Heating and cooling control circuit, heating and cooling device, host system and vehicle

Abstract

The utility model discloses a heating and cooling control circuit, a heating and cooling device, a host system and a vehicle. The heating and cooling control circuit comprises a signal control end, a heating control module and a cooling control module, the temperature rise control module and the temperature reduction control module are both connected with the signal control end, and based on a target control signal input by the signal control end, any one of the temperature rise control module and the temperature reduction control module works, and the other one of the temperature rise control module and the temperature reduction control module does not work; one end of the heating control module is connected with a first power supply, and the other end of the heating control module is connected with the semiconductor cooler and used for controlling forward conduction of the semiconductor cooler. The heating and cooling control circuit can perform forward and reverse conduction control on the semiconductor cooler, so that the heating and cooling functions of the semiconductor cooler are alternately performed and freely switched, the heating / cooling effect can be easily controlled, the structure is simple, and the control method is simple and easy to implement.

Description

Technical Field

[0001] The utility model relates to the technical field of temperature control, and in particular to a temperature rise and fall control circuit, a temperature rise and fall device, a host system and a vehicle. Background Art

[0002] Some components in the device, such as the power supply, have strict requirements on the ambient temperature. When the ambient temperature is too cold or too hot, it will affect the performance of the power supply in the device, and additional heating and cooling devices are needed to control the ambient temperature.

[0003] In the existing technology, heating devices such as heating wires are usually added to heat the environment to ensure that the temperature of the components is not too low, and cooling devices such as air cooling or water cooling are added to dissipate heat to ensure that the temperature of the components is not too high. However, simply adding heating wires and air cooling or water cooling devices will make the equipment structure more complicated, and there will be serious interference between the heating device and the cooling device, making it impossible to coordinate and control, and the temperature control effect is poor. Utility Model Content

[0004] The embodiments of the present invention provide a temperature rise and fall control circuit, a temperature rise and fall device, a host system and a vehicle to solve the problem that the existing temperature rise and fall devices cannot be coordinated and controlled, resulting in poor temperature control effect.

[0005] The embodiment of the utility model provides a temperature rise and fall control circuit, comprising a signal control terminal, a temperature rise control module and a temperature fall control module;

[0006] The temperature increase control module and the temperature decrease control module are both connected to the signal control terminal, and based on the target control signal input by the signal control terminal, either the temperature increase control module or the temperature decrease control module is operated and the other is not operated;

[0007] One end of the temperature control module is used to connect to the first power supply, and the other end is used to connect to the semiconductor cooler, and is used to control the semiconductor cooler to conduct forward so that the side of the semiconductor cooler that contacts the target object becomes the heating surface;

[0008] One end of the temperature reduction control module is used to connect to the first power supply, and the other end is used to connect to the semiconductor refrigerator, and is used to control the semiconductor refrigerator to conduct in reverse so that the side of the semiconductor refrigerator connected to the target object becomes the cooling surface.

[0009] Preferably, the temperature increase control module includes a first optical coupling component; the temperature decrease control module includes a second optical coupling component;

[0010] One end of the first optical coupler component is used to connect to the first power supply, and the other end is used to forward connect to the semiconductor cooler;

[0011] One end of the second optical coupler component is used to connect to the first power supply, and the other end is used to reversely connect to the semiconductor cooler;

[0012] The first optocoupler component and the second optocoupler component are both connected to the signal control end. Based on the target control signal input by the signal control end, either one of the first optocoupler component and the second optocoupler component works and the other does not work.

