Apparatus for manufacturing display device

Abstract

An apparatus for manufacturing a display device includes: a stage on which a display substrate is disposed; an ink discharge module that discharges ink onto the display substrate; and an ink supply module that supplies ink to the ink discharge module. The ink supply module includes: a storage portion in which ink is stored; a first flow path connecting the storage portion to the ink discharge module such that the ink stored in the storage portion flows into the ink discharge module; and a second flow path connecting the storage portion to the ink discharge module such that a portion of the ink supplied to the ink discharge module flows into the storage portion.

Description

[0001] This application claims priority to and all benefits derived from Korean Patent Application No. 10-2023-0123317, filed on September 15, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0002] One or more embodiments relate to an apparatus, and more particularly, to an apparatus for manufacturing a display device. Background Art

[0003] Mobile electronic devices have been widely used. Recently, in addition to small electronic devices such as mobile phones, tablet personal computers (PCs) have been widely used as mobile electronic devices.

[0004] To support various functions, such mobile electronic devices typically include a display device for providing visual information, such as images or videos, to a user. Recently, as the size of other components for driving the display device has decreased, the area occupied by the display device in the electronic device has gradually increased, and structures that can be bent to a certain angle from a flat state have been developed. Utility Model Content

[0005] One or more embodiments include an ink supply module wherein, when ink flows from a storage portion to an ink discharge module, the ink flows at a high flow rate until a point adjacent to the ink discharge module, and the flow rate of the ink decreases immediately before the ink is supplied to the ink discharge module.

[0006] According to one or more embodiments, an apparatus for manufacturing a display device includes: a table on which a display substrate is arranged; an ink discharge module for discharging ink onto the display substrate; and an ink supply module connected to the ink discharge module to supply ink to the ink discharge module, wherein the ink supply module includes: a storage portion in which ink is stored; a first flow path connecting the storage portion to the ink discharge module so that the ink stored in the storage portion flows into the ink discharge module; and a second flow path connecting the storage portion to the ink discharge module so that a portion of the ink supplied to the ink discharge module flows into the storage portion, and the first flow path includes: a supply flow path having a first end connected to the storage portion and a second end connected to the ink discharge module so that ink introduced from the storage portion is supplied to the ink discharge module; and a recovery flow path having a first end connected to the supply flow path and a second end connected to the storage portion so that a portion of the ink introduced into the supply flow path is recovered into the storage portion.

[0007] In one embodiment, the ink discharge module may include a plurality of head portions configured to eject ink, wherein the number of the plurality of head portions is 2. n+1 (wherein n is a natural number), and the supply flow path may include: a first supply flow path, through which ink is introduced from the storage portion; a second supply flow path, which branches into two parts from the first supply flow path; and a third supply flow path, which connects the second supply flow path to the multiple head portions.

[0008] In one embodiment, shapes of cross sections of the second supply flow path branched into two parts may be identical to each other.

[0009] In one embodiment, the sum of the cross-sectional areas of the second supply flow path branched into two parts may be the same as the cross-sectional area of the first supply flow path.

[0010] In one embodiment, the first supply flow path may include: a first first supply flow path portion comprising a flexible material and connected to the storage portion; and a second first supply flow path portion comprising a hard material and connecting the first first supply flow path portion to the second supply flow path.

[0011] In one embodiment, the second first supply flow path portion may have a straight line shape.

[0012] In one embodiment, each portion of the second supply flow path that branches into two portions may include: a first second supply flow path portion that is connected to the first supply flow path and has a curved shape; and a second second supply flow path portion that connects the first second supply flow path portion to the third supply flow path and has a straight shape.

[0013] In one embodiment, the ink supply module may further include a first pump provided in the first supply flow path so that the ink introduced into the supply flow path flows into the ink discharge module.

[0014] In an embodiment, the recovery flow path may connect the storage portion to the third supply flow path.

[0015] In one embodiment, the recovery flow path may include: a first recovery flow path connected to the storage part; a second recovery flow path branched from the first recovery flow path into two parts; and a third recovery flow path connecting the second recovery flow path to the third supply flow path.

[0016] In one embodiment, the shapes of cross sections of the second recovery flow path branched into two parts may be identical to each other.

[0017] In one embodiment, the sum of the cross-sectional areas of the second recovery flow path branched into two parts may be the same as the cross-sectional area of the first recovery flow path.

[0018] In one embodiment, the first recovery flow path may include: a first first recovery flow path portion, comprising a flexible material and connected to the storage portion; and a second first recovery flow path portion, comprising a hard material and connecting the first first recovery flow path portion to the second recovery flow path.

[0019] In one embodiment, the second first recovery flow path portion may have a straight line shape.

[0020] In one embodiment, each portion of the second recovery flow path that branches into two portions may include: a first second recovery flow path portion that is connected to the first recovery flow path and has a curved shape; and a second second recovery flow path portion that connects the first second recovery flow path portion to the third recovery flow path and has a straight shape.

[0021] In one embodiment, the ink supply module may further include a second pump disposed in the first recovery flow path so that the ink introduced into the recovery flow path flows into the storage portion.

[0022] In one embodiment, the second flow path may include: a first second flow path connected to the storage portion; a second second flow path branched from the first second flow path into two portions; and a third second flow path connecting the second second flow path to the plurality of head portions.

[0023] In one embodiment, shapes of cross sections of the second flow path branched into two parts may be identical to each other.

[0024] In one embodiment, the sum of the cross-sectional areas of the second second flow path branched into two parts may be the same as the cross-sectional area of the first second flow path.

[0025] In one embodiment, the first-second flow path may include: a first sub-flow path portion including a flexible material; and a second sub-flow path portion including a hard material and connecting the first sub-flow path portion to the second-second flow path.

[0026] Other features than those described above will be apparent from details of the drawings, from the claims and from details of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] The above and other features of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0028] Figure 1 is a perspective view schematically illustrating an apparatus for manufacturing a display device according to an embodiment;

[0029] Figure 2 is a perspective view schematically illustrating an ink supply module according to an embodiment;

[0030] Figure 3 is a perspective view schematically illustrating a first flow path according to an embodiment;

[0031] Figure 4 is a perspective view schematically illustrating a second flow path according to an embodiment;

[0032] Figure 5 is a plan view schematically illustrating a display device according to an embodiment;

[0033] Figure 6 is a cross-sectional view schematically illustrating a display device according to an embodiment; and

[0034] Figure 7 FIG. 4 is an equivalent circuit diagram of a pixel of a display panel according to an embodiment. DETAILED DESCRIPTION

[0035] The present invention will now be described more fully hereinafter with reference to the accompanying drawings showing various embodiments. However, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the scope of the invention to those skilled in the art.

[0036] Because various modifications and various embodiments are possible, specific embodiments are illustrated in the drawings and described in detail in the detailed description. The effects and features of the present disclosure and methods for achieving them will be apparent with reference to the embodiments described in detail below in conjunction with the drawings. However, the present disclosure is not limited to the embodiments disclosed herein, but can be implemented in various forms.

[0037] It will be understood that when an element is referred to as being “on” another element, it can be directly on the other element or intervening elements may be present therebetween. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements present.

[0038] It will be understood that although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Thus, a first element, component, region, layer, or section discussed below could be termed a second element, component, region, layer, or section without departing from the teachings herein.

[0039] The terms used herein are only used to describe the purpose of specific embodiments and are not intended to be restrictive. As used herein, "one", "said" and "at least one" do not represent a limit to quantity and are intended to include both the singular and the plural, unless the context clearly indicates otherwise. Therefore, in the claims, the reference to "said" element after the reference to "one" element includes one element and multiple elements. For example, "one element" has the same meaning as "at least one element", unless the context clearly indicates otherwise. "At least one" is not interpreted as limiting "one". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more related listed items. Throughout this disclosure, the expression "at least one of a, b and c" or "at least one selected from a, b and c" means only a, only b, only c, both a and b, both a and c, both b and c, all of a, b and c, or its variant. It will be further understood that the terms “include” and / or “comprises” when used in this specification specify the presence of stated features, regions, integers, steps, operations, elements and / or components, but do not preclude the presence or addition of one or more other features, regions, integers, steps, operations, elements, components and / or groups thereof.

[0040] In the following embodiments, when a portion such as a layer, a region, an element, etc. is on other portions, this means not only when the portion is on the other elements but also when other elements are interposed therebetween.

