Optical module heat dissipation structure and optical module

Abstract

The utility model relates to the technical field of optical communication, in particular to an optical module heat dissipation structure and an optical module, which comprises a vapor chamber arranged between an upper shell of the optical module and a PCB (printed circuit board), and a plurality of heat dissipation fins which are arranged on the vapor chamber, are vertical to the vapor chamber and are arranged at intervals, and the arrangement gaps of the plurality of heat dissipation fins form a heat dissipation air channel. The lower end of the vapor chamber is provided with heat dissipation bosses corresponding to heat dissipation chips and components on the PCB. According to the utility model, the integrated upper shell is divided into the upper shell and the vapor chamber, so that the upper shell can be used as a general component and is compatible and adaptive to different product schemes, the vapor chamber can be replaced according to different product schemes, the overall structural design process is simplified, and the structural universality is enhanced; the structural characteristics of the vapor chamber are greatly simplified, the yield can be guaranteed, more different materials can be selected for production and processing, and the requirement for higher heat dissipation performance of an optical module product can be met.

Description

Technical Field

[0001] The utility model relates to the technical field of optical communications, and in particular to an optical module heat dissipation structure and an optical module. Background Art

[0002] Driven by the global digitalization and the development of large-model applications brought about by artificial intelligence, the demand for network bandwidth traffic has grown rapidly. As the scale and complexity of AI models increase, the demand for computing power has also increased accordingly. This has directly promoted the rapid growth of investment in high-performance and intelligent computing infrastructure. The demand for high-speed optical modules has also increased significantly, injecting new market vitality into the optical communications industry.

[0003] OSFP is a form of optical module packaging that integrates a heat sink. Compared with other forms of optical modules, it has stronger heat dissipation performance. Therefore, it is increasingly used in high-speed, high-power optical modules. According to the OSFPMSA protocol requirements, the existing OSFP integrated heat sink forms are mainly open top and closed top. Figure 1 The figure shows an optical module using an open top heat sink. The heat sink is integrally formed with the upper housing. Figure 2 The figure shows an optical module using a Closed Top heat sink. The heat sink is mostly made of aluminum extruded heat sink or fin heat sink, and is integrated with the upper shell. The main disadvantages of the above-mentioned OSFP integrated heat sink are: (1) poor versatility. Some optical module products with different solutions have the same appearance and structure, and only the inner cavity of the shell is different. However, the upper shell of the existing optical module is an integrated design, so it is necessary to design a shell mold for different products; (2) it is difficult to meet higher heat dissipation performance requirements. For some high-speed and high-power products, there is a higher heat dissipation performance requirement. The existing optical module shell is generally a one-piece die-cast zinc alloy, and the thermal conductivity of the material itself is low; (3) it is difficult to mass produce. If other materials with high thermal conductivity (such as aluminum alloy, copper alloy, etc.) are used, the production yield will be very low due to the complex product structure. Utility Model Content

[0004] The purpose of the utility model is to provide an optical module heat dissipation structure and an optical module to solve the technical problems of poor versatility of the existing OSFP integrated heat sink, difficulty in meeting higher heat dissipation performance requirements and difficulty in mass production.

[0005] The embodiments of the present utility model are realized through the following technical solutions: a heat dissipation structure of an optical module, including a heat spreader arranged between the upper shell of the optical module and the PCB board, a plurality of heat dissipation ribs located on the heat spreader and arranged perpendicular to the heat spreader and with gaps therebetween, the arrangement gaps of the plurality of heat dissipation ribs forming a heat dissipation air duct, and a heat dissipation boss is provided at the lower end of the heat spreader corresponding to the heat dissipation chips and components on the PCB board.

[0006] According to a preferred embodiment, the contact surface between the heat dissipation boss and the heat dissipation chip and components on the PCB board is provided with heat conductive material.

[0007] According to a preferred embodiment, the plurality of heat dissipation ribs are integrally formed with the upper housing.

[0008] According to a preferred embodiment, the plurality of heat dissipation ribs are integrally formed with the heat spreader.

[0009] According to a preferred embodiment, the heat dissipation ribs are connected to the upper housing by, but not limited to, welding, bonding, or riveting.

[0010] According to a preferred embodiment, the heat dissipation fins are connected to the vapor chamber by, but not limited to, welding, bonding, or riveting.

[0011] According to a preferred embodiment, the heat spreader is connected to the PCB board by, but not limited to, welding, bonding, threaded connection, and spring clip fixation.

[0012] The utility model also provides an optical module, comprising the optical module heat dissipation structure as described above.

