Efficient chip removal grinding pad

Abstract

The utility model discloses an efficient chip removal grinding pad, and relates to the technical field of grinding pads, the efficient chip removal grinding pad comprises a grinding assembly, the grinding assembly comprises a grinding layer located on the end face, a chip removal mechanism is arranged on the upper surface of the grinding layer, and the chip removal mechanism comprises a plurality of groups of radial lines spirally extending outwards along the center of the grinding layer. The multiple sets of radial lines are evenly distributed, each set of lines form a first material guide groove which is concave inwards, the first material guide grooves are used for rapidly discharging chips, and an acute angle is formed between the tail end of each radial line and the edge of the grinding layer. Various chip removal paths are provided through the first material guide groove, the second material guide groove and the third material guide groove, it is ensured that waste chips can be rapidly and effectively discharged from the grinding surface, the blocking risk is reduced, the grinding device can adapt to materials with different hardness and characteristics, and the good grinding effect can be provided for both soft materials and hard materials.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding pads, in particular to a high-efficiency chip removal grinding pad. Background Art

[0002] Abrasive pads are a commonly used tool, mainly used in processes such as surface treatment, polishing and grinding. They are widely used in different industries, including but not limited to metal processing, woodworking, automobile repair and maintenance, jewelry making and home decoration.

[0003] According to Chinese patent announcement number; CN213258878U provides a high-efficiency chip removal grinding pad, including a grinding layer, a polishing pad, a support plate, a buffer pad and Velcro, the polishing pad is covered with a grinding layer, and the polishing pad covers the top surface of the support plate, the bottom surface of the support plate is covered with a buffer pad, and the bottom surface of the buffer pad is covered with Velcro, a chip removal hole is provided at the middle position of the grinding layer, and the chip removal hole is used for chip removal during the grinding process, and the grinding layer, polishing pad, support plate and buffer pad are all fixed by glue; the utility model sets a chip removal hole at the middle position of the grinding layer, which is convenient for introducing debris into the hole during the grinding process, reducing scratches on the grinding area, and utilizes a non-woven fabric formed by a fiber bundle impregnated with a polyurethane elastomer to form a polishing pad, and a grinding layer made of silica is provided on the polishing pad for grinding, and silica is used for grinding to remove damage and deformation on the material surface and optimize the processing effect.

[0004] It can be seen that traditional grinding pads focus on durability but lack effective chip removal channels, which causes the debris generated during the grinding process to easily accumulate on the grinding surface, affecting the grinding efficiency and surface quality. Utility Model Content

[0005] The purpose of the utility model is to provide a high-efficiency chip removal grinding pad, which can avoid the situation where traditional grinding pads lack effective chip removal channels, resulting in chips generated during the grinding process easily accumulating on the grinding surface, affecting the grinding efficiency and surface quality.

[0006] The utility model provides a high-efficiency chip removal grinding pad, including a grinding assembly, wherein the grinding assembly includes a grinding layer located at the end surface, and a chip removal mechanism is provided on the upper surface of the grinding layer. The chip removal mechanism includes a plurality of groups of radial lines extending outward in a spiral shape along the center of the grinding layer, the plurality of groups of radial lines are evenly distributed and each group of lines forms an inwardly concave material guide groove one, the material guide groove one is used for rapid chip removal, and the end of each radial line forms an acute angle with the edge of the grinding layer.

[0007] Preferably, there are at least 36 groups of radial lines, and the distance between adjacent radial lines measured along the radial direction is 6 mm.

[0008] Preferably, the width of the guide groove 1 is 0.8 mm and the depth is 0.6 mm.

[0009] Preferably, the chip removal mechanism further includes a second material guide groove opened on the upper surface of the grinding layer, and there are at least 18 second material guide grooves, and each second material guide groove is composed of two adjacent radial lines.

[0010] Preferably, the inclination angle of the radial lines is 10°.

[0011] Preferably, the chip removal mechanism further includes a material guide groove three opened on the upper surface of the grinding layer, and there are at least 6 material guide grooves three, and each material guide groove three is composed of two adjacent radial lines.

[0012] Preferably, the angle between two adjacent groups of radial lines is 60°.

[0013] Preferably, a support layer is provided on the lower side of the grinding layer, a shock-absorbing layer is provided on the lower side of the support layer, a protective layer is provided on the lower side of the shock-absorbing layer, a base material layer is provided on the lower side of the protective layer, and the edges of the grinding layer, support layer, shock-absorbing layer, protective layer and base material layer are sealed by a reinforcement edge layer.

[0014] Preferably, positioning grooves are provided on the upper and lower sides of the shock-absorbing layer, and positioning strips 1 and 2 are provided on the lower side of the supporting layer and the upper side of the protective layer respectively, and the positioning strips 1 and 2 are respectively engaged with the positioning grooves on both sides.

