Wafer cover plate

Abstract

The utility model provides a wafer cover plate which is used for abutting against a quartz cover plate and clamping an aluminum disc loading jig, the wafer cover plate comprises a cover plate body, the cover plate body is provided with a plurality of first through holes and a plurality of second through holes, the first through holes are located at the edge of the cover plate body, and the second through holes are far away from the first through holes and close to the center of the cover plate body. The hole diameter of the first through holes is consistent with that of the second through holes, the first through holes are evenly distributed and form a circle in an enclosing mode, the second through holes are evenly distributed and form a square in an enclosing mode, the side walls of the cover plate body are concaved inwards to form a plurality of grooves which are evenly distributed, and the edge, back on to the first through holes, of the cover plate body protrudes to form an annular body. According to the wafer feeding auxiliary jig, clothes of production personnel can be prevented from being smudged or other smudges, the situation that the production personnel make contact with a wafer or fall on the surface of the wafer can be avoided, disintegrating slag and by-product particles generated by fixing screws by the production personnel are prevented from falling on the surface of the wafer, in the rotation process of the wafer feeding auxiliary jig, raised dust particles are isolated from making contact with the surface of the wafer, and the wafer can be protected comprehensively.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to a wafer cover plate. Background Art

[0002] In the existing LED field, dry etching sites use aluminum plates and quartz covers. This combination needs to be fixed with ceramic screws to achieve a relatively closed environment for operation. A torque screwdriver is needed to manually fix the ceramic screws to prevent the aluminum plate and quartz cover from being poorly sealed, resulting in abnormal helium flow alarms.

[0003] During the process of manually loading and screwing the wafer, the used quartz cover will drop particles or by-products on the wafer surface. The dirt visible to the naked eye is cleaned again. The re-cleaning process requires re-loading and re-loading, which is a waste of manpower. The dirt that is invisible to the naked eye will remain on the wafer surface and be sent into the process chamber for processing as the wafer is sent into the process chamber for processing, resulting in the contaminated or obscured areas of the wafer being unable to be etched, which reduces the yield of the wafer. Utility Model Content

[0004] In view of the above situation, it is necessary to provide a wafer cover plate to address the problem that the combination of an aluminum plate and a quartz cover plate in the prior art easily causes wafer contamination.

[0005] A wafer cover plate, used for abutting against a quartz cover plate and clamping an aluminum disc mounting jig, the quartz cover plate is arranged between the wafer cover plate and the aluminum disc mounting jig, the aluminum disc mounting jig is arranged on a rotating table, the quartz cover plate is provided with a plurality of positioning grooves and a plurality of first threaded holes, the aluminum disc mounting jig is provided with a plurality of placement grooves, the placement grooves are used for wafers, the positioning grooves are adapted to the placement grooves, the quartz cover plate is fixed to the aluminum disc mounting jig through the first threaded holes, characterized in that: the wafer cover plate includes a cover plate body, the cover plate body is provided with a plurality of first through holes and a plurality of second through holes, the first through holes are located at the edge of the cover plate body, and the second through holes are away from the first through holes A through hole is arranged near the center of the cover body, the aperture of the first through hole is consistent with the aperture of the second through hole, several first through holes are evenly distributed and enclosed into a circle, several second through holes are evenly distributed and enclosed into a square, the positions of the first through hole and the second through hole correspond to the positions of the first threaded hole, the side wall of the cover body is concave to form several evenly distributed grooves, the grooves are used to be clamped with the aluminum disk upper fixture, the edge of the side of the cover body facing away from the first through hole is raised to form an annular body, several evenly distributed notches are opened on the annular body, the grooves are adapted to the notches, and the annular body is used to fit the edge of the aluminum disk upper fixture.

[0006] Beneficial effects of the utility model:

[0007] 1. The cover plate body abuts against the quartz cover plate and clamps the aluminum plate loading fixture. Several wafers are placed in the positioning groove of the quartz cover plate. The cover plate body covers the surface of the wafer from above to prevent production personnel from getting dirty clothes or other dirt from touching the wafer or falling on the surface of the wafer, resulting in product abnormalities such as wafer cleaning, rework or scrapping.

[0008] 2. The ceramic screws pass through the first through-hole and the second through-hole respectively, and are then screwed together through the first threaded hole of the quartz cover plate and the second threaded hole of the aluminum plate loading fixture. The cover plate body covers the surface of the wafer from above to prevent the debris and by-product particles generated during the process of fixing the ceramic screws. They can be cleaned manually to prevent them from falling on the wafer surface. The tight connection between the aluminum plate loading fixture and the quartz cover plate ensures the necessary conditions for the operation, avoids abnormal helium flow and wafer etching, thereby reducing the equipment failure rate caused by human factors, improving production efficiency and product yield.

[0009] 3. The groove design on the edge of the cover body can better fix the cover body and prevent it from falling during rotation. At the same time, during the rotation of the wafer auxiliary fixture, it isolates the rising dust particles from contacting the wafer surface, thereby fully protecting the wafer.