[0041] In the drawings, the size of the elements may be exaggerated or reduced for convenience of explanation. For example, since the size (eg, thickness) of each component shown in the drawings is arbitrarily represented for convenience of explanation, the present disclosure is not necessarily limited to the examples.

[0042] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another element as illustrated in the figures. It will be understood that relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one of the figures is flipped, an element described as being on the "lower" side of the other elements would then be oriented as being on the "upper" side of the other elements. Thus, depending on the particular orientation of the figures, the term "lower" may encompass both "lower" and "upper" orientations. Similarly, if the device in one of the figures is flipped, an element described as being "below" or "beneath" the other elements would then be oriented as being "above" the other elements. Thus, the term "lower" or "beneath" may encompass both "upper" and "lower" orientations.

[0043] In the following embodiments, the x-axis, y-axis, and z-axis are not limited to the three axes on the Cartesian coordinate system and can be interpreted in a broad sense including the same. For example, the x-axis, y-axis, and z-axis may be perpendicular to each other, but may refer to different directions that are not orthogonal to each other.

[0044] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those skilled in the art to which the present disclosure belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such herein.

[0045] In this specification, when some embodiments may be implemented in this specification, a specific process order may be performed differently from the order described. For example, two processes described in succession may be performed substantially simultaneously, or in an order opposite to the order described.

[0046] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings, and the same or corresponding components are denoted by and assigned the same reference numerals, and any repeated detailed description thereof will be omitted or simplified.

[0047] Figure 1 FIG. 1 is a perspective view schematically illustrating an apparatus 1 for manufacturing a display device according to an embodiment.

[0048] refer to Figure 1 An embodiment of an apparatus 1 for manufacturing a display device may include a supporting portion 10, a stage 20, a guide portion 30, a first moving portion 40, a second moving portion 50, a third moving portion 60, a connecting frame 70, an ink discharge module 80, and an ink supply module 90.

[0049] The supporting portion 10 may support the stage 20 , the guide portion 30 , the first moving portion 40 , the second moving portion 50 , the third moving portion 60 , the connection frame 70 , and the ink discharge module 80 . Figure 1 An embodiment is illustrated in which the shape of the support portion 10 is a hexahedron, However, this is only an example, and the shape of the support portion 10 is not limited thereto.

[0050] The stage 20 may be arranged above the support portion 10. The display substrate DS may be arranged on the stage 20. The stage 20 may include alignment marks for aligning the display substrate DS thereon. Here, the display substrate DS, which is part of the display device being manufactured, may be the object to which the ink discharge module 80 discharges ink. The stage 20 may constitute a working area for the inkjet printing process.

[0051] The guide portion 30 may be arranged above the support portion 10. In one embodiment, for example, two guide portions 30 may be provided and may be spaced apart from each other and arranged between them on opposite sides of the stage 20. The length of the guide portion 30 may be at least greater than the length of the side of the display substrate DS. The guide portion 30 may guide the first moving portion 40 to perform linear motion in the longitudinal direction of the guide portion 30. In one embodiment, for example, the guide portion 30 may include a linear motion track.

[0052] The first moving part 40 may be disposed on the supporting part 10 and perform linear reciprocating motion with respect to the stage 20. The first moving part 40 may include a support member 41 and a horizontal member 42. Figure 1 An embodiment is illustrated in which the support pillar member 41 and the horizontal member 42 have a rectangular bar shape. However, the shapes of the support pillar member 41 and the horizontal member 42 are not limited thereto.

[0053] The support member 41 may be connected to the guide portion 30. In one embodiment, for example, two support members 41 may be provided and may be spaced apart from each other and arranged on opposite sides of the stage 20 therebetween. The support member 41 is movable in the longitudinal direction of the guide member 30. The support member 41 may be linearly moved manually or automatically by including a motor cylinder or the like. In one embodiment, for example, the support member 41 may be linearly moved automatically by including a linear motion block that moves along a linear motion track.

[0054] The horizontal member 42 may be fixed to the support member 41. The horizontal member 42 may be provided between the two support members 41. A horizontal groove 42G extending in the longitudinal direction may be defined in the horizontal member 42. The horizontal groove 42G may be provided on one side of the horizontal member 42. The horizontal groove 42G may guide the second moving part 50 to perform linear reciprocating motion in the longitudinal direction of the horizontal groove 42G.

[0055] The second moving portion 50 may be connected to the first moving portion 40 and may perform linear reciprocating motion relative to the first moving portion 40. In one embodiment, for example, at least a portion of the second moving portion 50 may be accommodated in the horizontal groove 42G of the horizontal member 42. The second moving portion 50 may be movable in the longitudinal direction of the horizontal groove 42G. In one embodiment, for example, the second moving portion 50 may include a linear motor or the like.

[0056] The third movable portion 60 can be connected to the second movable portion 50 and can perform linear reciprocating motion relative to the second movable portion 50. In one embodiment, for example, the third movable portion 60 can be arranged on the lower surface (e.g., the surface facing the -z axis direction) of the second movable portion 50. Here, the lower surface (e.g., the surface facing the -z axis direction) of the second movable portion 50 can be the surface thereof facing the stage 20. In one embodiment, for example, the third movable portion 60 can include a pneumatic cylinder, etc. The third movable portion 60 can rotate about a rotation axis and can include an electric motor, a pneumatic motor, etc. for rotating.

[0057] The connecting frame 70 may be connected to the third movable portion 60. In one embodiment, for example, the connecting frame 70 may be arranged on the lower surface (e.g., the surface facing the -z axis direction) of the third movable portion 60. Here, the lower surface (e.g., the surface facing the -z axis direction) of the third movable portion 60 may be the surface thereof facing the stage 20. The movement directions of the first movable portion 40, the second movable portion 50, and the third movable portion 60 may intersect with each other. In this structure, the connecting frame 70 can be freely moved to a specified position in three-dimensional space.

[0058] The ink discharge module 80 may be connected to the connection frame 70. In one embodiment, for example, the ink discharge module 80 may be arranged on the lower surface of the connection frame 70 (e.g., the surface facing the -z axis direction). Here, the lower surface of the connection frame 70 (e.g., the surface facing the -z axis direction) may be the surface thereof facing the stage 20. In this structure, the ink discharge module 80 can be freely moved to a specified position in three-dimensional space. The ink discharge module 80 can discharge ink onto the display substrate DS. The ink discharge module 80 may include a plurality of head portions 81 for ejecting ink. The plurality of head portions 81 may be arranged in a row. Figure 1 The embodiment is illustrated in which four head parts 81 are provided. However, this is merely an example, and the number of the plurality of head parts 81 is not limited thereto.

[0059] Ink can be attached to the display substrate DS to form part of a layer of the display device. In one embodiment, the ink can be a polymer or low-molecular-weight organic material corresponding to the light-emitting layer of the organic light-emitting display device. In another embodiment, the ink can be a red, green, and blue liquid in which pigment particles are mixed with liquid crystals, an aligning agent, and a solvent. In another embodiment, the ink can include a solution containing inorganic particles such as quantum dot materials.

[0060] The ink supply module 90 can supply ink to the ink discharge module 80. The ink supply module 90 can be connected to the ink discharge module 80 via one or more flow paths. In one embodiment, for example, the ink supply module 90 can be supported by the support portion 10. In one embodiment, for example, the ink supply module 90 can be fixed to at least one selected from the first movable portion 40, the second movable portion 50, the third movable portion 60, and the connecting frame 70. This is merely an example, and the arrangement of the ink supply module 90 is not limited thereto. In one embodiment, for example, the ink supply module 90 can be arranged outside the support portion 10 and can supply ink to the ink discharge module 80.

[0061] Figure 2 FIG. 1 is a perspective view schematically illustrating an ink supply module 90 according to an embodiment.

[0062] refer to Figure 2 In one embodiment, the ink supply module 90 may include a storage portion ST, a first flow path FP1 (in Figure 3 ), a first pump PM1, a second pump PM2, a second flow path FP2, a level control portion LCL, and a pressure control portion PCL.

[0063] The storage portion ST may store the ink INK. The storage portion ST may provide a storage space STE, and the ink INK may be accommodated in the storage portion STE. The storage space STE may be sealed by the storage portion ST. Figure 2 An embodiment in which the storage portion ST and the storage space STE have a hexahedral shape is illustrated. However, this is merely an example, and the shapes of the storage portion ST and the storage space STE are not limited thereto.

