Circuit board assembly and electronic equipment

Abstract

The utility model relates to a circuit board assembly and electronic equipment, the circuit board assembly comprises a circuit board, a chip, a packaging ring and a radiator, the chip comprises a substrate and a chip bare crystal, the substrate is electrically connected with the circuit board, the chip bare crystal is packaged on one side, deviating from the circuit board, of the substrate, the packaging ring is fixed on one side, deviating from the circuit board, of the substrate and surrounds the outer side of the chip bare crystal, and the radiator is electrically connected with the chip bare crystal. The radiator is connected to the side, away from the circuit board, of the packaging ring in a sealed mode through a first connecting piece, the radiator is connected to the circuit board through a second connecting piece, a heat dissipation cavity is defined by the radiator, the packaging ring and the substrate, the chip bare crystal is arranged in the heat dissipation cavity, and the radiator is used for spraying refrigerant media into the heat dissipation cavity. The circuit board assembly is simple in structure, the reliability of sealing connection between the radiator and the packaging ring can be improved, meanwhile, the stability of electric connection between the chip and the circuit board is guaranteed, disassembly and replacement of all components are facilitated, and maintenance is convenient.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of electronic products, and in particular to a circuit board assembly and an electronic device. Background Art

[0002] With the increasing performance of electronic devices (such as communications equipment and computers), and the increasing power consumption and power density within these devices, chip heat dissipation has received increasing attention. Currently, a heat sink is typically placed on the side of the chip facing away from the circuit board, with one or more layers of thermally conductive media positioned between the heat sink and the chip to dissipate heat. However, the high thermal resistance of the thermally conductive media can reduce the efficiency of heat conduction between the chip and the heat sink. Furthermore, due to differences in thermal expansion coefficients between various components, the multilayered thermally conductive media can easily delaminate, compromising the chip's heat dissipation.

[0003] Related technologies eliminate the thermally conductive medium and instead seal the heat sink to the chip, forming a cavity for holding the coolant. This allows the coolant to enter the cavity and directly contact the chip surface, improving the chip's heat dissipation. However, when external impact loads are transmitted to the seal, there is a high risk of coolant leakage. Furthermore, it is difficult to simultaneously ensure the reliability of the seal between the heat sink and chip and the stability of the electrical connection between the chip and the circuit board. Utility Model Content

[0004] In view of this, the present application provides a circuit board assembly and an electronic device to solve the problem in the prior art that it is difficult to simultaneously take into account the sealing performance of the sealed connection between the heat sink and the chip and the stability of the electrical connection between the chip and the circuit board.

[0005] A first aspect of an embodiment of the present application provides a circuit board assembly, comprising a circuit board, a chip, a packaging ring and a heat sink, wherein the chip comprises a substrate and a chip die, the substrate is electrically connected to the circuit board, the chip die is packaged on a side of the substrate facing away from the circuit board, the packaging ring is fixed to a side of the substrate facing away from the circuit board, and is arranged around the outside of the chip die, the heat sink is sealedly connected to the side of the packaging ring facing away from the circuit board through the first connecting member, the heat sink is connected to the circuit board through the second connecting member, the heat sink, the packaging ring and the substrate form a heat dissipation cavity, the chip die is arranged in the heat dissipation cavity, and the heat sink is used to spray a coolant medium into the heat dissipation cavity.

[0006] In the present application, the refrigerant in the radiator can be directly sprayed into the heat dissipation cavity, so that the refrigerant can directly contact the chip bare crystal to dissipate heat, thereby maximizing the heat dissipation capacity of the chip and improving the heat dissipation efficiency of the chip. In addition, the radiator is sealed with the packaging ring fixed on the substrate through the first connecting member, which can improve the connection reliability between the radiator and the packaging ring, realize the axial sealing of the heat dissipation cavity, and avoid the external impact load from being transmitted to the sealed connection between the radiator and the packaging ring, thereby avoiding the risk of leakage of the refrigerant in the heat dissipation cavity under impact scenarios. At the same time, the radiator is connected to the circuit board through the second connecting member, so that the pressure applied to the radiator by the second connecting member can be used to press the chip to the circuit board, realize the electrical connection between the chip and the circuit board, and improve the stability of the electrical connection between the chip and the circuit board. The structure is simple and can realize the decoupling of the sealed connection between the radiator and the packaging ring and the electrical connection between the chip and the circuit board, thereby improving the reliability of the sealed connection between the radiator and the packaging ring while ensuring the stability of the electrical connection between the chip and the circuit board. It is also convenient for disassembly and replacement of various components and easy for maintenance.

[0007] In a possible design, the circuit board assembly further includes a seal, which is disposed between the heat sink and the packaging ring.

