the orthographic projection of the first insulating structure 312 on the substrate 10. At least a portion of the orthographic projection of the second conductive structure 313 on the substrate 10 is within the range of the orthographic projection of the first insulating structure 312 on the substrate 10. At least a portion of the orthographic projection of the second conductive structure 313 on the substrate 10 is within the range of the orthographic projection of the first conductive structure 311 on the substrate 10. The isolation insulating structure 401 at least partially covers the surface and second sidewall of the second conductive structure 313 away from the substrate 10.

[0245] In an exemplary embodiment, the first conductive structure 311 is located in one of the film layers of the multiple gate metal layers, and the second conductive structure 313 is located in another film layer of the multiple gate metal layers, or the first conductive structure 311 is located in one of the film layers of the multiple gate metal layers, and the second conductive structure 313 is located in one of the film layers of the multiple source / drain metal layers, the first insulating structure 312 is arranged in at least one inorganic insulating layer between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located, and the isolation insulating structure 401 is arranged in at least one inorganic insulating layer located on the side of the second conductive structure 313 away from the substrate 10. Figures 15 to 18 The description is made by taking an example where the first conductive structure 311 is located in one of the multiple gate metal layers, and the second conductive structure 313 is located in another of the multiple gate metal layers.

[0246] In an exemplary embodiment, adjacent spacer pillars 300 have the same structure, or the structures of adjacent spacer pillars 300 are symmetrically arranged with respect to a line perpendicular to the substrate 10 . Figure 15 The following description is made by taking the adjacent isolation columns 300 having the same structure as an example. Figures 16 to 18The description is made by taking the example that the structures of adjacent spacer columns 300 are symmetrically arranged with respect to a line perpendicular to the substrate 10 .

[0247] In an exemplary embodiment, Figures 16 to 18 As shown,

[0248] In an exemplary embodiment, Figures 16 to 18 As shown, the surface of the first insulating structure 312 away from the substrate 10 includes: a first surface and a second surface, the orthographic projection of the second surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10, the orthographic projection of the first surface on the substrate 10 does not have an overlapping area with the second conductive structure 313, and the first surface is located on the side of the second surface close to the first side wall.

[0249] In an exemplary embodiment, Figures 15 to 18 As shown, the orthographic projection of the second sidewall of the first conductive structure 311 on the substrate 10 does not overlap with the orthographic projection of the first insulating structure 312 on the substrate 10 , and the isolation insulating structure 401 also covers the second sidewall of the first conductive structure 311 and the second sidewall of the first insulating structure 312 .

[0250] like Figure 15 As shown, when the structures of adjacent isolation columns 300 are the same, the display substrate further includes: a first covering structure 601 and a second covering structure 602, the first covering structure 601 covers the surface and the second side wall of the isolation insulating structure 401 away from the substrate 10, and the first covering structure 601 also extends between adjacent isolation columns 300, and the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300.

[0251] like Figures 16 to 18 As shown, when the structures of adjacent isolation columns 300 are symmetrically arranged relative to a straight line perpendicular to the substrate 10, the two adjacent isolation columns 300 are respectively a first adjacent isolation column 300 and a second adjacent isolation column 300, the first sidewall of the isolation column 300 is arranged opposite to the first sidewall of the first adjacent isolation column 300, and the second sidewall of the isolation column 300 is arranged opposite to the second sidewall of the second adjacent isolation column 300, and the covering structure includes: a first covering structure 601, a second covering structure 602 and a third covering structure 603, wherein the first covering structure 601 covers the surface and the second sidewall of the isolation insulating structure 401 arranged on the isolation column 300 away from the substrate 10, the first covering structure 601 arranged on the isolation column 300 and the second adjacent isolation column 300 are connected to each other, the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300, and the third covering structure 603 is arranged between the isolation column 300 and the second adjacent isolation column 300. Figure 16 and Figure 18Shown are a spacer column and a second adjacent spacer column, Figure 17 Shown are a spacer pillar and a first adjacent spacer pillar.

[0252] In an exemplary embodiment, the isolation insulating structure 401 provided in an isolation pillar and the isolation insulating structure 401 provided in a second adjacent isolation pillar may be spaced apart from each other, or may be connected to each other. Figure 16 and Figure 17 The description is made by taking the case where the isolation insulating structure 401 provided on the isolation column and the isolation insulating structure 401 provided on the second adjacent isolation column are spaced apart from each other. Figure 18 The description is made by taking the example that the isolation insulating structure 401 of the isolation column is connected to the isolation insulating structure 401 provided in the second adjacent isolation column.

[0253] Figure 19 A partial cross-sectional view of the display substrate located in the second area Figure 10 , Figure 20 A partial cross-sectional view of the display substrate located in the second area Figure 10 one, Figure 21 A partial cross-sectional view of the display substrate located in the second area Figure 10 two, Figure 22 A partial cross-sectional view of the display substrate located in the second area Figure 10 Third, in an exemplary embodiment, Figures 19 to 22 Provided display substrate and Figures 15 to 18 Compared with the provided display substrate, the difference is that the second side wall of the isolation insulating structure 401 and the second side wall of the first conductive structure 311 are located within the range of the positive projection of the first insulating structure 312 on the substrate 10, the first insulating structure 312 covers the second side wall of the first conductive structure 311, and the isolation insulating structure 401 is partially arranged on the surface of the first insulating structure 312 away from the substrate 10.

[0254] like Figure 19 As shown, when the structures of adjacent isolation columns 300 are the same, the display substrate further includes: a first covering structure 601 and a second covering structure 602, the first covering structure 601 covers the surface and the second side wall of the isolation insulating structure 401 away from the substrate 10 and the second side wall of the first insulating structure 312, and the first covering structure 601 also extends between adjacent isolation columns 300, and the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300.

[0255] like Figures 20 to 22As shown, when the structures of adjacent isolation pillars 300 are symmetrically arranged with respect to a line perpendicular to the substrate 10, the two adjacent isolation pillars 300 are a first adjacent isolation pillar 300 and a second adjacent isolation pillar 300. The first sidewall of each isolation pillar 300 is arranged opposite the first sidewall of the first adjacent isolation pillar 300, and the second sidewall of each isolation pillar 300 is arranged opposite the second sidewall of the second adjacent isolation pillar 300. The covering structure further includes a first covering structure 601, a second covering structure 602, and a third covering structure 603. The first covering structure 601 covers the surface and second sidewall of the isolation insulating structure 401 disposed on the isolation pillar 300 away from the substrate 10, as well as the second sidewall of the first insulating structure 312. The first covering structures 601 disposed on the isolation pillar 300 and the second adjacent isolation pillar 300 are interconnected. The second covering structure 602 is disposed on the first surface of the first insulating structure 312 of the isolation pillar 300. The third covering structure 603 is disposed between the isolation pillar 300 and the second adjacent isolation pillar 300.

[0256] In an exemplary embodiment, the isolation insulating structure 401 provided in the isolation column and the isolation insulating structure 401 provided in the second adjacent isolation column can be spaced apart, and the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be spaced apart, or the isolation insulating structure 401 provided in the isolation column and the isolation insulating structure 401 provided in the second adjacent isolation column can be interconnected, and the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be interconnected. Figure 20 and Figure 21 The isolation insulating structure 401 provided on the isolation column and the isolation insulating structure 401 provided on the second adjacent isolation column can be spaced apart, and the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be spaced apart for explanation. Figure 22 The description is made by taking the example that the isolation insulating structure 401 provided in the isolation column and the isolation insulating structure 401 provided in the second adjacent isolation column can be interconnected, and the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be interconnected.

[0257] Figure 23 A partial cross-sectional view of the display substrate located in the second area Figure 10 Four, Figure 23 Provided display substrate and Figure 15 Compared with the display substrate provided, the difference is that the second conductive structure is located in one of the film layers of the multiple source and drain metal layers.

[0258] Figure 24 A partial cross-sectional view of the display substrate located in the second area Figure 10 five, Figure 24 Provided display substrate and Figure 16Compared with the display substrate provided, the difference is that the second conductive structure is located in one of the film layers of the multiple source and drain metal layers.

[0259] Figure 25 A partial cross-sectional view of the display substrate located in the second area Figure 10 six, Figure 25 Provided display substrate and Figure 17 Compared with the display substrate provided, the difference is that the second conductive structure is located in one of the film layers of the multiple source and drain metal layers.

[0260] Figure 26 A partial cross-sectional view of the display substrate located in the second area Figure 10 seven, Figure 26 Provided display substrate and Figure 18 Compared with the display substrate provided, the difference is that the second conductive structure is located in one of the film layers of the multiple source and drain metal layers.

[0261] Figure 27 A partial cross-sectional view of the display substrate located in the second area Figure 10 eight, Figure 27 Provided display substrate and Figure 19 Compared with the display substrate provided, the difference is that the second conductive structure is located in one of the film layers of the multiple source and drain metal layers.

[0262] Figure 28 A partial cross-sectional view of the display substrate located in the second area Figure 10 Nine, Figure 28 Provided display substrate and Figure 20 Compared with the display substrate provided, the difference is that the second conductive structure is located in one of the film layers of the multiple source and drain metal layers.

[0263] Figure 29 A partial cross-sectional view of the display substrate located in the second area Figure 2 ten, Figure 29 Provided display substrate and Figure 21 Compared with the display substrate provided, the difference is that the second conductive structure is located in one of the film layers of the multiple source and drain metal layers.

[0264] Figure 30 A partial cross-sectional view of the display substrate located in the second area Figure 2 eleven, Figure 30 Provided display substrate and Figure 22 Compared with the display substrate provided, the difference is that the second conductive structure is located in one of the film layers of the multiple source and drain metal layers.

[0265] Figures 15 to 30An isolation insulating structure is provided on the surface of at least one isolation column away from the substrate to cut off the conductive path between adjacent isolation columns.

[0266] Figure 31 A partial cross-sectional view of the display substrate located in the second area Figure 2 twelve, Figure 32 A partial cross-sectional view of the display substrate located in the second area Figure 2 Thirteen, Figure 33 A partial cross-sectional view of the display substrate located in the second area Figure 2 fourteen, Figure 34 A partial cross-sectional view of the display substrate located in the second area Figure 2 15. In an exemplary embodiment, Figures 31 to 34 As shown, the isolation column 300 located in the second region R2 includes a first conductive structure 311 , a first insulating structure 312 , and a second conductive structure 313 sequentially stacked on the substrate 10 .

[0267] In an exemplary embodiment, Figures 31 to 34 As shown, the orthographic projection of at least part of the first side wall of the first conductive structure 311 on the substrate 10 is located within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, the orthographic projection of at least part of the second conductive structure 313 on the substrate 10 is located within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, the orthographic projection of at least part of the second conductive structure 313 on the substrate 10 is located within the range of the orthographic projection of the first conductive structure 311 on the substrate 10, and the first insulating structure 312 covers the second side wall of the first conductive structure 311.

[0268] In an exemplary embodiment, Figures 31 to 34 As shown, the first conductive structure 311 is located in one of the film layers among the multiple gate metal layers, the second conductive structure 313 is set in one of the film layers among the multiple source and drain metal layers, and the first insulating structure 312 is set in at least one inorganic insulating layer between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located.

[0269] In an exemplary embodiment, Figures 31 to 34 As shown, the structures of adjacent isolation pillars 300 are the same, or the structures of adjacent isolation pillars 300 are symmetrically arranged with respect to a straight line perpendicular to the substrate 10 . Figure 31 The following description is made by taking the adjacent isolation columns 300 having the same structure as an example. Figures 32 to 34 The description is made by taking the example that the structures of adjacent spacer columns 300 are symmetrically arranged with respect to a line perpendicular to the substrate 10 .