[0064] The first flow path FP1 may connect the storage portion ST to the ink discharge module 80 so that the ink INK stored in the storage portion ST may flow to the ink discharge module 80. The first flow path FP1 may include a supply flow path SFP and a recovery flow path CFP.

[0065] One side (or first end) of the supply flow path SFP may be connected to the storage portion ST, and the other side (or second end) of the supply flow path SFP may be connected to the ink discharge module 80. The supply flow path SFP may communicate with the storage space STE of the storage portion ST and may be connected to each of the plurality of head portions 81. Therefore, the ink INK flowing from the storage portion ST into the supply flow path SFP may be supplied to the ink discharge module 80.

[0066] One side (or first end) of the recovery flow path CFP may be connected to the supply flow path SFP, and the other side (or second end) of the recovery flow path CFP may be connected to the storage portion ST. The recovery flow path CFP may communicate with both the storage space STE of the storage portion ST and the supply flow path SFP. Therefore, a portion of the ink INK flowing into the supply flow path SFP may be recovered to the storage portion ST.

[0067] The first pump PM1 may be disposed in the supply flow path SFP and may control the flow of the ink INK flowing into the supply flow path SFP. The ink INK introduced into the supply flow path SFP by the first pump PM1 may flow from the storage portion ST toward the ink discharge module 80 .

[0068] The second pump PM2 may be disposed in the recovery flow path CFP and may control the flow of the ink INK introduced into the recovery flow path CFP. The ink INK introduced into the recovery flow path CFP by the second pump PM2 may flow from the ink discharge module 80 toward the storage portion ST.

[0069] In such an embodiment, the ink INK introduced from the storage portion ST into the supply flow path SFP may flow along the first path PT1 toward the ink discharge module 80. Furthermore, the ink INK introduced from the supply flow path SFP into the recovery flow path CFP may flow along the second path PT2 toward the storage portion ST. Of the ink INK flowing along the first path PT1, the remaining ink INK, excluding the ink INK flowing along the second path PT2, may ultimately be supplied to the ink discharge module 80.

[0070] The flow rate of the ink INK supplied to the ink discharge module 80 may be a flow rate obtained by excluding the flow rate of the ink INK flowing along the second path PT2 from the flow rate of the ink INK flowing along the first path PT1. That is, the flow rate of the ink INK flowing along the first path PT1 may be a flow rate obtained by adding the flow rate of the ink INK supplied to the ink discharge module 80 to the flow rate of the ink INK flowing along the second path PT2.

[0071] Therefore, as the ink INK introduced into the supply flow path SFP flows along the first path PT1 and is supplied to the ink discharge module 80, the flow rate of the ink INK can be reduced at the boundary of the connection point with the recovery flow path CFP. The ink INK introduced into the supply flow path SFP can flow at a relatively high flow rate before the connection point with the recovery flow path CFP. Therefore, the phenomenon of ink INK settling or blocking the flow path during the flow of the ink INK can be reduced.

[0072] In this embodiment, the ink INK introduced into the supply flow path SFP can flow at a relatively low flow rate when passing through the connection point with the recovery flow path CFP. Therefore, the desired target flow rate of the ink INK flowing into the ink discharge module 80 can be met. Furthermore, the influence of the pulsation phenomenon generated by the first pump PM1 and the second pump PM2 on the ink discharge module 80 can be significantly reduced, allowing the ink discharge module 80 to stably discharge the ink INK.

[0073] In one embodiment, the ink INK introduced into the supply flow path SFP can flow at a high flow rate until it reaches a position adjacent to the ink discharge module 80, and then the flow rate of the ink INK can be reduced immediately before the ink INK is supplied to the ink discharge module 80. Therefore, it is possible to reduce the possibility that the ink INK introduced into the supply flow path SFP may settle or clog the flow path while flowing along the first path PT1, while simultaneously meeting the target ink INK inflow flow rate required by the ink discharge module 80. In this case, the pumping degrees of the first pump PM1 and the second pump PM2 can be controlled in consideration of the flow rates of the ink INK flowing along the supply flow path SFP and the recovery flow path CFP.

[0074] The second flow path FP2 can connect the storage part ST to the ink discharge module 80 so that a portion of the ink INK supplied to the ink discharge module 80 can flow into the storage part ST. The ink INK introduced into the second flow path FP2 can flow along the third path PT3 toward the storage part ST. One side (or first end) of the second flow path FP2 can be connected to the ink discharge module 80, and the other side (or second end) of the second flow path FP2 can be connected to the storage part ST. The second flow path FP2 can be connected to the storage space STE of the storage part ST and can be connected to each of the multiple head parts 81. A portion of the ink INK introduced into the ink discharge module 80 can be ejected by the multiple ejection parts, and another portion of the ink INK can be introduced into the second flow path FP2 and can flow into the storage part ST.

[0075] The liquid level control section LCL can control the liquid level of the ink INK disposed in the storage space STE of the storage section ST. A separate liquid level sensor can be disposed in the storage section ST, and the liquid level control section LCL can control the liquid level of the ink INK based on the liquid level sensed by the liquid level sensor. In one embodiment, for example, the liquid level control section LCL can supply the ink INK to the storage section ST so that the liquid level of the ink INK disposed in the storage space STE can be constant.

[0076] The pressure control unit PCL can control the pressure of the storage space STE of the storage unit ST. In one embodiment, for example, the pressure control unit PCL can control the pressure so as to form a negative pressure in the storage space STE of the storage unit ST. The negative pressure formed in the storage space STE can reduce the phenomenon of ink INK unintentionally flowing outside from the ink discharge module 80.

[0077] Figure 3 is a perspective view schematically illustrating a first flow path FP1 according to an embodiment.

[0078] refer to Figure 2 and Figure 3 In one embodiment, the first flow path FP1 may include a supply flow path SFP and a recovery flow path CFP.

[0079] The supply flow path SFP may include a first supply flow path SFP1, a second supply flow path SFP2, and a third supply flow path SFP3. The first supply flow path SFP1, the second supply flow path SFP2, and the third supply flow path SFP3 may be arranged sequentially in a direction from the storage portion ST to the ink discharge module 80. The first supply flow path SFP1, the second supply flow path SFP2, and the third supply flow path SFP3 may be connected to each other. In one embodiment, for example, the first supply flow path SFP1, the second supply flow path SFP2, and the third supply flow path SFP3 may be integrally formed as a single, integral, and inseparable part. Therefore, the ink INK introduced from the storage portion ST into the first supply flow path SFP1 may flow sequentially into the second supply flow path SFP2 and the third supply flow path SFP3 and be supplied to the ink discharge module 80. In one embodiment, a first pump PM1 may be arranged in the first supply flow path SFP1. In one embodiment, a recovery flow path CFP may connect the storage portion ST to the third supply flow path SFP3.

[0080] The second supply flow path SFP2 may branch from the first supply flow path SFP1 into two parts. The two-part second supply flow path SFP2 may be symmetrical. The cross-sectional shapes of the two-part second supply flow path SFP2 may be identical. Therefore, when ink INK flows from the first supply flow path SFP1 into the second supply flow path SFP2, the ink INK may be evenly distributed into the two-part second supply flow path SFP2. Therefore, the flow rate, flow velocity, and pressure of the ink INK flowing into the two-part second supply flow path SFP2 may be identical.

[0081] The third supply flow path SFP3 may connect the second supply flow path SFP2 to the plurality of head parts 81. The number of the plurality of head parts 81 may be 2 n+1 (where n is a natural number). For ease of description, the following will describe Figure 2 The number of the plurality of head portions 81 shown in FIG. 8 is 4 (where n=1).

[0082] The third supply flow path SFP3 may be connected to each of the four header sections 81. The third supply flow path SFP3 may branch from the second supply flow path SFP2 into two sections. The two-section third supply flow paths SFP3 may be arranged in two pairs. That is, one pair of third supply flow paths SFP3 may connect a corresponding one of the two-section second supply flow paths SFP2 to two header sections 81. Furthermore, another pair of third supply flow paths SFP3 may connect a corresponding one of the two-section second supply flow paths SFP2 to the remaining two header sections 81.

[0083] The bifurcated third supply flow path SFP3 may be symmetrical. The cross-sectional shapes of the bifurcated third supply flow path SFP3 may be identical. Therefore, when ink INK flows from the second supply flow path SFP2 into the third supply flow path SFP3, the ink INK may be evenly distributed into the bifurcated third supply flow path SFP3. Consequently, the flow rate, flow velocity, and pressure of the ink INK flowing into the bifurcated third supply flow path SFP3 may be identical.