[0015] Preferably, the shock-absorbing layer and the protective layer are respectively provided with a plurality of air holes 1 and air holes 2.

[0016] The embodiment of the utility model provides a high-efficiency chip removal polishing pad, compared with the prior art:

[0017] The utility model provides a variety of chip removal paths through the material guide trough 1, the material guide trough 2 and the material guide trough 3, ensuring that waste chips can be discharged from the grinding surface quickly and effectively, reducing the risk of blockage. The multi-level and multi-directional material guide trough design helps to evenly distribute the pressure during the grinding process, preventing a certain area from being prematurely worn or damaged due to concentrated pressure, and can adapt to materials of different hardness and characteristics, and can provide good grinding effects regardless of whether it is soft or hard material. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the utility model;

[0020] Figure 2 This is a schematic top view of a material guide chute structure according to an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the disassembled structure of the grinding assembly according to an embodiment of the utility model;

[0022] Figure 4 This is a schematic diagram of the shock-absorbing layer structure of an embodiment of the utility model;

[0023] Figure 5 This is a schematic diagram of the protective layer structure of an embodiment of the utility model;

[0024] Figure 6 This is a schematic diagram of the support layer structure of an embodiment of the utility model;

[0025] Figure 7 This is a schematic top view of the second structure of the guide trough according to an embodiment of the present utility model;

[0026] Figure 8 This is a top view of the three structures of the material guide chute according to an embodiment of the present invention.

[0027] Reference numerals:

[0028] 1. Grinding layer; 2. Support layer; 3. Shock-absorbing layer; 4. Protective layer; 5. Base material layer; 6. Reinforced edge layer; 7. Material guide trough 1; 8. Air vent 1; 9. Positioning groove; 10. Positioning strip 1; 11. Positioning strip 2; 12. Air vent 2; 13. Material guide trough 2; 14. Material guide trough 3. DETAILED DESCRIPTION

[0029] The following embodiments of the present invention are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0030] Please refer to Figure 1 and Figure 3 The embodiment of the utility model provides a high-efficiency chip removal grinding pad, including a grinding component, which includes a grinding layer 1 located at the end surface. The grinding layer 1 can use silica, aluminum oxide or other hard abrasive particles to provide high-efficiency wear resistance. A support layer 2 is provided on the lower side of the grinding layer 1. The support layer 2 can use materials such as hard fiberboard, plastic or metal foil to provide solid support for the grinding layer 1, ensuring stability and uniformity during the grinding process.

[0031] A shock-absorbing layer 3 is provided on the lower side of the supporting layer 2. The shock-absorbing layer 3 is usually made of elastic materials such as rubber and foam plastic to reduce vibration and noise, improve operating comfort, and protect the grinding pad and tools from impact damage. A protective layer 4 is provided on the lower side of the shock-absorbing layer 3. The protective layer 4 can be made of polyurethane, polyethylene and other materials to protect the internal structure from the influence of the external environment. A base material layer 5 is provided on the lower side of the protective layer 4. The base material layer 5 can be made of glass fiber reinforced plastic to provide support for the overall structure, ensure the stability of the grinding pad during use, and prevent delamination and tearing. The edges of the grinding layer 1, supporting layer 2, shock-absorbing layer 3, protective layer 4 and base material layer 5 are sealed by the reinforced edge layer 6 to prevent edge wear and tear.

[0032] Further, such as Figures 4 to 6 As shown, positioning grooves 9 are provided on the upper and lower sides of the shock-absorbing layer 3, and positioning strips 10 and 11 are provided on the lower side of the supporting layer 2 and the upper side of the protective layer 4 respectively. During installation, the positioning strips 10 and 11 are respectively engaged with the positioning grooves 9 on both sides, which can effectively prevent the shock-absorbing layer 3 from being displaced.

[0033] In addition, a plurality of ventilation holes 1 8 and ventilation holes 2 12 are respectively provided on the shock-absorbing layer 3 and the protective layer 4 , and holes are also provided on the base material layer 5 to assist in heat dissipation of the entire polishing pad.

[0034] Example 1

[0035] like Figure 2 As shown, a chip removal mechanism is provided on the upper surface of the grinding layer 1, and the chip removal mechanism includes a plurality of groups of radial lines extending outward in a spiral shape along the center of the grinding layer 1. The plurality of groups of radial lines are evenly distributed and each group of lines forms an inwardly concave material guide groove 7. When the grinding pad rotates following the equipment, the chips are quickly removed through the material guide groove 7, and the end of each radial line forms an acute angle with the edge of the grinding layer 1. The acute angle can more effectively guide and discharge the debris generated during the grinding process. The tip formed by the acute angle is more likely to cut and push the debris, thereby reducing the accumulation of debris on the grinding surface.