[0008] In this solution, the use of a welding-free axial sealing method such as a seal can achieve reliable sealing of the heat dissipation cavity while facilitating the disassembly of the radiator, thereby facilitating the subsequent maintenance and replacement of the chip and radiator, thereby saving users' usage costs.

[0009] In a possible design, the heat sink is provided with a groove, and the sealing member is provided in the groove.

[0010] In this solution, the groove can limit the displacement of the seal between the heat sink and the packaging ring, thereby reducing the fluctuation effect of external impact loads on the seal, improving the structural stability of the circuit board assembly, and further improving the reliability of the sealing connection between the heat sink and the packaging ring.

[0011] In a possible design, the heat sink includes a main body and a supporting portion, wherein the supporting portion is protruding from the surface of the main body, the supporting portion abuts against the packaging ring, and the surface of the supporting portion on one side close to the packaging ring is recessed with the groove, and the groove is closed by the packaging ring.

[0012] In this solution, the support portion increases the volume of the heat dissipation cavity, allowing it to accommodate more coolant and improving the heat exchange efficiency between the coolant and the chip. A groove is recessed into the surface of the support portion near the packaging ring. The groove is sealed by the packaging ring, ensuring a fixed compression of the seal within the groove and preventing external impact loads from being transmitted to the seal. This isolates the seal from compression changes caused by external impact loads, further ensuring a reliable seal in the heat dissipation cavity.

[0013] In a possible design, the material of the seal is one of rubber, silicone or sealant materials, so that the seal has higher elasticity, reduces the cost of preparing the seal, and increases the service life of the seal.

[0014] In a possible design, the circuit board assembly further includes an elastic member, one end of which abuts against the second connecting member, and the other end of which abuts against the heat sink.

[0015] In this solution, by arranging an elastic member between the second connecting member and the heat sink, the pressure applied by the second connecting member to the heat sink can be controlled within a certain range, thereby avoiding damage to the contact pins on the circuit board caused by excessive tightening of the second connecting member, thereby improving the service life of the circuit board. It can also avoid the second connecting member from loosening due to external impact loads, resulting in poor contact between the chip and the circuit board due to insufficient pressure applied to the heat sink, further improving the stability of the electrical connection between the chip and the circuit board under impact scenarios.

[0016] In a possible design, the circuit board assembly further includes an adjusting member, which is disposed on a side of the heat sink close to the circuit board. The adjusting member is threadedly connected to the second connecting member and abuts against the heat sink.

[0017] In this solution, the amount of compression of the elastic member between the second connector and the heat sink can be adjusted by moving the adjustment member on the second connector, thereby adjusting the pressure range of the second connector on the heat sink. This facilitates precise adjustment of the compression of the elastic member and reduces the difficulty of adjusting the compression of the elastic member. Furthermore, when removing and maintaining the circuit board, the second connector and the elastic member can be secured to the heat sink via the adjustment member, making it easier to reassemble the circuit board assembly after replacing the circuit board and improving disassembly and maintenance efficiency.

[0018] In one possible design, the heat sink further includes a receiving cavity for receiving a coolant and a first through-hole. The receiving cavity is configured to receive a coolant, and the first through-hole communicates with the receiving cavity. The coolant in the receiving cavity is ejected into the heat dissipation cavity through the first through-hole. This simple structure reduces the structural complexity of the heat sink, facilitates fabrication, and facilitates mass production of the heat sink, saving costs.

[0019] In a possible design, the heat sink is provided with a plurality of the first through holes, and along the thickness direction of the circuit board assembly, the plurality of the first through holes are arranged corresponding to the chip bare crystals.

[0020] In this solution, the provision of multiple first through holes can increase the spray rate of the radiator, so that the coolant medium can enter the heat dissipation cavity faster, and the multiple first through holes are provided corresponding to the chip bare crystal, so that the coolant medium can be sprayed more evenly to the surface of the chip bare crystal that generates heat in the chip, thereby increasing the contact area between the coolant medium and the chip bare crystal, so as to achieve targeted heat dissipation of high heat flux density hotspots, and further improve the heat dissipation efficiency of the chip.

[0021] In one possible design, the heat sink is further provided with a second through-hole that communicates with the accommodating cavity. The coolant in the heat dissipation cavity enters the accommodating cavity through the second through-hole, thereby preventing excessive pressure in the heat dissipation cavity and enabling heat exchange circulation of the coolant, further improving the heat dissipation efficiency of the chip. This simple structure reduces the structural complexity of the heat sink, facilitates fabrication, and facilitates mass production of heat sinks, saving costs.

[0022] In a possible design, the heat sink is provided with a plurality of second through holes, and along the thickness direction of the circuit board assembly, the second through holes are arranged corresponding to at least a portion of the area on the substrate where the chip bare crystal is not provided.