[0013] Preferably, the first optical coupling assembly includes a first light source and a first light receiver, the first light receiver is arranged opposite to the first light source, a first end of the first light receiver is connected to the positive electrode of the first power supply, a second end of the first light receiver is connected to the first end of the semiconductor cooler, a third end of the first light receiver is connected to the second end of the semiconductor cooler, and a fourth end of the first light receiver is connected to the negative electrode of the first power supply;

[0014] The second optical coupling assembly includes a second light source and a second light receiver, the second light receiver is arranged opposite to the second light source, a first end of the second light receiver is connected to the positive electrode of the first power supply, a second end of the second light receiver is connected to the second end of the semiconductor cooler, a third end of the second light receiver is connected to the first end of the semiconductor cooler, and a fourth end of the second light receiver is connected to the negative electrode of the first power supply;

[0015] The first light source and the second light source are both connected to the signal control end, and are used to turn on either the first light receiver or the second light receiver and turn off the other one based on the target control signal input by the signal control end.

[0016] Preferably, the target control signal includes a low level signal and a high level signal;

[0017] Either one of the first optical coupler component and the second optical coupler component is a normally open optical coupler component, and the other is a normally closed optical coupler component;

[0018] The normally open optocoupler component is used to be turned on under the control of the low-level signal and turned off under the control of the high-level signal;

[0019] The normally closed optocoupler component is used to be turned off under the control of the low-level signal and turned on under the control of the high-level signal.

[0020] Preferably, the temperature rise and fall control circuit further includes a second power supply circuit;

[0021] The second power supply circuit includes a first diode, a second diode and an interface;

[0022] The anode of the first diode is connected to the first end of the USB interface, and the cathode of the first diode is connected to the temperature increase control module and the temperature decrease control module;

[0023] The anode of the second diode is connected to the second end of the USB interface, and the cathode of the second diode is connected to the temperature increase control module and the temperature decrease control module;

[0024] The USB interface is used to connect a second power source so that the second power source supplies power to the temperature increase control module, the temperature decrease control module and the semiconductor refrigerator.

[0025] The embodiment of the present utility model further provides a temperature raising and lowering device, comprising a semiconductor refrigerator and any one of the temperature raising and lowering control circuits described above;

[0026] One side of the semiconductor refrigerator is used to connect with the target object;

[0027] The semiconductor refrigerator is connected to the temperature rise and fall control circuit and is used for forward conduction or reverse conduction under the control of the temperature rise and fall control circuit.

[0028] Preferably, the temperature control device further includes a fan;

[0029] The fan is arranged opposite to a side of the semiconductor refrigerator away from the target object;

[0030] The fan is connected to the temperature rise and fall control circuit and is used for inhaling or exhausting gas under the control of the temperature rise and fall control circuit.

[0031] The embodiment of the present invention further provides a host system, comprising a host and any one of the above-mentioned temperature-raising and cooling devices;

[0032] The host is connected to one side of the semiconductor refrigerator.

[0033] Preferably, the host comprises a first power supply and a temperature detection control module provided on the first power supply;

[0034] The first power supply is connected to the temperature increase control module and the temperature decrease control module to supply power to the temperature increase control module and the temperature decrease control module;

[0035] The temperature detection control module is provided on the first power supply and connected to the signal control terminal, and is used for detecting the power supply temperature corresponding to the first power supply and outputting a target control signal to the signal control terminal according to the power supply temperature.

[0036] An embodiment of the present invention further provides a vehicle, comprising any of the host systems described above.

[0037] The temperature rise and fall control circuit, temperature rise and fall device, host system and vehicle provided by the embodiments of the present invention can control the forward and reverse conduction of the semiconductor refrigerator by controlling any one of the temperature rise control module and the temperature fall control module to work and the other not to work, so that the heating and cooling functions of the semiconductor refrigerator are alternately performed and switched arbitrarily, and the temperature rise / cooling effect can be easily controlled. The structure is streamlined and the control method is simple and easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0039] Figure 1 This is a circuit diagram of a temperature rise and fall control circuit in one embodiment of the present invention;

[0040] Figure 2 It is a structural diagram of a host system in one embodiment of the present utility model.