[0013] The optical module heat dissipation structure and technical solution of the optical module provided by the present invention have at least the following advantages and beneficial effects: the utility model splits the integrated upper shell into two parts, the upper shell and the heat spreader, so that the upper shell can be used as a universal component, compatible with different product solutions, and the heat spreader can be replaced according to different product solutions, which simplifies the overall structural design process and enhances the structural versatility; the structural features of the heat spreader are greatly simplified, which can ensure the yield, and more different materials can be selected for production and processing, which can meet the higher heat dissipation performance requirements of optical module products. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the structure of the open top optical module;

[0015] Figure 2 This is a schematic diagram of the structure of the closed top optical module;

[0016] Figure 3 This is a schematic diagram of the overall structure of the heat dissipation structure of the optical module provided in Example 6 of the present utility model;

[0017] Figure 4 A schematic diagram of the layout of the heat sink provided in Example 1 of the present utility model;

[0018] Figure 5 A schematic longitudinal cross-sectional view of the heat dissipation structure of an optical module provided in Example 2 of the present utility model;

[0019] Figure 6 A schematic longitudinal cross-sectional view of the heat dissipation structure of an optical module provided in Example 3 of the present utility model;

[0020] Figure 7 Schematic diagram of the connection between the heat dissipation ribs, the heat spreader, and the upper housing provided in Example 4 of the present utility model;

[0021] Figure 8 Schematic diagram of the connection between the heat spreader and the PCB board provided in Example 5 of the present utility model;

[0022] Icons: 1-upper housing, 2-PCB board, 3-heat sink, 301-heat dissipation boss, 4-heat dissipation ribs, 5-heat dissipation duct, 6-heat dissipation chip, 7-thermal conductive material, 8-lower housing, 9-unlock button. DETAILED DESCRIPTION

[0023] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0024] Example 1

[0025] See also Figure 4 This embodiment provides a heat dissipation structure for an optical module, which separates the integrated upper housing 1 into two parts: the upper housing 1 and the heat spreader 3. Figure 4 This is a schematic diagram of the layout of the heat spreader 3; thus, the upper shell 1 can be used as a universal component, compatible with different product solutions, and the heat spreader 3 can be replaced according to different product solutions, which simplifies the overall structural design process and enhances the structural versatility.

[0026] Specifically, the vapor chamber 3 is a separate component, installed between the optical module's upper housing 1 and the PCB 2. A plurality of vertically spaced heat dissipation fins 4 are provided on the top of the vapor chamber 3. These fins 4 are made of aluminum or copper, but this is not a specific limitation. In this embodiment, these fins significantly increase the heat dissipation area of the vapor chamber 3, thereby enhancing the heat dissipation effect.

[0027] In this embodiment, the arrangement gaps between the plurality of heat dissipation fins 4 constitute a heat dissipation duct 5, which carries away the heat conducted from the heat spreader 3 through natural cooling or forced cooling, such as system exhaust / air supply. It should be noted that under natural cooling conditions, the arrangement gaps should not be too small to prevent the thermal boundary layers of adjacent heat dissipation fins 4 from crossing and affecting convective heat transfer. Under forced cooling conditions, the arrangement gaps can take smaller values.

[0028] Furthermore, the structural features of the heat spreader 3 have been greatly simplified, thereby ensuring the production yield; the simpler structural features also allow the heat spreader 3 of this embodiment to be produced and processed using more different materials, meeting the higher heat dissipation performance requirements of the optical module products.

[0029] Specifically, a heat dissipation boss 301 is provided at the lower end of vapor chamber 3, corresponding to the heat dissipation chip 6 and components on PCB 2. In a preferred embodiment, this heat dissipation boss 301 is integrally formed with vapor chamber 3, but this is not a specific limitation and a separate design is also possible. This will not be discussed in detail here. In this embodiment, heat generated by the heat dissipation chip 6 and components on PCB 2 is transferred to vapor chamber 3 via heat dissipation boss 301, which is integrally formed with vapor chamber 3. The heat is ultimately carried away by heat dissipation fins 4 and heat dissipation ducts 5.

[0030] In addition, in this embodiment, the contact surface between the heat dissipation boss 301 and the heat dissipation chip 6 and components on the PCB board 2 is filled with thermal conductive material 7. The thermal conductive material 7 fills the gap between the heat dissipation boss 301 and the heat dissipation chip 6 and components on the PCB board 2, so that the heat dissipation boss 301 can conduct heat normally and accelerate the conduction of heat, thereby preventing local excessive temperature from causing damage to the heat dissipation chip 6 and components on the PCB board 2.