[0023] In this solution, the structure enables the refrigerant medium that has absorbed the heat of the chip bare crystal in the heat dissipation cavity to enter the accommodating cavity more quickly, thereby increasing the heat exchange circulation rate of the refrigerant medium in the heat dissipation cavity, and ensuring that the heat exchanger can have a higher injection rate while maintaining the pressure in the heat dissipation cavity within a safe pressure range, thereby improving the safety of the electronic equipment.

[0024] In one possible design, the packaging ring includes a first connecting portion and a second connecting portion, the second connecting portion is connected to the outer edge of the first connecting portion, the first connecting portion is connected between the heat sink and the substrate, and the second connecting portion is connected to the heat sink through the first connecting member.

[0025] In this solution, the heat sink is connected to the second connection portion of the packaging ring via a first connector, preventing the first connector from excessively interfering with the chip during the connection process and potentially damaging it. Furthermore, the chip substrate is fixedly connected to the first connection portion of the packaging ring, reducing the size of the chip substrate and the space occupied by the chip on the circuit board. This helps save costs and meets the integrated design requirements of the circuit board assembly.

[0026] A second aspect of the present application provides an electronic device comprising a base plate and a circuit board assembly as described in any of the above embodiments, wherein the circuit board assembly is mounted on the base plate. Since the circuit board assembly has the above-described technical effects, an electronic device including the circuit board assembly should also have corresponding technical effects, which will not be further described here.

[0027] It should be understood that the foregoing general description and the following detailed description are merely illustrative and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0029] Figure 1 It is a structural diagram of a circuit board assembly in the related art;

[0030] Figure 2 A schematic structural diagram of an electronic device provided in this application in a specific embodiment;

[0031] Figure 3 A schematic structural diagram of a circuit board assembly provided in this application in a specific embodiment;

[0032] Figure 4 for Figure 3 A schematic diagram of a portion of the structure of the circuit board assembly;

[0033] Figure 5 This is a schematic structural diagram of another specific embodiment of the circuit board assembly provided in this application.

[0034] Reference numerals:

[0035] 1'-circuit board;

[0036] 2'-chip;

[0037] 4'- radiator;

[0038] 5'-linker;

[0039] 6'-cavity;

[0040] 7'-seal;

[0041] 10-circuit board assembly;

[0042] 1- Circuit board;

[0043] 11- stylus;

[0044] 2-chip;

[0045] 21-Substrate;

[0046] 22- bare chip;

[0047] 3-packaging ring;

[0048] 31- first connecting portion;

[0049] 32- second connecting portion;

[0050] 4- Radiator;

[0051] 41-Ontology;

[0052] 42-supporting portion;

[0053] 43-groove;

[0054] 44-accommodation cavity;

[0055] 45-first through hole;

[0056] 46-second through hole;

[0057] 47-Water inlet;

[0058] 48-water outlet;

[0059] 5a-first connecting member;

[0060] 5b-second connecting member;

[0061] 6- heat dissipation cavity;

[0062] 7-Seal;

[0063] 8- elastic member;

[0064] 9-adjustment piece;

[0065] 20- bottom plate;

[0066] 30-Connecting pipe.

[0067] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application. DETAILED DESCRIPTION

[0068] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0069] In the description of this application, unless otherwise expressly specified or limited, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "plurality" refers to two or more; the terms "connected" and "fixed" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0070] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0071] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.

[0072] With the increasing performance of electronic devices (such as communications equipment and computers), and the increasing power consumption and power density within these devices, chip heat dissipation has received increasing attention. Currently, a heat sink is typically placed on the side of the chip facing away from the circuit board, with one or more layers of thermally conductive media positioned between the heat sink and the chip to dissipate heat. However, the high thermal resistance of the thermally conductive media can reduce the efficiency of heat conduction between the chip and the heat sink. Furthermore, due to differences in thermal expansion coefficients between various components, the multilayered thermally conductive media can easily delaminate, compromising the chip's heat dissipation.

[0073] Please refer to Figure 1 , Figure 1 FIG. 1 is a schematic diagram of the structure of a circuit board assembly in the related art. Figure 1 As shown, the circuit board assembly of the related art includes a circuit board 1', a chip 2', and a heat sink 4'. The chip 2' is electrically connected to the circuit board 1', and the heat sink 4' is sealed to the chip 2' to form a cavity 6' for containing coolant. After the coolant enters the cavity, it can directly contact the surface of the chip 2', thereby improving the heat dissipation effect of the chip 2'.