[0270] In an exemplary embodiment, Figures 31 to 34As shown, in an exemplary embodiment, the surface of the first insulating structure 312 away from the substrate 10 includes: a first surface, a second surface and a third surface, the orthographic projection of the second surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10, the orthographic projections of the first surface and the third surface on the substrate 10 do not have an overlapping area with the second conductive structure 313, the first surface is located on the side of the second surface close to the first side wall, and the third surface is located on the side of the second surface close to the second side wall.

[0271] In an exemplary embodiment, Figure 31 As shown, when the structures of adjacent isolation pillars 300 are the same, the display substrate further includes: a first covering structure 601, a second covering structure 602, and a third covering structure 603 that are spaced apart from each other, wherein the first covering structure 601 is disposed on a surface of the second conductive structure 313 away from the substrate 10, the second covering structure 602 is disposed on a first surface of the first insulating structure 312 of the isolation pillar 300, and the third covering structure 603 is disposed on a second surface of the first insulating structure 312 and covers a second sidewall of the first insulating structure 312. The third covering structure 603 also extends between adjacent isolation pillars 300.

[0272] In an exemplary embodiment, Figures 32 to 34 As shown, when the structures of adjacent isolation columns 300 are symmetrically arranged relative to a straight line perpendicular to the substrate 10, two adjacent isolation columns 300 are a first adjacent isolation column 300 and a second adjacent isolation column 300, and the first side wall of the isolation column 300 is arranged opposite to the first side wall of the first adjacent isolation column 300, and the second side wall of the isolation column 300 is arranged opposite to the second side wall of the second adjacent isolation column 300. The display substrate further includes: a first covering structure 601, a second covering structure 602, a third covering structure 603 and a fourth covering structure 604 arranged at intervals, wherein the first covering structure 601 is arranged on the surface of the second conductive structure 313 away from the substrate 10, the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300, the third covering structure 603 is arranged on the second surface of the first insulating structure 312 of the isolation column 300 and covers the second sidewall of the first insulating structure 312, the third covering structure 603 arranged on the isolation column 300 is connected to the third covering structure 603 arranged on the second adjacent isolation column 300, and the fourth covering structure 604 is arranged between the isolation column 300 and the second adjacent isolation column 300.

[0273] In exemplary embodiments, the first insulating structure of the isolation column and the first insulating structure of a second adjacent isolation column may be spaced apart or may be connected to each other. Figure 32 and Figure 33 The following description is made by taking the example that the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be arranged at intervals. Figure 34 The description is made by taking an example in which the first insulating structure of an isolation column and the first insulating structure of a second adjacent isolation column can be connected to each other.

[0274] Figure 35 A partial cross-sectional view of the display substrate located in the second area Figure 2 sixteen, Figure 36 A partial cross-sectional view of the display substrate located in the second area Figure 2 Seventeen, Figure 37 A partial cross-sectional view of the display substrate located in the second area Figure 2 eighteen, Figure 38 A partial cross-sectional view of the display substrate located in the second area Figure 2 19. In an exemplary embodiment, Figures 35 to 38 As shown, the isolation column 300 includes: a first conductive structure 311, a first insulating structure 312, a second conductive structure 313, a second insulating structure 314 and a third conductive structure 315 stacked in sequence on the substrate 10, and an isolation insulating structure 401 is provided on the side of at least one isolation column 300 away from the substrate 10.

[0275] In an exemplary embodiment, Figures 35 to 38 As shown, the orthographic projection of at least a portion of the first side wall of the first conductive structure 311 on the substrate 10 is located within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, the orthographic projection of at least a portion of the first side wall of the second conductive structure 313 on the substrate 10 is located within the range of the orthographic projection of the second insulating structure 314 on the substrate 10, the orthographic projection of at least a portion of the second conductive structure 313 on the substrate 10 is located within the range of the orthographic projection of the first conductive structure 311 on the substrate 10, the orthographic projection of at least a portion of the third conductive structure 315 on the substrate 10 is located within the range of the orthographic projection of the second conductive structure 313 on the substrate 10, and the isolation insulating structure 401 at least partially covers the surface of the third conductive structure 315 away from the substrate 10 and the second side wall.

[0276] In an exemplary embodiment, Figures 35 to 38 As shown, any film layer of the first conductive structure 311 to the third conductive structure 315 is set in one of the film layers of the multiple gate metal layers, the first insulating structure 312 is set in at least one insulating layer between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located, and the second insulating structure 314 is set in at least one insulating layer between the film layer where the second conductive structure 313 is located and the film layer where the third conductive structure 315 is located.

[0277] In an exemplary embodiment, adjacent spacer pillars 300 have the same structure, or the structures of adjacent spacer pillars 300 are symmetrically arranged with respect to a line along a direction perpendicular to the substrate 10 . Figure 35The description is given by taking the example that the structures of adjacent isolation columns 300 are the same. Figures 36 to 38 The structures of adjacent isolation columns 300 are symmetrically arranged with respect to a straight line perpendicular to the substrate 10 .

[0278] In an exemplary embodiment, Figures 35 to 38 As shown, the surface of the first insulating structure 312 away from the substrate 10 includes: a first surface and a second surface. The orthographic projection of the second surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10, and the orthographic projection of the first surface on the substrate 10 and the second conductive structure 313 do not overlap. The first surface is located on the side of the second surface close to the first sidewall. The surface of the second insulating structure 314 away from the substrate 10 includes: a third surface and a fourth surface. The orthographic projection of the fourth surface on the substrate 10 overlaps with the orthographic projection of the third conductive structure 315 on the substrate 10, and the orthographic projection of the third surface on the substrate 10 and the third conductive structure 315 do not overlap. The third surface is located on the side of the fourth surface close to the first sidewall.

[0279] In an exemplary embodiment, Figures 35 to 38 As shown, the orthographic projection of the second side wall of the first conductive structure 311 on the substrate 10 does not overlap with the orthographic projection of the first insulating structure 312 on the substrate 10, the orthographic projection of the second side wall of the second conductive structure 313 on the substrate 10 does not overlap with the orthographic projection of the second insulating structure 314 on the substrate 10, and the isolation insulating structure 401 also covers the second side wall of the first conductive structure 311, the second side wall of the first insulating structure 312, the second side wall of the second conductive structure 313 and the second side wall of the second insulating structure 314.

[0280] In an exemplary embodiment, Figure 35 As shown, when the structures of adjacent isolation columns 300 are the same, the covering structure includes: a first covering structure 601, a second covering structure 602 and a third covering structure 603, the first covering structure 601 covers the surface and the second side wall of the isolation insulating structure 401 away from the substrate 10, and the first covering structure 601 also extends between adjacent isolation columns 300, the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300, and the third covering structure 603 is arranged on the third surface of the second insulating structure 314 of the isolation column 300.

[0281] In an exemplary embodiment, Figures 36 to 38As shown, when the structures of adjacent isolation columns 300 are symmetrically arranged relative to a straight line perpendicular to the substrate 10, the two adjacent isolation columns 300 are a first adjacent isolation column 300 and a second adjacent isolation column 300, the first sidewall of the isolation column 300 is arranged opposite to the first sidewall of the first adjacent isolation column 300, and the second sidewall of the isolation column 300 is arranged opposite to the second sidewall of the second adjacent isolation column 300, and the covering structure includes: a first covering structure 601, a second covering structure 602, a third covering structure 603 and a fourth covering structure 604, wherein the first covering structure 601 covers the surface and the second sidewall of the isolation insulating structure 401 arranged on the isolation column 300 away from the substrate 10, the first covering structures 601 arranged on the isolation column 300 and the second adjacent isolation column 300 are connected to each other, the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300, the third covering structure 603 is arranged on the second surface of the second insulating structure 314 of the isolation column 300, and the fourth covering structure 604 is arranged between the isolation column 300 and the second adjacent isolation column 300.

[0282] In exemplary embodiments, the first insulating structure of the isolation column and the first insulating structure of a second adjacent isolation column may be spaced apart or may be connected to each other. Figure 36 and Figure 37 The following description is made by taking the example that the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be arranged at intervals. Figure 38 The description is made by taking an example in which the first insulating structure of an isolation column and the first insulating structure of a second adjacent isolation column can be connected to each other.

[0283] Figure 39 A partial cross-sectional view of the display substrate located in the second area Figure 3 ten, Figure 40 A partial cross-sectional view of the display substrate located in the second area Figure 3 eleven, Figure 41 A partial cross-sectional view of the display substrate located in the second area Figure 3 twelve, Figure 42 A partial cross-sectional view of the display substrate located in the second area Figure 3 13. In an exemplary embodiment, Figures 39 to 42 Provided display substrate and Figures 35 to 38The difference of the provided display substrate is that the orthographic projections of the second side wall of the isolation insulating structure 401, the second side wall of the first conductive structure 311, and the second side wall of the second conductive structure 313 on the substrate 10 are located within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, the first insulating structure 312 covers the second side wall of the first conductive structure 311, the second insulating structure 314 covers the second side wall of the second conductive structure 313, and the isolation insulating structure 401 is partially arranged on the surface of the second insulating structure 314 away from the substrate 10.

[0284] In an exemplary embodiment, Figure 39 As shown, when the structures of adjacent isolation columns 300 are the same, the covering structure includes: a first covering structure 601, a second covering structure 602 and a third covering structure 603, the first covering structure 601 covers the surface and the second side wall of the isolation insulating structure 401 away from the substrate 10, the second side wall of the first insulating structure 312 and the second side wall of the second insulating structure 314, and the first covering structure 601 also extends between adjacent isolation columns 300, the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300, and the third covering structure 603 is arranged on the third surface of the second insulating structure 314 of the isolation column 300.

[0285] In an exemplary embodiment, Figures 40 to 42 As shown, when the structures of adjacent isolation columns 300 are symmetrically arranged relative to a straight line perpendicular to the substrate 10, the two adjacent isolation columns 300 are a first adjacent isolation column 300 and a second adjacent isolation column 300, the first side wall of the isolation column 300 is arranged opposite to the first side wall of the first adjacent isolation column 300, and the second side wall of the isolation column 300 is arranged opposite to the second side wall of the second adjacent isolation column 300, and the covering structure includes: a first covering structure 601, a second covering structure 602, a third covering structure 603 and a fourth covering structure 604, wherein the first covering structure 601 covers the The covering isolation insulating structure 401 arranged on the isolation column 300 is away from the surface and the second side wall of the substrate 10, the second side wall of the first insulating structure 312 and the second side wall of the second insulating structure 314, the first covering structure 601 arranged on the isolation column 300 and the second adjacent isolation column 300 are connected to each other, the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300, the third covering structure 603 is arranged on the third surface of the second insulating structure 314 of the isolation column 300, and the fourth covering structure 604 is arranged between the isolation column 300 and the second adjacent isolation column 300.

[0286] In an exemplary embodiment, the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be arranged at intervals, the second insulating structure of the isolation column and the second insulating structure of the second adjacent isolation column can be arranged at intervals, the isolation insulating structure arranged on the isolation column and the isolation insulating structure arranged on the second adjacent isolation column can be arranged at intervals, or the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be interconnected, the second insulating structure of the isolation column and the second insulating structure of the second adjacent isolation column can be interconnected, and the isolation insulating structure arranged on the isolation column and the isolation insulating structure arranged on the second adjacent isolation column can be interconnected. Figure 40 and Figure 41 The first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be arranged at intervals, the second insulating structure of the isolation column and the second insulating structure of the second adjacent isolation column can be arranged at intervals, and the isolation insulating structure arranged on the isolation column and the isolation insulating structure arranged on the second adjacent isolation column can be arranged at intervals. Figure 42 The illustration is based on the example that the first insulating structure of the isolation column and the first insulating structure of the second adjacent isolation column can be interconnected, the second insulating structure of the isolation column and the second insulating structure of the second adjacent isolation column can be interconnected, and the isolation insulating structure arranged on the isolation column and the isolation insulating structure arranged on the second adjacent isolation column can be interconnected.

