Two-channel temperature control system for wafer manufacturing

Abstract

The utility model relates to the related technical field of wafer manufacturing, in particular to a double-channel temperature control system for wafer manufacturing, which comprises a double-channel temperature control device, the double-channel temperature control device is connected with first equipment, and the double-channel temperature control device is connected with a second temperature controller. According to the dual-channel temperature control system for wafer manufacturing, the temperature control equipment can simultaneously acquire temperature information of a plurality of connecting equipment by arranging a plurality of input units and a plurality of processing units, so that the working efficiency of the temperature control equipment is improved, the cost of a user is reduced, the number of corollary equipment in the wafer production and processing process is reduced, and the production cost is reduced. The circuit arrangement of the semiconductor equipment is optimized, the temperature control equipment can simultaneously and respectively carry out instruction information sending control on a plurality of connecting equipment by arranging a plurality of output channel units, and the instruction information can be respectively output to the same equipment through the plurality of output channel units; and the mode of the output connection equipment state information of the temperature control equipment is expanded.

Description

Technical Field

[0001] The present invention relates to the technical field of underwear technology, and in particular to a dual-channel temperature control system for wafer manufacturing. Background Art

[0002] Temperature is one of the important parameters in industrial production, especially in the wafer manufacturing process, where temperature affects the quality and yield of wafer manufacturing. With the vigorous development of the domestic semiconductor and integrated circuit industries, slight unexpected temperature deviations in wafer production and processing will seriously damage the consistency of wafer performance, resulting in a decrease in yield. In the wafer manufacturing process, each link has different requirements for the operating temperature of semiconductor equipment. During the working process of semiconductor equipment, dedicated temperature monitoring equipment is required to obtain real-time temperature. The sensor is connected to the semiconductor equipment and obtains semiconductor equipment data information. The sensor can be one or more of a thermocouple, a thermistor or a potentiometer, and can be one or more of an infrared sensor, a thermal imager, and an infrared fiber optic thermometer. The sensor converts the obtained temperature information or current information into the corresponding temperature and sends it to the temperature control device to realize the simultaneous acquisition of temperature information of multiple connected devices, and sends corresponding instruction information based on the temperature information of the connected devices, so that the same temperature control device can control multiple semiconductor devices. By setting up dual channels, dual-channel temperature information processing of the temperature control device in this case can be achieved. That is, the characteristic of this case is that it can realize the separate control of multiple connected devices and the simultaneous output of multi-channel command signals for a single device. Therefore, there is a special need for a dual-channel temperature control system for wafer manufacturing.

[0003] However, existing temperature control equipment can only adjust the temperature of a single semiconductor device, which cannot meet the current situation of simultaneous temperature adjustment of multiple semiconductor devices. At the same time, it cannot intelligently and uniformly manage the command information and status information of a single device. Utility Model Content

[0004] The purpose of the present utility model is to provide a dual-channel temperature control system for wafer manufacturing, so as to solve the problem that the existing temperature control equipment proposed in the above background technology can only adjust the temperature of a single semiconductor device, cannot meet the current situation of simultaneous temperature adjustment of multiple semiconductor devices, and cannot intelligently and uniformly manage the instruction information and status information of a single device.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a dual-channel temperature control system for wafer manufacturing, comprising a dual-channel temperature control device, wherein the dual-channel temperature control device is connected to a first device, the dual-channel temperature control device is connected to a second device, the dual-channel temperature control device is connected to a first temperature controller, and the dual-channel temperature control device is connected to a second temperature controller.

[0006] Preferably, the dual-channel temperature control system includes a first processing unit, the first processing unit is connected to the second processing unit, the first processing unit is connected to the first output channel unit and the second output channel unit, and the second processing unit is connected to the third output channel unit and the fourth output channel unit.

