Wafer cleaning and spin-drying device

Abstract

The utility model relates to the technical field of semiconductor manufacturing, and discloses a wafer cleaning and spin-drying device which comprises a wafer spin-drying machine, a drain pipe used for discharging waste deionized water generated by the wafer spin-drying machine, a collecting box used for collecting the waste deionized water, and a resistance tester used for detecting the resistivity of the waste deionized water. A wall scraping assembly is further arranged on the collecting box. According to the wafer cleaning and spin-drying device, waste deionized water discharged by the wafer spin-drying machine through the water discharging pipe is temporarily collected through the collecting box, then the resistivity of the discharged deionized water is detected through the resistance tester so as to judge whether the resistivity meets the standard or not, and if the resistivity is lower than the standard and the ion concentration in water is high, the wafer is cleaned and dried. If the wafer surface is not thoroughly cleaned, the wafer is forbidden to flow into the next process, and the wafer is washed again until the resistivity of the waste deionized water reaches the standard, so that the cleaning effect of the wafer can be guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wafer cleaning and drying device. Background Art

[0002] A wafer refers to the silicon chip used to manufacture silicon semiconductor integrated circuits. After undergoing a series of complex processing steps, these silicon wafers become integrated circuit products with specific electrical functions.

[0003] The wafer needs to go through a series of cleaning steps to achieve the purpose of dryness and cleanliness. The wafer dryer is the last step in the cleaning process and needs to dry the wafer. However, if there are chemical residues or metal ions left on the surface of the wafer after drying, it will inevitably affect the cleaning effect. For this reason, we propose a wafer cleaning and drying device to solve the above problem. Utility Model Content

[0004] In view of the deficiencies in the prior art, the present invention provides a wafer cleaning and drying device, which solves the problems mentioned in the above background.

[0005] The utility model provides the following technical solution: a wafer cleaning and drying device, comprising: a wafer dryer, a drain pipe for discharging waste deionized water generated by the wafer dryer, a collection box for collecting the waste deionized water, and a resistance tester for detecting the resistivity of the waste deionized water, the collection box is also provided with a scraper assembly, the scraper assembly includes a column fixedly connected to the collection box, a slide slidably connected to the column, a first fixed rod fixedly mounted on the bottom surface of the slide, a fixed column fixedly mounted on the bottom surface of the first fixed rod, a loading plate fixedly mounted on the bottom surface of the fixed column, and an annular absorbent cotton for removing residual water droplets on the side wall of the collection box; the loading plate is also provided with a connecting assembly, the connecting assembly includes a movable plate slidably arranged inside the fixed column, a connecting rod fixedly connected to the movable plate, a connecting ring fixedly connected to the connecting rod, a second fixed rod fixedly connected to the connecting ring, an insert block fixedly mounted on the end of the second fixed rod, and a rubber ring fixedly mounted on the inner side of the annular absorbent cotton, the insert block is slidably connected to the loading plate, and the insert block is also plugged into the rubber ring.

[0006] Preferably, the wall scraping assembly further includes a first spring, which is located in the inner cavity of the column, and two ends of the first spring are fixedly connected to the slide plate and the column respectively.

[0007] Preferably, the connecting assembly further comprises a second spring with two ends fixedly connected to the movable plate and the fixed column respectively.

[0008] Preferably, a card slot is provided on the loading plate, through which the rubber ring and the loading plate can be snap-connected.

[0009] Preferably, a sliding groove for passing through the connecting rod is provided on the fixed column, and both ends of the sliding groove are sealed.

[0010] Preferably, the loading plate is in the shape of a Chinese character 'Ri', and the gap between the outer surface of the loading plate and the inner surface of the collection box is filled with a ring-shaped water-absorbing cotton.

[0011] Preferably, the water outlet of the drain pipe is located inside the chamber of the collection box, and a plug is also provided on the collection box.

[0012] Preferably, a probe in contact with the waste deionized water is also provided on the resistance tester.

[0013] Compared with the prior art, the present utility model has the following beneficial effects:

[0014] 1. For this wafer cleaning and drying device, first, the waste deionized water discharged by the wafer dryer through the drain pipe is temporarily collected by the collection box, and then the resistivity of the discharged deionized water is detected by a resistance tester to determine whether its resistivity meets the standard. If the resistivity is lower than the standard, it means that the ion concentration in the water is relatively high, indicating that there are still residues on the wafer surface that have not been thoroughly cleaned. In this case, such wafers are prohibited from flowing into the next process, and the wafers are rinsed again until the resistivity of the waste deionized water reaches the standard. In this way, the cleaning effect of the wafers can be ensured.

