Optical module heat dissipation device and electronic equipment

Abstract

The embodiment of the invention provides an optical module heat dissipation device and electronic equipment, and relates to the technical field of optical module heat dissipation. The optical module heat dissipation device comprises a circuit board, an optical mouse cage, a heat dissipation assembly and a liquid separator, the optical mouse cage is provided with a mounting group, the mounting group comprises a plurality of mounting cavities arranged side by side, and the mounting cavities are used for mounting optical modules; the heat dissipation assembly comprises a heat dissipation group corresponding to the installation group, the heat dissipation group comprises a plurality of heat dissipation plates arranged side by side, the heat dissipation plates form the top wall of the installation cavity, and heat exchange runners are arranged in the heat dissipation plates; the liquid separator is arranged on the side, back on to the mounting cavity, of the heat dissipation plates, and the liquid separator communicates with the heat exchange runners of the multiple heat dissipation plates so as to provide a cooling medium for the multiple heat dissipation plates; when the optical module is inserted into the mounting cavity, the optical module is suitable for driving the heat dissipation plate to move towards the liquid separator in the second direction. According to the optical module heat dissipation device, each heat dissipation module independently exchanges heat with the corresponding optical module, so that the heat dissipation uniformity of the optical module is improved.

Description

Technical Field

[0001] The present application relates to the technical field of optical module heat dissipation, and in particular to an optical module heat dissipation device and an electronic device. Background Art

[0002] Optical modules are optoelectronic devices that perform photoelectric and electro-optical conversion. As interface components of switches, they extend the fiber optic transmission capabilities. When inserted into a switch, optical modules generate considerable heat, so a heat sink is required in the switch to dissipate the heat.

[0003] In the prior art, a switch has at least one row of mounting cavities for inserting optical modules. A liquid cooling plate is provided above the row of mounting cavities. The liquid cooling plate is in contact with each optical module inserted into the same row of mounting cavities to achieve heat dissipation.

[0004] However, in the above heat dissipation method, one liquid cooling plate is in contact with multiple optical modules at the same time. The refrigerant in the liquid cooling plate flows through each optical module in turn. From the inlet to the outlet of the liquid cooling plate, the temperature of the refrigerant gradually increases, resulting in poor heat dissipation effect of the optical modules near the outlet. Therefore, the heat dissipation uniformity of multiple optical modules is poor. Summary of the Invention

[0005] The embodiments of the present application provide an optical module heat dissipation device and an electronic device, which are beneficial to ensuring the heat dissipation effect of each optical module in the electronic device and improving the uniformity of heat dissipation of the optical module.

[0006] On the one hand, an embodiment of the present application provides an optical module heat dissipation device, comprising: a circuit board; an optical cage fixed to the circuit board, the optical cage being provided with at least one mounting group, the mounting group comprising a plurality of mounting cavities arranged side by side along a first direction, the mounting cavities being used to mount the optical module; a heat dissipation assembly comprising a heat dissipation group corresponding to the mounting group, the heat dissipation group comprising a plurality of heat dissipation plates arranged side by side along the first direction, the heat dissipation plates corresponding one-to-one to the mounting cavities, the heat dissipation plates being arranged on one side of the mounting cavities along a second direction and constituting a top wall of the mounting cavities, a heat exchange flow channel being provided in the heat dissipation plates, the first direction being perpendicular to the second direction; a liquid dispenser being provided on a side of the heat dissipation plate facing away from the mounting cavity, the liquid dispenser being respectively connected to the heat exchange flow channels of the plurality of heat dissipation plates to provide cooling medium to the plurality of heat dissipation plates; when the optical module is inserted into the mounting cavity, the optical module is adapted to drive the heat dissipation plates to move toward the liquid dispenser along the second direction.

[0007] In one possible embodiment, the heat sink includes: a plate body, the heat exchange channel is formed inside the plate body; two plugs are provided on the side of the plate body facing the liquid distributor, one of the plugs is provided with a liquid inlet hole connected to the heat exchange channel on the inner side, and the other plug is provided with a liquid outlet hole connected to the heat exchange channel on the inner side; the liquid distributor is provided with a liquid supply channel, a liquid return channel and connecting holes corresponding to the plugs one by one, and the plugs are inserted into the corresponding connecting holes so that the liquid inlets of the multiple heat sinks are connected to the liquid supply channel, and the liquid outlet holes of the multiple heat sinks are connected to the return channel, and the plugs are movable along the connecting holes.

[0008] In a possible embodiment, the two plugs are respectively located at the two ends of the heat sink along the third direction; the liquid supply channel and the liquid return channel both extend along the first direction, and the liquid supply channel and the liquid return channel are respectively located at the two ends of the liquid distributor along the third direction.

[0009] In a possible embodiment, at least one of the inner wall of the connecting hole and the outer wall of the plug is provided with a sealing groove, and the optical module heat dissipation device further includes: a sealing ring, which is provided in the sealing groove to seal the gap between the inner wall of the connecting hole and the outer wall of the plug.

[0010] In one possible embodiment, the liquid dispenser includes a liquid supply body and a plug corresponding one-to-one to the plug, the inner side of the plug defines the connection hole, the sealing groove is opened on the inner wall of the plug, the liquid supply body and the plate body are spaced along the second direction and jointly define a floating gap, and the plug is guided and matched with the plug.

[0011] In a possible embodiment, the device further includes an elastic sealing gasket, which is disposed in the floating gap, and two ends of the elastic sealing gasket are respectively in contact with the liquid supply body and the plate body.

[0012] In a possible implementation manner, the elastic sealing gasket is sleeved on the circumference of the plug post.