[0287] Figure 43 A partial cross-sectional view of the display substrate located in the second area Figure 3 fourteen, Figure 44 A partial cross-sectional view of the display substrate located in the second area Figure 3 fifteen, Figure 45 A partial cross-sectional view of the display substrate located in the second area Figure 3 sixteen, Figure 46 A partial cross-sectional view of the display substrate located in the second area Figure 3 17. In an exemplary embodiment, Figures 43 to 46 As shown, the isolation column 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, a second conductive structure 313, a second insulating structure 314 and a third conductive structure 315 stacked in sequence on the substrate 10, and an isolation insulating structure 401 is also provided on the surface of at least one isolation column 300 away from the substrate 10.

[0288] In an exemplary embodiment, Figures 43 to 46As shown, the orthographic projections of the first conductive structure 311 and the second conductive structure 313 on the substrate 10 are located within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, the orthographic projection of the second conductive structure 313 on the substrate 10 is located within the range of the orthographic projection of the first conductive structure 311 on the substrate 10, and the orthographic projection of the third conductive structure 315 on the substrate 10 is located within the range of the orthographic projection of the second conductive structure 313 on the substrate 10; the second insulating structure 314 covers the portion of the surface and the second sidewall of the second conductive structure 313 away from the substrate 10, as well as the second sidewalls of the first conductive structure 311 and the first insulating structure 312; a portion of the third conductive structure 315 is connected to the portion of the surface of the second conductive structure 313 away from the substrate 10; the third conductive structure 315 is step-shaped; and the isolation insulating structure 401 covers the second sidewall of the third conductive structure 315 and the second sidewall of the isolation insulating structure 401.

[0289] In an exemplary embodiment, Figures 43 to 46 As shown, the first conductive structure 311 is located in one of the film layers among the multiple gate metal layers, the second conductive structure 313 is located in another film layer among the multiple gate metal layers, the third conductive structure 315 is located in a source-drain metal layer close to the substrate 10 among the multiple source-drain metal layers, the first insulating structure 312 is arranged in at least one inorganic insulating layer between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located, the second insulating structure 314 is arranged in at least one inorganic insulating layer between the second conductive structure 313 and the third conductive structure 315, and the isolation insulating structure 401 is arranged in at least one inorganic insulating layer among the multiple source-drain metal layers.

[0290] In an exemplary embodiment, adjacent spacer pillars 300 have the same structure, or adjacent spacer pillars 300 are symmetrically arranged with respect to a line perpendicular to the substrate 10 . Figure 43 The following description is made taking the adjacent isolation columns 300 having the same structure as an example. Figures 44 to 46 The description is made by taking the example that the adjacent spacer columns 300 are symmetrically arranged with respect to a line perpendicular to the substrate 10 .

[0291] In an exemplary embodiment, Figures 43 to 46 As shown, the surface of the first insulating structure 312 away from the substrate 10 includes: a first surface and a second surface, the orthographic projection of the second surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10, the orthographic projection of the first surface on the substrate 10 does not have an overlapping area with the second conductive structure 313, and the first surface is located on the side of the second surface close to the first side wall.

[0292] In an exemplary embodiment, Figures 43 to 46As shown, the orthographic projection of the second sidewall of the first conductive structure 311 on the substrate 10 does not overlap with the orthographic projection of the first insulating structure 312 on the substrate 10 .

[0293] In an exemplary embodiment, Figure 43 As shown, when the structures of adjacent isolation columns 300 are the same, the covering structure includes: a first covering structure 601 and a second covering structure 602, the first covering structure 601 covers the surface and the second side wall of the isolation insulating structure 401 away from the substrate 10, and the first covering structure 601 also extends between adjacent isolation columns 300, and the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300.

[0294] In an exemplary embodiment, Figures 44 to 46 As shown, when the structures of adjacent isolation columns 300 are symmetrically arranged relative to a straight line perpendicular to the substrate 10, the two adjacent isolation columns 300 are a first adjacent isolation column 300 and a second adjacent isolation column 300, the first side wall of the isolation column 300 is arranged opposite to the first side wall of the first adjacent isolation column 300, and the second side wall of the isolation column 300 is arranged opposite to the second side wall of the second adjacent isolation column 300, and the covering structure includes: a first covering structure 601, a second covering structure 602 and a third covering structure 603, wherein the first covering structure 601 covers the surface and the second side wall of the isolation insulating structure 401 arranged on the isolation column 300 away from the substrate 10, the first covering structure 601 arranged on the isolation column 300 and the second adjacent isolation column 300 are connected to each other, the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300, and the third covering structure 603 is arranged between the isolation column 300 and the second adjacent isolation column 300.

[0295] In an exemplary embodiment, the second insulating structure of the isolation column is spaced apart from the second insulating structure of the second adjacent isolation column, and the isolation insulating structure provided on the isolation column is spaced apart from the isolation insulating structure provided on the second adjacent isolation column, or the second insulating structure of the isolation column is interconnected with the second insulating structure of the second adjacent isolation column, and the isolation insulating structure provided on the isolation column is interconnected with the isolation insulating structure provided on the second adjacent isolation column.

[0296] Figure 47 A partial cross-sectional view of the display substrate located in the second area Figure 3 eighteen, Figure 48 A partial cross-sectional view of the display substrate located in the second area Figure 3 nineteen, Figure 49 A partial cross-sectional view of the display substrate located in the second area Figure 4 ten, Figure 50 A partial cross-sectional view of the display substrate located in the second area Figure 4 11. In an exemplary embodiment, Figures 47 to 50 As shown, the isolation column 300 includes: a first conductive structure 311, a first insulating structure 312, a second conductive structure 313 and a third conductive structure 315 stacked in sequence on the substrate 10, and an isolation insulating structure 401 is provided on the surface of at least one isolation column 300 away from the substrate 10. The first side wall of at least one conductive structure among the first conductive structure 311 and the second conductive structure 313 is groove-shaped, and the second side wall is sloped. The first side wall of the third conductive structure 315 is groove-shaped, and the second side wall is sloped.

[0297] In an exemplary embodiment, Figures 47 to 50 As shown, the orthographic projection of at least a portion of the first side wall of the first conductive structure 311 on the substrate 10 is located within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, the orthographic projection of at least a portion of the first side wall of the second conductive structure 313 on the substrate 10 is located within the range of the orthographic projection of the second insulating structure 314 on the substrate 10, the orthographic projection of at least a portion of the second conductive structure 313 on the substrate 10 is located within the range of the orthographic projection of the first conductive structure 311 on the substrate 10, the orthographic projection of at least a portion of the third conductive structure 315 on the substrate 10 is located within the range of the orthographic projection of the second conductive structure 313 on the substrate 10, and the isolation insulating structure 401 at least partially covers the surface of the third conductive structure 315 away from the substrate 10 and the second side wall.

[0298] In an exemplary embodiment, Figures 47 to 50 As shown, the first conductive structure 311 is arranged in one of the film layers among the multiple gate metal layers, the second conductive structure 313 is arranged in another film layer among the multiple gate metal layers, the third conductive structure 315 is arranged in one of the film layers among the multiple source and drain metal layers, the first insulating structure 312 is arranged in at least one insulating layer between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located, the second insulating structure 314 is arranged in at least one insulating layer between the film layer where the second conductive structure 313 is located and the film layer where the third conductive structure 315 is located, and the isolation insulating layer is arranged in at least one inorganic insulating layer between the multiple source and drain metal layers.

[0299] In an exemplary embodiment, adjacent spacer pillars 300 have the same structure, or the structures of adjacent spacer pillars 300 are symmetrically arranged with respect to a line along a direction perpendicular to the substrate 10 . Figure 47 The following description is made by taking the adjacent isolation columns 300 having the same structure as an example. Figures 48 to 50 The description is made by taking the example that the structures of adjacent spacer columns 300 are symmetrically arranged with respect to a line perpendicular to the substrate 10 .

[0300] In an exemplary embodiment, Figures 47 to 50As shown, the surface of the first insulating structure 312 away from the substrate 10 includes: a first surface and a second surface, the orthographic projection of the second surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10, the orthographic projection of the first surface on the substrate 10 does not have an overlapping area with the second conductive structure 313, and the first surface is located on the side of the second surface close to the first side wall.

[0301] In an exemplary embodiment, Figures 47 to 50 As shown, the orthographic projection of the second side wall of the first conductive structure 311 on the substrate 10 does not overlap with the orthographic projection of the first insulating structure 312 on the substrate 10, and the isolation insulating structure 401 also covers the second side wall of the first conductive structure 311, the second side wall of the first insulating structure 312, and the second side wall of the second conductive structure 313.

[0302] In an exemplary embodiment, Figure 47 As shown, when the structures of adjacent isolation columns 300 are the same, the covering structure includes: a first covering structure 601 and a second covering structure 602, the first covering structure 601 covers the surface and the second side wall of the isolation insulating structure 401 away from the substrate 10, and the first covering structure 601 also extends between adjacent isolation columns 300, and the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300.

[0303] In an exemplary embodiment, Figures 48 to 50 As shown, when the structures of adjacent isolation columns 300 are symmetrically arranged relative to a straight line perpendicular to the substrate 10, the two adjacent isolation columns 300 are a first adjacent isolation column 300 and a second adjacent isolation column 300, the first side wall of the isolation column 300 is arranged opposite to the first side wall of the first adjacent isolation column 300, and the second side wall of the isolation column 300 is arranged opposite to the second side wall of the second adjacent isolation column 300, and the covering structure includes: a first covering structure 601, a second covering structure 602 and a third covering structure 603, wherein the first covering structure 601 covers the surface and the second side wall of the isolation insulating structure 401 arranged on the isolation column 300 away from the substrate 10, the first covering structure 601 arranged on the isolation column 300 and the second adjacent isolation column 300 are connected to each other, the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300, and the third covering structure 603 is arranged between the isolation column 300 and the second adjacent isolation column 300.

[0304] In an exemplary embodiment, the isolation insulating structure disposed on an isolation pillar and the isolation insulating structure disposed on a second adjacent isolation pillar are spaced apart from each other or are in communication with each other. Figure 48 and Figure 49The description is made by taking the example that the isolation insulating structure provided on the isolation column and the isolation insulating structure provided on the second adjacent isolation column are spaced apart from each other. Figure 50 The description is made by taking an example where the isolation insulating structure provided on an isolation column is connected to the isolation insulating structure provided on a second adjacent isolation column.

[0305] Figure 51 A partial cross-sectional view of the display substrate located in the second area Figure 4 twelve, Figure 52 A partial cross-sectional view of the display substrate located in the second area Figure 4 Thirteen, Figure 53 A partial cross-sectional view of the display substrate located in the second area Figure 4 fourteen, Figure 54 A partial cross-sectional view of the display substrate located in the second area Figure 4 15. In an exemplary embodiment, Figures 51 to 54 Provided display substrate and Figures 47 to 50 The difference of the provided display substrate is that the orthographic projections of the second side wall of the isolation insulating structure 401, the second side wall of the first conductive structure 311, and the second side wall of the second conductive structure 313 on the substrate 10 are located within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, the first insulating structure 312 covers the second side wall of the first conductive structure 311, and the isolation insulating structure 401 is partially arranged on the surface of the first insulating structure 312 away from the substrate 10.