[0041] In the figure: 1. Signal control terminal; 2. Temperature increase control module; 3. Temperature reduction control module; 4. Semiconductor refrigerator; 5. Power supply; 6. Second power supply circuit; 7. Fan; 71. Air inlet side hole; 8. PWM signal generator. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0043] It should be understood that the present invention can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to make the disclosure thorough and complete and to fully convey the scope of the present invention to those skilled in the art. In the drawings, the dimensions and relative dimensions of layers and regions may be exaggerated for clarity. Like reference numerals denote like elements throughout.

[0044] It should be understood that when an element or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" another element or layer, it may be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. Conversely, when an element is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" another element or layer, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer, or part discussed below may be represented as a second element, component, region, layer, or part.

[0045] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," etc., may be used herein for convenience of description to describe the relationship of one element or feature shown in the figures to other elements or features. It should be understood that the spatially relative terms are intended to include different orientations of the device in use and operation in addition to the orientations shown in the figures. For example, if the device in the drawings is flipped, then the elements or features described as "under" or "beneath" or "beneath" the other elements will be oriented as "over" the other elements or features. Thus, the exemplary terms "under" and "under" may include both the upper and lower orientations. The device may be oriented otherwise (rotated 90 degrees or in other orientations) and the spatial descriptors used herein are interpreted accordingly.

[0046] The purpose of the terms used herein is only to describe specific embodiments and is not intended to limit the present invention. When used herein, the singular forms "a", "an" and "the" are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0047] In order to fully understand the present invention, the following description will provide detailed structures and steps to illustrate the technical solutions proposed by the present invention. The preferred embodiments of the present invention are described in detail below. However, in addition to these detailed descriptions, the present invention may also have other implementation methods.

[0048] An embodiment of the present utility model provides a temperature rise and fall control circuit, comprising a signal control terminal 1, a temperature rise control module 2 and a temperature drop control module 3; the temperature rise control module 2 and the temperature drop control module 3 are both connected to the signal control terminal 1, and based on the target control signal input by the signal control terminal 1, either the temperature rise control module 2 or the temperature drop control module 3 is operated and the other is not operated; one end of the temperature rise control module 2 is used to connect to a first power source 5, and the other end is used to connect to a semiconductor refrigerator 4, for controlling the semiconductor refrigerator 4 to conduct forward, so that the side of the semiconductor refrigerator 4 in contact with the target object is a heating surface; one end of the temperature drop control module 3 is used to connect to the first power source 5, and the other end is used to connect to the semiconductor refrigerator 4, for controlling the semiconductor refrigerator 4 to conduct reverse, so that the side of the semiconductor refrigerator 4 in contact with the target object is a cooling surface.

[0049] As an example, the temperature control circuit includes a signal control terminal 1, a temperature increase control module 2, and a temperature decrease control module 3. The signal control terminal 1 is connected to the temperature increase control module 2 and the temperature decrease control module 3, and can control either the temperature increase control module 2 or the temperature decrease control module 3 to operate while the other is inoperative, thereby achieving temperature increase or temperature decrease control. Furthermore, the temperature increase control module 2 and the temperature decrease control module 3 can be controlled to operate alternately within a period of time, and the temperature increase / cooling effect can be controlled by adjusting the operating time of the temperature increase control module 2 and the temperature decrease control module 3. One end of the temperature increase control module 2 is used to connect to a first power source 5, and the other end is used to connect to a semiconductor cooler 4. The semiconductor cooler 4 can be controlled to conduct forward, for example, by controlling the first end of the semiconductor cooler 4 to connect to the positive terminal of the first power source 5 and the second end of the semiconductor cooler 4 to connect to the negative terminal of the first power source 5, so that the side of the semiconductor cooler 4 in contact with the target object becomes the heating side, and the side facing away from the target object becomes the cooling side, thereby heating the target object and increasing its temperature. One end of the cooling control module 3 is connected to the first power source 5, and the other end is connected to the semiconductor cooler 4. The cooling control module 3 can control the reverse conduction of the semiconductor cooler 4. For example, the first end of the semiconductor cooler 4 is connected to the negative terminal of the first power source 5, and the second end of the semiconductor cooler 4 is connected to the positive terminal of the first power source 5. The side of the semiconductor cooler 4 that contacts the target object becomes the cooling surface, and the side facing away from the target object becomes the heating surface, thereby cooling the target object. The target object here refers to the object that needs to be controlled to increase or decrease temperature, including but not limited to batteries or other objects that need temperature regulation.

