Semiconductor packaging structural member

Abstract

The utility model discloses a semiconductor packaging structural member, which comprises a base and clamping seats, a plurality of groups of clamping seats are arranged in the base at equal intervals, three groups of arc-shaped grooves are arranged in the clamping seats at equal intervals, clamping columns are arranged in the arc-shaped grooves in a sliding manner, clamping motors are arranged at the bottom ends of the clamping seats, and the clamping motors are connected with the clamping seats. Driving shafts are installed at the output ends of the clamping motors, three sets of short connecting arms are installed on the surfaces of the driving shafts at equal intervals, long connecting arms are installed at the ends, away from the driving shafts, of the short connecting arms, movable shafts are installed at the ends, close to the short connecting arms, of the long connecting arms, and the long connecting arms are movably connected with the short connecting arms through the movable shafts; and the long connecting arm is connected with the clamping column. According to the utility model, the semiconductor chip can be conveniently clamped and fixed in a centering manner, a packaging plastic shell can be conveniently pressed and attached, and the packaging effect of the semiconductor chip is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging structural parts, in particular to a semiconductor packaging structural part. Background Art

[0002] Semiconductor packaging refers to the process of processing tested wafers into independent chips according to product models and functional requirements. The packaging process is as follows: the wafers from the front-end wafer process are cut into small chips through a dicing process, and then the cut chips are glued to the corresponding islands of the substrate frame. Ultra-fine metal wires or conductive resins are used to connect the bonding pads of the chips to the corresponding pins of the substrate to form the required circuit. The independent chips are then encapsulated and protected with a plastic shell. After the plastic encapsulation, a series of operations are required. After the packaging is completed, the finished product is tested. It usually goes through inspection, testing and packaging, and finally is put into storage for shipment. In order to better encapsulate semiconductor chips, a semiconductor packaging structure is proposed.

[0003] For example, a semiconductor packaging structure disclosed in authorization announcement number CN216980534U includes a box body, an anti-vibration pad is provided inside the box body, a placement groove is placed on the top of the anti-vibration pad, a rotating shaft is installed on the top left side of the box body, a cover plate is fixedly connected to the right side of the rotating shaft, a push rod motor is installed inside the cover plate, and there are two sets of push rod motors, a telescopic rod is installed at the bottom of the push rod motor, a pressing plate is fixedly connected to the bottom of the telescopic rod, and springs are fixedly connected to the bottom of the left and right sides of the cover plate;

[0004] Although it can effectively fix the semiconductor in the placement box inside the box body by installing a shock-proof pad at the bottom of the placement box and a spring at the bottom of the cover plate, and by pushing the pressing plate to fix the semiconductor through the push rod motor, it can prevent the semiconductor from being damaged by shaking during transportation. At the same time, the device can be installed and disassembled separately, which is easy to use;

[0005] However, the problem that the existing packaging structure is not conducive to conveniently centering and clamping the semiconductor chip during use and is not conducive to pressing and fitting the packaging plastic shell, thus affecting the packaging effect of the semiconductor chip. Utility Model Content

[0006] The purpose of the present invention is to provide a semiconductor packaging structure to solve the problem in the above background technology that the packaging structure is not convenient for conveniently centering and clamping the semiconductor chip, is not conducive to pressing and fitting the packaging plastic shell, and affects the packaging effect of the semiconductor chip.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a semiconductor packaging structure, comprising a base and a clamping seat, wherein a plurality of clamping seats are installed at equal intervals inside the base, three sets of arc-shaped grooves are installed at equal intervals inside the clamping seats, clamping columns are slidably installed inside the arc-shaped grooves, a clamping motor is installed at the bottom end of the clamping seat, a drive shaft is installed at the output end of the clamping motor, three sets of short connecting arms are installed at equal intervals on the surface of the drive shaft, a long connecting arm is installed at the end of the short connecting arm away from the drive shaft, and the long connecting arm is close to the short connecting arm. A movable shaft is installed at one end of the base, and the long connecting arm is movably connected to the short connecting arm through a movable shaft, and the long connecting arm is connected to the clamping column. An integrated frame is symmetrically installed on the top of the base, and a lifting motor is installed on the top of the integrated frame. A lifting threaded rod is movably installed inside the integrated frame, and the output end of the lifting motor is connected to the lifting threaded rod. A lifting threaded sleeve is set on the surface of the lifting threaded rod, and the lifting threaded sleeve is threadedly connected to the lifting threaded rod, and the lifting threaded sleeve is slidably connected to the integrated frame, and a rotating seat is installed on the side wall of the lifting threaded sleeve.