[0074] However, if Figure 1As shown, in the related art, the heat sink 4' is usually connected to the circuit board 1' via a connector 5', so that the heat sink 4' is pressed against the chip 2' to achieve a sealed connection between the heat sink 4' and the chip 2' via the seal 7', and at the same time, the chip 2' is pressed against the circuit board 1' to achieve an electrical connection between the chip 2' and the circuit board 1'. However, when an external impact load is transmitted to the sealing position, the compression amount of the seal 7' may fluctuate, and there is a high risk of leakage of the coolant. In the circuit board assembly of this structure, the sealed connection between the heat sink 4' and the chip 2' and the electrical connection between the chip 2' and the circuit board 1' are not decoupled. The pressing force of the connector 5' on the heat sink 4' is difficult to simultaneously take into account the reliability of the sealed connection between the heat sink 4' and the chip 2' and the stability of the electrical connection between the chip 2' and the circuit board 1'.

[0075] In view of this, the present application provides a circuit board assembly and an electronic device to improve the reliability of the sealed connection between the radiator and the chip while ensuring a stable connection between the chip and the circuit board, thereby achieving a reliable connection of the electrical signal. Wherein, the electronic device includes, for example, a mobile phone, a tablet computer, a desktop computer, a laptop computer, a handheld computer, a notebook computer, an ultra-mobile personal computer (UMPC), a netbook, and a cellular phone, a personal digital assistant (PDA), an augmented reality (AR) device, a virtual reality (VR) device, an artificial intelligence (AI) device, a wearable device, an in-vehicle device, a smart home device and / or a smart city device and other terminal electronic devices, without limitation. The present application is further described in detail below through specific embodiments and in conjunction with the accompanying drawings.

[0076] Please refer to Figure 2 , Figure 2 This is a schematic diagram of the structure of the electronic device provided in this application in a specific embodiment. Figure 2 As shown, the electronic device includes a base plate 20 and a circuit board assembly 10 , and the circuit board assembly 10 is mounted on the base plate 20 .

[0077] The bottom plate 20 may be a plate-shaped component such as a housing, a middle frame or a printed circuit board of an electronic device, which is not limited here.

[0078] In addition, the electronic device may further include a connecting pipe 30 , which may be connected to the water inlet 47 and the water outlet 48 of the radiator 4 of the circuit board assembly 10 , so as to facilitate connection between the radiator 4 and the refrigerant medium supply device in the electronic device.

[0079] Please refer to Figure 3 , Figure 3 This is a schematic diagram of the structure of the circuit board assembly provided in this application in a specific embodiment. Figure 3 As shown, the circuit board assembly 10 includes a circuit board 1 , a chip 2 , a packaging ring 3 and a heat sink 4 .

[0080] The circuit board 1 can be a single-layer or multi-layer printed circuit board (PCB), or other circuit boards without limitation. The circuit board 1 can be provided with a chip 2, capacitors, inductors, transistor sensors and other electrical components.

[0081] The chip 2 includes a substrate 21 and a chip die 22. The substrate 21 is electrically connected to the circuit board 1, and the chip die 22 is packaged on the side of the substrate 21 facing away from the circuit board 1. The chip 2 can be packaged using a ball grid array package (BGA), a chip size package (CSP), a pin grid array package (PGA), a land grid array package (LGA), or the like. In the embodiment of the present application, the chip 2 is a land grid array package (LGA) chip to improve the electrical connection performance between the chip 2 and the circuit board 1. Specifically, a contact pin 11 can be provided on the circuit board 1, and a pad or contact can be provided on the substrate 21. The contact pin 11 on the circuit board 1 contacts the pad or contact on the substrate 21 to achieve electrical connection between the chip 2 and the circuit board 1.

[0082] The packaging ring 3 is fixed to the side of the substrate 21 facing away from the circuit board 1 and surrounds the outer side of the chip die 22. The packaging ring 3 can be a metal ring made of a material such as stainless steel, or a plastic ring. Exemplarily, the packaging ring 3 is connected to the substrate 21 by bonding or other means.

[0083] The heat sink 4 is used to dissipate heat from the chip 2. The heat sink 4, the packaging ring 3, and the substrate 21 enclose a heat dissipation cavity 6. The chip die 22 is disposed within the heat dissipation cavity 6. The heat sink 4 is used to spray a coolant into the heat dissipation cavity 6 so that the coolant can contact the surface of the chip die 22 within the heat dissipation cavity 6, thereby dissipating heat from the chip die 22.

[0084] The heat sink 4 is sealed and connected to the side of the packaging ring 3 facing away from the circuit board 1 through the first connecting member 5a, and is connected to the circuit board 1 through the second connecting member 5b.