[0013] In a possible implementation manner, one of the liquid supply body and the plate body is provided with a mounting groove, the mounting groove opens toward the floating gap, and the elastic sealing gasket is clamped in the mounting groove.

[0014] In a possible embodiment, the elastic sealing gasket includes a first side surface facing the liquid supply body and a second side surface facing the plate body, and at least one of the first side surface and the second side surface is provided with sealing feelers distributed along the radial direction of the plug.

[0015] In a possible embodiment, the elastic sealing gasket includes a first sealing portion and a second sealing portion distributed radially along the plug post, the ends of the first sealing portion and the second sealing portion facing the heat sink are flush, the end of the first sealing portion facing the liquid dispenser is higher than the end of the second sealing portion facing the liquid dispenser, when the optical module is not inserted into the installation cavity, the two ends of the first sealing portion respectively abut against the liquid dispenser and the heat sink, and when the optical module is inserted into the installation cavity, the two ends of the first sealing portion and the second sealing portion both abut against the liquid dispenser and the heat sink.

[0016] In a possible implementation manner, end surfaces of the first sealing portion and the second sealing portion facing the liquid dispenser are both formed as arched surfaces.

[0017] In a possible implementation, the heat dissipation plate includes: a first plate body; a second plate body, wherein the second plate body is located on a side of the first plate body facing the installation cavity, and the first plate body and the second plate body jointly define the heat exchange channel.

[0018] In a possible embodiment, the heat dissipation plate further includes: a thermal conductive layer, which covers the surface of the second plate body facing the installation cavity, and the thermal conductive layer includes a phase change plate and a thermal conductive film, and the thermal conductive film wraps the phase change plate, and the thermal conductive film is also connected to the second plate body.

[0019] In a possible implementation manner, the heat-conducting film is a metal film; and / or the heat-conducting film is welded to the second plate.

[0020] In a possible implementation, the installation groups are multiple and stacked along the second direction, and the heat dissipation components and the liquid dispensers both correspond to the installation groups.

[0021] On the other hand, an embodiment of the present application provides an electronic device, comprising any of the above-mentioned optical module heat dissipation devices.

[0022] The optical module heat dissipation device and electronic device provided in the embodiments of the present application are provided with a circuit board, an optical cage, a heat dissipation assembly and a liquid dispenser. The optical cage has an installation group, the installation group includes multiple installation cavities arranged along a first direction, the optical module is installed in the installation cavity, the heat dissipation assembly includes a heat dissipation group, the heat dissipation group includes multiple heat dissipation plates, the heat dissipation plates correspond to the installation cavities one by one and are arranged on the top wall of the installation cavity. When the optical module is installed in the installation cavity, the optical module and the heat dissipation plate are in heat exchange contact, thereby realizing heat dissipation of the optical module. The liquid dispenser is connected to the heat exchange flow channels of each heat dissipation plate in a heat dissipation group and provides cooling medium to multiple heat dissipation plates. In this way, the heat exchange flow channels in each heat dissipation plate are not connected to each other, and the cooling medium circulates independently, which is conducive to ensuring that the heat dissipation effect of the optical modules in each installation cavity is the same, thereby improving the uniformity of heat dissipation of the optical modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0024] Figure 1 A schematic diagram of the structure of the optical module heat dissipation device provided in an embodiment of the present application;

[0025] Figure 2 for Figure 1 Right side view of the heat sink of the optical module;

[0026] Figure 3 for Figure 1 A top view of the heat dissipation device of the optical module;

[0027] Figure 4 for Figure 1 Bottom view of the heat dissipation device of the optical module;

[0028] Figure 5 for Figure 4 AA cross-sectional view of the heat dissipation device of the optical module;

[0029] Figure 6 A perspective view of a liquid dispenser of a heat dissipation device for an optical module provided in an embodiment of the present application;

[0030] Figure 7 A perspective view of the connection between the liquid distributor and the heat dissipation group of the optical module heat dissipation device provided in an embodiment of the present application;

[0031] Figure 8 A perspective view of a heat dissipation plate of a heat dissipation device for an optical module provided in an embodiment of the present application;

[0032] Figure 9 for Figure 8 Right side view of the middle heat sink;

[0033] Figure 10 for Figure 8 BB cross-sectional view of the middle heat sink;

[0034] Figure 11 A schematic diagram of the structure of the elastic sealing gasket of the optical module heat dissipation device provided in an embodiment of the present application;

[0035] Figure 12 for Figure 11 CC cross-sectional view of the elastic sealing gasket;

[0036] Figure 13 A schematic diagram of the partial structure of the elastic sealing gasket of the optical module heat dissipation device provided in an embodiment of the present application.

[0037] Description of reference numerals:

[0038] 100- Optical module heat dissipation device;

[0039] 110-circuit board;

[0040] 120-light mouse cage; 121-installation cavity;

[0041] 130 - heat dissipation assembly; 131 - heat dissipation plate; 1311 - plate body; 1311a - first plate body; 1311a1 - heat exchange channel; 1311b - second plate body; 1312 - plug; 1312a - liquid inlet; 1312b - liquid outlet; 1313 - heat conduction layer;

[0042] 140 - liquid distributor; 141 - liquid supply body; 1411 - liquid supply channel; 1412 - liquid return channel; 1413 - floating gap; 142 - plug column; 1421 - connecting hole; 1422 - sealing groove; 143 - liquid supply pipe; 144 - liquid return pipe;

[0043] 150-seal ring;

[0044] 160 - elastic sealing gasket; 161 - first sealing portion; 162 - second sealing portion.