[0007] Preferably, the dual-channel temperature control device includes an input module, a processing module, a communication module and an output module, and the dual-channel temperature control system includes a human-computer interaction module, and the human-computer interaction module includes an instruction control unit and an information display unit. The instruction control unit is used to receive user instructions, and the information display unit is used to display the status information and alarm information of the equipment.

[0008] Preferably, the dual-channel temperature control system includes an input module, which includes a first input unit and a second input unit. The first input unit and the second input unit are respectively connected to different sensors and can simultaneously receive data information sent by the sensors. The data information transmitted by the sensors can be current information or temperature information.

[0009] Preferably, the dual-channel temperature control system includes an output module, and the output module includes a first output channel unit, a second output channel unit, a third output channel unit and a fourth output channel unit. The output module may include more output channel units.

[0010] Preferably, the processing module includes a first processing unit and a second processing unit, the first processing unit is connected to the first input unit, the second processing unit is connected to the second input unit, and the first processing unit is connected to the second processing unit.

[0011] Preferably, the dual-channel temperature control system includes a processing module, and the processing module is connected to the human-computer interaction module, the input module, the communication module and the output module respectively.

[0012] Preferably, the dual-channel temperature control system includes a first output channel unit, the first output channel unit, the second output channel unit, the third output channel unit and the fourth output channel unit can be connected to the same sensor or to different sensors at the same time, and the first processing unit is connected to the second processing unit.

[0013] Preferably, the dual-channel temperature control system includes a first processing unit, the first processing unit is connected to the second processing unit, the first processing unit is connected to the first output channel unit and the second output channel unit, and the second processing unit is connected to the third output channel unit and the fourth output channel unit.

[0014] Compared with the prior art, the beneficial effects of the present invention are:

[0015] 1. By setting up multiple input units and multiple processing units, the temperature control equipment can simultaneously obtain the temperature information of multiple connected devices, thereby improving the working efficiency of the temperature control equipment, reducing the user's cost, reducing the number of supporting equipment in the wafer production and processing process, and optimizing the circuit layout of the semiconductor equipment.

[0016] 2. By setting up multiple output channel units, the temperature control device can simultaneously send and control command information to multiple connected devices separately, and output command information to the same device through multiple output channel units separately, thereby expanding the way the temperature control device outputs the status information of the connected devices, while improving the working efficiency of the temperature control device and stabilizing the accuracy of the command information output by the temperature control device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the output, processing and input structure of the new utility model;

[0019] Figure 3 This is a schematic diagram of the upper structure of the system of the utility model;

[0020] Figure 4 This is a schematic diagram of the lower structure of the system of the utility model. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] See also Figure 1-4 The utility model provides a technical solution: a dual-channel temperature control system for wafer manufacturing, including a dual-channel temperature control device, the dual-channel temperature control device is connected to a first device, the dual-channel temperature control device is connected to a second device, the dual-channel temperature control device is connected to a first temperature controller, and the dual-channel temperature control device is connected to a second temperature controller. Through the setting of the dual-channel temperature control device, the control effect is better. After the connection of the devices is completed, the temperature information of the first device and the second device is obtained, and instruction information is sent to the first device and the second device based on the temperature information. The first device can be a semiconductor device or a wafer. The obtained temperature information can be the temperature information of the semiconductor device or the temperature information of the wafer.

[0023] Furthermore, the dual-channel temperature control system includes a first processing unit, the first processing unit is connected to the second processing unit, the first processing unit is connected to the first output channel unit and the second output channel unit, and the second processing unit is connected to the third output channel unit and the fourth output channel unit. The use effect is better through the connection between the first processing unit and the second processing unit, and the connection effect is better.

[0024] Furthermore, the dual-channel temperature control device includes an input module, a processing module, a communication module and an output module. The dual-channel temperature control system includes a human-computer interaction module, which includes an instruction control unit and an information display unit. The instruction control unit is used to receive user instructions and the information display unit is used to display the status information and alarm information of the equipment. Through the setting of the human-computer interaction module, the effect is more convenient.