[0084] The sum of the cross-sectional areas of the second supply flow path SFP2 branched into two parts may be the same as the cross-sectional area of the first supply flow path SFP1. In one embodiment, for example, in the case where the cross-sectional shape of the supply flow path SFP is circular, the length of the diameter of the cross-sectional area of the first supply flow path SFP1 may be 1 / 2 the length of the diameter of the cross-sectional area of the second supply flow path SFP2. Therefore, when the ink INK flows into the supply flow path SFP, there may be little or no change in the flow rate at the boundary between the first supply flow path SFP1 and the second supply flow path SFP2. Therefore, the flow stability of the ink INK flowing into the supply flow path SFP can be improved.

[0085] The sum of the cross-sectional areas of the third supply flow path SFP3 branched into two parts may be the same as the cross-sectional area of the second supply flow path SFP2. In one embodiment, for example, in the case where the cross-sectional shape of the supply flow path SFP is circular, the length of the diameter of the cross-sectional area of the second supply flow path SFP2 may be 1 / 2 the length of the diameter of the cross-sectional area of the third supply flow path SFP3. times. Therefore, when the ink INK flows into the supply flow path SFP, there may be little or no change in the flow rate at the boundary between the second supply flow path SFP2 and the third supply flow path SFP3. Therefore, the flow stability of the ink INK flowing into the supply flow path SFP can be improved.

[0086] The first supply flow path SFP1 may include a first supply flow path portion (hereinafter, referred to as "1-1th supply flow path portion") SFP1-1 and a second supply flow path portion (hereinafter, referred to as "1-2th supply flow path portion") SFP1-2.

[0087] The 1-1 supply flow path portion SFP1-1 may be connected to the storage portion ST. The 1-1 supply flow path portion SFP1-1 may include a flexible material or be made of a flexible material. Figure 1 The first supply flow path portion SFP1-1 may have various shapes depending on the shape, arrangement, or position of 1). That is, the space utilization rate of the first supply flow path portion SFP1-1 can be improved.

[0088] The first-second supply flow path portion SFP1-2 can connect the first-first supply flow path portion SFP1-1 to the second supply flow path SFP2. The first-second supply flow path portion SFP1-2 can include or be made of a hard material. Furthermore, the first-second supply flow path portion SFP1-2 can have a straight line shape. In one embodiment, for example, the first-second supply flow path portion SFP1-2 can have a cylindrical shape. This can reduce the tendency of the ink INK flowing in the first-second supply flow path portion SFP1-2 to branch off from the second supply flow path SFP2 and form eddies. In other words, the flow stability of the ink INK can be improved.

[0089] Each part of the second supply flow path SFP2 branched into two parts may include a first second supply flow path part (hereinafter referred to as "2-1st supply flow path part") SFP2-1 and a second second supply flow path part (hereinafter referred to as "2-2nd supply flow path part") SFP2-2.

[0090] The 2-1st supply flow path portion SFP2-1 can be connected to the first supply flow path SFP1. The 2-1st supply flow path portion SFP2-1 can include a hard material or be made of a hard material. Therefore, when the ink INK flows into the 2-1st supply flow path portion SFP2-1, the flow stability of the ink INK can be improved. In addition, the 2-1st supply flow path portion SFP2-1 can have a curved shape. In one embodiment, for example, the 2-1st supply flow path portion SFP2-1 can have a curved shape in a tangential form (i.e., a form similar to a tangential diagram). Therefore, the flow resistance generated when the ink INK flows can be effectively reduced.

[0091] The 2nd-2nd supply flow path portion SFP2-2 can connect the 2nd-1st supply flow path portion SFP2-1 to the third supply flow path SFP3. The 2nd-2nd supply flow path portion SFP2-2 can include or be made of a hard material. In addition, the 2nd-2nd supply flow path portion SFP2-2 can have a straight shape. In one embodiment, for example, the 2nd-2nd supply flow path portion SFP2-2 can have a cylindrical shape. Therefore, when the ink INK flowing in the 2nd-2nd supply flow path portion SFP2-2 branches off from the third supply flow path SFP3, the ink INK can be reduced from flowing to either side or forming an eddy current. In other words, the flow stability of the ink INK can be improved.

[0092] Each part of the third supply flow path SFP3 that branches into two parts may include a first third supply flow path part (hereinafter referred to as "3-1st supply flow path part") SFP3-1 and a second third supply flow path part (hereinafter referred to as "3-2nd supply flow path part") SFP3-2.

[0093] The 3-1st supply flow path portion SFP3-1 may be connected to the second supply flow path SFP2. The 3-1st supply flow path portion SFP3-1 may include or be made of a hard material. Therefore, when the ink INK flows in the 3-1st supply flow path portion SFP3-1, the flow stability of the ink INK can be improved. In addition, the 3-1st supply flow path portion SFP3-1 may have a curved shape. In one embodiment, for example, the 3-1st supply flow path portion SFP3-1 may have a tangential curved shape. Therefore, the flow resistance generated when the ink INK flows can be effectively reduced.

[0094] The 3-2 supply flow path portion SFP3-2 can connect the 3-1 supply flow path portion SFP3-1 to the four head portions 81. The 3-2 supply flow path portion SFP3-2 can include or be made of a hard material. In addition, the 3-2 supply flow path portion SFP3-2 can have a straight shape. In one embodiment, for example, the 3-2 supply flow path portion SFP3-2 can have a cylindrical shape. Therefore, when the ink INK flowing in the 3-2 supply flow path portion SFP3-2 is supplied to the ink discharge module 80, the phenomenon of the ink INK flowing to either side or forming an eddy current can be reduced. In other words, the flow stability of the ink INK can be improved.

[0095] The recovery flow path CFP may include a first recovery flow path CFP1, a second recovery flow path CFP2, and a third recovery flow path CFP3. The first recovery flow path CFP1, the second recovery flow path CFP2, and the third recovery flow path CFP3 may be arranged sequentially in a direction from the storage portion ST to the ink discharge module 80. The first recovery flow path CFP1, the second recovery flow path CFP2, and the third recovery flow path CFP3 may be connected to one another. For example, the first recovery flow path CFP1, the second recovery flow path CFP2, and the third recovery flow path CFP3 may be integrally formed as a single, integral, and inseparable part. The first recovery flow path CFP1 may be connected to the storage portion ST. Therefore, the ink INK introduced from the supply flow path SFP into the third recovery flow path CFP3 may flow sequentially into the second recovery flow path CFP2 and the first recovery flow path CFP1, and may be recovered into the supply portion. In one embodiment, the second pump PM2 may be arranged in the first recovery flow path CFP1.

[0096] The second recovery flow path CFP2 may be branched into two parts from the first recovery flow path CFP1. The two-part second recovery flow path CFP2 may be symmetrical to each other. The cross-sectional shapes of the two-part second recovery flow path CFP2 may be the same as each other.

[0097] The third recovery flow path CFP3 can connect the second recovery flow path CFP2 to the supply flow path SFP. The third recovery flow path CFP3 can branch from the second recovery flow path CFP2 into two parts. The third recovery flow paths CFP3 branching into two parts can be arranged in two pairs. That is, a pair of third recovery flow paths CFP3 can connect a corresponding one of the second recovery flow path CFP2 branching into two parts to a pair of third supply flow paths SFP3. That is, another pair of third recovery flow paths CFP3 can connect a corresponding one of the second recovery flow path CFP2 branching into two parts to another pair of third supply flow paths SFP3.

[0098] The third recovery flow path CFP3 divided into two parts may be symmetrical to each other. Shapes of cross sections of the third recovery flow path CFP3 divided into two parts may be identical to each other.

[0099] The sum of the cross-sectional areas of the second recovery flow path CFP2 branched into two parts may be the same as the cross-sectional area of the first recovery flow path CFP1. In one embodiment, for example, when the cross-sectional shape of the recovery flow path CFP is circular, the length of the diameter of the cross-sectional area of the first recovery flow path CFP1 may be 1 / 2 the length of the diameter of the cross-sectional area of the second recovery flow path CFP2. Therefore, when the ink INK flows into the recovery flow path CFP, there may be little or no change in the flow rate at the boundary between the first recovery flow path CFP1 and the second recovery flow path CFP2.