[0045] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0046] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0047] As explained in the background, conventional switches have at least one row of mounting cavities for optical modules. A liquid cooling plate is positioned above each row of mounting cavities, simultaneously contacting each optical module within the same row to dissipate heat. However, in this heat dissipation approach, a single liquid cooling plate simultaneously contacts multiple optical modules. The refrigerant in the liquid cooling plate flows through each optical module sequentially, gradually increasing in temperature from the plate's inlet to its outlet. This results in poor heat dissipation for optical modules near the outlet, and consequently, poor heat dissipation uniformity across the multiple optical modules.

[0048] In response to the above technical problems, an embodiment of the present application provides an optical module heat dissipation device and an electronic device. The optical module heat dissipation device is provided with a circuit board, an optical cage, a heat dissipation assembly and a liquid dispenser. The optical cage has an installation group, the installation group includes multiple installation cavities arranged along a first direction, the optical module is installed in the installation cavity, the heat dissipation assembly includes a heat dissipation group, the heat dissipation group includes multiple heat dissipation plates, the heat dissipation plates correspond to the installation cavities one by one, and are arranged on the top wall of the installation cavity. When the optical module is installed in the installation cavity, the optical module is in heat exchange contact with the heat dissipation plate, thereby realizing heat dissipation of the optical module. The liquid dispenser is connected to the heat exchange flow channels of each heat dissipation plate in a heat dissipation group, and provides cooling medium to multiple heat dissipation plates. In this way, the heat exchange flow channels in each heat dissipation plate are not connected to each other, and the cooling medium circulates independently, which is conducive to ensuring that the heat dissipation effect of the optical modules in each installation cavity is the same, thereby improving the uniformity of heat dissipation of the optical modules.

[0049] The following specific embodiments are used to describe in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The following embodiments of the present application are described in conjunction with the accompanying drawings:

[0050] It should be noted that the optical module heat dissipation device provided in the embodiments of the present application can be applied to various electronic devices.

[0051] See also Figures 1 to 7As shown, the X direction is the first direction, the Y direction is the second direction, and the Z direction is the third direction. The optical module heat dissipation device 100 of the embodiment of the present application includes: a circuit board 110, an optical cage 120, a heat dissipation assembly 130 and a liquid dispenser 140, wherein the optical cage 120 is fixed to the circuit board 110, and the optical cage 120 is provided with at least one mounting group, the mounting group includes a plurality of mounting cavities 121 arranged side by side along the first direction, and the mounting cavity 121 is used to mount the optical module; the heat dissipation assembly 130 includes a heat dissipation group corresponding to the mounting group, and the heat dissipation group includes a plurality of heat dissipation plates 131 arranged side by side along the first direction, and the heat dissipation plates 131 corresponds to the installation cavity 121 one by one, the heat sink 131 is arranged on one side of the installation cavity 121 along the second direction and constitutes the top wall of the installation cavity 121, a heat exchange channel 1311a1 is provided in the heat sink 131, and the first direction is perpendicular to the second direction; the liquid separator 140 is arranged on the side of the heat sink 131 facing away from the installation cavity 121, and the liquid separator 140 is respectively connected to the heat exchange channels 1311a1 of multiple heat sinks 131 to provide cooling medium to the multiple heat sinks 131; when the optical module is inserted into the installation cavity 121, the optical module is suitable for driving the heat sink 131 to move toward the liquid separator 140 along the second direction.

[0052] In the embodiment of the present application, after the optical module is inserted into the mounting cavity 121, it is electrically connected to the circuit board 110, thereby converting the electrical signal into an optical signal. The optical module generates a large amount of heat during operation, so a heat dissipation assembly 130 is required to dissipate heat to ensure that the optical module operates within a suitable temperature range and to ensure the working efficiency of the optical module. The number of mounting groups can be reasonably set according to the number of optical modules actually required, and the embodiment of the present application does not impose any restrictions on this. The heat dissipation group corresponds to the mounting group one by one, and each heat dissipation plate 131 in the heat dissipation group is located on one side of the mounting cavity 121 of the mounting group along the second direction, and the heat dissipation plate 131 is movable relative to the mounting cavity 121.

[0053] In a specific implementation, before the optical module is inserted into the installation cavity 121, the distance between the heat sink 131 and the bottom wall of the installation cavity 121 can be set to be slightly smaller than the thickness of the optical module along the second direction. When the optical module is inserted into the installation cavity 121, the optical module squeezes the heat sink 131, thereby driving the heat sink 131 to move toward the liquid dispenser 140. This ensures that after the optical module is inserted into the installation cavity 121, the heat sink 131 is in full contact with the optical module, which is beneficial to ensuring the heat dissipation efficiency of the heat sink 131.

[0054] Furthermore, the liquid separator 140 is used to connect with the cooling medium supply device and simultaneously transport the cooling medium to the heat exchange channel 1311a1 of each heat dissipation group. After the cooling medium completes the circulation in the heat exchange channel 1311a1, it is uniformly returned to the cooling medium through the liquid separator 140, thereby completing a heat exchange cycle. In this way, the heat dissipation group is divided into multiple heat dissipation plates 131, each heat dissipation plate 131 is only in heat exchange contact with one optical module, and the cooling medium of each heat dissipation plate 131 is supplied separately, and the heat exchange channels 1311a1 in each heat dissipation plate 131 are not connected to each other, and the cooling medium circulates independently, thereby ensuring that the temperature of the cooling medium in each heat dissipation plate 131 remains basically consistent, which is beneficial to ensuring that the heat dissipation effect of the optical modules in each installation cavity 121 is the same, thereby improving the uniformity of heat dissipation of the optical modules.