[0025] Furthermore, the dual-channel temperature control system includes an input module, which includes a first input unit and a second input unit. The first input unit and the second input unit are respectively connected to different sensors and can simultaneously receive data information sent by the sensors. The data information transmitted by the sensors can be current information or temperature information. Through the setting of the sensors, the data information can be transmitted.

[0026] Furthermore, the dual-channel temperature control system includes an output module, which includes a first output channel unit, a second output channel unit, a third output channel unit and a fourth output channel unit. The output module may include more output channel units, and data can be output through the setting of the first output channel unit.

[0027] Furthermore, the processing module includes a first processing unit and a second processing unit. The first processing unit is connected to the first input unit, the second processing unit is connected to the second input unit, and the first processing unit is connected to the second processing unit. Through the setting of the first processing unit and the second processing unit, the data can be sorted faster.

[0028] Furthermore, the dual-channel temperature control system includes a processing module, which is respectively connected to the human-computer interaction module, the input module, the communication module and the output module. Through the setting of the processing module, the data processing effect is better. The first output channel unit, the second output channel unit, the third output channel unit and the fourth output channel unit can output different command signals at the same time. The processing module can select the corresponding output channel unit according to the user's setting to output the command signal respectively. For example, the first input unit is connected to the first device, the first output channel unit and the second output channel unit respectively output the command information of the first device, the second input unit is connected to the second device, the third output channel unit and the fourth output channel unit respectively output the command information of the first device. The units output the instruction information of the second device respectively, and the instruction information between different output units can be output simultaneously, where the instruction information may include shutdown, heating, cooling, alarm or event notification. That is, when the first device needs to be controlled to stop working due to its own reasons, the dual-channel temperature control device disclosed in this case obtains the status information of the first device through the first input unit, the processing module identifies the status information, and confirms the corresponding instruction information, controls the first output channel unit to send the shutdown instruction information to the first device, and controls the second output channel unit to send the event notification instruction information to the external device, thereby realizing the simultaneous output of different instruction information, making it convenient for users to obtain the status information of the semiconductor device connected to the temperature control device in a timely manner.

[0029] Furthermore, the dual-channel temperature control system includes a first output channel unit. The first output channel unit, the second output channel unit, the third output channel unit and the fourth output channel unit can be connected to the same sensor and can also be connected to different sensors at the same time. The first processing unit is connected to the second processing unit. Through the connection of the first output channel unit, the second output channel unit, the third output channel unit and the fourth output channel unit, the sensor can better transmit data. The first output channel unit is connected to the device itself, and the second output channel unit is an alarm signal. The first input unit sends the temperature information of the first device to the first processing unit. The first processing unit identifies the temperature information. The first processing unit confirms that the first device needs to be heated based on the temperature information, and then controls the first output channel unit to output the heating instruction information to the first device, and controls the second output channel unit to display the heating signal instruction. The same instruction signal content is displayed through different channels, which is convenient for users to obtain the instruction information executed by the first device in a timely manner.

[0030] Furthermore, the dual-channel temperature control system includes a first processing unit, the first processing unit is connected to the second processing unit, the first processing unit is connected to the first output channel unit and the second output channel unit, the second processing unit is connected to the third output channel unit and the fourth output channel unit. Through the setting of the first processing unit, the processing effect is better, the first output channel unit is connected to the device itself, the second output channel unit is connected to the external device, the third output channel unit is an alarm signal, the first input unit is connected to the first device, the first input unit obtains the temperature information of the first device, the first processing unit identifies the temperature information, the first processing unit confirms that the first device needs to be cooled according to the temperature information, then controls the first output channel unit to output the cooling instruction information to the first device, controls the second output channel unit to send the cooling status information to the external device, controls the third output channel unit to display the cooling signal instruction, and performs the same instruction information in different ways through multiple output channel units. Output, the dual-channel temperature control device sends the instruction information output mode of the first output channel unit, the second output channel unit, the third output channel unit, and the fourth output channel unit to the upper computer device. The dual-channel temperature control device receives the user's setting instructions, and based on the instruction information, confirms the instruction information of the corresponding output channel unit to output the corresponding device. The dual-channel temperature control device can be remotely controlled through the communication module. By setting multiple information interaction modules, modular management of the dual-channel temperature control device can be achieved. Users can set the corresponding instruction information output mode according to the information of the connected device. The wafer processing production process is completed by multiple devices and multiple processes. Therefore, in the wafer processing production process, it is necessary to simultaneously control the working temperature of multiple devices and control the working temperature of different process stages. Therefore, the dual-channel temperature control device disclosed in this case can be based on modular settings. When a problem occurs in one of the channels, other channels can be used to connect the devices, thereby improving the adaptability of the temperature control device.