[0050] In this example, by controlling any one of the temperature rise control module 2 and the temperature drop control module 3 to work and the other not to work, and by controlling the forward or reverse conduction of the semiconductor refrigerator 4, the heating and cooling functions of the semiconductor refrigerator 4 are alternately performed and switched arbitrarily, and the temperature rise / cooling effect can be easily controlled. The structure is streamlined and the control method is simple and easy.

[0051] In one embodiment, the temperature increase control module 2 includes a first optocoupler component U1; the temperature reduction control module 3 includes a second optocoupler component U2; one end of the first optocoupler component U1 is used to connect to the first power supply 5, and the other end is used to forward connect to the semiconductor cooler 4; one end of the second optocoupler component U2 is used to connect to the first power supply 5, and the other end is used to reverse connect to the semiconductor cooler 4; the first optocoupler component U1 and the second optocoupler component U2 are both connected to the signal control terminal 1, and based on the target control signal input by the signal control terminal 1, either one of the second optocoupler component U2 and the second optocoupler component U2 works, and the other does not work.

[0052] As an example, the temperature increase control module 2 includes a first optocoupler component U1, and the temperature decrease control module 3 includes a second optocoupler component U2. One end of the first optocoupler component U1 is used to connect to the first power supply 5, and the other end is used to connect to the semiconductor cooler 4 in the forward direction. When the first optocoupler component U1 is turned on, it is used to supply forward power to the semiconductor cooler 4, so that the semiconductor cooler 4 is forward-conducting. One end of the second optocoupler component U2 is used to connect to the first power supply 5, and the other end is used to connect to the semiconductor cooler 4 in the reverse direction. When the first optocoupler component U1 is turned on, it is used to supply reverse power to the semiconductor cooler 4, so that the semiconductor cooler 4 is reverse-conducting. The first optocoupler component U1 and the second optocoupler component U2 are both connected to the signal control terminal 1. The target control signal input to the signal control terminal 1 can be a high-level signal or a low-level signal to control either one of the first optocoupler component U1 and the second optocoupler component U2 to be turned on and the other not to be turned on, so that temperature rise control or temperature fall control can be achieved; further, the target control signal can also be a PWM signal to control the first optocoupler component U1 and the second optocoupler component U2 to be turned on alternately, and by adjusting the duty cycle of the PWM signal, the conduction time ratio of the first optocoupler component U1 and the second optocoupler component U2 within a period of time can be adjusted to control the heating / cooling effect.

[0053] In one embodiment, the first optocoupler component U1 includes a first light source and a first light receiver, and the first light receiver is arranged opposite to the first light source; the first end of the first light receiver is connected to the positive pole of the first power supply 5, the second end of the first light receiver is connected to the first end of the semiconductor refrigerator 4, the third end of the first light receiver is connected to the negative pole of the semiconductor refrigerator 4, and the fourth end of the first light receiver is connected to the negative pole of the first power supply 5; the second optocoupler component U2 includes a second light source and a second light receiver, and the second light receiver is arranged opposite to the second light source; the first end of the second light receiver is connected to the positive pole of the first power supply 5, the second end of the second light receiver is connected to the second end of the semiconductor refrigerator 4, the third end of the second light receiver is connected to the first end of the semiconductor refrigerator 4, and the fourth end of the second light receiver is connected to the negative pole of the first power supply 5; the first light receiver and the second light receiver are both connected to the signal control terminal 1, and based on the target control signal input by the signal control terminal 1, either the first light receiver or the second light receiver is turned on and the other is turned off.