[0306] like Figure 51 As shown, when the structures of adjacent isolation columns 300 are the same, the display substrate further includes: a first covering structure 601 and a second covering structure 602, the first covering structure 601 covers the surface and the second side wall of the isolation insulating structure 401 away from the substrate 10, and the first covering structure 601 also extends between adjacent isolation columns 300, and the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300.

[0307] like Figures 52 to 54As shown, when the structures of adjacent isolation columns 300 are symmetrically arranged relative to a straight line perpendicular to the substrate 10, the two adjacent isolation columns 300 are a first adjacent isolation column 300 and a second adjacent isolation column 300, the first side wall of the isolation column 300 is arranged opposite to the first side wall of the first adjacent isolation column 300, and the second side wall of the isolation column 300 is arranged opposite to the second side wall of the second adjacent isolation column 300, and the covering structure includes: a first covering structure 601, a second covering structure 602 and a third covering structure 603, wherein the first covering structure 601 covers the surface and the second side wall of the isolation insulating structure 401 arranged on the isolation column 300 away from the substrate 10, the first covering structure 601 arranged on the isolation column 300 and the second adjacent isolation column 300 are connected to each other, the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300, and the third covering structure 603 is arranged between the isolation column 300 and the second adjacent isolation column 300.

[0308] In an exemplary embodiment, the first insulating structure of the isolation column is spaced apart from the first adjacent structure of the second adjacent isolation column, and the isolation insulating structure provided on the isolation column is spaced apart from the isolation insulating structure provided on the second adjacent isolation column, or the first insulating structure of the isolation column is interconnected with the first adjacent structure of the second adjacent isolation column, and the isolation insulating structure provided on the isolation column is interconnected with the isolation insulating structure provided on the second adjacent isolation column. Figure 52 and Figure 53 The following is an example in which the first insulating structure of the isolation column is spaced apart from the first adjacent structure of the second adjacent isolation column, and the isolation insulating structure provided on the isolation column is spaced apart from the isolation insulating structure provided on the second adjacent isolation column. Figure 54 The description is made by taking as an example that the first insulating structure of the isolation column is interconnected with the first adjacent structure of the second adjacent isolation column, and the isolation insulating structure provided on the isolation column is interconnected with the isolation insulating structure provided on the second adjacent isolation column.

[0309] Figure 55 A partial cross-sectional view of the display substrate located in the second area Figure 4 sixteen, Figure 56 A partial cross-sectional view of the display substrate located in the second area Figure 4 Seventeen, Figure 57 A partial cross-sectional view of the display substrate located in the second area Figure 4 eighteen, Figure 58 A partial cross-sectional view of the display substrate located in the second area Figure 4 19. In an exemplary embodiment, Figures 55 to 58As shown, the isolation column 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, a second conductive structure 313, a second insulating structure 314, a third conductive structure 315, a third insulating structure 316 and a fourth conductive structure 317 stacked in sequence on the substrate 10, and an isolation insulating structure 401 is provided on the surface of at least one isolation column 300 away from the substrate 10. The first sidewall of at least one conductive structure among the first conductive structure 311, the second conductive structure 313 and the third conductive structure 315 is groove-shaped, and the second sidewall is sloped. The first sidewall of the fourth conductive structure 317 is groove-shaped, and the second sidewall of the fourth conductive structure 317 is sloped.

[0310] In an exemplary embodiment, Figures 55 to 58 As shown, the orthographic projections of the first conductive structure 311 and the second conductive structure 313 on the substrate 10 are located within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, the orthographic projections of the second conductive structure 313 and the third conductive structure 315 on the substrate 10 are located within the range of the orthographic projection of the second insulating structure 314 on the substrate 10, the orthographic projection of the second conductive structure 313 on the substrate 10 is located within the range of the orthographic projection of the first conductive structure 311 on the substrate 10, and the orthographic projection of the third conductive structure 315 on the substrate 10 is located within the range of the orthographic projection of the second conductive structure 313 on the substrate 10. Within the range of the orthographic projection on the substrate 10, the orthographic projection of the fourth conductive structure 317 on the substrate 10 is located within the range of the orthographic projection of the third conductive structure 315 on the substrate 10. The third insulating structure 316 covers the portion of the surface and the second sidewall of the third conductive structure 315 away from the substrate 10. A portion of the fourth conductive structure 317 is connected to the portion of the surface of the third conductive structure 315 away from the substrate 10. The fourth conductive structure 317 is step-shaped. The isolation insulating structure 401 covers the second sidewall of the fourth conductive structure 317 and the second sidewall of the isolation insulating structure 401.

[0311] In an exemplary embodiment, Figures 55 to 58 As shown, any structure among the first conductive structure 311 to the third conductive structure 315 is set in one of the film layers among the multiple gate metal layers, the first insulating structure 312 is set in at least one inorganic insulating layer between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located, the second insulating structure 314 is set in at least one inorganic insulating layer between the second conductive structure 313 and the third conductive structure 315, the third insulating structure 316 is set in at least one inorganic insulating layer between the third conductive structure 315 and the fourth conductive structure 317, and the isolation insulating structure 401 is set in at least one inorganic insulating layer among the multiple source and drain metal layers.

[0312] In an exemplary embodiment, adjacent spacer pillars 300 have the same structure, or adjacent spacer pillars 300 are symmetrically arranged with respect to a line perpendicular to the substrate 10 . Figure 55 The following description is made taking the adjacent isolation columns 300 having the same structure as an example. Figures 56 to 58 The description is made by taking the example that the adjacent spacer columns 300 are symmetrically arranged with respect to a line perpendicular to the substrate 10 .

[0313] In an exemplary embodiment, Figures 55 to 58 As shown, the surface of the first insulating structure 312 away from the substrate 10 includes: a first surface and a second surface, the orthographic projection of the second surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10, the orthographic projection of the first surface on the substrate 10 does not have an overlapping area with the second conductive structure 313, and the first surface is located on the side of the second surface close to the first side wall.

[0314] In an exemplary embodiment, Figures 55 to 58 As shown, the surface of the second insulating structure 314 away from the substrate 10 includes: a third surface and a fourth surface, the orthographic projection of the fourth surface on the substrate 10 overlaps with the orthographic projection of the third conductive structure 315 on the substrate 10, the orthographic projection of the third surface on the substrate 10 does not have an overlapping area with the third conductive structure 315, and the third surface is located on the side of the fourth surface close to the first side wall.

[0315] In an exemplary embodiment, Figures 55 to 58 As shown, the orthographic projection of the second side wall of the first conductive structure 311 on the substrate 10 does not overlap with the orthographic projection of the first insulating structure 312 on the substrate 10 , and the orthographic projection of the second side wall of the second conductive structure 313 on the substrate 10 does not overlap with the orthographic projection of the second insulating structure 314 on the substrate 10 .

[0316] In an exemplary embodiment, Figure 55 As shown, when the structures of adjacent isolation columns 300 are the same, the covering structure includes: a first covering structure 601, a second covering structure 602 and a third covering structure 603, the first covering structure 601 covers the surface and the second side wall of the isolation insulating structure 401 away from the substrate 10, and the first covering structure 601 also extends between adjacent isolation columns 300, the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300, and the third covering structure 603 is arranged on the third surface of the second insulating structure 314 of the isolation column 300.

[0317] In an exemplary embodiment, Figures 56 to 58As shown, when the structures of adjacent isolation columns 300 are symmetrically arranged relative to a straight line perpendicular to the substrate 10, the two adjacent isolation columns 300 are a first adjacent isolation column 300 and a second adjacent isolation column 300, the first sidewall of the isolation column 300 is arranged opposite to the first sidewall of the first adjacent isolation column 300, and the second sidewall of the isolation column 300 is arranged opposite to the second sidewall of the second adjacent isolation column 300, and the covering structure includes: a first covering structure 601, a second covering structure 602, a third covering structure 603 and a fourth covering structure 604 , wherein the first covering structure 601 covers the surface and the second side wall of the isolation insulating structure 401 set on the isolation column 300 away from the substrate 10, the first covering structures 601 set on the isolation column 300 and the second adjacent isolation column 300 are connected to each other, the second covering structure 602 is set on the first surface of the first insulating structure 312 of the isolation column 300, the third covering structure 603 is set on the third surface of the second insulating structure 314 of the isolation column 300, and the fourth covering structure 604 is set between the isolation column 300 and the second adjacent isolation column 300.

[0318] In an exemplary embodiment, the third insulating structure of the isolation column is spaced apart from the third insulating structure of the second adjacent insulating structure, and the isolation insulating structure provided on the isolation column is spaced apart from the third insulating structure provided on the second adjacent insulating structure, or the third insulating structure of the isolation column is interconnected with the third insulating structure of the second adjacent insulating structure, and the isolation insulating structure provided on the isolation column is interconnected with the third insulating structure provided on the second adjacent insulating structure. Figure 56 and Figure 57 The third insulating structure of the isolation column is spaced apart from the third insulating structure of the second adjacent insulating structure, and the isolation insulating structure arranged on the isolation column is spaced apart from the third insulating structure arranged on the second adjacent insulating structure. Figure 58 The description is made by taking the example that the third insulating structure of the isolation column is interconnected with the third insulating structure of the second adjacent insulating structure, and the isolation insulating structure arranged on the isolation column is interconnected with the third insulating structure arranged on the second adjacent insulating structure.

[0319] Figure 59 A partial cross-sectional view of the display substrate located in the second area Figure 5 ten, Figure 60 A partial cross-sectional view of the display substrate located in the second area Figure 5 eleven, Figure 61 A partial cross-sectional view of the display substrate located in the second area Figure 5 twelve, Figure 62 A partial cross-sectional view of the display substrate located in the second area Figure 5 13. In an exemplary embodiment, Figures 59 to 62As shown, the isolation column 300 located in the second region R2 includes: a first conductive structure 311, a first insulating structure 312, a second conductive structure 313, a second insulating structure 314, a third conductive structure 315 and a fourth conductive structure 317 stacked in sequence on the substrate 10, and an isolation insulating structure 401 is provided on the surface of at least one isolation column 300 away from the substrate 10. The first side wall of at least one conductive structure among the first conductive structure 311 to the third conductive structure 315 is groove-shaped, and the second side wall is sloped. The first side wall of the fourth conductive structure 317 is groove-shaped, and the second side wall is sloped.

[0320] In an exemplary embodiment, Figures 59 to 62 As shown, the orthographic projection of at least a portion of the first sidewall of the first conductive structure 311 on the substrate 10 is located within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, the orthographic projection of at least a portion of the first sidewall of the second conductive structure 313 on the substrate 10 is located within the range of the orthographic projection of the second insulating structure 314 on the substrate 10, the orthographic projection of the second conductive structure 313 on the substrate 10 is located within the range of the orthographic projection of the first conductive structure 311 on the substrate 10, the orthographic projection of the third conductive structure 315 on the substrate 10 is located within the range of the orthographic projection of the second conductive structure 313 on the substrate 10, the orthographic projection of the fourth conductive structure 317 on the substrate 10 is located within the range of the orthographic projection of the third conductive structure 315 on the substrate 10, and the isolation insulating structure 401 at least partially covers the surface of the fourth conductive structure 317 away from the substrate 10 and the second sidewall.