[0100] The sum of the cross-sectional areas of the third recovery flow path CFP3 that branches into two parts may be the same as the cross-sectional area of the second recovery flow path CFP2. In one embodiment, for example, when the cross-sectional shape of the recovery flow path CFP is circular, the length of the diameter of the cross-sectional area of the second recovery flow path CFP2 may be 1 / 2 the length of the diameter of the cross-sectional area of the third recovery flow path CFP3. Therefore, when the ink INK flows into the recovery flow path CFP, there may be little or no change in the flow rate at the boundary between the second recovery flow path CFP2 and the third recovery flow path CFP3.

[0101] In this embodiment, when ink INK is introduced from the supply flow path SFP to the recovery flow path CFP, the ink INK can be uniformly introduced into each of the two pairs of third recovery flow paths CFP3 that branch into two. Therefore, the flow rate, flow velocity, and pressure of the ink INK supplied to the multiple head sections 81 via the supply flow path SFP can be made uniform. In other words, the flow stability of the ink INK supplied to the multiple head sections 81 can be improved.

[0102] The first recovery flow path CFP1 may include a first recovery flow path portion (hereinafter, referred to as “1-1th recovery flow path portion”) CFP1-1 and a second recovery flow path portion (hereinafter, referred to as “1-2th recovery flow path portion”) CFP1-2.

[0103] The 1-1st recycling flow path portion CFP1-1 may be connected to the storage portion ST. The 1-1st recycling flow path portion CFP1-1 may include a flexible material or be made of a flexible material. Figure 1 The 1-1st recovery flow path portion CFP1-1 may have various shapes depending on the shape, arrangement or position of 1). That is, the space utilization rate of the 1-1st recovery flow path portion CFP1-1 can be improved.

[0104] The 1st-2nd recovery flow path portion CFP1-2 can connect the 1st-1st recovery flow path portion CFP1-1 to the second recovery flow path CFP2. The 1st-2nd recovery flow path portion CFP1-2 can include or be made of a hard material. In addition, the 1st-2nd recovery flow path portion CFP1-2 can have a straight shape. In one embodiment, for example, the shape of the 1st-2nd recovery flow path portion CFP1-2 can be cylindrical. Therefore, the phenomenon that the ink INK flows to either side or forms an eddy when the ink INK flowing in the branched second recovery flow path CFP2 merges into the 1st-2nd recovery flow path portion CFP1-2 can be reduced. In other words, the flow stability of the ink INK can be improved.

[0105] Each portion of the second recovery flow path CFP2 that branches into two portions may include a first second recovery flow path portion (hereinafter, referred to as "2-1st recovery flow path portion") CFP2-1 and a second second recovery flow path portion (hereinafter, referred to as "2-2nd recovery flow path portion") CFP2-2.

[0106] The 2-1st recovery flow path portion CFP2-1 may be connected to the first recovery flow path CFP1. The 2-1st recovery flow path portion CFP2-1 may include or be made of a hard material. Therefore, when the ink INK flows in the 2-1st recovery flow path portion CFP2-1, the flow stability of the ink INK can be improved. In addition, the 2-1st recovery flow path portion CFP2-1 may have a curved shape. In one embodiment, for example, the 2-1st recovery flow path portion CFP2-1 may have a tangential curved shape. Therefore, the flow resistance generated when the ink INK flows can be effectively reduced.

[0107] The 2-2 recovery flow path portion CFP2-2 can connect the 2-1 recovery flow path portion CFP2-1 to the 3rd recovery flow path CFP3. The 2-2 recovery flow path portion CFP2-2 can include a hard material or be made of a hard material. In addition, the 2-2 recovery flow path portion CFP2-2 can have a straight shape. In one embodiment, for example, the shape of the 2-2 recovery flow path portion CFP2-2 can be cylindrical. Therefore, the phenomenon that the ink INK flows to either side or forms an eddy when the ink INK flowing in the branched 3rd recovery flow path CFP3 merges into the 2-2 recovery flow path portion CFP2-2 can be reduced. That is, the flow stability of the ink INK can be improved.

[0108] The third recovery flow path CFP3 may include or be made of a hard material. Therefore, when the ink INK flows into the third recovery flow path CFP3, the flow stability of the ink INK can be improved. Furthermore, the third recovery flow path CFP3 may have a curved shape. In one embodiment, for example, the third recovery flow path CFP3 may have a tangential curved shape. Therefore, the flow resistance generated when the ink INK flows can be effectively reduced.

[0109] Figure 4 is a perspective view schematically illustrating a second flow path FP2 according to an embodiment.

[0110] refer to Figure 2 and Figure 4 In one embodiment, the second flow path FP2 may include a first second flow path (hereinafter, referred to as "2-1st flow path") FP2-1, a second second flow path (hereinafter, referred to as "2-2nd flow path") FP2-2 and a third second flow path (hereinafter, referred to as "2-3rd flow path") FP2-3.

[0111] The 2-1st flow path FP2-1, the 2-2nd flow path FP2-2, and the 2-3rd flow path FP2-3 may be arranged sequentially in a direction from the storage section ST to the ink discharge module 80. The 2-1st flow path FP2-1, the 2-2nd flow path FP2-2, and the 2-3rd flow path FP2-3 may be connected to each other. In one embodiment, for example, the 2-1st flow path FP2-1, the 2-2nd flow path FP2-2, and the 2-3rd flow path FP2-3 may be integrally formed with each other as a single, integral, and inseparable part. The 2-1st flow path FP2-1 may be connected to the storage section ST. Therefore, the ink INK introduced from the ink discharge unit into the 2-3rd flow path FP2-3 may flow sequentially into the 2-2nd flow path FP2-2 and the 2-1st flow path FP2-1, and may be introduced into the supply section.

[0112] The 2-2nd flow path FP2-2 may be branched into two parts from the 2-1st flow path FP2-1. The two divided 2-2nd flow path FP2-2 may be symmetrical to each other. The cross-sectional shapes of the two divided 2-2nd flow path FP2-2 may be the same as each other.

[0113] The 2nd-3rd flow path FP2-3 can connect the 2nd-2nd flow path FP2-2 to the plurality of head portions 81. The 2nd-3rd flow path FP2-3 can branch from the 2nd-2nd flow path FP2-2 into two portions. The two-part 2nd-3rd flow path FP2-3 can be arranged in two pairs. That is, one pair of the 2nd-3rd flow path FP2-3 can connect a corresponding one of the two-part 2nd-2nd flow path FP2-2 to the two head portions 81. Additionally, another pair of the 2nd-3rd flow path FP2-3 can connect a corresponding one of the two-part 2nd-2nd flow path FP2-2 to the two head portions 81.

[0114] The 2-3 flow path FP2-3 divided into two parts may be symmetrical to each other. The shapes of cross sections of the 2-3 flow path FP2-3 divided into two parts may be identical to each other.

[0115] The sum of the cross-sectional areas of the branched 2-2 flow path FP2-2 may be equal to the cross-sectional area of the 2-1 flow path FP2-1. In one embodiment, for example, when the cross-sectional shape of the second flow path FP2 is circular, the length of the diameter of the cross-sectional area of the 2-1 flow path FP2-1 may be twice the length of the diameter of the cross-sectional area of the 2-2 flow path FP2-2. Therefore, when the ink INK flows into the second flow path FP2, there may be little or no change in the flow rate at the boundary between the 2-1st flow path FP2-1 and the 2-2nd flow path FP2-2.

[0116] The sum of the cross-sectional areas of the second-third flow path FP2-3 branched into two parts may be the same as the cross-sectional area of the second-second flow path FP2-2. In one embodiment, for example, when the cross-sectional shape of the second flow path FP2 is circular, the length of the diameter of the cross-sectional area of the second-second flow path FP2-2 may be twice the length of the diameter of the cross-sectional area of the second-third flow path FP2-3. Therefore, when the ink INK flows into the second flow path FP2, there may be little or no change in the flow rate at the boundary between the 2-2nd flow path FP2-2 and the 2-3rd flow path FP2-3.

[0117] In this embodiment, when ink INK is introduced from the ink discharge module 80 into the second supply flow path FP2, the ink INK can be uniformly introduced into each of the two pairs of bifurcated 2-3 flow paths FP2-3. Furthermore, when the ink INK introduced into the 2-3 flow path FP2-3 flows into the 2-2 flow path FP2-2 and the 2-1 flow path FP2-1, the flow rate, velocity, and pressure of the ink INK can be made uniform. This improves the flow stability of the ink INK flowing into the second flow path FP2.