[0031] Working principle: The first input unit and the second input unit in the input module are respectively connected to different sensors. These sensors can be thermocouples, thermistors, potentiometers, etc., which can obtain the temperature information of semiconductor devices or wafers and convert them into electrical signals for transmission to the processing module. These sensors can work simultaneously, so that the system can obtain the temperature information of multiple connected devices at the same time, providing a data basis for precise temperature control. The first processing unit is connected to the first input unit, receives the temperature information from the first device, and identifies and analyzes it. The second processing unit is connected to the second input unit, and performs similar processing on the temperature information of the second device. The two processing units are connected to each other to realize information sharing and collaborative processing. For example, when the first processing unit When it is recognized that the temperature of the first device needs to be adjusted, it will generate corresponding instruction information, such as heating or cooling instructions, according to preset algorithms and rules, and pass these instructions to the corresponding output channel units. The output module includes a first output channel unit, a second output channel unit, a third output channel unit, and a fourth output channel unit. They can output different instruction signals at the same time. These instruction signals may include shutdown, heating, cooling, alarm or event notification, etc. For example, when the first device needs to be heated, the first output channel unit will send the heating instruction information to the first device, and the second output channel unit may send the heating status information to the external device, or notify the user by displaying a specific signal. Such a multi-channel output method is not only convenient The user can obtain the status information of the device in a timely manner and ensure the accurate transmission and execution of the instruction information. The communication module is connected to the host computer device, so that the dual-channel temperature control device can send the instruction information output mode of each output channel unit to the host computer device, and can also receive the user's setting instructions. Through the communication module, the user can realize remote control of the dual-channel temperature control device, monitor the operating status and temperature data of the device in real time, and adjust and optimize it as needed. The human-computer interaction module includes an instruction control unit and an information display unit. The instruction control unit is used to receive the user's instruction information. The user can set the device's working parameters, control mode, etc. through this unit. The information display unit is used to display the device's status information and alarm information, allowing the user to intuitively Understand the operation status of the equipment and promptly discover and handle any abnormal situations. The wafer processing production process usually involves multiple equipment and processes, and precise temperature control is required for different equipment at different process stages. The advantage of the dual-channel temperature control system is that it can monitor and control the temperature of multiple devices at the same time, thereby improving the working efficiency of the temperature control equipment. For example, the first input unit is connected to the first device and obtains its temperature information. The first processing unit generates corresponding instruction information according to the temperature information, such as a heating instruction, and then sends the instruction to the first device through the first output channel unit to achieve temperature adjustment of the first device. At the same time, the second input unit is connected to the second device to perform a similar temperature monitoring and control process, thereby achieving simultaneous control of multiple devices.When a problem occurs in one channel, other channels can be used to connect the equipment, which improves the adaptability of the temperature control equipment. Moreover, by setting up multiple information interaction modules, modular management of dual-channel temperature control equipment is realized. Users can set the corresponding instruction information output method according to the specific information of the connected equipment to meet the needs of different production scenarios. In general, the dual-channel temperature control system for wafer manufacturing realizes precise control of the temperature in the wafer manufacturing process through precise temperature monitoring, intelligent processing and analysis, and diversified instruction output. It not only improves the production quality and yield of wafers, but also reduces user costs, reduces the number of supporting equipment in the wafer production and processing process, and optimizes the circuit layout of semiconductor equipment. Sensors can directly Thermocouples use the thermoelectric effect between different metals to convert temperature differences into measurable voltage signals. Resistance temperature detectors (RTDs) reflect temperature values based on the linear change of resistance with temperature. Thermistors also rely on the temperature characteristics of resistance, but usually have higher sensitivity. These diverse input sensors ensure that the system can obtain temperature data from different angles and levels of accuracy. Whether it is a small temperature fluctuation or a large temperature range change, it can be accurately sensed. The collected temperature data is quickly transmitted to the processing module, which is the "brain" of the