[0008] Preferably, a rotating motor is installed on the inner wall of the rotating seat, a worm is installed at the output end of the rotating motor, and the worm is movably connected to the rotating seat.

[0009] Preferably, a rotating shaft is movably mounted inside the rotating seat on one side of the worm, and the rotating shaft extends to the outside of the rotating seat.

[0010] Preferably, the surfaces of the rotating shafts are all covered with worm wheels, and the worm and the worm wheels are meshed with each other.

[0011] Preferably, a turning frame is provided above the base, and the turning frame is connected to the rotating shaft.

[0012] Preferably, a plurality of upper support plates with equal spacing are installed on the top of the flip frame, a plurality of suction cups are installed inside the upper support plates, and a plurality of lower support plates with equal spacing are installed on the bottom of the flip frame.

[0013] Preferably, the interior of the lower support plate is symmetrically and movably installed with a bidirectional threaded rod, the surface of the bidirectional threaded rod is covered with two sets of bidirectional threaded sleeves, and the bidirectional threaded sleeves are threadedly connected to the bidirectional threaded rod, and the bottom end of the bidirectional threaded sleeve is installed with a clamping block.

[0014] Preferably, adjustment motors are symmetrically installed inside the lower support plates on one side of the bidirectional threaded rod, and the output ends of the adjustment motors are connected to the bidirectional threaded rods.

[0015] Compared with the prior art, the beneficial effects of the present invention are: the packaging structure not only realizes convenient centering, clamping and fixing of the semiconductor chip, facilitates pressing and fitting the packaging plastic shell, but also improves the packaging effect of the semiconductor chip;

[0016] (1) The clamping motor drives the short connecting arm to rotate through the driving shaft, and the short connecting arm drives the long connecting arm to rotate through the movable shaft, and the long connecting arm drives the clamping column to slide inside the arc groove to move the clamping column to the center position. With the cooperation of the three groups of clamping columns, the semiconductor chip is clamped and fixed, and then glue is applied to the back of the semiconductor chip in turn, and the packaging plastic shell is placed on the surface of the suction cup in turn. The packaging plastic shell is sucked by the suction cup, and the rotating motor drives the worm to rotate, and the worm drives the worm gear to rotate. The worm gear drives the flip frame to rotate through the rotating shaft, and the flip frame drives the upper support plate, the suction cup and the packaging plastic shell to rotate, and the packaging plastic shell is rotated downward, and the lifting motor drives the lifting thread rod to rotate, and the lifting thread rod drives the lifting thread sleeve to move downward, and the lifting motor drives the lifting thread rod to rotate. The lifting threaded sleeve drives the rotating seat, the rotating shaft, the flip frame, the upper support plate, the suction cup and the packaging plastic shell to move downward, so that the packaging plastic shell contacts the glue, and then the suction cup is closed to leave the packaging plastic shell on the back of the semiconductor chip, and the lifting motor is turned on in the reverse direction, and the lifting motor drives the flip frame to move upward, and then the rotating motor is turned on in the reverse direction, and the rotating motor drives the suction cup to rotate and reset, and the pressing block is rotated downward, and the lifting motor drives the pressing block to move downward, so that the pressing block contacts the surface of the packaging plastic shell and presses down, and under the continuous action of the lifting motor, the pressing block tightly adheres the packaging plastic shell and the semiconductor chip to complete the chip packaging operation, thereby realizing convenient centering and fixing of the semiconductor chip and facilitating the pressing and fitting of the packaging plastic shell;

[0017] (2) By adjusting the motor to drive the bidirectional threaded rod to rotate, the bidirectional threaded rod drives the two sets of bidirectional threaded sleeves to move, and the bidirectional threaded sleeve drives the pressing block to move, the position of the pressing block can be fine-tuned to facilitate the pressing and fitting of different positions of the packaging plastic shell, thereby improving the packaging effect of the semiconductor chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the three-dimensional structure of the clamping seat of the utility model;

[0020] Figure 3 This is a schematic diagram of the three-dimensional structure of the clamping column of the utility model;

[0021] Figure 4 This is a schematic diagram of a top cross-sectional structure of the rotating seat of the present invention;

[0022] Figure 5 This is a schematic side cross-sectional structural diagram of the lower support plate of the present invention;

[0023] Figure 6 It is a schematic diagram of the front cross-sectional structure of the integrated frame of the present utility model.