[0118] The 2-1st flow path FP2-1 may include a first sub-flow path portion (hereinafter, referred to as "2-11th flow path portion") FP2-11 and a second sub-flow path portion (hereinafter, referred to as "2-12th flow path portion") FP2-12.

[0119] The 2-11th flow path portion FP2-11 may be connected to the storage portion ST. The 2-11th flow path portion FP2-11 may include a flexible material or be made of a flexible material. Figure 1 The second-eleventh flow path portion FP2-11 may have various shapes depending on the shape, arrangement, or position of 1). That is, the space utilization rate of the second-eleventh flow path portion FP2-11 can be improved.

[0120] The 2-12th flow path portion FP2-12 can connect the 2-11th flow path portion FP2-11 to the 2-2nd flow path FP2-2. The 2-12th flow path portion FP2-12 can include or be made of a hard material. In addition, the 2-12th flow path portion FP2-12 can have a straight shape. In one embodiment, for example, the shape of the 2-12th flow path portion FP2-12 can be cylindrical. Therefore, the phenomenon that the ink INK flowing in the branched 2-2nd flow path FP2-2 merges into the 2-12th flow path portion FP2-12 and flows to either side or forms an eddy can be reduced. In other words, the flow stability of the ink INK can be improved.

[0121] Each part of the 2-2 flow path FP2-2 branching into two parts may include a first sub-flow path part (hereinafter referred to as "2-21 flow path part") FP2-21 and a second sub-flow path part (hereinafter referred to as "2-22 flow path part") FP22-2.

[0122] The 2-21st flow path portion FP2-21 may be connected to the 2-1st flow path FP2-1. The 2-21st flow path portion FP2-21 may include or be made of a hard material. Therefore, when the ink INK flows into the 2-21st flow path portion FP2-21, the flow stability of the ink INK can be improved. In addition, the 2-21st flow path portion FP2-21 may have a straight shape. In one embodiment, for example, the 2-21st flow path portion FP2-21 may have a tangential curved shape. Therefore, the flow resistance generated when the ink INK flows can be effectively reduced.

[0123] The 2-22nd flow path portion FP2-22 can connect the 2-21st flow path portion FP2-21 to the 2-3rd flow path FP2-3. The 2-22nd flow path portion FP2-22 can include or be made of a hard material. In addition, the 2-22nd flow path portion FP2-22 can have a straight shape. In one embodiment, for example, the shape of the 2-22nd flow path portion FP2-22 can be cylindrical. Therefore, the phenomenon that the ink INK flows to either side or forms an eddy when the ink INK flowing into the branched 2-3rd flow path FP2-3 merges into the 2-22nd flow path portion FP2-22 can be reduced. In other words, the flow stability of the ink INK can be improved.

[0124] Each part of the 2nd-3rd flow path FP2-3 branching into two parts may include a first sub-flow path part (hereinafter referred to as "2nd-31st flow path part") FP2-31 and a second sub-flow path part (hereinafter referred to as "2nd-32nd flow path part") FP2-32.

[0125] The 2-31st flow path portion FP2-31 may be connected to the 2-2nd flow path FP2-2. The 2-31st flow path portion FP2-31 may include or be made of a hard material. Therefore, when the ink INK flows in the 2-31st flow path portion FP2-31, the flow stability of the ink INK can be improved. In addition, the 2-31st flow path portion FP2-31 may have a straight shape. In one embodiment, for example, the 2-31st flow path portion FP2-31 may have a tangential curved shape. Therefore, the flow resistance generated when the ink INK flows can be effectively reduced.

[0126] The 2-32nd flow path portion FP2-32 can connect the 2-31st flow path portion FP2-31 to the storage portion ST. The 2-32nd flow path portion FP2-32 can include or be made of a hard material and can have a straight shape. In one embodiment, for example, the 2-32nd flow path portion FP2-32 can have a cylindrical shape. This can reduce the tendency of the ink INK to drift to one side or form an eddy when flowing into the 2-32nd flow path portion FP2-32 branching from the storage portion ST. In other words, the flow stability of the ink INK can be improved.

[0127] Figures 2 to 4 The embodiment in which the number of the header portions 81 is four is illustrated. However, as described above, this is only an example, and the number of the header portions 81 may be two. n+1 (where n is a natural number.) In one embodiment, for example, the number of the header parts 81 may also be 8 (where n=2).

[0128] In an embodiment providing eight head portions 81, the supply flow path SFP may further include a fourth supply flow path (not shown), and the recovery flow path CFP may further include a fourth recovery flow path (not shown), and the second flow path FP2 may further include a fourth second flow path (not shown).

[0129] In such an embodiment, first, in the supply flow path SFP, the second supply flow path SFP2 branched into two parts can be connected to the first supply flow path SFP1, the fourth supply flow path (not shown) branched into two parts can be connected to each part of the second supply flow path SFP2 branched into two parts, the third supply flow path SFP3 branched into two parts can be connected to each part of the fourth supply flow path (not shown) branched into two parts, and finally, the third supply flow path SFP3 can be connected to multiple head parts 81.

[0130] In addition, in the recovery flow path CFP, the second recovery flow path CFP2 branched into two parts can be connected to the first recovery flow path CFP1, the fourth recovery flow path (not shown) branched into two parts can be connected to each part of the second recovery flow path CFP2 branched into two parts, the third recovery flow path CFP3 branched into two parts can be connected to each part of the fourth recovery flow path (not shown) branched into two parts, and finally, the third recovery flow path CFP3 can be connected to the third supply flow path SFP3.

[0131] In addition, in the second flow path FP2, the 2-2 flow path FP2-2 branched into two parts can be connected to the 2-1 flow path FP2-1, the fourth supply flow path (not shown) branched into two parts can be connected to each part of the 2-2 flow path FP2-2 branched into two parts, the 2-3 flow path FP2-3 branched into two parts can be connected to each part of the fourth supply flow path (not shown) branched into two parts, and finally, the 2-3 flow path FP2-3 can be connected to multiple head parts 81.

[0132] In addition, the number of the head parts 81 may also be 16 (where n=3) or 32 (where n=4).

[0133] Figure 5 FIG. 1 is a plan view schematically illustrating a display device according to an embodiment.

[0134] refer to Figure 5 The display device 2 according to an embodiment may include a display area DA and a peripheral area PA outside the display area DA. The display device 2 may provide an image through an array of a plurality of pixels two-dimensionally arranged in an xy plane in the display area DA.

[0135] The peripheral area PA may be an area where no image is provided and may completely or partially surround the display area DA. A driver for providing an electrical signal or power to each pixel circuit corresponding to each pixel PX may be arranged in the peripheral area PA. Pads, which are areas where electronic devices or printed circuit boards can be electrically connected, may be included in the peripheral area PA.

[0136] Hereinafter, the display device 2 described as a light-emitting element includes an embodiment of an organic light-emitting diode (OLED), but the display device 2 of the present disclosure is not limited thereto. In another embodiment, the display device 2 may be a light-emitting display device including an inorganic light-emitting diode, that is, an inorganic light-emitting display device. The inorganic light-emitting diode may include a PN junction diode, which contains a material based on an inorganic material semiconductor. When a voltage is applied to the PN junction diode in the forward direction, holes and electrons can be injected, and the energy generated by the recombination of holes and electrons can be converted into light energy, thereby emitting light with a specific color. The above-mentioned inorganic light-emitting diode may have a width of several microns to several hundred microns, and in some embodiments, the inorganic light-emitting diode may be referred to as a micro light-emitting diode (LED). In another embodiment, the display device 2 may be a quantum dot light-emitting display device.

[0137] The display device 2 can be applied to various products such as mobile phones, smart phones, tablet personal computers (PCs), mobile communication terminals, electronic notebooks, electronic books, portable multimedia players (PMPs), navigation devices, ultra-mobile personal computers, televisions (TVs), laptop computers, monitors, billboards, Internet of Things (IoT) devices, and the like. Furthermore, the display device 2 according to one embodiment can be used in wearable devices such as smart watches, watch phones, glasses-type displays, or head-mounted displays (HMDs). Furthermore, the display device 2 according to one embodiment can be used as an instrument panel for a vehicle, a center information display (CID) arranged on a central instrument panel or dashboard of a vehicle, a room mirror display for replacing a side mirror of a vehicle, and a display screen arranged on the rear surface of a front seat as an entertainment device for the rear seats of a vehicle.