[0010] Furthermore, the cover plate body is circular, the diameter of the cover plate body is 399 mm to 401 mm, and the thickness of the cover plate body is 9 mm to 11 mm.

[0011] Furthermore, the number of the first through holes is 7, and the number of the second through holes is 4.

[0012] Furthermore, the diameter of the first through hole and the diameter of the second through hole are both 19 mm to 21 mm.

[0013] Furthermore, the number of the grooves is 3.

[0014] Furthermore, the length of the groove is 22 mm to 24 mm, and the width of the groove is 11 mm to 13 mm.

[0015] Furthermore, the inner diameter of the annular body is 389 mm to 391 mm, the height of the annular body is 14 mm to 16 mm, and the width of the annular body is 4 mm to 6 mm.

[0016] Furthermore, the height of the notch is 14 mm to 16 mm, and the width of the notch is 11 mm to 13 mm.

[0017] Furthermore, the cover plate body and the annular body are both made of aluminum or resin.

[0018] Furthermore, the cover plate body and the annular body are processed as one piece. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A top view of the overall structure of an embodiment of the utility model;

[0020] Figure 2 It is a structural schematic diagram of an embodiment of the present utility model.

[0021] Explanation of the accompanying drawings: 1. Cover plate body; 2. First through hole; 3. Second through hole; 4. Groove; 5. Ring body; 51. Notch. DETAILED DESCRIPTION

[0022] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be provided below with reference to the accompanying drawings. The drawings illustrate embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, the embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0023] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used herein in the specification of this invention are for the purpose of describing specific embodiments only and are not intended to limit this invention. The term "and / or" as used herein includes any and all combinations of one or more of the related listed items. Furthermore, the various embodiments of this invention, the features within the embodiments, and the features between the embodiments may be freely combined, provided there are no obvious conflicts or contradictions.

[0025] A wafer cover plate is used to abut against a quartz cover plate (not shown) and clamp an aluminum plate loading jig (not shown). The quartz cover plate is arranged between the wafer cover plate and the aluminum plate loading jig. The quartz cover plate is provided with a plurality of positioning grooves and a plurality of first threaded holes. The aluminum plate loading jig is provided with a plurality of placement grooves and a plurality of second threaded holes. The placement grooves are used to place wafers. The positioning grooves are adapted to the placement grooves. The quartz cover plate is fixed to the second threaded holes of the aluminum plate loading jig through the first threaded holes. Figure 1 and Figure 2As shown, the wafer cover includes a cover body 1, which is circular, has a diameter of 399mm to 401mm, and a thickness of 9mm to 11mm. The cover body 1 covers the surface of the wafer from above to prevent production personnel from getting dirty clothes or other dirt, touching the wafer or falling on the surface of the wafer, causing product abnormalities such as wafer cleaning, rework, or scrapping.

[0026] Specifically, the cover body 1 is provided with 7 first through holes 2 and 4 second through holes 3, the first through holes 2 are located at the edge of the cover body 1, the second through holes 3 are away from the first through holes 2, and close to the center of the cover body 1, the aperture of the first through hole is consistent with the aperture of the second through hole, the aperture of the first through hole 2 and the aperture of the second through hole 3 are both 19mm~21mm, the 7 first through holes 2 are evenly distributed and enclosed into a circle, the 4 second through holes 3 are evenly distributed and enclosed into a square, the first through holes 2 and the second through holes 3 correspond to the positions of the first threaded holes, and the side wall of the cover body 1 is concave to form 3 evenly distributed grooves 4, and the length of the groove 4 is 22mm~24m m, the width of the groove is 11mm to 13mm, the groove 4 is used to clamp the aluminum disc wafer jig, the ceramic screws pass through the first through hole 2 and the second through hole 3 respectively, and then are screwed together through the first threaded hole of the quartz cover plate and the second threaded hole of the aluminum disc wafer jig. The cover plate body 1 covers the surface of the wafer from above to avoid the debris and by-product particles generated during the process of fixing the ceramic screws. They can be manually cleaned to avoid falling on the wafer surface. The tight connection between the aluminum disc wafer jig and the quartz cover plate ensures the necessary conditions for the operation, avoids abnormal helium flow and wafer etching, thereby reducing the equipment failure rate caused by human factors, improving production efficiency and product yield.

[0027] Specifically, the edge of the cover body 1 facing away from the first through hole is raised to form a ring body 5, and the ring body 5 is provided with a plurality of evenly distributed notches 51. The number and width of the grooves 4 are the same as those of the notches 51. The inner diameter of the ring body 5 is 389mm~391mm, the height of the ring body is 14mm~16mm, the width of the ring body is 4mm~6mm, the height of the notch is 14mm~16mm, and the width of the notch is 11mm~13mm. The ring body 5 is used to fit the edge of the aluminum disk upper fixture. The cover body 1 and the ring body 5 are both made of aluminum or resin. The cover body 1 and the ring body 5 are processed as one piece. The clamping column of the aluminum disk upper fixture enters through the notch 51 and is clamped with the groove 4. The groove design on the edge of the cover body 1 can better fix the cover body 1 and prevent it from falling during rotation. At the same time, during the rotation of the upper auxiliary fixture, the dust particles that rise are isolated from contacting the wafer surface, thereby comprehensively protecting the wafer.