[0024] In the figure: 1. Base; 2. Integrated frame; 3. Rotating seat; 4. Clamping seat; 5. Flipping frame; 6. Pressing block; 7. Lower support plate; 8. Upper support plate; 9. Suction cup; 10. Clamping motor; 11. Drive shaft; 12. Short connecting arm; 13. Movable shaft; 14. Long connecting arm; 15. Arc groove; 16. Clamping column; 17. Lifting motor; 18. Lifting threaded rod; 19. Lifting threaded sleeve; 20. Worm; 21. Worm gear; 22. Rotating motor; 23. Rotating shaft; 24. Bidirectional threaded rod; 25. Bidirectional threaded sleeve; 26. Adjusting motor. DETAILED DESCRIPTION

[0025] The following is a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] See also Figure 1-6 The utility model provides an embodiment: a semiconductor packaging structure, including a base 1 and a clamping seat 4, the base 1 is internally installed with multiple groups of clamping seats 4 at equal intervals, the inside of the clamping seat 4 is installed with three groups of arc grooves 15 at equal intervals, the inside of the arc groove 15 is slidably installed with a clamping column 16, the bottom end of the clamping seat 4 is installed with a clamping motor 10, the clamping motor 10 plays the role of power drive, the output end of the clamping motor 10 is installed with a drive shaft 11, the surface of the drive shaft 11 is installed with three groups of short connecting arms 12 at equal intervals, the end of the short connecting arm 12 away from the drive shaft 11 is installed with a long connecting arm 14, and the end of the long connecting arm 14 close to the short connecting arm 12 is installed with a movable The base 1 has a movable shaft 13, and the long connecting arm 14 is movably connected to the short connecting arm 12 through the movable shaft 13, and the long connecting arm 14 is connected to the clamping column 16. The top of the base 1 is symmetrically installed with an integrated frame 2, and the top of the integrated frame 2 is installed with a lifting motor 17. The lifting motor 17 plays a role of power drive. The interior of the integrated frame 2 is movably installed with a lifting threaded rod 18, and the output end of the lifting motor 17 is connected to the lifting threaded rod 18. The surface of the lifting threaded rod 18 is covered with a lifting threaded sleeve 19, and the lifting threaded sleeve 19 is threadedly connected to the lifting threaded rod 18, and the lifting threaded sleeve 19 is slidably connected to the integrated frame 2, and the side wall of the lifting threaded sleeve 19 is installed with a rotating seat 3;

[0027] The back of the circular semiconductor chip to be packaged is placed on the upper surface of the clamping seat 4 in sequence, and the clamping motor 10 is turned on. The clamping motor 10 drives the short connecting arm 12 to rotate through the driving shaft 11, and the short connecting arm 12 drives the long connecting arm 14 to rotate through the movable shaft 13. Under the sliding cooperation between the clamping column 16 and the arc groove 15, the long connecting arm 14 drives the clamping column 16 to slide inside the arc groove 15 to move the clamping column 16 to the center position. Under the cooperation of the three groups of clamping columns 16, the semiconductor chip is clamped and fixed, and then the semiconductor chip is moved to the center. Glue is applied to the back of the chip in sequence, and the encapsulated plastic shell is placed on the surface of the suction cup 9 in sequence. The encapsulated plastic shell is sucked by the suction cup 9, and then the rotating motor 22 is turned on. The rotating motor 22 drives the worm 20 to rotate. Under the mutual engagement of the worm 20 and the worm wheel 21, the worm 20 drives the worm wheel 21 to rotate, and the worm wheel 21 drives the flip frame 5 to rotate through the rotating shaft 23. The flip frame 5 drives the upper support plate 8, the suction cup 9 and the encapsulated plastic shell to rotate, and the encapsulated plastic shell is rotated downward, and the lifting motor 17 is turned on. The machine 17 drives the lifting thread rod 18 to rotate. Under the threaded connection between the lifting thread rod 18 and the lifting thread sleeve 19, the lifting thread rod 18 drives the lifting thread sleeve 19 to move downward, and the lifting thread sleeve 19 drives the rotating seat 3, the rotating shaft 23, the flip frame 5, the upper support plate 8, the suction cup 9 and the packaging plastic shell to move downward, so that the packaging plastic shell contacts the glue, and then the suction cup is closed, leaving the packaging plastic shell on the back of the semiconductor chip, and the lifting motor 17 is turned on in the reverse direction, and the lifting motor 17 drives the flip frame 5 to move upward. Then, the rotary motor 22 is turned on in the reverse direction, and the rotary motor 22 drives the suction cup 9 to rotate and reset, and the pressing block 6 is rotated downward. Then, the lifting motor 17 is turned on again, and the lifting motor 17 drives the pressing block 6 to move downward, so that the pressing block 6 contacts the surface of the packaging plastic shell and presses down. Under the continuous action of the lifting motor 17, the pressing block 6 tightly adheres the packaging plastic shell and the semiconductor chip to complete the chip packaging operation, realizing convenient centering and fixing of the semiconductor chip, and facilitating the pressing and fitting of the packaging plastic shell;