[0321] In an exemplary embodiment, Figures 59 to 62 As shown, any structure among the first conductive structure 311 to the third conductive structure 315 is set in one of the film layers among the multiple gate metal layers, the fourth conductive structure 317 is located in one of the film layers among the multiple source and drain metal layers, the first insulating structure 312 is set in at least one insulating layer between the film layer where the first conductive structure 311 is located and the film layer where the second conductive structure 313 is located, the second insulating structure 314 is set in at least one insulating layer between the film layer where the second conductive structure 313 is located and the film layer where the third conductive structure 315 is located, and the isolation insulating layer is located in at least one inorganic insulating layer between the multiple source and drain metal layers.

[0322] In an exemplary embodiment, adjacent spacer pillars 300 have the same structure, or the structures of adjacent spacer pillars 300 are symmetrically arranged with respect to a line along a direction perpendicular to the substrate 10 . Figure 59 The following description is made by taking the adjacent isolation columns 300 having the same structure as an example. Figures 60 to 62 The description is made by taking the example that the structures of adjacent spacer columns 300 are symmetrically arranged with respect to a line perpendicular to the substrate 10 .

[0323] In an exemplary embodiment, Figures 59 to 62 As shown, the surface of the first insulating structure 312 away from the substrate 10 includes: a first surface and a second surface, the orthographic projection of the second surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10, the orthographic projection of the first surface on the substrate 10 and the second conductive structure 313 do not have an overlapping area, and the first surface is located on the side of the second surface close to the first side wall; the surface of the second insulating structure 314 away from the substrate 10 includes: a third surface and a fourth surface, the orthographic projection of the fourth surface on the substrate 10 overlaps with the orthographic projection of the second conductive structure 313 on the substrate 10, the orthographic projection of the third surface on the substrate 10 and the second conductive structure 313 do not have an overlapping area, and the third surface is located on the side of the fourth surface close to the first side wall.

[0324] In an exemplary embodiment, Figures 59 to 62 As shown, the orthographic projection of the second side wall of the first conductive structure 311 on the substrate 10 does not overlap with the orthographic projection of the first insulating structure 312 on the substrate 10, the orthographic projection of the second partition wall of the second conductive structure 313 on the substrate 10 does not overlap with the orthographic projection of the second insulating structure 314 on the substrate 10, and the isolation insulating structure 401 also covers the second side wall of the first conductive structure 311, the second side wall of the first insulating structure 312, the second side wall of the second conductive structure 313, the second side wall of the second insulating structure 314 and the second side wall of the third conductive structure 315.

[0325] In an exemplary embodiment, Figure 59 As shown, when the structures of adjacent isolation columns 300 are the same, the covering structure includes: a first covering structure 601, a second covering structure 602 and a third covering structure 603, the first covering structure 601 covers the surface and the second side wall of the isolation insulating structure 401 away from the substrate 10, and the first covering structure 601 also extends between adjacent isolation columns 300, the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300, and the third covering structure 603 is arranged on the second surface of the second insulating structure 314 of the isolation column 300.

[0326] In an exemplary embodiment, Figures 60 to 62As shown, when the structures of adjacent isolation columns 300 are symmetrically arranged relative to a straight line perpendicular to the substrate 10, the two adjacent isolation columns 300 are a first adjacent isolation column 300 and a second adjacent isolation column 300, the first sidewall of the isolation column 300 is arranged opposite to the first sidewall of the first adjacent isolation column 300, and the second sidewall of the isolation column 300 is arranged opposite to the second sidewall of the second adjacent isolation column 300, and the covering structure includes: a first covering structure 601, a second covering structure 602, a third covering structure 603 and a fourth covering structure 604 , wherein the first covering structure 601 covers the surface and the second side wall of the isolation insulating structure 401 set on the isolation column 300 away from the substrate 10, the first covering structures 601 set on the isolation column 300 and the second adjacent isolation column 300 are connected to each other, the second covering structure 602 is set on the first surface of the first insulating structure 312 of the isolation column 300, the third covering structure 603 is set on the third surface of the second insulating structure 314 of the isolation column 300, and the fourth covering structure 604 is set between the isolation column 300 and the second adjacent isolation column 300.

[0327] In an exemplary embodiment, the isolation insulating structure disposed on an isolation pillar and the isolation insulating structure disposed on a second adjacent isolation pillar are spaced apart from each other or are in communication with each other. Figure 60 and Figure 61 The description is made by taking the example of the isolation insulating structure provided on the isolation column and the isolation insulating structure provided on the second adjacent isolation column as an example. Figure 62 The description is made by taking the example that the isolation insulating structure provided on the isolation column is connected to the isolation insulating structure provided on the second adjacent isolation column.

[0328] Figure 63 A partial cross-sectional view of the display substrate located in the second area Figure 5 fourteen, Figure 64 A partial cross-sectional view of the display substrate located in the second area Figure 5 fifteen, Figure 65 A partial cross-sectional view of the display substrate located in the second area Figure 5 sixteen, Figure 66 A partial cross-sectional view of the display substrate located in the second area Figure 5 17. In an exemplary embodiment, Figures 63 to 66 Provided display substrate and Figures 59 to 62 The display substrate provided is different in that Figures 63 to 66In the provided display substrate, the orthographic projections of the second side wall of the isolation insulating structure 401, the second side wall of the first conductive structure 311, the second side wall of the second conductive structure 313, the second side wall of the third conductive structure 315, and the second side wall of the fourth conductive structure 317 on the substrate 10 are located within the range of the orthographic projection of the first insulating structure 312 on the substrate 10, the first insulating structure 312 covers the second side wall of the first conductive structure 311, the second insulating structure 314 covers the second side wall of the second conductive structure 313, and the isolation insulating structure 401 is partially arranged on the surface of the second insulating structure 314 away from the substrate 10.

[0329] like Figure 63 As shown, when the structures of adjacent isolation columns 300 are the same, the covering structure includes: a first covering structure 601, a second covering structure 602 and a third covering structure 603, the first covering structure 601 covers the surface and the second side wall of the isolation insulating structure 401 away from the substrate 10, the second side wall of the second insulating structure 314 and the second side wall of the first insulating structure 312, and the first covering structure 601 also extends between adjacent isolation columns 300, the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300, and the third covering structure 603 is arranged on the third surface of the second insulating structure 314 of the isolation column 300.

[0330] like Figures 64 to 66 As shown, when the structures of adjacent isolation columns 300 are symmetrically arranged relative to a straight line perpendicular to the substrate 10, the two adjacent isolation columns 300 are a first adjacent isolation column 300 and a second adjacent isolation column 300, the first side wall of the isolation column 300 is arranged opposite to the first side wall of the first adjacent isolation column 300, and the second side wall of the isolation column 300 is arranged opposite to the second side wall of the second adjacent isolation column 300, and the display substrate further includes: a first covering structure 601, a second covering structure 602, a third covering structure 603 and a fourth covering structure 604, wherein the first covering structure 601 covers The isolation insulating structure 401 covered on the isolation column 300 is away from the surface and the second side wall of the substrate 10, the second side wall of the second insulating structure 314 and the second side wall of the first insulating structure 312, the first covering structure 601 arranged on the isolation column 300 and the second adjacent isolation column 300 are connected to each other, the second covering structure 602 is arranged on the first surface of the first insulating structure 312 of the isolation column 300, the third covering structure 603 is arranged on the third surface of the second insulating structure 314 of the isolation column 300, and the fourth covering structure 604 is arranged between the isolation column 300 and the second adjacent isolation column 300.

[0331] In an exemplary embodiment, the first insulating structure 312 of the isolation column is spaced apart from the first insulating structure 312 of the second adjacent isolation column, the second insulating structure 314 of the isolation column 300 is spaced apart from the second insulating structure 314 of the second adjacent isolation column 300, and the isolation insulating structure 401 provided on the isolation column 300 is spaced apart from the isolation insulating structure 401 provided on the second adjacent isolation column 300; alternatively, the first insulating structure 312 of the isolation column is interconnected with the first insulating structure 312 of the second adjacent isolation column, the second insulating structure 314 of the isolation column 300 is interconnected with the second insulating structure 314 of the second adjacent isolation column 300, and the isolation insulating structure 401 provided on the isolation column 300 is interconnected with the isolation insulating structure 401 provided on the second adjacent isolation column 300. Figure 64 and Figure 65 The following example illustrates that the first insulating structure 312 of the isolation column is spaced apart from the first insulating structure 312 of the second adjacent isolation column, the second insulating structure 314 of the isolation column 300 is spaced apart from the second insulating structure 314 of the second adjacent isolation column 300, and the isolation insulating structure 401 provided on the isolation column 300 is spaced apart from the isolation insulating structure 401 provided on the second adjacent isolation column 300. Figure 66 The description is made by taking the example that the first insulating structure 312 of the isolation column is interconnected with the first insulating structure 312 of the second adjacent isolation column, the second insulating structure 314 of the isolation column 300 is interconnected with the second insulating structure 314 of the second adjacent isolation column 300, and the isolation insulating structure 401 arranged on the isolation column 300 is interconnected with the isolation insulating structure 401 arranged on the second adjacent isolation column 300.

[0332] In an exemplary embodiment, an angle between the surface of the insulating filling structure 400 disposed on the surface of the isolation column 300 away from the substrate 10 and the surface of the isolation column 300 away from the substrate 10 is in a range of 30 to 60 degrees.

[0333] In an exemplary embodiment, at least one insulating structure is arranged in at least one inorganic insulating layer. When at least one insulating structure is arranged in one inorganic insulating layer, the insulating structure is a single-layer structure. When at least one insulating structure is arranged in L inorganic insulating layers, the insulating structure includes: L sub-insulating structures stacked on a substrate, and the lth sub-insulating structure is arranged in the lth inorganic insulating layer where the at least one insulating structure is arranged.

[0334] The following is an illustrative explanation using the preparation process of a display substrate. The "patterning process" mentioned in the present disclosure includes processes such as coating photoresist, mask exposure, development, etching, and stripping photoresist for metal materials, inorganic materials, or transparent conductive materials, and includes processes such as coating organic materials, mask exposure, and development for organic materials. Deposition can be performed by any one or more of sputtering, evaporation, and chemical vapor deposition; coating can be performed by any one or more of spraying, spin coating, and inkjet printing; and etching can be performed by any one or more of dry etching and wet etching, which are not limited in the present disclosure. "Thin film" refers to a layer of thin film prepared by deposition, coating, or other processes on a substrate using a certain material. If the "thin film" does not require a patterning process during the entire preparation process, the "thin film" can also be called a "layer." If the "thin film" requires a patterning process during the entire preparation process, it is called a "thin film" before the patterning process and a "layer" after the patterning process. The "layer" after the patterning process contains at least one "pattern." As used in this disclosure, "A and B are disposed in the same layer" means that A and B are formed simultaneously through the same patterning process, and the "thickness" of the film layer refers to the dimension of the film layer in a direction perpendicular to the display substrate. In exemplary embodiments of this disclosure, "the orthographic projection of B is within the range of the orthographic projection of A" or "the orthographic projection of A contains the orthographic projection of B" means that the boundary of the orthographic projection of B falls within the boundary of the orthographic projection of A, or that the boundary of the orthographic projection of A overlaps with the boundary of the orthographic projection of B.

[0335] Figures 10 to 14 The power outage in the hole area is achieved by setting an insulating filling structure. The only difference is the film layer included in the isolation column. Figure 14 The preparation process of the display substrate provided further illustrates the display substrate provided in the embodiment of the present disclosure. Figures 10 to 13 The preparation process of the display substrate provided is Figure 14 The same is true for , so I will not go into details here.