[0015] 2. For this wafer cleaning and drying device, by providing a scraping wall assembly and a connecting assembly for cleaning the side wall of the collection box, the water droplets remaining on the side wall of the collection box due to the surface tension of the deionized water are scraped off, so as to avoid affecting the purity of the waste deionized water collected inside the collection box subsequently. In this way, the accuracy of the resistivity detected by the resistance tester can be ensured, and further the performance of the overall device can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0017] Figure 2 is Figure 1 a schematic enlarged view of the structure at A in

[0018] Figure 3 is an exploded view of the rubber strip structure of the present utility model;

[0019] Figure 4 is Figure 3 a schematic enlarged view of the structure at B in

[0020] Figure 5 is a schematic sectional view of the fixed column structure of the present utility model;

[0021] Figure 6 is a schematic diagram of the collection box structure of the present utility model.

[0022] In the figure: 1. Wafer spin dryer; 2. Collection box; 21. Plug; 3. Resistance tester; 4. Drain pipe; 5. Wall scraping component; 51. Column; 52. First spring; 53. Slide plate; 54. First fixing rod; 55. Loading plate; 56. Ring-shaped water absorbent cotton; 57. Fixing column; 6. Connection component; 61. Connection ring; 62. Connecting rod; 63. Second fixing rod; 64. Rubber ring; 65. Insert block; 66. Movable plate; 67. Second spring. Detailed implementation mode

[0023] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0024] Please refer to Figure 1-6 , a wafer cleaning and spin drying device, including: a wafer spin dryer 1, a drain pipe 4 for discharging the waste deionized water generated by the wafer spin dryer 1, a collection box 2 for collecting the waste deionized water, and a resistance tester 3 for detecting the resistivity of the waste deionized water. A probe in contact with the waste deionized water is also provided on the resistance tester 3. The water outlet of the drain pipe 4 is located inside the chamber of the collection box 2. A plug 21 is also provided on the collection box 2. The plug 21 can ensure that the collection box 2 has the functions of draining and storing water to meet the actual use requirements. A wall scraping component 5 is also provided on the collection box 2. The wall scraping component 5 includes a column 51 fixedly connected to the collection box 2, a slide plate 53 slidably connected to the column 51, a first fixing rod 54 fixedly installed on the bottom surface of the slide plate 53, a fixing column 57 fixedly installed on the bottom surface of the first fixing rod 54, a loading plate 55 fixedly installed on the bottom surface of the fixing column 57, and a ring-shaped water absorbent cotton 56 for removing the residual water droplets on the side wall of the collection box 2; the wall scraping component 5 further includes a first spring 52. The first spring 52 is located in the internal cavity of the column 51, and both ends of the first spring 52 are fixedly connected to the slide plate 53 and the column 51 respectively. The shape of the loading plate 55 is "day" shaped, and the gap between the outer surface of the loading plate 55 and the inner surface of the collection box 2 is filled with the ring-shaped water absorbent cotton 56.

[0025] The loading plate 55 is also provided with a connecting assembly 6, which includes a movable plate 66 slidably arranged inside the fixed column 57, a connecting rod 62 fixedly connected to the movable plate 66, a connecting ring 61 fixedly connected to the connecting rod 62, a second fixed rod 63 fixedly connected to the connecting ring 61, an insert block 65 fixedly installed at the end of the second fixed rod 63, and a rubber ring 64 fixedly installed on the inner side of the annular absorbent cotton 56. The insert block 65 is slidably connected to the loading plate 55, and the insert block 65 is also plugged into the rubber ring 64. The connecting assembly 6 also includes a second spring 67 fixedly connected to the movable plate 66 and the fixed column 57 at both ends. A card slot is provided on the loading plate 55, through which the card slot can be realized. The rubber ring 64 is snap-fitted to the loading plate 55 . The rubber ring 64 itself has a certain elasticity. Therefore, after the shape of the rubber ring 64 is changed, it will automatically return to its original state due to its own elasticity, thereby cooperating with the slot on the loading plate 55 to limit the position of the rubber ring 64 and the annular absorbent cotton 56 on the loading plate 55 . A sliding groove for passing the connecting rod 62 is provided on the fixing column 57 . The two ends of the sliding groove are sealed. The sliding range of the connecting rod 62 and the connecting ring 61 is limited by the sliding groove with a sealing design at both ends, thereby preventing the plug 65 at the end of the second fixing rod 63 from detaching, thereby ensuring the stability of the overall structural design.

[0026] The working principle is to first block the drain outlet of the collection box 2 with the plug 21, so that the collection box 2 can be used to temporarily collect the waste deionized water discharged from the wafer dryer 1 through the drain pipe 4, and then insert the probe of the resistance tester 3 into the deionized water to detect the resistivity of the discharged deionized water to determine whether its resistivity meets the standard. If the resistivity is lower than the standard, the ion concentration in the water is high, which means that there are still residues on the surface of the wafer that have not been thoroughly cleaned. In this case, the wafers are prohibited from flowing into the next process and are re-rinsed until the resistivity of the waste deionized water discharged by the resistance tester 3 reaches the standard.