[0036] In addition, there are at least 36 groups of radial lines, which can provide more chip removal paths, and the distance between adjacent radial lines measured along the radial direction is 6 mm to ensure that the debris can be discharged smoothly through these gaps without being easily blocked due to the small spacing. The width of the guide groove 7 is 0.8 mm and the depth is 0.6 mm, which provides sufficient space for the guide groove 7 to accommodate and discharge the debris. Such a size can effectively remove the debris without affecting the overall structural strength of the grinding layer 1.

[0037] Example 2

[0038] like Figure 7As shown, the chip removal mechanism also includes a guide groove 2 13 opened on the upper surface of the grinding layer 1. There are at least 18 guide grooves 2 13. Each guide groove 2 13 is composed of two adjacent radial lines. The inclination angle of the radial lines is 10°, which optimizes the chip removal direction to better guide the debris to move in a specific direction, thereby reducing the possibility of debris accumulation.

[0039] Example 3

[0040] like Figure 8 As shown, the chip removal mechanism also includes a guide groove three 14 opened on the upper surface of the grinding layer 1. There are at least 6 guide grooves three 14, and each guide groove three 14 is composed of two adjacent radial lines. The angle between the two adjacent groups of radial lines is 60°, so that smaller particles and powdery waste chips can be discharged more easily through a limited number of guide grooves three 14.

[0041] The number, structure and angle of each guide trough are different. This multi-level and multi-directional design can meet the discharge requirements of different types of waste chips.

[0042] In summary, the highly efficient chip removal polishing pad of the present invention operates as follows: as the polishing pad rotates with the equipment, guide trough 1 (7) quickly guides and removes the debris generated during the grinding process. The sharp angle design makes it easier for the tip to cut and push the debris, reducing its accumulation on the polishing surface. Similarly, guide trough 2 (13) and guide trough 3 (14) operate in the same manner as described above.

[0043] The above is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A high-efficiency chip removal polishing pad, comprising a polishing assembly, characterized in that: The grinding assembly comprises a grinding layer (1) located at an end surface, and a chip removal mechanism is provided on the upper surface of the grinding layer (1), the chip removal mechanism comprising a plurality of radial lines extending outward in a spiral shape along the center of the grinding layer (1), the plurality of radial lines being evenly distributed and each group of lines forming an inwardly concave material guide groove (7), the material guide groove (7) being used for rapid chip removal, and the end of each radial line forming an acute angle with the edge of the grinding layer (1).

2. The high-efficiency chip removal polishing pad according to claim 1, characterized in that: There are at least 36 groups of radial lines, and the distance between adjacent radial lines measured along the radial direction is 6 mm.

3. The high-efficiency chip removal polishing pad according to claim 2, characterized in that: The guide groove 1 (7) has a width of 0.8 mm and a depth of 0.6 mm.

4. The high-efficiency chip removal polishing pad according to claim 1, characterized in that: The chip removal mechanism further includes a second material guide groove (13) opened on the upper surface of the grinding layer (1). There are at least 18 second material guide grooves (13), and each second material guide groove (13) is composed of two adjacent radial lines.

5. The high-efficiency chip removal polishing pad according to claim 4, characterized in that: The inclination angle of the radial lines is 10°.

6. The high-efficiency chip removal polishing pad according to claim 1, characterized in that: The chip removal mechanism further includes a material guide groove three (14) opened on the upper surface of the grinding layer (1), and there are at least six material guide grooves three (14), and each material guide groove three (14) is composed of two adjacent radial lines.

7. The high-efficiency chip removal polishing pad according to claim 5, characterized in that: The angle between two adjacent groups of radial lines is 60°.

8. The high-efficiency chip removal polishing pad according to claim 1, characterized in that: A support layer (2) is provided on the lower side of the grinding layer (1), a shock-absorbing layer (3) is provided on the lower side of the support layer (2), a protective layer (4) is provided on the lower side of the shock-absorbing layer (3), a base material layer (5) is provided on the lower side of the protective layer (4), and the edges of the grinding layer (1), the support layer (2), the shock-absorbing layer (3), the protective layer (4) and the base material layer (5) are sealed by a reinforcement edge layer (6).

9. The high-efficiency chip removal polishing pad according to claim 8, characterized in that: Positioning grooves (9) are provided on both the upper and lower sides of the shock-absorbing layer (3), and positioning strips 1 (10) and 2 (11) are provided on the lower side of the supporting layer (2) and the upper side of the protective layer (4), respectively. The positioning strips 1 (10) and 2 (11) are respectively engaged with the positioning grooves (9) on both sides.

10. The high-efficiency chip removal polishing pad according to claim 9, characterized in that: The shock-absorbing layer (3) and the protective layer (4) are respectively provided with a plurality of air holes one (8) and air holes two (12).

Images