[0336] Figure 10 、 Figure 11 and Figure 13 The preparation process is similar to that of Figure 13 The preparation process further illustrates the display substrate provided by the embodiment of the present disclosure.

[0337] (1) Forming an original structure. In an exemplary embodiment, forming the original structure includes: providing a substrate 10, forming a first composite insulating layer 20 on the substrate 10, depositing a first metal film on the first composite insulating layer 20, forming a first original conductive structure 3110 by a patterning process, depositing a first insulating film 3120 on the first original conductive structure, depositing a second metal film on the first insulating film, forming a second original conductive structure 3130 by a patterning process, depositing a second insulating film 3140 on the second original conductive structure, depositing a third metal film on the second insulating film, and forming a third original conductive structure 3150 by a patterning process, as shown in FIG. Figure 67A As shown, Figure 67A for Figure 13 Preparation process Figure 1 .

[0338] In an exemplary embodiment, the first composite insulating layer 20 covers the substrate and is located in the display area and at least a portion of the hole area.

[0339] (2) Forming an insulating structure. In an exemplary embodiment, forming an insulating structure includes: patterning the first insulating film and the second insulating film through a patterning process to form a first insulating structure 312 and a second insulating structure 314, such as Figure 67B As shown, Figure 67B for Figure 13 Preparation process Figure 2 .

[0340] In an exemplary embodiment, the first insulating structure 312 is a structure covered by the third original conductive structure, and the second insulating structure is a structure covered by the second original conductive structure.

[0341] (3) Forming a plurality of conductive structures. In an exemplary embodiment, forming a plurality of conductive structures includes: etching the sidewalls of the first original conductive structure, the second original conductive structure, the third original conductive structure, and the fourth original conductive structure through a patterning process to form a first conductive structure 311, a second conductive structure 313, a third conductive structure 315, and a fourth conductive structure 317, as shown in FIG. Figure 67C As shown, Figure 67C for Figure 13 Preparation process Figure 3 .

[0342] In an exemplary embodiment, an undercut structure is formed between at least one conductive structure and two adjacent film layers.

[0343] (4) Forming an insulating filling structure and a covering structure. In an exemplary embodiment, forming the insulating filling structure and the covering structure includes: forming a filling structure 400 between at least two adjacent isolation pillars, and providing a covering structure on the surface of the isolation pillar away from the substrate, such as Figure 67D As shown, Figure 67D for Figure 13 Preparation process Figure 4 .

[0344] like Figure 67D As shown, the covering structure includes: a first covering structure 601 to a fourth covering structure 604 arranged at intervals.

[0345] Figure 12 and Figure 14 The preparation process is similar. Figure 14 The preparation process of the provided display substrate further illustrates the display substrate provided by the embodiment of the present disclosure.

[0346] (1) Forming an original structure. In an exemplary embodiment, forming the original structure includes: providing a substrate 10, forming a first composite insulating layer 20 on the substrate 10, depositing a first metal film on the first composite insulating layer 20, forming a first original conductive structure 3110 through a patterning process, depositing a first insulating film 3120 on the first original conductive structure, depositing a second metal film on the first insulating film, forming a second original conductive structure 3130 through a patterning process, depositing a second insulating film 3140 on the second original conductive structure, depositing a third metal film on the second insulating film, and forming a third original conductive structure 3150 through a patterning process. Figure 14 Preparation process Figure 1 and Figure 13 Preparation process Figure 1 same.

[0347] In an exemplary embodiment, the first composite insulation layer 20 covers the substrate.

[0348] (2) Forming an insulating structure. In an exemplary embodiment, forming an insulating structure includes: patterning the first insulating film and the second insulating film through a patterning process to form a first insulating structure 312 and a second insulating structure 314, Figure 14 Preparation process Figure 2 and Figure 13 Preparation process Figure 2 same.

[0349] In an exemplary embodiment, the first insulating structure 312 is a structure covered by the third original conductive structure, and the second insulating structure is a structure covered by the second original conductive structure.

[0350] (3) Forming a fourth original conductive structure. In an exemplary embodiment, forming the third original conductive structure includes: depositing a fourth original conductive structure 3170 on the third original conductive structure, such as Figure 68A As shown in Figure 68 Figure 14 Preparation process Figure 3 .

[0351] (4) Forming a plurality of conductive structures. In an exemplary embodiment, forming a plurality of conductive structures includes: etching the sidewalls of the first original conductive structure, the second original conductive structure, the third original conductive structure, and the fourth original conductive structure through a patterning process to form a first conductive structure 311, a second conductive structure 313, a third conductive structure 315, and a fourth conductive structure 317, as shown in FIG. Figure 68B As shown, Figure 68B for Figure 14 Preparation process Figure 4 .

[0352] In an exemplary embodiment, an undercut structure is formed between at least one conductive structure and two adjacent film layers.

[0353] (5) Forming an insulating filling structure and a covering structure. In an exemplary embodiment, forming the insulating filling structure and the covering structure includes: forming a filling structure 400 between at least two adjacent isolation pillars, and providing a covering structure on the surface of the isolation pillar away from the substrate, such as Figure 68C As shown, Figure 68C for Figure 14 Preparation process Figure 5 .

[0354] like Figure 68C As shown, the covering structure includes: a first covering structure 601 to a fourth covering structure 604 arranged at intervals.

[0355] Figures 15 to 18 、 Figures 23 to 26 、 Figures 35 to 38 、 Figures 47 to 50 、 Figures 59 to 62 In the provided display substrate, at least one insulating structure does not cover the sidewall of the conductive structure located below the insulating structure, and the isolation insulating structure covers the sidewall of the entire isolation column, and the preparation method is similar.

[0356] This disclosure is made through Figure 59 The display substrate provided by the embodiment of the present disclosure is further illustrated by taking the display substrate of as an example.

[0357] (1) Forming an original structure. In an exemplary embodiment, forming the original structure includes: providing a substrate 10, forming a first composite insulating layer 20 on the substrate 10, depositing a first metal film on the first composite insulating layer 20, forming a first original conductive structure 3110 through a patterning process, depositing a first insulating film 3120 on the first original conductive structure, depositing a second metal film on the first insulating film, forming a second original conductive structure 3130 through a patterning process, depositing a second insulating film 3140 on the second original conductive structure, depositing a third metal film on the second insulating film, and forming a third original conductive structure 3150 through a patterning process. Figure 59 Preparation process Figure 1 and Figure 14 Preparation process Figure 1 same.

[0358] In an exemplary embodiment, the first composite insulation layer 20 covers the substrate.

[0359] (2) Forming an insulating structure. In an exemplary embodiment, forming an insulating structure includes patterning the first insulating film and the second insulating film through a patterning process to form a first insulating structure 312 and a second insulating structure 314, as shown in FIG. 68 . Figure 59 Preparation process Figure 2 and Figure 14 Preparation process Figure 2 same.

[0360] In an exemplary embodiment, the first insulating structure 312 is a structure covered by the third original conductive structure, and the second insulating structure is a structure covered by the second original conductive structure.

[0361] (3) Forming a fourth original conductive structure. In an exemplary embodiment, forming the fourth original conductive structure includes: depositing a fourth original conductive structure 3170 on the third original conductive structure, Figure 59 Preparation process Figure 3 and Figure 14 Preparation process Figure 3 same.

[0362] (4) Forming an isolation insulating structure. In an exemplary embodiment, an isolation insulating film is deposited on the surface of the isolation column away from the substrate, and the isolation insulating film is patterned by a patterning process to form an isolation insulating structure 401, such as Figure 69A As shown, Figure 69A for Figure 59 Preparation process Figure 4 .

[0363] (5) Forming a plurality of conductive structures and a covering structure. In an exemplary embodiment, forming a plurality of conductive structures includes: etching the first sidewalls of the first original conductive structure, the second original conductive structure, the third original conductive structure, and the fourth original conductive structure through a patterning process to form a first conductive structure 311, a second conductive structure 313, a third conductive structure 315, and a fourth conductive structure 317, and providing a covering structure on the surface of the isolation column away from the substrate, such as Figure 69B As shown, Figure 69B for Figure 59 Preparation process Figure 5 .

[0364] In an exemplary embodiment, an undercut structure is formed between the first sidewall of the at least one conductive structure and two adjacent film layers.

[0365] like Figure 59 As shown, the covering structures include first to fourth covering structures 601 to 604 arranged at intervals.

[0366] Below through Figures 31 to 34 The preparation process of the display substrate provided by the embodiment of the present disclosure is described.

[0367] (1) Forming an original structure. In an exemplary embodiment, forming the original structure includes: providing a substrate 10, forming a first composite insulating layer 20 on the substrate 10, depositing a first metal film on the first composite insulating layer 20, forming a first original conductive structure 3110 by a patterning process, depositing a first insulating film 3120 on the first original conductive structure, and patterning the first insulating film 3120 by a patterning process to form a first insulating structure 312, as shown in FIG. Figure 70A As shown, Figure 70A for Figure 31 Preparation process Figure 1 .

[0368] The first insulating structure 312 covers the second sidewall of the first original conductive structure.

[0369] In an exemplary embodiment, the first composite insulation layer 20 covers the substrate.

[0370] (2) Forming a second original conductive structure. In an exemplary embodiment, forming the second original conductive structure includes: depositing the second original conductive structure 3130 on the first insulating film, such as Figure 70B As shown, Figure 70B for Figure 31 Preparation process Figure 2 .

[0371] (3) Forming a plurality of conductive structures and a covering structure. In an exemplary embodiment, forming a plurality of conductive structures includes: etching the first sidewall of the first original conductive structure and the second original conductive structure, the third original conductive structure, and the first sidewall of the fourth original conductive structure through a patterning process to form a first conductive structure 311 and a second conductive structure 313, and providing a covering structure on the surface of the isolation column away from the substrate, such as Figure 70C As shown, Figure 70C for Figure 31 Preparation process Figure 3 .

[0372] In an exemplary embodiment, an undercut structure is formed between the first sidewall of the at least one conductive structure and two adjacent film layers.

[0373] like Figure 70C As shown, the covering structures include first to fourth covering structures 601 to 604 arranged at intervals.

[0374] Figures 43 to 46 、 Figures 55 to 58 The structures of the provided display substrates are similar, except that the number of the conductive structures of the isolation pillars is different, and the preparation processes are the same.

[0375] This disclosure is made through Figure 55 The preparation process of the display substrate provided by the embodiment of the present disclosure further illustrates the display substrate provided by the embodiment of the present disclosure.

[0376] (1) Forming an original structure. In an exemplary embodiment, forming the original structure includes: providing a substrate 10, forming a first composite insulating layer 20 on the substrate 10, depositing a first metal film on the first composite insulating layer 20, forming a first original conductive structure 3110 through a patterning process, depositing a first insulating film 3120 on the first original conductive structure, depositing a second metal film on the first insulating film, forming a second original conductive structure 3130 through a patterning process, depositing a second insulating film 3140 on the second original conductive structure, depositing a third metal film on the second insulating film, and forming a third original conductive structure 3150 through a patterning process. Figure 55 Preparation process Figure 1 and Figure 14 Preparation process Figure 1 same.

[0377] In an exemplary embodiment, the first composite insulation layer 20 covers the substrate.

[0378] (2) Forming the first insulating structure and the second insulating structure. In an exemplary embodiment, forming the first insulating structure and the second insulating structure includes: patterning the first insulating film and the second insulating film through a patterning process to form the first insulating structure 312 and the second insulating structure 314, Figure 55 Preparation process Figure 2 and Figure 14 Preparation process Figure 2 same.