[0055] In some possible implementations, see Figures 1 to 8 As shown, the heat dissipation plate 131 of the embodiment of the present application includes: a plate body 1311 and two plugs 1312, wherein the heat exchange channel 1311a1 is formed inside the plate body 1311; the two plugs 1312 are arranged on the side of the plate body 1311 facing the liquid dispenser 140, the inner side of one of the plugs 1312 is provided with a liquid inlet hole 1312a connected to the heat exchange channel 1311a1, and the inner side of the other plug 1312 is provided with a liquid inlet hole 1312a connected to the heat exchange channel 1311a1. The liquid distributor 140 is provided with a liquid supply channel 1411, a liquid return channel 1412, and a connecting hole 1421 corresponding to the plug 1312. The plug 1312 is inserted into the corresponding connecting hole 1421, so that the liquid inlet holes 1312a of the plurality of heat sinks 131 are all connected to the liquid supply channel 1411, and the liquid outlet holes 1312b of the plurality of heat sinks 131 are all connected to the liquid return channel 1412. The plug 1312 is movable along the connecting hole 1421. Figure 7 The direction of the middle arrow is the flow direction of the cooling medium in the optical module heat dissipation device 100 .

[0056] It can be understood that the liquid supply channel 1411 and the liquid return channel 1412 of the liquid distributor 140 are connected to the liquid supply port and the liquid return port of the cooling medium supply device through the liquid supply pipe 143 and the liquid return pipe 144 respectively. The cooling medium enters the liquid supply channel 1411 through the liquid supply port. When it flows through the connecting hole 1421 connected to the liquid inlet hole 1312a, the cooling medium enters the heat sink 131 and flows in the heat exchange channel 131a1 of the heat sink 131 for heat exchange. After the cooling medium in each heat sink 131 completes independent heat exchange, the cooling medium flows into the liquid return channel 1412 through the liquid outlet hole 1312b. As a result, the cooling medium in each heat sink 131 converges in the liquid return channel 1412 and returns to the cooling medium supply device again through the liquid return port, thereby completing the cycle.

[0057] In this way, the cooling medium does not exchange heat before entering the heat exchange channel 1311a1 of the heat sink 131, thereby ensuring that the temperature of the cooling medium entering each heat sink 131 is basically the same, and each heat exchange channel 1311a1 independently circulates the cooling medium, thereby ensuring that the heat dissipation effect of each heat sink 131 is the same, and improving the uniformity of heat dissipation of the optical module. Finally, the cooling medium in each heat sink 131 is uniformly merged into the return liquid channel 1412 and returned to the cooling medium supply device. Only one liquid supply channel 1411 and one return liquid channel 1412 are required to ensure the circulation of the cooling medium of each heat sink 131 in the heat dissipation group. The structure is simple, which is conducive to optimizing the pipeline setting and saving the production cost of the optical module heat dissipation device 100.

[0058] Furthermore, the plug 1312 is movable relative to the connecting hole 1421, and the plug 1312 and the connecting hole 1421 are never separated, thereby ensuring that when the optical module is inserted into the installation cavity 121, the heat sink 131 moves toward the liquid distributor 140 to provide sufficient accommodation space for the optical module without affecting the connection between the plug 1312 and the connecting hole 1421, thereby avoiding leakage.

[0059] In some possible implementations, see Figures 4 to 10 As shown, the two plugs 1312 of the embodiment of the present application are respectively located at the two ends of the heat dissipation plate 131 along the third direction; the liquid supply channel 1411 and the return liquid channel 1412 both extend along the first direction, and the liquid supply channel 1411 and the return liquid channel 1412 are respectively located at the two ends of the liquid distributor 140 along the third direction.

[0060] As a result, the cooling medium can circulate more smoothly in the heat exchange channel 1311a1. The cooling medium enters from one end of the heat sink 131 and flows out from the other end. This can reduce the detour and mixing of the cooling medium in the heat exchange channel 1311a1, which is beneficial to improving the flow efficiency of the coolant. In addition, the supply channel 1411 and the return channel 1412 are arranged at both ends of the liquid separator 140, which can prevent the higher temperature cooling medium in the return channel 1412 from exchanging heat with the lower temperature cooling medium in the supply channel 1411, thereby ensuring the temperature of the cooling medium in the supply channel 1411, which is beneficial to ensuring the heat dissipation efficiency of the heat dissipation group and improving the heat dissipation uniformity.

[0061] In some possible implementations, see Figure 4 、 Figure 5 and Figure 6 As shown, at least one of the inner wall of the connecting hole 1421 and the outer wall of the plug 1312 of the embodiment of the present application is provided with a sealing groove 1422, and the optical module heat dissipation device 100 also includes a sealing ring 150, which is provided in the sealing groove 1422 to seal the gap between the inner wall of the connecting hole 1421 and the outer wall of the plug 1312.

[0062] In some embodiments, the gap between the connecting hole 1421 and the plug 1312 is sealed by the sealing ring 150, which can prevent the cooling medium in the dispenser 140 or the heat sink 131 from leaking out from the connection between the connecting hole 1421 and the plug 1312 when the plug 1312 moves relative to the connecting hole 1421, causing a circuit short circuit and damaging the optical module or other electronic components. This is beneficial to improving the reliability of the optical module heat dissipation device 100 and ensuring the normal operation of the optical module.

[0063] In addition, the sealing ring 150 can play a certain buffering and fixing role while sealing the gap, which can reduce the shaking between the plug 1312 and the connecting hole 1421, improve the stability of the connection between the plug 1312 and the pre-connecting hole 1421, and help to ensure the reliability of the mechanical connection between the heat sink 131 and the dispenser 140.