[0085] In this embodiment, Figure 3As shown, the coolant medium in the radiator 4 can be directly sprayed into the heat dissipation cavity 6, so that the coolant medium can directly contact the chip bare crystal 22 to dissipate heat, thereby maximizing the heat dissipation capacity of the chip 2 and improving the heat dissipation efficiency of the chip 2. In addition, the radiator 4 is sealed with the packaging ring 3 fixed on the substrate 21 through the first connector 5a, which can improve the connection reliability between the radiator 4 and the packaging ring 3, realize the axial sealing of the heat dissipation cavity 6, and avoid the external impact load from being transmitted to the sealed connection between the radiator 4 and the packaging ring 3, thereby avoiding the risk of leakage of the coolant medium in the heat dissipation cavity under impact scenarios. At the same time, the radiator 4 is connected to the circuit board 1 through the second connector 5b, so that the pressure applied to the radiator 4 by the second connector 5b can be used to press the chip 2 to the circuit board 1, realize the electrical connection between the chip 2 and the circuit board 1, and improve the stability of the electrical connection between the chip 2 and the circuit board 1. The structure is simple and can achieve decoupling of the sealed connection between the heat sink 4 and the packaging ring 3 and the electrical connection between the chip 2 and the circuit board 1, thereby improving the reliability of the sealed connection between the heat sink 4 and the packaging ring 3 while ensuring the stability of the electrical connection between the chip 2 and the circuit board 1, and also facilitating the disassembly and replacement of various components and maintenance.

[0086] The first connector 5a can be a fastening screw, thereby further improving the connection reliability between the heat sink 4 and the packaging ring 3, thereby further preventing the impact of external impact loads on the sealing of the heat dissipation cavity 6, and further reducing the risk of refrigerant medium leakage under impact scenarios. Of course, the first connector 5a can also be other locking connectors, which is not limited here.

[0087] The second connector 5b may be a fastening screw, thereby further improving the connection reliability between the heat sink 4 and the circuit board 1, thereby preventing the chip 2 from shifting relative to the circuit board 1, allowing the chip 2 to be stably pressed onto the circuit board 1, and further improving the stability of the electrical connection between the chip 2 and the circuit board 1. Of course, the second connector 5b may also be other locking connectors, which are not limited here.

[0088] In addition, the refrigerant medium can be any suitable coolant, including air, water, ethylene glycol, propylene glycol, ethanol, ammonia, or any other fluid. A combination of two or more of these fluids can also be used, without limitation. In the embodiment of the present application, the refrigerant medium is a liquid medium, which has a higher specific heat capacity, thereby further improving the heat dissipation effect of the radiator 4.

[0089] In addition, if Figure 2 As shown, the circuit board assembly 10 can be connected to the base plate 20 via the second connector 5b, thereby further reducing the number of connectors used in the electronic device, which is beneficial to the lightweight design requirements of the electronic device. Of course, the circuit board assembly 10 can also be connected to the base plate 20 in other ways.

[0090] In a specific embodiment, Figure 3 As shown, the circuit board assembly further includes an elastic member 8 , one end of the elastic member 8 abuts against the second connecting member 5 b , and the other end abuts against the heat sink 4 .

[0091] like Figure 3 As shown, the electrical connection between the chip 2 and the circuit board 1 requires a certain pressure range to ensure the stability of the electrical connection. If the pressure is too high, the contact pins 11 on the circuit board 1 are easily damaged. If the pressure is too low, the contact between the chip 2 and the circuit board 1 is poor, which can easily lead to electrical connection failure.

[0092] In this embodiment, Figure 3 As shown, by arranging an elastic member 8 between the second connector 5b and the heat sink 4, the pressure applied by the second connector 5b to the heat sink 4 can be controlled within a certain range, thereby avoiding excessive tightening of the second connector 5b and causing damage to the contact pins 11 on the circuit board 1, thereby improving the service life of the circuit board 1, and can also avoid the second connector 5b from loosening due to external impact loads, resulting in poor contact between the chip 2 and the circuit board 1 due to insufficient pressure applied to the heat sink 4, further improving the stability of the electrical connection between the chip 2 and the circuit board 1 under impact scenarios.

[0093] Among them, Figure 3 As shown, the elastic member 8 can be a spring, so that the elastic member 8 can be sleeved on the second connecting member 5b, thereby further saving costs and improving the structural stability of the circuit board assembly 10. Of course, the elastic member 8 can also be other elastic components, such as rubber rings, etc., which is not limited here.

[0094] In a specific embodiment, Figure 3 As shown, the circuit board assembly 10 further includes an adjusting member 9 , which is disposed on a side of the heat sink 4 close to the circuit board 1 . The adjusting member 9 is threadedly connected to the second connecting member 5 b and abuts against the heat sink 4 .

[0095] In this embodiment, Figure 3 As shown, by moving the position of the adjusting member 9 on the second connecting member 5b, the compression amount of the elastic member 8 between the second connecting member 5b and the heat sink 4 can be adjusted, thereby adjusting the pressure range of the second connecting member 5b on the heat sink 4. This facilitates precise adjustment of the compression amount of the elastic member 8 and reduces the difficulty of adjusting the compression amount of the elastic member 8. At the same time, when disassembling and maintaining the circuit board 1, the second connecting member 5b and the elastic member 8 can be fixed to the heat sink 4 via the adjusting member 9, thereby further facilitating the assembly of the circuit board assembly 10 after replacing the circuit board 1 and improving the efficiency of disassembly and maintenance.