[0379] In an exemplary embodiment, the first insulating structure 312 is a structure covered by the third original conductive structure, and the second insulating structure is a structure covered by the second original conductive structure.

[0380] (3) Forming a third insulating structure. In an exemplary embodiment, a third insulating film is deposited on the surface of the third original conductive structure away from the substrate, and the third insulating film is patterned by a patterning process to form a third insulating structure 316, such as Figure 71A As shown, Figure 71A for Figure 55 Preparation process Figure 3 .

[0381] (4) Forming a fourth original conductive structure. In an exemplary embodiment, forming the fourth original conductive structure includes: depositing a fourth original conductive structure 3170 on the third insulating structure 316, such as Figure 71B As shown, Figure 71B for Figure 55 Preparation process Figure 4 .

[0382] (5) Forming an isolation insulating structure. In an exemplary embodiment, an isolation insulating film is deposited on the surface of the isolation column away from the substrate, and the isolation insulating film is patterned by a patterning process to form an isolation insulating structure 401, such as Figure 71C As shown, Figure 71C for Figure 55 Preparation process Figure 5 .

[0383] (6) Forming a plurality of conductive structures and a covering structure. In an exemplary embodiment, forming a plurality of conductive structures includes: etching the first sidewalls of the first original conductive structure, the second original conductive structure, the third original conductive structure, and the fourth original conductive structure through a patterning process to form a first conductive structure 311, a second conductive structure 313, a third conductive structure 315, and a fourth conductive structure 317, and providing a covering structure on the surface of the isolation column away from the substrate, such as Figure 71D As shown, Figure 71D for Figure 55 Preparation process Figure 6 .

[0384] Figures 19 to 22 、 Figures 27 to 30 、 Figures 39 to 42 、 Figures 51 to 54 、 Figures 63 to 66 In the provided display substrate, at least one insulating structure covers the sidewall of the conductive structure located below the insulating structure, and the isolated insulating structure only covers the sidewall of a portion of the conductive column. The preparation method is the same as Figure 63 The preparation method is similar.

[0385] This disclosure is made through Figure 63 The preparation process of the display substrate provided by the embodiment of the present disclosure further illustrates the display substrate provided by the embodiment of the present disclosure.

[0386] (1) Forming an original structure. In an exemplary embodiment, forming the original structure includes: providing a substrate 10, forming a first composite insulating layer 20 on the substrate 10, depositing a first metal film on the first composite insulating layer 20, forming a first original conductive structure 3110 by a patterning process, depositing a first insulating film on the first original conductive structure, patterning the first insulating film by a patterning process to form a first insulating structure 312, depositing a second metal film on the first insulating structure 312, forming a second original conductive structure 3120 by a patterning process, depositing a second insulating film on the second original conductive structure, patterning the second insulating film by a patterning process to form a second insulating structure 314, sequentially depositing a third metal film and a fourth metal film on the second insulating structure, patterning the third metal film and the fourth metal film by a patterning process to form a third original conductive structure 3150 and a fourth original conductive structure 3170, as shown in FIG. Figure 72A As shown, Figure 72A for Figure 63 Preparation process Figure 1 .

[0387] In an exemplary embodiment, the first composite insulation layer 20 covers the substrate.

[0388] (2) Forming an isolation insulating structure. In an exemplary embodiment, an isolation insulating film is deposited on the surface of the isolation column away from the substrate, and the isolation insulating film is patterned by a patterning process to form an isolation insulating structure 401, such as Figure 72B As shown, Figure 72B for Figure 63 Preparation process Figure 2 .

[0389] (3) Forming a plurality of conductive structures and a covering structure. In an exemplary embodiment, forming a plurality of conductive structures includes: etching the first sidewalls of the first original conductive structure, the second original conductive structure, the third original conductive structure, and the fourth original conductive structure through a patterning process to form a first conductive structure 311, a second conductive structure 313, a third conductive structure 315, and a fourth conductive structure 317, and providing a covering structure on the surface of the isolation column away from the substrate, such as Figure 72C As shown, Figure 72C for Figure 63 Preparation process Figure 3 .

[0390] In an exemplary embodiment, the first sidewall and the second sidewall of the original conductive structure are sloped.

[0391] In an exemplary embodiment, etching of at least one sidewall of the conductive structure may occur after the formation of multiple source and drain metal layers. Exemplarily, etching of at least one sidewall of the conductive structure may occur after the formation of the anode of the light-emitting device and before the formation of the covering structure.

[0392] In an exemplary embodiment, when the isolation column includes: a first conductive structure, a second conductive structure, a third conductive structure, and a fourth conductive structure, the length of the first conductive structure along the direction parallel to the substrate is in the range of 7 microns to 8 microns, the length of the second conductive structure along the direction parallel to the substrate is in the range of 6 microns to 7 microns, the length of the third conductive structure along the direction parallel to the substrate is in the range of 5 microns to 6 microns, and the length of the fourth conductive structure along the direction parallel to the substrate is in the range of 4 microns to 5 microns.

[0393] Figure 73 FIG. 1 is a schematic diagram of a display device according to at least one embodiment of the present disclosure. Figure 73 As shown, this embodiment provides a display device 91, including the display substrate 910 provided by any of the above embodiments.

[0394] In an exemplary embodiment, the display substrate 910 may be an OLED display substrate, such as an OLED display substrate with an integrated touch structure. The display device 91 may be any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system, or may be a product or component with both touch and display functions. In an exemplary embodiment, the display device 91 may be a wearable display device, such as one that can be worn on the human body in some manner. For example, the display device 91 may be a smartwatch, a smart bracelet, or the like. However, this embodiment is not limited to this.

[0395] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example" or "some examples" and the like mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and features of different embodiments or examples, unless they are mutually inconsistent.

[0396] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A display substrate, characterized in that: include: A display area and a hole area, wherein the display area is arranged around the hole area, and the hole area includes: a first area and a second area arranged in sequence away from the display area; a plurality of isolation columns are provided in any of the first area and the second area; At least one isolation column of the multiple isolation columns located in at least one area of the second area and the first area includes: at least two conductive structures and at least one insulating structure, the at least one insulating structure is arranged between the at least two conductive structures, and at least one side of the at least one conductive structure is groove-shaped.

2. The display substrate according to claim 1, wherein: The display substrate comprises: a base and a circuit structure layer arranged on the base, the circuit structure layer comprising: a plurality of gate metal layers and a plurality of source / drain metal layers, at least one film layer selected from an organic insulating layer and an inorganic insulating layer being arranged between at least two metal layers; At least one isolation column among the plurality of isolation columns comprises: a first conductive structure, a first insulating structure, and a second conductive structure; At least one side of at least one of the first conductive structure and the second conductive structure is groove-shaped, and an orthographic projection of at least part of the second conductive structure on the substrate is within the range of an orthographic projection of the first insulating structure and the first conductive structure on the substrate; The first conductive structure is located in one of the multiple gate metal layers, and the second conductive structure is located in another film layer among the multiple gate metal layers, or the first conductive structure is located in one of the multiple gate metal layers, and the second conductive structure is located in one of the multiple source / drain metal layers, and the first insulating structure is arranged in at least one inorganic insulating layer between the film layer where the first conductive structure is located and the film layer where the second conductive structure is located.

3. The display substrate according to claim 2, wherein: At least one of the plurality of isolation pillars further comprises: a third conductive structure, the third conductive structure being located on a side of the second conductive structure away from the substrate; At least one side of at least one conductive structure from the first conductive structure to the third conductive structure is in a groove shape, and an orthographic projection of at least part of the third conductive structure on the substrate is located within the range of an orthographic projection of the second conductive structure on the substrate; Any one of the first conductive structure and the second conductive structure is located in one of the multiple gate metal layers, the third conductive structure is located in one of the multiple source / drain metal layers, and the first insulating structure is arranged in at least one inorganic insulating layer between the film layer where the first conductive structure is located and the film layer where the second conductive structure is located.

4. The display substrate according to claim 2, wherein: At least one of the plurality of isolation columns further comprises: a second insulating structure and a third conductive structure, wherein the second insulating structure is located on a side of the second conductive structure away from the substrate, and the third conductive structure is located on a side of the second insulating structure away from the substrate; At least one side of at least one conductive structure from the first conductive structure to the third conductive structure is groove-shaped, an orthographic projection of at least part of the third conductive structure on the substrate is located within the range of an orthographic projection of the second insulating structure on the substrate, and an orthographic projection of at least part of the third conductive structure on the substrate is located within the range of an orthographic projection of the second conductive structure on the substrate; Any one of the first conductive structure, the second conductive structure and the third conductive structure is arranged in one of the film layers of the multiple gate metal layers, or any one of the first conductive structure and the second conductive structure is located in one of the film layers of the multiple gate metal layers, the third conductive structure is located in one of the film layers of the multiple source / drain metal layers, the first insulating structure is arranged in at least one inorganic insulating layer located between the film layer where the first conductive structure is located and the film layer where the second conductive structure is located, and the second insulating structure is arranged in at least one inorganic insulating layer located between the film layer where the second conductive structure is located and the film layer where the third conductive structure is located.

5. The display substrate according to any one of claims 2 to 4, characterized in that: An insulating filling structure is provided between at least two adjacent isolation columns; The insulating filling structure covers a side of two adjacent isolation columns close to the insulating filling structure and a portion of the surface away from the substrate.

6. The display substrate according to claim 5, wherein: The display substrate further comprises: a covering structure, the covering structure comprising an organic structure and a cathode structure; The covering structure is disconnected at the grooves of at least two conductive structures included in the isolation column; The covering structure includes: a first covering structure, which is arranged on the surface of the isolation column away from the substrate, and the first covering structures on at least two isolation columns with insulating filling structures are connected to each other, and the orthographic projection of the first covering structure on the substrate at least partially overlaps with the orthographic projection of the insulating filling structure on the substrate.

7. The display substrate according to claim 2, wherein: At least one of the plurality of isolation pillars is provided with an isolation insulating structure on a surface away from the substrate, and at least one of the first conductive structure and the second conductive structure comprises: a first sidewall and a second sidewall; The isolation insulating structure at least partially covers the surface and the second sidewall of the second conductive structure away from the substrate, and the isolation insulating structure is provided on at least one inorganic insulating layer located on a side of the second conductive structure away from the substrate; The structures of adjacent isolation pillars are the same, or the structures of adjacent isolation pillars are symmetrically arranged with respect to a straight line perpendicular to the substrate.

8. The display substrate according to claim 7, wherein: The insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation column along a center line perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation column along a center line perpendicular to the substrate; The isolation insulating structure also covers the second sidewall of the first conductive structure and the second sidewall of the first insulating structure; The display substrate further includes: a covering structure, the covering structure including an organic structure and a cathode structure, the covering structure being disconnected at the grooves of the first conductive structure and the second conductive structure; The covering structure includes a first covering structure, wherein the first covering structure covers the surface of the isolation insulating structure away from the substrate and the second sidewall, and the first covering structure further extends between adjacent isolation pillars.

9. The display substrate according to claim 7, wherein: The first insulating structure covers the second sidewall of the first conductive structure, and the isolation insulating structure is partially arranged on a surface of the first insulating structure away from the substrate; The display substrate further includes: a covering structure, the covering structure including an organic structure and a cathode structure, the covering structure being disconnected at the grooves of the first conductive structure and the second conductive structure; The covering structure includes a first covering structure, which covers a surface and a second sidewall of the isolation insulating structure away from the substrate and the second sidewall of the first insulating structure, and further extends between adjacent isolation pillars.