[0064] In some possible implementations, see Figure 4 、 Figure 5 and Figure 6 As shown, the liquid dispenser 140 of the embodiment of the present application includes a liquid supply body 141 and a plug 142 corresponding one-to-one to the plug 1312, the inner side of the plug 142 defines a connecting hole 1421, and a sealing groove 1422 is opened on the inner wall of the plug 142. The liquid supply body 141 and the plate body 1311 are spaced along the second direction and jointly define a floating gap 1413, and the plug 1312 is guided and matched with the plug 142.

[0065] In a specific implementation, the sealing groove 1422 is opened on the inner wall of the plug 142, and the sealing ring 150 is clamped in the sealing groove 1422, which can prevent the sealing ring 150 from shifting when the plug 142 moves relative to the connecting hole 1421, which is beneficial to ensuring the sealing effect between the plug 1312 and the connecting hole 1421.

[0066] Furthermore, a floating gap 1413 is defined between the liquid supply body 141 and the plate body 1311, which can provide a certain movement space for the heat sink 131 along the second direction, so as to prevent the heat sink 131 from excessively squeezing the liquid supply body 141 when the optical module is inserted into the installation cavity 121, thereby causing damage to the optical module heat dissipation device 100. The guiding cooperation between the plug 1312 and the plug column 142 can limit the movement direction of the heat sink 131. When the optical module is inserted into the installation cavity 121, the heat sink 131 can only move along the second direction, which is beneficial to prevent the heat sink 131 from being misaligned along the first direction or the third direction during the insertion of the optical module, thereby ensuring the stability of the connection between the heat sink 131 and the liquid distributor 140, and improving the reliability and stability of the optical module heat dissipation device 100.

[0067] In some possible implementations, see Figure 4 、 Figure 5 and Figure 6As shown, the embodiment of the present application further includes: an elastic sealing gasket 160, which is disposed in the floating gap 1413, with both ends of the elastic sealing gasket 160 respectively abutting against the liquid supply body 141 and the plate body 1311.

[0068] In a specific implementation, before the optical module is inserted into the installation cavity 121, the elastic sealing gasket 160 abuts against both the liquid supply body 141 and the plate body 1311. After the optical module is inserted into the installation cavity 121, the plate body 1311 moves toward the liquid supply body 141 under the squeezing of the optical module, and the elastic sealing gasket 160 is squeezed, thereby pressing the plate body 1311 tightly against the optical module, which is beneficial to ensuring the contact area between the heat sink 131 and the optical module and improving the heat dissipation efficiency of the heat sink 131. In addition, when the optical module is taken out of the installation cavity 121, the plate body 1311 automatically resets under the action of the elastic force of the elastic sealing gasket 160, without the need for manual intervention, which is beneficial to simplify the installation and maintenance process of the optical module heat dissipation device 100.

[0069] In some possible implementations, see Figure 4 、 Figure 5 and Figure 6 As shown, the elastic sealing gasket 160 of the embodiment of the present application is sleeved on the circumference of the plug post 142 .

[0070] In this way, the elastic sealing gasket 160 and the sealing ring 150 achieve double sealing, which can effectively prevent the cooling medium from leaking out from the connection between the pin 142 and the plug 1312, causing problems such as circuit short circuit, which is beneficial to ensuring the safe and stable operation of the optical module and other electronic components, and improving the stability and reliability of the optical module heat dissipation device 100.

[0071] In some possible implementations, see Figure 4 、 Figure 5 and Figure 6 As shown, one of the liquid supply body 141 and the plate body 1311 of the embodiment of the present application is provided with a mounting groove (not shown in the figure), the mounting groove opens toward the floating gap 1413, and the elastic sealing gasket 160 is clamped in the mounting groove.

[0072] It is understood that the provision of the mounting groove provides a clear mounting position for the elastic sealing gasket 160. When assembling the optical module heat sink 100, the elastic sealing gasket 160 need only be accurately placed into the groove, eliminating the need to repeatedly adjust the position of the elastic sealing gasket 160, thereby improving the assembly efficiency of the optical module heat sink 100. In addition, the elastic sealing gasket 160 being locked in the mounting groove helps to improve the tightness of the connection between the elastic sealing gasket 160 and the liquid supply body 141 or the plate body 1311, prevents the elastic sealing gasket 160 from shifting, and helps to improve the sealing effect of the elastic sealing gasket 160.

[0073] In some possible implementations, see Figure 4 、 Figure 5 and Figure 6 As shown, the elastic sealing gasket 160 of the embodiment of the present application includes a first side facing the liquid supply body 141 and a second side facing the plate body 1311, and at least one of the first side and the second side is provided with sealing tentacles distributed radially along the plug 142.

[0074] In some embodiments, the sealing tentacles can increase the contact area between the elastic sealing gasket 160 and the liquid supply body 141 and the plate body 1311, and at the same time fill any possible tiny gaps, which is beneficial to improving the tightness of the seal. At the same time, the outer surfaces of the liquid supply body 141 and the plate body 1311 may have certain unevenness. The sealing tentacles are elastic and can therefore penetrate into the depressions on the outer surfaces of the liquid supply body 141 and the plate body 1311, thereby improving the continuity and reliability of the seal.

[0075] Furthermore, the sealing tentacles can also play a certain buffering role when the elastic sealing gasket 160 is under pressure, absorbing part of the energy when the liquid dispenser 140 or the heat sink 131 is impacted, thereby protecting the liquid dispenser 140 or the heat sink 131 from damage, which is beneficial to extending the service life of the optical module heat dissipation device 100.