[0096] In a specific embodiment, Figure 3As shown, the packaging ring 3 connected between the substrate 21 and the heat sink 4 includes a first connecting portion 31 and a second connecting portion 32. The second connecting portion 32 is arranged around the outer edge of the first connecting portion 31. The first connecting portion 31 is connected between the heat sink 4 and the substrate 21, and the second connecting portion 32 is connected to the heat sink 4 through the first connecting member 5a.

[0097] In this embodiment, Figure 3 As shown, the heat sink 4 is connected to the second connection portion 32 of the packaging ring 3 via the first connection member 5a, which prevents the first connection member 5a from excessively interfering with the chip 2 during the connection process, potentially causing damage. Furthermore, the substrate 21 of the chip 2 is fixedly connected to the first connection portion 31 of the packaging ring 3, which can reduce the size of the substrate 21 of the chip 2, thereby reducing the space occupied by the chip 2 on the circuit board 1. This helps save costs and meets the integrated design requirements of the circuit board assembly 10.

[0098] The radiator 4 may be a jet liquid cooling radiator, or other radiators with a spray module, which is not limited here.

[0099] Please refer to Figure 4 , Figure 4 for Figure 3 Schematic diagram of part of the structure of the circuit board assembly, Figure 4 The arrows in the middle show the flow path of the refrigerant.

[0100] like Figure 3 and Figure 4 As shown, the radiator 4 is provided with a water inlet 47, a water outlet 48, and a receiving chamber 44, which is used to receive the refrigerant. The radiator 4 is connected to the refrigerant supply device in the electronic device through the water inlet 47 and the water outlet 48, so that the refrigerant can flow into the receiving chamber 44 from the water inlet 47 and flow out of the receiving chamber 44 from the water outlet 48, thereby realizing the heat dissipation cycle of the refrigerant.

[0101] In a specific embodiment, Figure 3 and Figure 4 As shown, the radiator 4 is also provided with a first through hole 45, which is connected to the accommodating cavity 44 so that the refrigerant medium in the accommodating cavity 44 can be sprayed into the heat dissipation cavity 6 through the first through hole 45. The structure is simple, which can reduce the structural complexity of the radiator 4, is easy to process and realize, and is convenient for mass production of the radiator 4, saving costs.

[0102] Furthermore, if Figure 3 and Figure 4 As shown, the heat sink 4 is provided with a plurality of first through holes 45 , and along the thickness direction of the circuit board assembly 10 , the plurality of first through holes 45 are provided corresponding to the chip dies 22 .

[0103] In this embodiment, Figure 3 and Figure 4 As shown, the arrangement of multiple first through holes 45 can increase the injection rate of the radiator 4, so that the coolant medium can enter the heat dissipation cavity 6 faster, and the multiple first through holes 45 are arranged corresponding to the chip bare crystal 22, so that the coolant medium can be sprayed more evenly to the surface of the chip bare crystal 22 that generates heat in the chip 2, thereby increasing the contact area between the coolant medium and the chip bare crystal 22, so as to achieve targeted heat dissipation for high heat flux density hotspots, and further improve the heat dissipation efficiency of the chip 2.

[0104] The first through hole 45 may be a circular hole, a square hole, a strip hole, a conical hole or a hole of other shapes, which is not limited here.

[0105] Furthermore, if Figure 3 and Figure 4 As shown, the heat sink 4 is further provided with a second through hole 46, which communicates with the accommodating cavity 44. This allows the coolant in the heat dissipation cavity 6 to enter the accommodating cavity 44 through the second through hole 46, thereby preventing excessive pressure in the heat dissipation cavity 6 and enabling heat exchange circulation of the coolant, further improving the heat dissipation efficiency of the chip 2. This simple structure can reduce the structural complexity of the heat sink 4, facilitate processing, and facilitate mass production of the heat sink 4, saving costs.

[0106] Furthermore, if Figure 3 and Figure 4 As shown, the heat sink 4 is provided with a plurality of second through holes 46 . Along the thickness direction of the circuit board assembly 10 , the second through holes 46 are provided corresponding to at least a portion of the area on the substrate 21 where the chip bare die 22 is not provided.

[0107] In this embodiment, Figure 3 and Figure 4 As shown, this structure enables the coolant medium that absorbs the heat of the chip bare crystal 22 in the heat dissipation cavity 6 to enter the accommodating cavity 44 more quickly, thereby improving the heat exchange circulation rate of the coolant medium in the heat dissipation cavity 6, and ensuring that the heat exchanger 4 can have a higher injection rate while maintaining the pressure in the heat dissipation cavity 6 within a safe pressure range, thereby improving the safety of the electronic equipment.