[0138] Figure 6 is a cross-sectional view schematically illustrating a display device according to an embodiment, and can be compared with Figure 5 The cross section of the display device taken along line VII-VII' corresponds to FIG.

[0139] refer to Figure 6 An embodiment of the display device 2 may have a stacked structure including a substrate 100 , a pixel circuit layer PC, a display element layer DEL, and an encapsulation layer 300 .

[0140] The substrate 100 may have a multilayer structure including a layer comprising a polymer resin and an inorganic layer (not shown). For example, the substrate 100 may include a base layer comprising a polymer resin and an isolation layer comprising an inorganic insulating layer. In one embodiment, for example, the substrate 100 may include a first base layer 101, a first isolation layer 102, a second base layer 103, and a second isolation layer 104 stacked in sequence. The first base layer 101 and the second base layer 103 may include polyimide (PI), polyethersulfone (PES), polyarylate, polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polycarbonate, cellulose triacetate (TAC), and / or cellulose acetate propionate (CAP). The first isolation layer 102 and the second isolation layer 104 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, and / or silicon nitride. The substrate 100 may have flexible properties.

[0141] The pixel circuit layer PC may be disposed on the substrate 100 . Figure 6 An embodiment is illustrated in which the pixel circuit layer PC includes a thin film transistor TFT and a buffer layer 111, a first gate insulating layer 112, a second gate insulating layer 113, an interlayer insulating layer 114, a first planarization insulating layer 115 and a second planarization insulating layer 116 arranged below and / or on components of the thin film transistor TFT.

[0142] The buffer layer 111 can reduce or block the penetration of foreign matter, moisture, or external air from the lower portion of the substrate 100, and can provide a flat surface on the substrate 100. The buffer layer 111 may include an inorganic insulating material such as silicon oxide, silicon oxynitride, or silicon nitride, and may have a single-layer or multi-layer structure, each layer of which includes at least one selected from the above materials.

[0143] The thin film transistor TFT on the buffer layer 111 may include a semiconductor layer Act, and the semiconductor layer Act may include polycrystalline silicon (Poly-Si). Alternatively, the semiconductor layer Act may include amorphous silicon (a-Si), an oxide semiconductor, or an organic semiconductor. The semiconductor layer Act may include a channel region C and a drain region D and a source region S on opposite sides of the channel region C. The gate electrode GE may overlap the channel region C.

[0144] The gate electrode GE may include a low-resistance metal material. The gate electrode GE may include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), etc., and may have a multi-layer or single-layer structure, each layer of which includes at least one selected from the above materials.

[0145] The first gate insulating layer 112 between the semiconductor layer Act and the gate electrode GE may include an inorganic insulating material such as silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO x Here, zinc oxide (ZnO x ) may be zinc oxide (ZnO) and / or zinc peroxide (ZnO2).

[0146] The second gate insulating layer 113 may be provided to cover the gate electrode GE. Similar to the first gate insulating layer 112, the second gate insulating layer 113 may include an inorganic insulating material such as silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO x Here, zinc oxide (ZnO x ) may be zinc oxide (ZnO) and / or zinc peroxide (ZnO2).

[0147] The upper electrode Cst2 of the storage capacitor Cst may be arranged above the second gate insulating layer 113. The upper electrode Cst2 may overlap the gate electrode GE thereunder. In such an embodiment, the gate electrode GE and the upper electrode Cst2 (overlapping each other with the second gate insulating layer 113 therebetween) may form or collectively define the storage capacitor Cst. That is, the gate electrode GE may function as the lower electrode Cst1 of the storage capacitor Cst.

[0148] In such an embodiment, the storage capacitor Cst and the thin film transistor TFT may overlap each other. In some embodiments, the storage capacitor Cst may not overlap with the thin film transistor TFT.

[0149] The upper electrode Cst2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and may have a single-layer or multi-layer structure, each layer of which includes at least one selected from the above materials.

[0150] An interlayer insulating layer 114 may be provided to cover the upper electrode Cst2. The interlayer insulating layer 114 may include an inorganic insulating material such as silicon oxide (SiO2), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnOx). Zinc oxide (ZnO x ) may be zinc oxide (ZnO) and / or zinc peroxide (ZnO2). The interlayer insulating layer 114 may have a single-layer or multi-layer structure, wherein each layer includes at least one selected from the above-mentioned inorganic insulating materials.

[0151] The drain electrode DE and the source electrode SE may be located on the interlayer insulating layer 114. The drain electrode DE and the source electrode SE may be connected to the drain region D and the source region S, respectively, through contact holes defined or formed in the insulating layer thereunder. The drain electrode DE and the source electrode SE may include a highly conductive material. The drain electrode DE and the source electrode SE may include conductive materials such as molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and may have a multilayer or single-layer structure, each layer of which includes at least one selected from the foregoing materials. In one embodiment, the drain electrode DE and the source electrode SE may have a multilayer structure of Ti / Al / Ti.

[0152] The first planarization insulating layer 115 may cover the drain electrode DE and the source electrode SE. The first planarization insulating layer 115 may include an organic insulating material, such as a general polymer (such as polymethyl methacrylate (PMMA) or polystyrene (PS)), a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, a vinyl alcohol polymer, and a blend thereof.

[0153] The second planarization insulating layer 116 may be disposed on the first planarization insulating layer 115. The second planarization insulating layer 116 may include the same material as the first planarization insulating layer 115, and may include an organic insulating material such as a general polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenolic group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, a vinyl alcohol polymer, and a blend thereof.

[0154] The display element layer DEL may be arranged on the pixel circuit layer PC having the above-described structure. The display element layer DEL may include an organic light-emitting diode OLED as a display element (i.e., a light-emitting device), and the organic light-emitting diode OLED may include a stacked structure of a pixel electrode 210, an intermediate layer 220, and a common electrode 230. The organic light-emitting diode OLED may emit, for example, red light, green light, or blue light, or may emit red light, green light, blue light, or white light. The organic light-emitting diode OLED may emit light through an emission region, and the emission region may be defined as a pixel PX.

[0155] The pixel electrode 210 of the organic light emitting diode OLED may be electrically connected to the thin film transistor TFT through a contact hole defined or formed in the second planarization insulating layer 116 and the first planarization insulating layer 115 and a contact metal CM disposed on the first planarization insulating layer 115 .

[0156] In one embodiment, the pixel electrode 210 may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). In another embodiment, the pixel electrode 21 may include a reflective layer comprising Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, or a compound thereof. In another embodiment, the pixel electrode 210 may further include a layer formed of ITO, IZO, ZnO, or In2O3 on / below the reflective layer.

[0157] A dam layer 117 having an opening 117OP for exposing the center of the pixel electrode 210 may be disposed on the pixel electrode 210. The dam layer 117 may include an organic insulating material and an inorganic insulating material. The opening 117OP may define an emission region for light emitted from the organic light emitting diode OLED. In one embodiment, for example, the size (e.g., width) of the opening 117OP may correspond to the size (e.g., width) of the emission region. Therefore, the size (e.g., width) of the pixel PX may depend on the size (e.g., width) of the opening 117OP of the dam layer 117.

[0158] The intermediate layer 220 may include a light emitting layer 222 formed to correspond to the pixel electrode 210. The light emitting layer 222 may include a polymer or a low molecular weight organic material that emits light of a specific color. Alternatively, the light emitting layer 222 may include an inorganic light emitting material or quantum dots.

[0159] In one embodiment, the intermediate layer 220 may include a first functional layer 221 and a second functional layer 223 disposed below and above the light-emitting layer 222, respectively. The first functional layer 221 may include, for example, a hole transport layer (HTL) or an HTL and a hole injection layer (HIL). The second functional layer 223 may be a component disposed above the light-emitting layer 222 and may include an electron transport layer (ETL) and / or an electron injection layer (EIL). Similar to the common electrode 230 to be described later, the first functional layer 221 and / or the second functional layer 223 may be a common layer formed to completely cover the substrate 100.

[0160] The common electrode 230 may be arranged on the pixel electrode 210 and may overlap with the pixel electrode 210. The common electrode 230 may include a conductive material having a low work function. In one embodiment, for example, the common electrode 230 may include a transparent layer or a semi-transparent layer containing Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, or an alloy thereof. Alternatively, the common electrode 230 may further include a layer containing, for example, ITO, IZO, ZnO, or In2O3 on the transparent layer or semi-transparent layer containing the above materials. The common electrode 230 may be formed entirely or continuously throughout the substrate 100.