[0076] In some possible implementations, see Figures 4 to 6 and Figures 11 to 13 As shown, the elastic sealing gasket 160 of the embodiment of the present application includes a first sealing portion 161 and a second sealing portion 162 distributed radially along the plug 142, and the ends of the first sealing portion 161 and the second sealing portion 162 facing the heat sink 131 are flush, and the end of the first sealing portion 161 facing the liquid dispenser 140 is higher than the end of the second sealing portion 162 facing the liquid dispenser 140. When the optical module is not inserted into the installation cavity 121, the two ends of the first sealing portion 161 are respectively abutted against the liquid dispenser 140 and the heat sink 131. When the optical module is inserted into the installation cavity 121, the two ends of the first sealing portion 161 and the second sealing portion 162 are both abutted against the liquid dispenser 140 and the heat sink 131.

[0077] In a specific implementation, when the optical module is not inserted into the installation cavity 121, only the first sealing portion 161, the liquid separator 140 and the heat sink 131 form an initial sealing guarantee, which effectively prevents external impurities from entering the connecting hole 1421, and at the same time prevents the cooling medium from overflowing and contaminating or damaging the optical module. When the optical module is inserted into the installation cavity 121, the plug 1312 moves relative to the plug post 142, and the cooling medium is more likely to leak out from the connection between the plug 1312 and the plug post 142. Therefore, the first sealing portion 161 and the second sealing portion 162 are both in contact with the liquid separator 140 and the heat sink 131, thereby enhancing the sealing effect of the elastic sealing gasket 160 and avoiding leakage of the cooling medium, which is beneficial to improving the reliability of the optical module heat dissipation device 100.

[0078] Specifically, the end surfaces of the first sealing portion 161 and the second sealing portion 162 facing the liquid distributor 140 are both formed as arched surfaces.

[0079] In this way, when the optical module is inserted into the installation cavity 121, as the heat sink 131 gradually moves toward the liquid separator 140, the elastic sealing gasket 160 is compressed, and the contact area between the two arched surfaces and the liquid separator 140 gradually increases. On the one hand, the sealing effect of the elastic sealing gasket 160 can be enhanced to ensure that the cooling medium cannot overflow and contaminate or damage the optical module. On the other hand, as the contact area gradually increases, the compression amount of the elastic sealing gasket 160 gradually increases, thereby pressing the heat sink 131 against the optical module and improving the heat dissipation efficiency of the heat sink 131. When the optical module is pulled out of the installation cavity 121, the elastic sealing gasket 160 can also provide a sufficiently large elastic force to drive the elastic sealing gasket 160 to automatically reset.

[0080] In some possible implementations, see Figures 4 to 6 and Figures 11 to 13 As shown, the heat dissipation plate 131 of the embodiment of the present application includes: a first plate body 1311a and a second plate body 1311b, the second plate body 1311b is located on the side of the first plate body 1311a facing the installation cavity 121, and the first plate body 1311a and the second plate body 1311b jointly define a heat exchange channel 1311a1.

[0081] In a specific implementation, the heat exchange channel 1311a1 is directly defined by the first plate 1311a and the second plate 1311b, eliminating the need for additional piping or components. This makes the overall structure of the heat sink 131 more compact, reducing the space occupied by the heat sink 131 and saving production costs. Furthermore, the first plate 1311a and the second plate 1311b can be secured together via bolts, welding, or other methods, simplifying installation and eliminating the need to consider piping layout during assembly, thereby improving the assembly efficiency of the heat sink 131. The second plate 1311b must be constructed of a material with good thermal conductivity to ensure efficient heat exchange between the optical module and the cooling medium.

[0082] For example, one end of the second plate body 1311b facing the opening of the installation cavity 121 can be set as a slope. When the optical module is inserted into the installation cavity 121, the second plate body 1311b is squeezed toward the liquid distributor 140 through the slope, which helps to reduce the resistance of the optical module to the installation cavity 121. Of course, the specific structure of the second plate body 1311b is not limited in the embodiment of the present application, and can be reasonably set according to the shape structure of the optical module.

[0083] In some possible implementations, see Figure 5 、 Figure 8 、 Figure 9 and Figure 10 As shown, the heat dissipation plate 131 of the embodiment of the present application also includes a thermal conductive layer 1313, which covers the side surface of the second plate body 1311b facing the installation cavity 121. The thermal conductive layer 1313 includes a phase change plate and a thermal conductive film. The thermal conductive film wraps the phase change plate, and the thermal conductive film is also connected to the second plate body 1311b.

[0084] It should be noted that the phase change sheet is solid at room temperature and liquid at elevated temperatures. Therefore, during the transition between solid and liquid phases, the sheet can absorb and release significant amounts of heat to regulate temperature. Since the sheet is solid at room temperature, when installing the thermally conductive layer 1313, the sheet can be directly mounted on the second plate 1311b. The thermally conductive film can be used to define the sheet's position and prevent it from falling off. No additional filling or coating is required, making installation easy.

[0085] In specific implementation, when the temperature of the optical module rises, the phase change plate is converted into liquid. At this time, the thermal conductive layer 1313 can be deformed according to the shape of the optical module, thereby filling the tiny gap between the second plate 1311b and the optical module, adapting to the unevenness of the second plate 1311b and the surface of the optical module, forming a better heat conduction path, which is beneficial to reducing the contact thermal resistance and improving the overall heat dissipation performance of the heat sink 131.

[0086] Furthermore, the performance degradation of the phase change plate is small during repeated phase changes, and the stable heat conduction efficiency can be maintained for a long time, which is beneficial to extending the service life of the optical module heat dissipation device 100.

[0087] In some possible implementations, see Figure 5 、 Figure 8 、 Figure 9 and Figure 10 As shown, the thermally conductive film in the embodiment of the present application is a metal film and the thermally conductive film is welded to the second plate 1311 b.