[0028] A rotating motor 22 is installed on the inner wall of the rotating base 3. The rotating motor 22 plays the role of power drive. The output end of the rotating motor 22 is installed with a worm 20, and the worm 20 is movably connected to the rotating base 3.

[0029] A rotating shaft 23 is movably mounted inside the rotating base 3 on one side of the worm 20, and the rotating shaft 23 extends to the outside of the rotating base 3;

[0030] The surface of the rotating shaft 23 is provided with a worm gear 21, and the worm 20 and the worm gear 21 are meshed with each other. A turning frame 5 is provided above the base 1, and the turning frame 5 is connected to the rotating shaft 23;

[0031] The top of the turning frame 5 is equipped with multiple sets of upper support plates 8 at equal intervals, and multiple sets of suction cups 9 are installed inside the upper support plates 8. The bottom of the turning frame 5 is equipped with multiple sets of lower support plates 7 at equal intervals. The insides of the lower support plates 7 are symmetrically and movably equipped with bidirectional threaded rods 24. The surfaces of the bidirectional threaded rods 24 are all covered with two sets of bidirectional threaded sleeves 25, and the bidirectional threaded sleeves 25 are threadedly connected to the bidirectional threaded rods 24. The bottom ends of the bidirectional threaded sleeves 25 are all equipped with pressing blocks 6.

[0032] Adjustment motors 26 are symmetrically installed inside the lower support plate 7 on one side of the bidirectional threaded rod 24. The adjustment motors 26 play a role of power drive, and the output end of the adjustment motor 26 is connected to the bidirectional threaded rod 24.

[0033] Turn on the adjustment motor 26, and the adjustment motor 26 drives the bidirectional threaded rod 24 to rotate. Under the threaded connection between the bidirectional threaded rod 24 and the bidirectional threaded sleeve 25, and the sliding cooperation between the bidirectional threaded sleeve 25 and the lower support plate 7, the bidirectional threaded rod 24 drives the two groups of bidirectional threaded sleeves 25 to move, and the bidirectional threaded sleeve 25 drives the clamping block 6 to move, so as to fine-tune the position of the clamping block 6, so as to facilitate the compression and fitting of different positions of the packaging plastic shell, thereby improving the packaging effect of the semiconductor chip.

[0034] Working principle: Place the back of the circular semiconductor chip to be packaged on the upper surface of the clamping seat 4 in sequence, and the clamping motor 10 drives the short connecting arm 12 to rotate through the driving shaft 11, and the short connecting arm 12 drives the long connecting arm 14 to rotate through the movable shaft 13, and the long connecting arm 14 drives the clamping column 16 to slide inside the arc groove 15 to move the clamping column 16 to the center position. With the cooperation of the three groups of clamping columns 16, the semiconductor chip is clamped and fixed, and then glue is applied to the back of the semiconductor chip in sequence to package it. The plastic shells are placed on the surface of the suction cup 9 in sequence, and the suction cup 9 sucks the encapsulated plastic shells. The rotating motor 22 drives the worm 20 to rotate, and the worm 20 drives the worm wheel 21 to rotate. The worm wheel 21 drives the flip frame 5 to rotate through the rotating shaft 23. The flip frame 5 drives the upper support plate 8, the suction cup 9 and the encapsulated plastic shell to rotate, and the encapsulated plastic shell is rotated downward. The lifting motor 17 drives the lifting threaded rod 18 to rotate, and the lifting threaded rod 18 drives the lifting threaded sleeve 19 to move downward, and the lifting threaded sleeve 1 9 drives the rotating seat 3, the rotating shaft 23, the flip frame 5, the upper support plate 8, the suction cup 9 and the packaging plastic shell to move downward, so that the packaging plastic shell contacts the glue, and then the suction cup is closed to leave the packaging plastic shell on the back of the semiconductor chip, and the lifting motor 17 is opened in reverse, and the lifting motor 17 drives the flip frame 5 to move upward, and then the rotating motor 22 is opened in reverse, and the rotating motor 22 drives the suction cup 9 to rotate and reset, and the pressing block 6 is rotated downward, and the lifting motor 17 drives the pressing block 6 to move downward, so that the pressing block 6 contacts the surface of the packaging plastic shell and presses down. Under the continuous action of the lifting motor 17, the pressing block 6 tightly adheres the packaging plastic shell and the semiconductor chip to complete the chip packaging operation, and the bidirectional threaded rod 24 is driven by the adjustment motor 26 to rotate, and the bidirectional threaded rod 24 drives the two sets of bidirectional threaded sleeves 25 to move, and the bidirectional threaded sleeve 25 drives the pressing block 6 to move, to fine-tune the position of the pressing block 6, to facilitate the pressing and fitting of different positions of the packaging plastic shell, thereby completing.