[0108] The second through hole 46 may be a circular hole, a square hole, a strip hole, a tapered hole or a hole of other shapes, which is not limited here.

[0109] For example, Figure 3 and Figure 4In the specific embodiment shown, the chip bare crystal 22 is arranged at the center position of the substrate 21, and the multiple first through holes 45 are correspondingly arranged in the central area of the top of the heat dissipation cavity 6 of the radiator 4, and the multiple second through holes 46 are correspondingly arranged in the edge area of the top of the heat dissipation cavity 6 of the radiator 4, so that the refrigerant medium ejected by the radiator 4 through the first through holes 45 can be sprayed onto the surface of the chip bare crystal 22 for heat exchange, and then can flow into the accommodating cavity 44 through the second through holes 46 in the edge area to realize the heat exchange cycle of the refrigerant medium and improve the heat dissipation efficiency of the chip 2.

[0110] In another specific embodiment, a nozzle, an air release valve and other devices may be provided at the top of the radiator 4 at the heat dissipation cavity 6 to realize the heat exchange circulation of the refrigerant medium in the heat dissipation cavity 6, which is not limited here.

[0111] In a specific embodiment, Figure 3 As shown, the circuit board assembly 10 further includes a seal 7 , which is disposed between the heat sink 4 and the packaging ring 3 .

[0112] In this embodiment, Figure 3 As shown, the use of the welding-free axial sealing method of the seal 7 can achieve reliable sealing of the heat dissipation cavity 6 while facilitating the disassembly of the radiator 4, thereby facilitating the subsequent maintenance and replacement of the chip 2 and the radiator 4, thereby saving the user's usage costs.

[0113] In a specific embodiment, Figure 3 As shown, the radiator 4 is provided with a groove 43 , and the sealing member 7 is provided in the groove 43 .

[0114] In this scheme, if Figure 3 As shown, the groove 43 can limit the displacement of the seal 7 between the heat sink 4 and the packaging ring 3, thereby reducing the fluctuation effect of the external impact load on the seal 7, improving the structural stability of the circuit board assembly 10, and further improving the reliability of the sealing connection between the heat sink 4 and the packaging ring 3.

[0115] In a specific embodiment, if Figure 4 As shown, the heat sink 4 includes a body 41 and a support portion 42. The support portion 42 is protruding from the surface of the body 41 and abuts against the packaging ring 3. A groove 43 is recessed on the surface of the support portion 42 close to the packaging ring 3. The groove 43 is closed by the packaging ring 3.

[0116] In this embodiment, Figure 4As shown, the provision of support portion 42 can increase the volume of heat dissipation cavity 6, thereby allowing heat dissipation cavity 6 to accommodate more coolant medium and improving the heat exchange efficiency between the coolant medium and chip 2. A groove 43 is provided in the surface of support portion 42 on one side near packaging ring 3. Groove 43 is sealed by packaging ring 3, thereby ensuring that the seal 7 disposed in groove 43 has a fixed amount of compression and preventing external impact loads from being transmitted to seal 7. This isolates the seal 7 from changes in compression caused by external impact loads, further ensuring the reliable sealing of heat dissipation cavity 6.

[0117] In a specific embodiment, the material of the seal 7 is one of rubber, silicone or sealant materials, so that the seal 7 has higher elasticity, reduces the preparation cost of the seal 7, and increases the service life of the seal 7.

[0118] For example, Figure 4 As shown, when the material of the seal 7 is rubber or silicone, the seal 7 can be prepared first, and then the seal 7 can be installed in the groove 43 of the radiator 4, and finally the radiator 4 and the packaging ring 3 are locked and connected through the first connecting member 5a, so that the seal 7 is compressed between the radiator 4 and the packaging ring 3 to achieve a sealed connection between the radiator 4 and the packaging ring 3.

[0119] For example, Figure 4 As shown, when the material of the sealing member 7 is a sealant material, the sealant material can be directly filled into the groove 43 of the radiator 4, and the radiator 4 and the packaging ring 3 are locked and connected through the first connecting member 5a, so that the sealant material forms a sealant 7 with precise sealing at the joint between the radiator 4 and the packaging ring 3, thereby providing good sealing performance for the heat dissipation cavity 6.

[0120] Of course, the material of the sealing member 7 may also be other flexible materials, which is not limited here.

[0121] In a specific embodiment, the seal 7 may be a sealing ring to improve the preparation efficiency of the seal 7 and save preparation costs. It also facilitates the installation of the seal 7 and improves the assembly efficiency of the circuit board assembly 10.

[0122] In another specific embodiment, the seal 7 may also be a ring structure formed by multiple sealing strips or sealing blocks to enhance the design freedom of the seal 7 and facilitate accurate sealing at the joint between the heat sink 4 and the packaging ring 3 .