[0088] As will be appreciated, metal has a high thermal conductivity coefficient. Using a metal film as the thermally conductive film can quickly transfer heat from the optical module to the phase change plate, thereby improving the heat dissipation efficiency of the optical module heat dissipation device 100. Furthermore, the thermally conductive film is welded to the second plate 1311b, which helps to improve the connection strength between the thermally conductive film and the second plate 1311b, thereby preventing the phase change plate from falling off and improving the stability and reliability of the optical module heat dissipation device 100.

[0089] In some possible implementations, see Figures 1 to 4 As shown, the installation groups of the embodiment of the present application are multiple and stacked along the second direction, and the heat dissipation components 130 and the liquid dispenser 140 both correspond to the installation groups.

[0090] In some embodiments, the installation groups are set to be multiple and arranged along the second direction, which is conducive to making full use of the vertical space, reducing the space occupied by the optical module heat dissipation device 100 in the horizontal direction, and optimizing the spatial layout. At the same time, each group of heat dissipation components 130, liquid dispenser 140 and installation group acts as an independent module. When the heat dissipation component 130, liquid dispenser 140 or installation group in one of the modules fails, it will not affect the normal operation of other modules. Only the damaged part needs to be replaced or repaired, which is conducive to improving the maintainability and reliability of the optical module heat dissipation device 100.

[0091] See also Figure 1 As shown, an embodiment of the present application further provides an electronic device, comprising any of the above-mentioned optical module heat dissipation devices 100 .

[0092] The structure and working principle of the optical module heat dissipation device 100 are described in detail in the above embodiments, and will not be repeated here.

[0093] In the embodiment of the present application, by using the above-mentioned optical module heat dissipation device 100, it can be ensured that all optical modules in the electronic device operate within a suitable temperature range, which is beneficial to ensuring the working efficiency of the electronic device and improving the reliability of the electronic device.

[0094] In summary, the embodiment of the present application provides an optical module heat dissipation device 100 and an electronic device, wherein the optical module includes a circuit board 110, an optical cage 120, a heat dissipation assembly 130, and a liquid dispenser 140. The optical cage 120 includes a plurality of mounting groups stacked along the second direction, and the mounting group has a plurality of mounting cavities 121 arranged along the first direction. The heat dissipation assembly 130 includes a plurality of heat dissipation groups, and the heat dissipation groups and the liquid dispenser 140 correspond to the mounting groups. The heat dissipation group includes a plurality of heat dissipation plates 131, and the heat dissipation plates 131 form the top wall of the mounting cavity 121. After the optical module is inserted into the mounting cavity 121, the heat dissipation plates 131 are in heat exchange contact with the optical module, and the liquid dispenser 140 supplies the cooling medium in the device. The cooling medium is injected into the heat sink 131 in sequence through the liquid supply channel 1411. After the cooling medium circulates heat independently in each heat sink 131, it is collectively merged into the return liquid channel 1412 of the liquid separator 140 and returned to the cooling medium supply device through the return liquid channel 1412. In this way, the cooling medium does not undergo heat exchange before entering each heat sink 131, thereby ensuring that the temperature of the cooling medium entering each heat sink 131 remains basically consistent. Each heat sink 131 independently exchanges heat for each optical module, and the heat sinks 131 do not interfere with each other, which is conducive to ensuring the uniformity of heat dissipation of the optical module, ensuring that each optical module is effectively cooled, and thus ensuring the working efficiency of the electronic equipment.

[0095] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0096] In the embodiments of the present application, any device or element referred to or implied must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise specifically specified.

[0097] The terms "first," "second," "third," "fourth," and so on (if any) in the description and claims of the embodiments of the present application and the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the present application described herein, for example, can be implemented in an order other than those illustrated or described herein.

[0098] In addition, the terms "comprises" and "having" and any variations thereof are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, product or apparatus.

[0099] The term "plurality" in this document refers to two or more. The term "and / or" in this document simply describes an association between related objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, or B exists alone.

[0100] It will be understood that the various numerical numbers involved in the embodiments of the present application are merely distinctions for the convenience of description and are not intended to limit the scope of the embodiments of the present application.

[0101] It can be understood that in the embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0102] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of the present application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, and the true scope and spirit of the present application are indicated by the following claims.

[0103] It should be understood that the present application is not limited to the exact structure described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. An optical module heat dissipation device (100), characterized in that: include: a circuit board (110); An optical cage (120) is fixed to the circuit board (110), the optical cage (120) being provided with at least one mounting group, the mounting group comprising a plurality of mounting cavities (121) arranged side by side along a first direction, the mounting cavities (121) being used for mounting optical modules; A heat dissipation assembly (130) comprising a heat dissipation group corresponding to the installation group, the heat dissipation group comprising a plurality of heat dissipation plates (131) arranged side by side along the first direction, the heat dissipation plates (131) corresponding one to the installation cavity (121), the heat dissipation plates (131) being arranged on one side of the installation cavity (121) along the second direction and constituting the top wall of the installation cavity (121), a heat exchange flow channel (1311a1) being provided in the heat dissipation plates (131), and the first direction being perpendicular to the second direction; A liquid separator (140) is provided on a side of the heat sink (131) facing away from the mounting cavity (121), and the liquid separator (140) is respectively connected to the heat exchange channels (1311a1) of the plurality of heat sinks (131) to provide cooling medium to the plurality of heat sinks (131); When the optical module is inserted into the installation cavity (121), the optical module is suitable for driving the heat dissipation plate (131) to move toward the liquid dispenser (140) along the second direction.