[0161] The encapsulation layer 300 may be disposed on the display element layer DEL and may cover the display element layer DEL. The encapsulation layer 300 may include at least one inorganic encapsulation layer and at least one organic encapsulation layer, and in one embodiment, Figure 6 The exemplary encapsulation layer 300 includes a first inorganic encapsulation layer 310 , an organic encapsulation layer 320 , and a second inorganic encapsulation layer 330 , which are sequentially stacked.

[0162] The first inorganic encapsulation layer 310 and the second inorganic encapsulation layer 330 may comprise at least one inorganic material selected from aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 320 may comprise a polymer material. Polymer materials may include acrylic resins, epoxy resins, polyimide, polyethylene, and the like. In one embodiment, the organic encapsulation layer 320 may comprise an acrylate. The organic encapsulation layer 320 may be formed by hardening a monomer or by coating a polymer. The organic encapsulation layer 320 may be transparent.

[0163] Although not shown, the touch sensor layer may be arranged on the encapsulation layer 300, and the optical functional layer may be arranged on the touch sensor layer. The touch sensor layer may obtain coordinate information based on external input (e.g., a touch event). The optical functional layer may reduce the reflectivity of light (external light) incident from the outside toward the display device and / or may improve the color purity of light emitted from the display device. In one embodiment, the optical functional layer may include a phase retarder and / or a polarizer. The phase retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 phase retarder or a λ / 4 phase retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include an elongated synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a specific arrangement. The phase retarder and the polarizer may further include a protective film.

[0164] An adhesive member may be disposed between the touch sensor layer and the optical functional layer. The adhesive member may be a general adhesive member known in the art without limitation. The adhesive member may be a pressure sensitive adhesive (PSA).

[0165] In one embodiment, at least one selected from the pixel circuit layer PC, the display element layer DEL and the encapsulation layer 300 may be formed from the above reference Figures 1 to 4 The ink INK discharged from the ink discharge module 80 is formed as described above.

[0166] Figure 7 FIG. 4 is an equivalent circuit diagram of a pixel of a display panel according to an embodiment.

[0167] In one embodiment, each pixel PX may include a pixel circuit PC and a display element connected to the pixel circuit PC, such as an organic light emitting diode (OLED). The pixel circuit PC may include a first thin-film transistor T1, a second thin-film transistor T2, and a storage capacitor Cst. Each pixel PX may emit, for example, red, green, blue, or white light via the organic light emitting diode (OLED).

[0168] The second thin film transistor T2 may be a switching thin film transistor, may be connected to the scan line SL and the data line DL, and may be configured to transmit a data voltage input from the data line DL to the first thin film transistor T1 in response to a switching voltage input from the scan line SL. The storage capacitor Cst may be connected to the second thin film transistor T2 and the driving voltage line PL, and may store a voltage corresponding to a difference between a voltage transmitted from the second thin film transistor T2 and a first power supply voltage ELVDD supplied to the driving voltage line PL.

[0169] The first thin film transistor T1 may be a driving thin film transistor, which may be connected to the driving voltage line PL and the storage capacitor Cst. The first thin film transistor T1 may control a driving current flowing from the driving voltage line PL through the organic light emitting diode OLED in response to a voltage value stored in the storage capacitor Cst. The organic light emitting diode OLED may emit light having a certain brightness by using the driving current. A counter electrode (e.g., a cathode) of the organic light emitting diode OLED may receive a second power supply voltage ELVSS.

[0170] Figure 7 An embodiment in which the pixel circuit PC includes two thin film transistors and one storage capacitor is described, but the embodiment is not limited thereto. The number of thin film transistors and the number of storage capacitors can be varied in various ways depending on the design of the pixel circuit PC. In one embodiment, for example, in addition to the two thin film transistors described above, the pixel circuit PC may further include four, five, or more thin film transistors.

[0171] According to one or more embodiments of the apparatus for manufacturing a display device, ink does not precipitate during ink supply, and a target ink inflow flow rate desired by an ink discharge module can be achieved.

[0172] The effects of the present disclosure are not limited to the aforementioned objects, and other effects not mentioned can be clearly understood by those skilled in the art from the following description.

[0173] The present invention should not be interpreted as being limited to the embodiments set forth herein. Instead, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the present invention to those skilled in the art.

[0174] While the invention has been particularly shown and described with reference to embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit or scope of the invention as defined by the following claims.

Claims

1. An apparatus for manufacturing a display device, characterized in that: The device comprises: a stage, on which a display substrate is arranged; an ink discharge module for discharging ink onto the display substrate; and an ink supply module connected to the ink discharge module to supply ink to the ink discharge module, The ink supply module comprises: a storage portion in which ink is stored; a first flow path connecting the storage portion to the ink discharge module so that ink stored in the storage portion flows into the ink discharge module; and a second flow path connecting the storage portion to the ink discharge module so that a portion of the ink supplied to the ink discharge module flows into the storage portion, and The first flow path includes: a supply flow path having a first end connected to the storage portion and a second end connected to the ink discharge module so that ink introduced from the storage portion is supplied to the ink discharge module; and A recovery flow path has a first end connected to the supply flow path and a second end connected to the storage portion so that a portion of ink introduced into the supply flow path is recovered into the storage portion.

2. The device according to claim 1, characterized in that: The ink discharge module includes a plurality of head portions configured to eject ink, wherein the number of the plurality of head portions is 2 n+1 , where n is a natural number, and The supply flow path includes: a first supply flow path through which ink is introduced from the storage portion; a second supply flow path branching into two parts from the first supply flow path; and A third supply flow path connects the second supply flow path to the plurality of head portions.

3. The device according to claim 2, characterized in that The shapes of the cross sections of the second supply flow path branched into the two parts are identical to each other, and A sum of the areas of the cross sections of the second supply flow path branched into the two parts is the same as an area of the cross section of the first supply flow path.

4. The device according to claim 2, characterized in that The first supply flow path comprises: a first supply flow path portion comprising a flexible material and connected to the storage portion; and a second first supply flow path portion comprising a hard material and connecting said first first supply flow path portion to said second supply flow path, wherein the second first supply flow path portion has a straight line shape, and wherein each portion of the second supply flow path branching into the two portions comprises: a first second supply flow path portion connected to the first supply flow path and having a bent shape; and A second supply flow path portion connects the first second supply flow path portion to the third supply flow path and has a straight line shape.

5. The device according to claim 2, characterized in that The ink supply module further includes a first pump disposed in the first supply flow path so that ink introduced into the supply flow path flows into the ink discharge module.

6. The device according to claim 2, characterized in that The recovery flow path connects the storage portion to the third supply flow path, and The recovery flow path includes: a first recovery flow path connected to the storage portion; a second recovery flow path branching into two parts from the first recovery flow path; and A third recovery flow path connects the second recovery flow path to the third supply flow path.

7. The device according to claim 6, characterized in that The shapes of the cross sections of the second recovery flow path branched into the two parts are identical to each other, and A sum of the areas of the cross sections of the second recovery flow path branched into the two parts is the same as an area of the cross section of the first recovery flow path.

8. The device according to claim 6, characterized in that The first recovery flow path includes: a first recovery flow path portion comprising a flexible material and connected to the storage portion; and a second first recovery flow path portion comprising a hard material and connecting said first first recovery flow path portion to said second recovery flow path, wherein the second first recovery flow path portion has a straight line shape, and wherein each portion of the second recovery flow path branching into the two portions comprises: a first second recovery flow path portion connected to the first recovery flow path and having a curved shape; and The second recovery flow path portion connects the first recovery flow path portion to the third recovery flow path and has a straight line shape.

9. The device according to claim 6, characterized in that The ink supply module further includes a second pump disposed in the first recovery flow path so that the ink introduced into the recovery flow path flows into the storage portion.

10. The device according to claim 2, characterized in that The second flow path includes: a first second flow path connected to the storage portion; a second second flow path branching from the first second flow path into two parts; and a third second flow path connecting the second second flow path to the plurality of head portions, wherein the shapes of cross sections of the second flow path branched into the two parts are identical to each other, wherein the sum of the cross-sectional areas of the second second flow path branched into the two parts is the same as the cross-sectional area of the first second flow path, and The first and second flow paths include: a first sub-flow path portion comprising a flexible material and connected to the storage portion; and A second sub-flow path portion comprises a hard material and connects the first sub-flow path portion to the second second flow path.

Images