Claims

1. A semiconductor packaging structure, comprising a base (1) and a clamping seat (4), characterized in that: The base (1) is internally provided with multiple groups of clamping seats (4) at equal intervals, the clamping seats (4) are internally provided with three groups of arc grooves (15) at equal intervals, the arc grooves (15) are internally provided with clamping columns (16) which are slidably installed, the bottom ends of the clamping seats (4) are each provided with a clamping motor (10), the output ends of the clamping motors (10) are each provided with a driving shaft (11), the surfaces of the driving shafts (11) are each provided with three groups of short connecting arms (12) at equal intervals, the ends of the short connecting arms (12) away from the driving shaft (11) are each provided with a long connecting arm (14), the ends of the long connecting arms (14) close to the short connecting arms (12) are each provided with a movable shaft (13), and the long connecting arms (14) are connected to the movable shaft (13) by the movable shaft (13). 3) is movably connected to the short connecting arm (12), and the long connecting arm (14) is connected to the clamping column (16), the top of the base (1) is symmetrically installed with an integrated frame (2), the top of the integrated frame (2) is installed with a lifting motor (17), the interior of the integrated frame (2) is movably installed with a lifting threaded rod (18), and the output end of the lifting motor (17) is connected to the lifting threaded rod (18), the surface of the lifting threaded rod (18) is covered with a lifting threaded sleeve (19), and the lifting threaded sleeve (19) is threadedly connected to the lifting threaded rod (18), and the lifting threaded sleeve (19) is slidably connected to the integrated frame (2), and the side wall of the lifting threaded sleeve (19) is installed with a rotating seat (3).

2. The semiconductor package structure according to claim 1, wherein: A rotating motor (22) is installed on the inner wall of the rotating seat (3), a worm (20) is installed on the output end of the rotating motor (22), and the worm (20) is movably connected to the rotating seat (3).

3. The semiconductor package structure according to claim 2, wherein: A rotating shaft (23) is movably mounted inside the rotating seat (3) on one side of the worm (20), and the rotating shaft (23) extends to the outside of the rotating seat (3).

4. The semiconductor package structure according to claim 3, wherein: The surface of the rotating shaft (23) is covered with a worm wheel (21), and the worm (20) and the worm wheel (21) are meshed with each other.

5. The semiconductor package structure according to claim 1, wherein: A turning frame (5) is provided above the base (1), and the turning frame (5) is connected to the rotating shaft (23).

6. The semiconductor package structure according to claim 5, wherein: The top of the flip frame (5) is equipped with multiple groups of upper support plates (8) at equal intervals, and multiple groups of suction cups (9) are installed inside the upper support plates (8). The bottom of the flip frame (5) is equipped with multiple groups of lower support plates (7) at equal intervals.

7. The semiconductor package structure according to claim 6, wherein: The interior of the lower support plate (7) is symmetrically and movably mounted with a bidirectional threaded rod (24), the surface of the bidirectional threaded rod (24) is sleeved with two sets of bidirectional threaded sleeves (25), and the bidirectional threaded sleeves (25) are threadedly connected to the bidirectional threaded rod (24), and the bottom end of the bidirectional threaded sleeve (25) is mounted with a pressing block (6).

8. The semiconductor package structure according to claim 7, wherein: An adjustment motor (26) is symmetrically installed inside the lower support plate (7) on one side of the bidirectional threaded rod (24), and the output end of the adjustment motor (26) is connected to the bidirectional threaded rod (24).

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