2. The optical module heat dissipation device (100) according to claim 1, characterized in that: The heat dissipation plate (131) comprises: A plate body (1311), wherein the heat exchange channel (1311a1) is formed inside the plate body (1311); Two plugs (1312) are provided on a side of the plate body (1311) facing the liquid dispenser (140), wherein a liquid inlet (1312a) communicating with the heat exchange channel (1311a1) is provided on the inner side of one of the plugs (1312), and a liquid outlet (1312b) communicating with the heat exchange channel (1311a1) is provided on the inner side of the other plug (1312); The liquid distributor (140) is provided with a liquid supply channel (1411), a liquid return channel (1412), and connection holes (1421) corresponding to the plugs (1312) one by one. The plugs (1312) are inserted into the corresponding connection holes (1421), so that the liquid inlet holes (1312a) of the plurality of heat sinks (131) are all connected to the liquid supply channel (1411), and the liquid outlet holes (1312b) of the plurality of heat sinks (131) are all connected to the liquid return channel (1412). The plug (1312) is movable along the connecting hole (1421).

3. The optical module heat dissipation device (100) according to claim 2, characterized in that: The two plugs (1312) are respectively located at two ends of the heat dissipation plate (131) along the third direction; The liquid supply channel (1411) and the liquid return channel (1412) both extend along the first direction, and the liquid supply channel (1411) and the liquid return channel (1412) are respectively located at two ends of the liquid distributor (140) along the third direction.

4. The optical module heat dissipation device (100) according to claim 2, characterized in that: At least one of the inner wall of the connection hole (1421) and the outer wall of the plug (1312) is provided with a sealing groove (1422). The optical module heat dissipation device (100) further comprises: a sealing ring (150), wherein the sealing ring (150) is arranged in the sealing groove (1422) to seal the gap between the inner wall of the connection hole (1421) and the outer wall of the plug (1312).

5. The optical module heat dissipation device (100) according to claim 4, characterized in that: The liquid dispenser (140) includes a liquid supply body (141) and a plug (142) corresponding one-to-one to the plug (1312), the inner side of the plug (142) defines the connecting hole (1421), the sealing groove (1422) is opened on the inner wall of the plug (142), the liquid supply body (141) and the plate body (1311) are spaced along the second direction and jointly define a floating gap (1413), and the plug (1312) and the plug (142) are guided and matched.

6. The optical module heat dissipation device (100) according to claim 5, characterized in that: Also includes: An elastic sealing gasket (160) is provided in the floating gap (1413), and two ends of the elastic sealing gasket (160) are respectively in contact with the liquid supply body (141) and the plate body (1311).

7. The optical module heat dissipation device (100) according to claim 6, characterized in that: The elastic sealing pad (160) is sleeved on the peripheral side of the plug post (142).

8. The optical module heat dissipation device (100) according to claim 6, characterized in that: One of the liquid supply body (141) and the plate body (1311) is provided with a mounting groove, the mounting groove opens toward the floating gap (1413), and the elastic sealing gasket (160) is clamped in the mounting groove.

9. The optical module heat dissipation device (100) according to claim 6, characterized in that: The elastic sealing gasket (160) includes a first side surface facing the liquid supply body (141) and a second side surface facing the plate body (1311). At least one of the first side surface and the second side surface is provided with sealing tentacles distributed along the radial direction of the plug post (142).

10. The optical module heat dissipation device (100) according to claim 6, characterized in that: The elastic sealing gasket (160) comprises a first sealing portion (161) and a second sealing portion (162) distributed along the radial direction of the plug post (142). The ends of the first sealing portion (161) and the second sealing portion (162) facing the heat dissipation plate (131) are flush with each other, and the end of the first sealing portion (161) facing the liquid dispenser (140) is higher than the end of the second sealing portion (162) facing the liquid dispenser (140). When the optical module is not inserted into the mounting cavity (121), the two ends of the first sealing portion (161) abut against the liquid dispenser (140) and the heat dissipation plate (131), respectively. When the optical module is inserted into the mounting cavity (121), the two ends of the first sealing portion (161) and the second sealing portion (162) abut against the liquid dispenser (140) and the heat dissipation plate (131).

11. The optical module heat dissipation device (100) according to claim 10, characterized in that: The end surfaces of the first sealing portion (161) and the second sealing portion (162) facing the liquid dispenser (140) are both formed as arched surfaces.

12. The optical module heat dissipation device (100) according to any one of claims 1 to 11, characterized in that: The heat dissipation plate (131) comprises: a first plate (1311a); A second plate body (1311b), the second plate body (1311b) is located on a side of the first plate body (1311a) facing the installation cavity (121), and the first plate body (1311a) and the second plate body (1311b) jointly define the heat exchange flow channel (1311a1).

13. The optical module heat dissipation device (100) according to claim 12, characterized in that: The heat dissipation plate (131) further comprises: A heat-conducting layer (1313), the heat-conducting layer (1313) covers a surface of the second plate body (1311b) facing the installation cavity (121), the heat-conducting layer (1313) comprises a phase change plate and a heat-conducting film, the heat-conducting film wraps the phase change plate, and the heat-conducting film is also connected to the second plate body (1311b).

14. The optical module heat dissipation device (100) according to claim 13, characterized in that: The heat-conducting film is a metal film; and / or the heat-conducting film is welded to the second plate (1311b).

15. The optical module heat dissipation device (100) according to any one of claims 1 to 11, characterized in that: The installation group is a plurality of devices stacked and arranged along the second direction, and the heat dissipation assembly (130) and the liquid dispenser (140) both correspond to the installation group.

16. An electronic device, characterized in that: The optical module heat dissipation device (100) comprises any one of claims 1-15.

Images