[0123] Please refer to Figure 5 , Figure 5 This is a schematic structural diagram of another specific embodiment of the circuit board assembly provided in this application.

[0124] like Figure 5As shown, in another embodiment, the circuit board assembly 10 can be provided with multiple sealing members 7, which are arranged in a circular manner to further improve the sealing of the heat dissipation cavity 6. The number of sealing members 7 can be 2, 3, 4, 5, etc., and can be set according to actual needs and is not limited here.

[0125] Furthermore, if Figure 5 As shown, a plurality of grooves 43 may also be correspondingly provided on the radiator 4, and a plurality of seals 7 may be correspondingly provided in the plurality of grooves 43, so that each seal 7 provided in the groove 43 has a fixed compression amount, thereby avoiding the external impact load from being transmitted to the seal 7, isolating the compression amount change of the seal 7 caused by the external impact load, and further ensuring the reliable sealing of the heat dissipation cavity 6.

[0126] In this specification, reference can be made to the same or similar parts between the various embodiments. In particular, for the device embodiment and the terminal embodiment, since they are basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the description in the method embodiment.

[0127] The above description is merely a specific implementation of the embodiments of the present application, but the scope of protection of the embodiments of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of the present application shall be included in the scope of protection of the embodiments of the present application. Therefore, the scope of protection of the embodiments of the present application shall be based on the scope of protection of the claims.

Claims

1. A circuit board assembly, characterized in that: include: circuit boards; A chip, the chip comprising a substrate and a chip die, the substrate being electrically connected to the circuit board, the chip die being packaged on a side of the substrate facing away from the circuit board; A packaging ring, fixed to a side of the substrate facing away from the circuit board and surrounding the outer side of the chip die; a heat sink, the heat sink being sealedly connected to a side of the packaging ring facing away from the circuit board through a first connector, and the heat sink being connected to the circuit board through a second connector; The heat sink, the packaging ring and the substrate are arranged to form a heat dissipation cavity. The chip bare die is arranged in the heat dissipation cavity. The heat sink is used to spray a coolant medium into the heat dissipation cavity.

2. The circuit board assembly according to claim 1, wherein: The circuit board assembly further includes a seal disposed between the heat sink and the packaging ring.

3. The circuit board assembly according to claim 2, wherein: The radiator is provided with a groove, and the sealing component is arranged in the groove.

4. The circuit board assembly according to claim 3, wherein: The heat sink includes a body and a support portion, wherein the support portion is protruding from the surface of the body and abuts against the packaging ring; The surface of one side of the support portion close to the packaging ring is concavely provided with the groove, and the groove is closed by the packaging ring.

5. The circuit board assembly according to any one of claims 2 to 4, characterized in that: The sealing member is made of rubber, silicone or sealant.

6. The circuit board assembly according to any one of claims 1 to 5, characterized in that: The circuit board assembly further includes an elastic member, one end of which abuts against the second connecting member, and the other end of which abuts against the heat sink.

7. The circuit board assembly according to any one of claims 1 to 6, wherein: The circuit board assembly further includes an adjusting member, which is arranged on a side of the heat sink close to the circuit board; The adjusting member is threadedly connected to the second connecting member and abuts against the radiator.

8. The circuit board assembly according to any one of claims 1 to 7, wherein: The radiator is further provided with a receiving cavity and a first through hole; The accommodating cavity is used to accommodate the refrigerant medium; The first through hole is communicated with the accommodating cavity, and the coolant medium in the accommodating cavity is sprayed into the heat dissipation cavity through the first through hole.

9. The circuit board assembly according to claim 8, wherein: The heat sink is provided with a plurality of the first through holes; Along the thickness direction of the circuit board assembly, a plurality of the first through holes are arranged corresponding to the chip dies.

10. The circuit board assembly according to claim 8, wherein: The radiator is further provided with a second through hole, which is communicated with the accommodating cavity. The coolant medium in the heat dissipation cavity enters the accommodating cavity through the second through hole.

11. The circuit board assembly according to claim 10, wherein: The heat sink is provided with a plurality of second through holes; Along the thickness direction of the circuit board assembly, the second through hole is arranged corresponding to at least a portion of the area on the substrate where the chip bare die is not arranged.

12. The circuit board assembly according to any one of claims 1 to 11, characterized in that: The packaging ring includes a first connecting portion and a second connecting portion, wherein the second connecting portion is connected to the outer edge of the first connecting portion; The first connecting portion is connected between the heat sink and the substrate; The second connecting portion is connected to the heat sink through the first connecting member.

13. An electronic device, characterized in that: The electronic device includes a base plate and a circuit board assembly according to any one of claims 1 to 12, wherein the circuit board assembly is mounted on the base plate.

Images