entire system. The core component of the processing module, the PID controller, begins to play a key role. The PID controller uses proportional The proportional link (P), integral link (I) and differential link (D) work together to accurately calculate and analyze the input temperature signal. The proportional link quickly generates a preliminary control output based on the current temperature deviation to quickly respond to temperature changes. The integral link accumulates past temperature deviations to eliminate steady-state errors and ensure that the system can reach and maintain the set temperature during long-term operation. The differential link predicts the temperature change trend and adjusts the control output in advance to enhance the stability and response speed of the system. In the output module, the system shows the characteristics of diversity and flexibility. Multiple channels such as output 1, output 2 and output 3 each undertake different but mutually cooperative tasks. The heating function is achieved through specific components such as mechanical relays or It is achieved by a solid-state relay (ASSR). When the temperature is lower than the set value, the heating channel is activated and a command is sent to the heating equipment to increase the heat output, thereby raising the ambient temperature. The cooling function is activated when the temperature is too high. The excess heat may be removed by fans, refrigerators or coolant circulation systems to quickly reduce the temperature. The alarm function is an important safety guarantee for the system. When the temperature exceeds the preset safety range, or the system detects equipment failure, sensor abnormality and other problems, the alarm module will immediately send out sound and light signals or send alarm information to relevant personnel through the communication interface. The duplex function allows the system to quickly switch between two different temperature control modes or tasks to adapt to the needs of different stages or processes in the wafer manufacturing process.The event function can trigger corresponding control actions according to preset specific conditions or events, such as starting specific auxiliary equipment or adjusting the production process when a certain temperature threshold is reached. The communication function is the key to the system's intelligentization and remote monitoring. The RTU / TCP communication protocol enables efficient data exchange with various controllers, programmable logic controllers (PLCs), personal computers (PCs), or human-machine interfaces (HMIs). This means that operators can monitor temperature data, control parameters, and system status in real time at remote terminals, and perform remote operations and adjustments. Support for multiple communication methods such as Devicenet, EtherNet / IP, and Profibus further enhances the system's compatibility and scalability, enabling it to be easily integrated into complex industrial automation networks. In the specific architecture of the system, the first input unit and the second input unit collect temperature information from different locations and links. This information may come from different parts of the wafer manufacturing equipment, such as the inside of the heating furnace, the wafer surface, and the cooling pipe. The first processing unit and the second processing unit independently process and analyze the input signals they receive, and then pass the processing results to the corresponding output channel units. The first, second, third, and fourth output channel units accurately control the relevant execution devices according to the instructions of the processing units. For example, the first output channel unit may be responsible for controlling the power output of the heating furnace, the second output channel unit is responsible for adjusting the speed of the cooling fan, the third output channel unit controls the flow of the coolant, and the fourth output channel unit is responsible for controlling the cooling fan speed. The channel unit manages the temperature compensation device in a specific area. In addition, the power supply part of the system cannot be ignored. A variety of power input options such as 100 to 240 volts AC, 20 to 28 volts AC or 12 to 40 volts DC provide the system with stable and reliable power support to ensure normal operation in different industrial power supply environments. The workflow of the dual-channel temperature control system is closely aligned with the requirements of the production process. In key processes such as wafer deposition, etching, and annealing, the system accurately adjusts the heating and cooling output according to the preset temperature curve and real-time temperature feedback to ensure that the wafer experiences appropriate temperature conditions at each stage. For example, during the deposition process, the temperature needs to be precisely controlled. To ensure the uniformity and quality of the film; in the annealing process, accurate temperature control helps to eliminate stress inside the wafer and improve the integrity of the crystal structure. At the same time, the system's programmable functions and configurable parameters provide users with great flexibility. The programmable functions of BZ keys 1 and 2 allow users to customize specific operations according to actual needs, such as fast switching of control modes, emergency stop, etc. The 16 LED output status indicators and 2 LED area address indicators on the monitoring and power supply board provide operators with intuitive system status information, convenient real-time monitoring and fault diagnosis, optional configuration of digital input (or output) 5 and 6, and the existence of slots A, B, C, and E,It facilitates the expansion and upgrade of the system, and users can add more sensors, actuators or communication modules according to future production needs.