[0028] The implementation process of this utility model is:

[0029] Prepare 8 wafers to be operated, place the 8 wafers in the placement grooves on the aluminum disc mounting jig, the aluminum disc mounting jig is set on the rotating table, and then cover the quartz cover plate on the aluminum disc mounting jig. At this time, the wafer is fixed in position by the placement grooves and the positioning grooves, and its surface is exposed. Then the wafer cover plate is abutted against the quartz cover plate, and the edge of the wafer cover plate is clamped with the aluminum disc mounting jig. The aluminum disc mounting jig (not shown) and the quartz cover plate (not shown) are fixed with ceramic screws through the first through hole 2 and the second through hole 3. Rotating the aluminum disc mounting jig drives the rotating table to rotate, thereby changing the relative position of the first through hole 2 and the second through hole 3. The quartz cover plate is placed on the aluminum plate loading jig to facilitate the fixation of the quartz cover plate and the aluminum plate loading jig. The debris and by-product particles generated during the rotation are manually cleaned, and then the wafer cover plate is removed. Since the operation process requires the surface of the wafer to be exposed, the 8 wafers continue to be placed in the placement groove on the aluminum plate loading jig, and the quartz cover plate is covered on the aluminum plate loading jig. After the wafer operation is completed, the aluminum plate loading jig is placed on the rotating table again, the wafer cover plate is abutted against the quartz cover plate, the aluminum plate loading jig is rotated, the ceramic screws are removed, the debris and by-product particles are manually cleaned, and then the wafer cover plate is removed, and then the quartz cover plate is removed, and finally the 8 wafers that have completed the operation are removed.

[0030] Repeat the above steps to carry out wafer loading and unloading operations. The wafer cover effectively protects the wafer during the entire process.

[0031] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0032] The above-described embodiments merely represent implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A wafer cover plate, used to abut a quartz cover plate and clamp an aluminum plate loading jig, the quartz cover plate is arranged between the wafer cover plate and the aluminum plate loading jig, the aluminum plate loading jig is arranged on a rotating table, the quartz cover plate is provided with a plurality of positioning grooves and a plurality of first threaded holes, the aluminum plate loading jig is provided with a plurality of placement grooves, the placement grooves are used for wafers, the positioning grooves are adapted to the placement grooves, the quartz cover plate is fixed to the aluminum plate loading jig through the first threaded holes, characterized in that: The wafer cover plate includes a cover plate body, and the cover plate body is provided with a plurality of first through holes and a plurality of second through holes, the first through hole is located at the edge of the cover plate body, the second through hole is away from the first through hole and close to the center of the cover plate body, the aperture of the first through hole is consistent with the aperture of the second through hole, a plurality of the first through holes are evenly distributed and enclosed into a circle, a plurality of the second through holes are evenly distributed and enclosed into a square, the first through holes and the second through holes correspond to the positions of the first threaded holes, the side wall of the cover plate body is concave to form a plurality of evenly distributed grooves, and the grooves are used to be clamped with the aluminum disk upper fixture, the edge of the side of the cover plate body facing away from the first through hole is raised to form an annular body, a plurality of evenly distributed notches are provided on the annular body, the grooves are adapted to the notches, and the annular body is used to fit the edge of the aluminum disk upper fixture.

2. The wafer cover plate according to claim 1, wherein: The cover plate body is circular, the diameter of the cover plate body is 399 mm to 401 mm, and the thickness of the cover plate body is 9 mm to 11 mm.

3. The wafer cover plate according to claim 1, wherein: The number of the first through holes is 7, and the number of the second through holes is 4.

4. The wafer cover plate according to claim 1, wherein: The diameter of the first through hole and the diameter of the second through hole are both 19 mm to 21 mm.

5. The wafer cover plate according to claim 1, wherein: The number of the grooves is 3.

6. The wafer cover plate according to claim 4, wherein: The length of the groove is 22 mm to 24 mm, and the width of the groove is 11 mm to 13 mm.

7. The wafer cover plate according to claim 1, wherein: The inner diameter of the annular body is 389 mm to 391 mm, the height of the annular body is 14 mm to 16 mm, and the width of the annular body is 4 mm to 6 mm.

8. The wafer cover plate according to claim 1, wherein: The height of the notch is 14 mm to 16 mm, and the width of the notch is 11 mm to 13 mm.

9. The wafer cover plate according to claim 2, wherein: The cover plate body and the annular body are both made of aluminum or resin.

10. The wafer cover plate according to claim 1, wherein: The cover plate body and the annular body are processed as one piece.

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