[0054] As an example, the first optical coupling component U1 includes a first light source and a first light receiver. The first light receiver is arranged relative to the first light source. When the first light source emits light under the control of the target control signal, the first light receiver can be turned on or off. The first light receiver connects the first end of the semiconductor refrigerator 4 to the positive electrode of the first power supply 5, and connects the second end of the semiconductor refrigerator 4 to the negative electrode of the first power supply 5. When turned on, it can make the semiconductor refrigerator 4 forward-conducting, so that the side of the semiconductor refrigerator 4 in contact with the target object is the heating side, and the side facing away from the target object is the cooling side, so that the target object is heated to achieve a heating effect. The second optical coupling component U2 includes a second light source and a second light receiver. The second light receiver is arranged relative to the second light source. When the second light source emits light under the control of the target control signal, the second light receiver can be turned on or off. The second light receiver connects the first end of the semiconductor cooler 4 to the negative electrode of the first power supply 5, and connects the second end of the semiconductor cooler 4 to the positive electrode of the first power supply 5. When turned on, the semiconductor cooler 4 can be reversely conducted, so that the side of the semiconductor cooler 4 connected to the target object is the cooling surface, and the side facing away from the target object is the heating surface, so that the target object is cooled down to achieve a cooling effect.

[0055] In one embodiment, the target control signal includes a low-level signal and a high-level signal; either one of the first optocoupler component U1 and the second optocoupler component U2 is a normally open optocoupler component, and the other is a normally closed optocoupler component; the normally open optocoupler component is used to turn on under the control of a low-level signal and turn off under the control of a high-level signal; the normally closed optocoupler component is used to turn off under the control of a low-level signal and turn on under the control of a high-level signal.

[0056] As an example, the target control signal can be a series of continuous low-level signals, a series of continuous high-level signals, or a PWM signal including high-level signals and low-level signals. One of the first optocoupler component U1 and the second optocoupler component U2 is a normally open optocoupler component, and the other is a normally closed optocoupler component. The light sources of the normally open optocoupler component and the normally closed optocoupler component emit light based on the high-level signal, which can turn off the light receiver of the normally open optocoupler component and turn on the light receiver of the normally closed optocoupler component; the light sources of the normally open optocoupler component and the normally closed optocoupler component do not emit light based on the low-level signal, which can turn on the light receiver of the normally open optocoupler component and turn off the light receiver of the normally closed optocoupler component, thereby achieving the effect of using one target control signal including high-level and / or low-level signals to simultaneously control the conduction of any one of the two optocoupler components with different functions, which is simple, easy to operate, and convenient to control.

[0057] In one embodiment, the temperature rise and fall control circuit also includes a second power supply circuit 6; the second power supply circuit 6 includes a first diode D1, a second diode D2 and a USB interface; the anode of the first diode D1 is connected to the first end of the USB interface, and the cathode of the first diode D1 is connected to the temperature rise control module 2 and the temperature drop control module 3; the anode of the second diode D2 is connected to the second end of the USB interface, and the cathode of the second diode D2 is connected to the temperature rise control module 2 and the temperature drop control module 3; the USB interface is used to connect a second power supply so that the second power supply can supply power to the temperature rise control module 2, the temperature drop control module 3 and the semiconductor refrigerator 4.

[0058] As an example, the temperature rise and fall control circuit further includes a second power supply circuit 6. The second power supply circuit 6 is used to connect to an external second power supply when the first power supply 5 is unable to provide electrical energy, thereby powering the temperature rise control module 2, the temperature fall control module 3, and the semiconductor cooler 4. The second power supply may include a first diode D1 and a second diode D2 for limiting the direction of current flow, and also includes a USB interface. The anode of the first diode D1 is connected to the first end of the USB interface, the cathode of the first diode D1 is connected to the temperature rise control module 2 and the temperature fall control module 3, the anode of the second diode D2 is connected to the second end of the USB interface, and the cathode of the second diode D2 is connected to the temperature rise control module 2 and the temperature fall control module 3. The USB interface is used to connect to the second power supply so that the second power supply can power the temperature rise control module 2, the temperature fall control module 3, and the semiconductor cooler 4.