10. The display substrate according to claim 2, wherein: At least one of the first conductive structure and the second conductive structure includes: a first sidewall and a second sidewall; An orthographic projection of at least a portion of the first sidewall of the first conductive structure on the substrate is located within the range of an orthographic projection of the first insulating structure on the substrate, and the first insulating structure covers the second sidewall of the first conductive structure; The structures of adjacent isolation pillars are the same, or the structures of adjacent isolation pillars are symmetrically arranged with respect to a straight line perpendicular to the substrate.

11. The display substrate according to claim 10, wherein: The display substrate further includes: a covering structure, the covering structure including an organic structure and a cathode structure, the covering structure being disconnected at the grooves of the first conductive structure and the second conductive structure; The covering structure includes: a first covering structure, which is arranged on a surface of the second conductive structure away from the substrate.

12. The display substrate according to claim 4, wherein: When any one of the first conductive structure, the second conductive structure, and the third conductive structure is provided in one of the plurality of gate metal layers, at least one of the plurality of isolation pillars is provided with an isolation insulating structure on a surface away from the substrate; at least one of the first conductive structure to the third conductive structure comprises: a first sidewall and a second sidewall; The orthographic projection of at least a portion of the first sidewall of the first conductive structure on the substrate is located within the range of the orthographic projection of the first insulating structure on the substrate, and the orthographic projection of at least a portion of the first sidewall of the second conductive structure on the substrate is located within the range of the orthographic projection of the second insulating structure on the substrate. The isolation insulating structure at least partially covers the surface of the third conductive structure away from the substrate and the second sidewall. The isolation insulating structure is provided on at least one inorganic insulating layer located on a side of the third conductive structure away from the substrate. The structures of adjacent isolation pillars are the same, or the structures of adjacent isolation pillars are symmetrically arranged with respect to a straight line perpendicular to the substrate.

13. The display substrate according to claim 12, wherein: The insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation column along a center line perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation column along a center line perpendicular to the substrate; The orthographic projection of the second sidewall of the first conductive structure on the substrate does not overlap with the orthographic projection of the first insulating structure on the substrate, the orthographic projection of the second sidewall of the second conductive structure on the substrate does not overlap with the orthographic projection of the second insulating structure on the substrate, and the isolation insulating structure further covers the second sidewall of the first conductive structure, the second sidewall of the first insulating structure, the second sidewall of the second conductive structure, and the second sidewall of the second insulating structure; The display substrate further includes: a covering structure, the covering structure including an organic structure and a cathode structure, the covering structure being disconnected at the grooves of the first conductive structure and the second conductive structure; The covering structure includes a first covering structure, which covers the surface of the isolation insulating structure away from the substrate and the second sidewall, and further extends between adjacent isolation pillars.

14. The display substrate according to claim 12, wherein: The insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation column along a center line perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation column along a center line perpendicular to the substrate; The orthographic projections of the second sidewall of the isolation insulating structure, the second sidewall of the first conductive structure, and the second sidewall of the second conductive structure on the substrate are located within the range of the orthographic projection of the first insulating structure on the substrate; the first insulating structure covers the second sidewall of the first conductive structure; the second insulating structure covers the second sidewall of the second conductive structure; and the isolation insulating structure is partially provided on the surface of the second insulating structure away from the substrate; The display substrate further includes: a covering structure, the covering structure including an organic structure and a cathode structure, the covering structure being disconnected at the grooves of the first conductive structure and the second conductive structure; The covering structure includes: a first covering structure, which covers the surface and the second sidewall of the isolation insulating structure away from the substrate, the second sidewall of the first insulating structure, and the second sidewall of the second insulating structure, and the first covering structure also extends between adjacent isolation pillars.

15. The display substrate according to claim 4, wherein: When any one of the first conductive structure and the second conductive structure is provided in one of the plurality of gate metal layers, and the third conductive structure is provided in one of the plurality of source and drain metal layers, an isolation insulating structure is provided on a surface of at least one of the plurality of isolation pillars away from the substrate, and at least one of the first conductive structure to the third conductive structure comprises: a first sidewall and a second sidewall; The second insulating structure covers the portion of the surface and the second sidewall of the second conductive structure away from the substrate, the second sidewall of the first conductive structure, and the second sidewall of the first insulating structure. A portion of the third conductive structure is connected to the portion of the surface of the second conductive structure away from the substrate. The third conductive structure is stepped. The isolation insulating structure covers the second sidewall of the third conductive structure and the second sidewall of the isolation insulating structure. The isolation insulating structure is provided in at least one inorganic insulating layer located between a plurality of source and drain metal layers. Adjacent isolation columns have the same structure, or adjacent isolation columns are symmetrically arranged with respect to a straight line perpendicular to the substrate.

16. The display substrate according to claim 15, wherein: The insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation column along a center line perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation column along a center line perpendicular to the substrate; An orthographic projection of the second sidewall of the first conductive structure on the substrate does not overlap with an orthographic projection of the first insulating structure on the substrate; The display substrate further includes: a covering structure, the covering structure including an organic structure and a cathode structure, the covering structure being disconnected at the grooves of the first conductive structure, the second conductive structure, and the third conductive structure; The covering structure includes a first covering structure, wherein the first covering structure covers a surface of the isolation insulating structure away from the substrate and a second sidewall, and the first covering structure further extends between adjacent isolation pillars.

17. The display substrate according to claim 4, wherein: At least one of the plurality of isolation pillars is provided with an isolation insulating structure on a surface away from the substrate, and at least one of the first to third conductive structures comprises: a first sidewall and a second sidewall; The orthographic projection of at least a portion of the first sidewall of the first conductive structure on the substrate is located within the range of the orthographic projection of the first insulating structure on the substrate, and the orthographic projection of at least a portion of the first sidewall of the second conductive structure on the substrate is located within the range of the orthographic projection of the second insulating structure on the substrate. The isolation insulating structure at least partially covers the surface of the third conductive structure away from the substrate and the second sidewall. The isolation insulating structure is provided in at least one inorganic insulating layer located between a plurality of source and drain metal layers. The structures of adjacent isolation pillars are the same, or the structures of adjacent isolation pillars are symmetrically arranged with respect to a straight line perpendicular to the substrate.

18. The display substrate according to claim 17, wherein: The insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation column along a center line perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation column along a center line perpendicular to the substrate; The orthographic projection of the second sidewall of the first conductive structure on the substrate does not overlap with the orthographic projection of the first insulating structure on the substrate, and the isolation insulating structure further covers the second sidewall of the first conductive structure, the second sidewall of the first insulating structure, and the second sidewall of the second conductive structure; The display substrate further includes: a covering structure, the covering structure including an organic structure and a cathode structure, the covering structure being disconnected at the grooves of the first conductive structure, the second conductive structure, and the third conductive structure; The covering structure includes a first covering structure, wherein the first covering structure covers the surface of the isolation insulating structure away from the substrate and the second sidewall, and the first covering structure further extends between adjacent isolation pillars.

19. The display substrate according to claim 17, wherein: The insulating structure and the isolation insulating structure include: a first sidewall and a second sidewall, the first sidewall of the insulating structure and the isolation insulating structure and the first sidewall of the conductive structure are located on a first side of the isolation column along a center line perpendicular to the substrate, and the second sidewall of the insulating structure and the isolation insulating structure and the second sidewall of the conductive structure are located on a second side of the isolation column along a center line perpendicular to the substrate; The orthographic projections of the second sidewall of the isolation insulating structure, the second sidewall of the first conductive structure, and the second sidewall of the second conductive structure on the substrate are located within the range of the orthographic projection of the first insulating structure on the substrate, the first insulating structure covers the second sidewall of the first conductive structure, and the isolation insulating structure is partially provided on the surface of the first insulating structure away from the substrate; The display substrate further includes: a covering structure, the covering structure including an organic structure and a cathode structure, the covering structure being disconnected at the grooves of the first conductive structure, the second conductive structure, and the third conductive structure; The covering structure includes a first covering structure, wherein the first covering structure covers a surface of the isolation insulating structure away from the substrate and a second sidewall, and the first covering structure further extends between adjacent isolation pillars.

20. The display substrate according to any one of claims 7, 12, 15 and 17, wherein: When structures of adjacent isolation columns among the plurality of isolation columns are symmetrically arranged relative to a line perpendicular to the substrate, the isolation insulating structure arranged on the isolation column and the isolation insulating structure arranged on the adjacent isolation column are spaced apart or connected to each other.

21. The display substrate according to any one of claims 7 to 19, wherein: When structures of adjacent isolation columns among the plurality of isolation columns are symmetrically arranged relative to a line perpendicular to the substrate, at least one insulating structure of an isolation column is spaced apart from or connected to at least one insulating structure of an adjacent isolation column.

22. The display substrate according to claim 1, wherein The hole region further includes: a third region, the third region being located between the first region and the second region; the display substrate further includes: a base and a circuit structure layer disposed on the base, the circuit structure layer including: a plurality of gate metal layers and a plurality of source / drain metal layers, at least one film layer selected from an organic insulating layer and an inorganic insulating layer being disposed between at least two metal layers, at least one inorganic insulating layer disposed on a side of the plurality of gate metal layers close to the base being referred to as a first composite insulating layer, and a plurality of inorganic insulating layers disposed between the plurality of gate metal layers and the plurality of source / drain metal layers being referred to as a second composite insulating layer; The first composite insulating layer extends from the display area to the second area, the second composite insulating layer is located in the display area and does not extend to the first area, or extends from the display area to the third area; When the second composite insulating layer is located in the display area and does not extend to the first area, the isolation columns located in the first area have the same shape as the isolation columns located in the second area.

23. The display substrate according to claim 22, wherein: When the second composite insulating layer extends from the display area to the third area, the isolation column located in the first area includes: a first conductive structure located in one of the plurality of source and drain metal layers.

24. The display substrate according to claim 23, wherein: The isolation column located in the first region further includes at least: at least one conductive structure from the second conductive structure to the K+1th conductive structure, wherein the orthographic projection of the at least one conductive structure from the second conductive structure to the K+1th conductive structure on the substrate overlaps with the orthographic projection of the first conductive structure; The k+1th conductive structure is located in the kth gate metal layer, 1≤k≤K.

25. The display substrate according to claim 2, wherein When the isolation column located in the second area includes: a first conductive structure, a first insulating structure and a second conductive structure, the first conductive structure is located in a gate metal layer close to the substrate among the multiple gate metal layers, and the second conductive structure is located in the source-drain metal layer on the side away from the substrate among the multiple source-drain metal layers, and the thickness of the first insulating structure is in the range of 0.7 microns to 0.9 microns.

26. The display substrate according to claim 2, wherein: The conductive structure of at least one film layer in the plurality of source and drain metal layers includes: a first isolation portion, a second isolation portion, and a third isolation portion, wherein the first isolation portion is located on a side of the second isolation portion close to the substrate, and the third isolation portion is located on a side of the second isolation portion away from the substrate; The orthographic projection of the surface of the second isolation portion close to the substrate on the substrate is within the range of the orthographic projection of the surface of the first isolation portion away from the substrate on the substrate, and the orthographic projection of the surface of the second isolation portion away from the substrate on the substrate is within the range of the orthographic projection of the surface of the third isolation portion close to the substrate on the substrate.

27. The display substrate according to claim 5, wherein: An angle between a surface of the insulating filling structure disposed on a surface of at least one of the plurality of isolation pillars away from the substrate and the surface of the isolation pillar away from the substrate is in a range of 30 degrees to 60 degrees.

28. A display device, characterized in that: include: The display substrate according to any one of claims 1 to 27.

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