[0031] Example 2

[0032] This embodiment is based on the technical solution provided in Example 1, and further explains the connection relationship between the heat dissipation ribs 4 and the upper shell 1: Figure 5 As shown, in this embodiment, the heat dissipation ribs 4 are arranged on the inner side of the upper shell 1 and are integrally formed with the upper shell 1, and the lower ends of the heat dissipation ribs 4 are in contact with the upper end of the heat spreader 3, taking away the heat from the heat spreader 3 in a close contact manner.

[0033] Example 3

[0034] This embodiment is an alternative to the embodiment 2. Based on the technical solution provided in the embodiment 1, the connection relationship between the heat dissipation ribs 4 and the heat spreader 3 is further described: Figure 6 As shown, in this embodiment, the heat dissipation ribs 4 are located inside the upper shell 1 and are integrally formed with the heat spreader 3 , and the upper ends of the heat dissipation ribs 4 are in contact with the inner wall of the upper shell 1 .

[0035] Example 4

[0036] This embodiment further explains the connection relationship between the heat sink 3 and the upper housing 1:

[0037] See also Figure 7 As shown in the figure on the left, in this embodiment, based on the technical solution provided in Example 3, the heat spreader 3 is connected to the upper shell 1 through the heat dissipation ribs 4 integrally formed therewith by welding, bonding, riveting, or plugging, thereby achieving connection with the upper shell 1, and the connection point is point a in the figure.

[0038] In another alternative embodiment, see Figure 7 As shown in the accompanying figure on the right side, based on the technical solution provided in Example 2, the upper shell 1 is connected to the heat spreader 3 by welding, bonding, riveting, or plugging through the heat dissipation ribs 4 integrally formed therewith, thereby achieving connection with the heat spreader 3, and the connection point is point b in the figure.

[0039] Example 5

[0040] This embodiment further illustrates the connection relationship between the heat sink 3 and the PCB board 2:

[0041] See also Figure 8 As shown in the accompanying figure on the left, in this embodiment, based on the technical solution provided in Example 3, the heat spreader 3 integrally formed with the heat dissipation ribs 4 is connected to the PCB board 2 by, but not limited to, welding, bonding, threaded connection, spring fixation, and snap connection, and the connection point is point c in the figure.

[0042] In another alternative embodiment, see Figure 8 As shown in the figure on the right, based on the technical solution provided in Example 2, the heat spreader 3 designed to be separated from the heat dissipation ribs 4 is connected to the PCB board 2 by, but not limited to, welding, bonding, threaded connection, spring fixation, and snap connection.

[0043] Example 6

[0044] This embodiment provides an optical module based on the technical solution provided in any one of Embodiments 1 to 5; Figure 3 As shown, the optical module includes not only the upper shell 1, the lower shell 8, the PCB board 2 and the unlocking key 9, but also the optical module heat dissipation structure as described in any one of Examples 1 to 5.

[0045] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. An optical module heat dissipation structure, characterized in that: The invention comprises a heat spreader (3) arranged between an upper housing (1) of an optical module and a PCB (2), a plurality of heat dissipation ribs (4) located on the heat spreader (3) and arranged perpendicularly to the heat spreader (3) and with gaps therebetween, wherein the gaps between the heat dissipation ribs (4) form a heat dissipation duct (5), and a heat dissipation boss (301) is provided at the lower end of the heat spreader (3) corresponding to a heat dissipation chip (6) and components on the PCB (2).

2. The optical module heat dissipation structure according to claim 1, wherein: The contact surfaces between the heat dissipation boss (301) and the heat dissipation chip (6) and components on the PCB board (2) are provided with heat conducting material (7).

3. The optical module heat dissipation structure according to claim 2, wherein: The plurality of heat dissipation ribs (4) are integrally formed with the upper housing (1).

4. The optical module heat dissipation structure according to claim 2, wherein: The plurality of heat dissipation ribs (4) and the heat spreader (3) are integrally formed.

5. The optical module heat dissipation structure according to claim 3, wherein: The heat dissipation ribs (4) are connected to the upper shell (1) by, but not limited to, welding, bonding, or riveting.

6. The optical module heat dissipation structure according to claim 4, wherein: The heat dissipation fins (4) are connected to the heat spreader (3) by, but not limited to, welding, bonding, or riveting.

7. The optical module heat dissipation structure according to any one of claims 5 to 6, characterized in that: The heat spreader (3) is connected to the PCB board (2) by, but not limited to, welding, bonding, threaded connection, or spring clip fixation.

8. An optical module, characterized in that: The optical module heat dissipation structure comprises the optical module heat dissipation structure according to any one of claims 1 to 7.

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