[0059] An embodiment of the present utility model also provides a temperature control device, including a semiconductor refrigerator 4 and a temperature control circuit in any one of the above embodiments; one side of the semiconductor refrigerator 4 is used to connect with a target object; the semiconductor refrigerator 4 is connected to the temperature control circuit and is used to conduct forward or reverse under the control of the temperature control circuit.

[0060] As an example, the temperature control device includes a semiconductor cooler 4 and a temperature control circuit as described in any of the above examples. One side of the semiconductor cooler 4 is configured to interface with a target object, which is the object to be controlled by the temperature control circuit, and may be, for example, a host computer with high ambient temperature requirements. The temperature control circuit is connected to the semiconductor cooler 4 and configured to, based on a received target control signal, either conduct electricity in the forward direction of the semiconductor cooler 4, such that the side of the semiconductor cooler 4 in contact with the target object serves as a heating surface, or conduct electricity in the reverse direction of the semiconductor cooler 4, such that the side of the semiconductor cooler 4 in contact with the target object serves as a cooling surface.

[0061] In this example, the temperature rise and fall control circuit can perform forward and reverse conduction control on the semiconductor refrigerator 4, so that the heating and cooling functions of the semiconductor refrigerator 4 can be performed alternately and switched arbitrarily, and the heating / cooling effect can be easily controlled. The structure is simple and the control method is simple and easy.

[0062] In one embodiment, the temperature raising and lowering device further includes a fan 7; the fan 7 is arranged opposite to a side of the semiconductor cooler 4 away from the target object; the fan 7 is connected to the temperature raising and lowering control circuit, and is used to inhale or exhaust gas under the control of the temperature raising and lowering control circuit.

[0063] As an example, the temperature control system also includes a fan 7. The fan 7 can be an axial flow fan 7, which is arranged opposite to a side of the semiconductor cooler 4 away from the target object. An air inlet side hole 71 is provided on the side wall of the axial flow fan 7, which is used to cooperate with the fan blades of the axial flow fan 7 to form an air duct for air circulation. The fan 7 is connected to the temperature control circuit and is connected in parallel with the semiconductor cooler 4, and is used to inhale or exhaust gas through the air inlet side hole 71 under the control of the temperature control circuit. Specifically, when the temperature control circuit controls the semiconductor cooler 4 to be forward-conducted, the fan 7 can take in air from the fan blades and exhaust from the air inlet side hole 71 under the control of the temperature control circuit; when the temperature control circuit controls the semiconductor cooler 4 to be reverse-conducted, the fan 7 can take in air from the air inlet side hole 71 and exhaust from the fan blades under the control of the temperature control circuit, so as to enhance the cooling / cooling of the semiconductor cooler 4. Heating effect, for example, when the fan blades of the axial flow fan 7 are arranged opposite to the exhaust duct for discharging hot air, and the air inlet side hole 71 of the axial flow fan 7 is arranged opposite to the air inlet duct for inhaling cold air, if the fan 7 takes in air from the fan blades and exhausts air from the air inlet side hole 71 under the control of the temperature rise and fall control circuit, it can inhale hot air and exhaust cold air, thereby enhancing the heating effect of the semiconductor refrigerator 4. If the fan 7 takes in air from the air inlet side hole 71 and exhausts air from the fan blades under the control of the temperature rise and fall control circuit, it can inhale cold air and exhaust hot air, thereby enhancing the cooling effect of the semiconductor refrigerator 4.

[0064] The embodiment of the present invention further provides a host system, comprising a host and the temperature raising and lowering device in any one of the above embodiments; the host is connected to one side of the semiconductor refrigerator 4 .