[0032] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A dual-channel temperature control system for wafer manufacturing, comprising a dual-channel temperature control device, characterized in that: The dual-channel temperature control device is connected to the first device, the dual-channel temperature control device is connected to the second device, the dual-channel temperature control device is connected to the first thermostat, and the dual-channel temperature control device is connected to the second thermostat.

2. The dual-channel temperature control system for wafer manufacturing according to claim 1, characterized in that: The dual-channel temperature control system includes a first processing unit, the first processing unit is connected to the second processing unit, the first processing unit is connected to the first output channel unit and the second output channel unit, and the second processing unit is connected to the third output channel unit and the fourth output channel unit.

3. The dual-channel temperature control system for wafer manufacturing according to claim 1, characterized in that: The dual-channel temperature control device includes an input module, a processing module, a communication module and an output module. The dual-channel temperature control system includes a human-computer interaction module. The human-computer interaction module includes an instruction control unit and an information display unit. The instruction control unit is used to receive user instructions and the information display unit is used to display the status information and alarm information of the device.

4. The dual-channel temperature control system for wafer manufacturing according to claim 1, characterized in that: The dual-channel temperature control system includes an input module, which includes a first input unit and a second input unit. The first input unit and the second input unit are respectively connected to different sensors and can simultaneously receive data information sent by the sensors. The data information transmitted by the sensors can be current information or temperature information.

5. The dual-channel temperature control system for wafer manufacturing according to claim 1, characterized in that: The dual-channel temperature control system includes an output module, which includes a first output channel unit, a second output channel unit, a third output channel unit, and a fourth output channel unit. The output module may include more output channel units.

6. The dual-channel temperature control system for wafer manufacturing according to claim 1, characterized in that: The processing module includes a first processing unit and a second processing unit, the first processing unit is connected to the first input unit, the second processing unit is connected to the second input unit, and the first processing unit is connected to the second processing unit.

7. The dual-channel temperature control system for wafer manufacturing according to claim 1, characterized in that: The dual-channel temperature control system includes a processing module, and the processing module is connected to a human-computer interaction module, an input module, a communication module and an output module respectively.

8. The dual-channel temperature control system for wafer manufacturing according to claim 1, characterized in that: The dual-channel temperature control system includes a first output channel unit. The first output channel unit, the second output channel unit, the third output channel unit and the fourth output channel unit can be connected to the same sensor or to different sensors at the same time.

9. The dual-channel temperature control system for wafer manufacturing according to claim 1, characterized in that: The dual-channel temperature control system includes a first processing unit, the first processing unit is connected to the second processing unit, the first processing unit is connected to the first output channel unit and the second output channel unit, and the second processing unit is connected to the third output channel unit and the fourth output channel unit.

Images