[0027] When scraping off the residual water droplets on the side wall of the collecting box 2, press down the slide plate 53 that is slidably connected to the column 51, wherein the first fixing rod 54 is fixedly connected to the slide plate 53 and the fixing column 57 respectively, and the fixing column 57 is fixed on the loading plate 55. At this time, the loading plate 55 drops synchronously, and the annular absorbent cotton 56 set around the loading plate 55 can use its own water absorption to quickly absorb the residual water droplets on the side wall of the collecting box 2 during the lowering process of the loading plate 55. After loosening the column 51, the slide plate 53 drives the loading plate 55 and other structures to slide upward and return to the initial position under the action of the fixed connection between the two ends of the slide plate 53 and the column 51 respectively.

[0028] When the annular absorbent cotton 56 absorbs too much water and needs to be replaced, a rubber ring 64 with a certain elasticity is fixed to the inner side of the annular absorbent cotton 56, and the loading plate 55 is provided with a groove that engages with the rubber ring 64. The plug 65 slidably connected to the loading plate 55 is also plugged into the rubber ring 64. Therefore, when the connecting ring 61 is pulled up, under the action of the second fixing rod 63 fixedly connected to the plug 65 and the connecting ring 61 at both ends, the plug 65 slides upward along with the connecting ring 61, so that the plug 65 is separated from the rubber ring 64. At this time, the rubber ring 64 is released from the restriction, and the rubber ring can be removed from the loading plate 55. 64 and the annular absorbent cotton 56, complete the replacement, then loosen the connecting ring 61, and because the movable plate 66 sliding inside the fixed column 57 is fixedly connected to the connecting ring 61 through the connecting rod 62, and the movable plate 66 also uses the second spring 67 to further connect with the fixed column 57, so under the action of the second spring 67, the connecting ring 61, the second fixed rod 63 and the insert block 65 slide downward until the insert block 65 is inserted into the rubber ring 64, and then the position of the rubber ring 64 and the annular absorbent cotton 56 is restricted on the loading plate 55, so as to facilitate the subsequent scraping of residual water droplets on the side wall of the collection box 2.

[0029] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer cleaning and drying device, characterized in that: Including: A wafer spin dryer (1), a drain pipe (4) for discharging the waste deionized water generated by the wafer spin dryer (1), a collection tank (2) for collecting the waste deionized water, and a resistivity tester (3) for detecting the resistivity of the waste deionized water. A scraping wall assembly (5) is further provided on the collection tank (2). The scraping wall assembly (5) includes a column (51) fixedly connected to the collection tank (2), a sliding plate (53) slidably connected to the column (51), a first fixed rod (54) fixedly installed on the bottom surface of the sliding plate (53), a fixed column (57) fixedly installed on the bottom surface of the first fixed rod (54), a loading plate (55) fixedly installed on the bottom surface of the fixed column (57), and an annular absorbent cotton (56) for removing the residual water droplets on the side wall of the collection tank (2); A connection assembly (6) is further provided on the loading plate (55). The connection assembly (6) includes a movable plate (66) slidably disposed inside the fixed column (57), a connecting rod (62) fixedly connected to the movable plate (66), a connecting ring (61) fixedly connected to the connecting rod (62), a second fixed rod (63) fixedly connected to the connecting ring (61), a plug (65) fixedly installed at the end of the second fixed rod (63), and a rubber ring (64) fixedly installed on the inner side of the annular absorbent cotton (56). The plug (65) is slidably connected to the loading plate (55), and the plug (65) is also inserted into the rubber ring (64).

2. The wafer cleaning and drying device according to claim 1, characterized in that: The scraping wall assembly (5) further includes a first spring (52). The first spring (52) is located in the inner cavity of the column (51), and both ends of the first spring (52) are fixedly connected to the sliding plate (53) and the column (51) respectively.

3. The wafer cleaning and drying device according to claim 1, characterized in that: The connection assembly (6) further includes a second spring (67) with both ends fixedly connected to the movable plate (66) and the fixed column (57) respectively.

4. The wafer cleaning and drying device according to claim 1, characterized in that: A card slot is formed on the loading plate (55). Through this card slot, the rubber ring (64) can be detachably connected to the loading plate (55).

5. The wafer cleaning and drying device according to claim 1, characterized in that: A chute for passing through the connecting rod (62) is formed on the fixed column (57), and both ends of the chute are sealed.

6. The wafer cleaning and drying device according to claim 1, characterized in that: The shape of the loading plate (55) is character "日", and the gap between the outer surface of the loading plate (55) and the inner surface of the collection tank (2) is filled with the annular absorbent cotton (56).

7. The wafer cleaning and drying device according to claim 1, characterized in that: The water outlet of the drain pipe (4) is located inside the chamber of the collection tank (2), and a plug (21) is further provided on the collection tank (2).

8. The wafer cleaning and drying device according to claim 1, characterized in that: A probe in contact with the waste deionized water is further provided on the resistivity tester (3).

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