[0065] As an example, the host system includes a host and a temperature control device in any of the above examples. The host is the target object for temperature control by the temperature control device. One side of the semiconductor refrigerator 4 can be connected to a part of the host where the temperature needs to be controlled, such as the part where the mainboard chip is located, or the part where the first power supply 5 is located. The temperature control circuit in the temperature control device can heat or cool the host by controlling the side of the semiconductor refrigerator 4 connected to the host to heat or cool.

[0066] In this example, the temperature control circuit in the temperature control device can perform forward or reverse conduction control on the semiconductor refrigerator 4, so that the heating and cooling functions of the semiconductor refrigerator 4 are performed alternately and switched arbitrarily, and the heating / cooling effect can be easily controlled. The structure is streamlined and the control method is simple and easy.

[0067] In one embodiment, the host includes a first power supply 5 and a temperature detection control module arranged on the first power supply 5; the first power supply 5 is connected to the temperature increase control module 2 and the temperature reduction control module 3 to supply power to the temperature increase control module 2 and the temperature reduction control module 3; the temperature detection control module is arranged on the first power supply 5 and connected to the signal control terminal 1, and is used to detect the power supply temperature corresponding to the first power supply 5, and output a target control signal to the signal control terminal 1 according to the power supply temperature.

[0068] As an example, the host computer includes a first power supply 5 and a temperature detection control module disposed on the first power supply 5. The first power supply 5 is connected to the temperature increase control module 2 and the temperature decrease control module 3 to supply power to the temperature increase control module 2 and the temperature decrease control module 3. The temperature detection control module may include a controller and a thermistor disposed on the first power supply 5. The thermistor is connected to the controller and is configured to transmit a detected power supply temperature signal to the controller, so that the controller outputs a target control signal to the temperature increase and decrease control circuit based on the power supply temperature signal, thereby controlling the temperature increase control module 2 and the temperature decrease control module 3 to alternately conduct and achieve the desired cooling / heating effect.

[0069] As another example, the host system may further include a PWM signal generator 8, which may serve as a backup signal source. When the target object is unable to output the target control signal, the PWM signal generator 8 may output the target control signal to the temperature rise and fall control circuit through the second signal interface. For example, the PWM signal with a certain duty cycle may be output to control the temperature rise control module 2 and the temperature fall control module 3 in the temperature rise and fall control circuit to alternately operate to achieve the desired heating / cooling effect.

[0070] An embodiment of the present invention further provides a vehicle, comprising the host system in any one of the above embodiments.

[0071] As an example, the vehicle includes the host system described in any of the above examples. The temperature control circuit in the host system can control the semiconductor cooler 4 in forward or reverse directions, allowing the semiconductor cooler 4 to alternately perform heating and cooling functions, allowing for easy control of the heating / cooling effect, a streamlined structure, and a simple and easy control method.

[0072] The embodiments described above are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the scope of protection of the present invention.

Claims

1. A temperature control circuit, characterized in that: It includes a signal control terminal, a temperature increase control module and a temperature decrease control module; The temperature increase control module and the temperature decrease control module are both connected to the signal control terminal, and based on the target control signal input by the signal control terminal, either the temperature increase control module or the temperature decrease control module is operated and the other is not operated; One end of the temperature control module is used to connect to the first power supply, and the other end is used to connect to the semiconductor cooler, and is used to control the semiconductor cooler to conduct forward so that the side of the semiconductor cooler that contacts the target object becomes the heating surface; One end of the temperature reduction control module is used to connect to the first power supply, and the other end is used to connect to the semiconductor refrigerator, and is used to control the semiconductor refrigerator to conduct in reverse so that the side of the semiconductor refrigerator connected to the target object becomes the cooling surface.

2. The temperature rise and fall control circuit according to claim 1, characterized in that: The temperature rise control module includes a first optical coupling component; One end of the first optical coupler component is used to connect to the first power supply, and the other end is used to forward connect to the semiconductor cooler; The temperature reduction control module includes a second optical coupling component; One end of the second optical coupler component is used to connect to the first power supply, and the other end is used to reversely connect to the semiconductor cooler; The first optocoupler component and the second optocoupler component are both connected to the signal control end. Based on the target control signal input by the signal control end, either one of the first optocoupler component and the second optocoupler component works and the other does not work.

3. The temperature rise and fall control circuit according to claim 2, characterized in that: The first optical coupling assembly includes a first light source and a first light receiver, the first light receiver is arranged opposite to the first light source, a first end of the first light receiver is connected to the positive electrode of the first power supply, a second end of the first light receiver is connected to the first end of the semiconductor cooler, a third end of the first light receiver is connected to the second end of the semiconductor cooler, and a fourth end of the first light receiver is connected to the negative electrode of the first power supply; The second optical coupling assembly includes a second light source and a second light receiver, the second light receiver is arranged opposite to the second light source, a first end of the second light receiver is connected to the positive electrode of the first power supply, a second end of the second light receiver is connected to the second end of the semiconductor cooler, a third end of the second light receiver is connected to the first end of the semiconductor cooler, and a fourth end of the second light receiver is connected to the negative electrode of the first power supply; The first light source and the second light source are both connected to the signal control end, and are used to turn on either the first light receiver or the second light receiver and turn off the other one based on the target control signal input by the signal control end.

4. The temperature rise and fall control circuit according to claim 2, characterized in that: The target control signal includes a low level signal and a high level signal; Either one of the first optical coupler component and the second optical coupler component is a normally open optical coupler component, and the other is a normally closed optical coupler component; The normally open optocoupler component is used to be turned on under the control of the low-level signal and turned off under the control of the high-level signal; The normally closed optocoupler component is used to be turned off under the control of the low-level signal and turned on under the control of the high-level signal.

5. The temperature rise and fall control circuit according to claim 1, characterized in that: The temperature rise and fall control circuit further includes a second power supply circuit; The second power supply circuit includes a first diode, a second diode and an interface; The anode of the first diode is connected to the first end of the USB interface, and the cathode of the first diode is connected to the temperature increase control module and the temperature decrease control module; The anode of the second diode is connected to the second end of the USB interface, and the cathode of the second diode is connected to the temperature increase control module and the temperature decrease control module; The USB interface is used to connect a second power source so that the second power source supplies power to the temperature increase control module, the temperature decrease control module and the semiconductor refrigerator.

6. A temperature control device, characterized in that: It comprises a semiconductor refrigerator and a temperature rise and fall control circuit according to any one of claims 1 to 5; One side of the semiconductor refrigerator is used to connect with the target object; The semiconductor refrigerator is connected to the temperature rise and fall control circuit and is used for forward conduction or reverse conduction under the control of the temperature rise and fall control circuit.

7. The temperature raising and lowering device according to claim 6, characterized in that: The temperature raising and lowering device further comprises a fan; The fan is arranged opposite to a side of the semiconductor refrigerator away from the target object; The fan is connected to the temperature rise and fall control circuit and is used for inhaling or exhausting gas under the control of the temperature rise and fall control circuit.

8. A host system, characterized in that: It comprises a host and a temperature raising and lowering device according to any one of claims 6 to 7; The host is connected to one side of the semiconductor refrigerator.

9. The host system according to claim 8, wherein: The host comprises a first power supply and a temperature detection control module arranged on the first power supply; The first power supply is connected to the temperature increase control module and the temperature decrease control module to supply power to the temperature increase control module and the temperature decrease control module; The temperature detection control module is provided on the first power supply and connected to the signal control terminal, and is used for detecting the power supply temperature corresponding to the first power supply and outputting a target control signal to the signal control terminal according to the power supply temperature.

10. A vehicle, characterized in that: The host system comprises any one of claims 8 to 9.

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