Sand feeding device for diamond wire for low-wire-consumption wafer cutting

Abstract

The utility model discloses a sanding device for a diamond wire for low-wire-consumption wafer cutting, which comprises a mounting plate, the top of the mounting plate is movably connected with an electroplating box, and the top of the electroplating box is movably connected with an electroplating liquid adding pipe. According to the device, the electroplating box, the water tank, a water inlet pipe, a water suction pump, a connecting pipe, a conductive supporting plate, a flow divider, a spray head and a water outlet pipe are arranged and used in cooperation, so that the device can clean the interior of the electroplating box after diamond wire electroplating is completed, and a worker can quickly clean the device after using the device; by means of the device, workers can rapidly clean the device, the working efficiency of the workers during cleaning is improved, the device can better clean the inner wall through cooperative use of a flow divider and a spray head, the workers can better clean the device when cleaning the device, the workload of the workers is reduced, and the working efficiency of the workers is improved. And the cleaning efficiency of the device used by workers is further improved.

Description

Technical Field

[0001] The utility model belongs to the field of diamond wire sanding, and particularly relates to a diamond wire sanding device for low-line-consumption wafer cutting. Background Art

[0002] Many hard materials in industry are cut using steel wire or higher-quality gold wire, such as polysilicon slices, single crystal silicon, and ingots in the photovoltaic industry. The material of the wire is extremely important. Excessive wire breakage and poor product quality are often directly related to the wire's material.

[0003] Nowadays, diamond wire is needed for cutting in many industrial cutting tasks, but the diamond wire needs to be sanded before use. The general sanding device is not easy to clean by the staff, which slows down the work efficiency of the staff. In addition, the general sanding device is not good for the sanding effect of the diamond wire when the staff uses it, and the general sanding device is difficult to adjust the height when the staff uses it, making it not practical.

[0004] Therefore, how to provide a low-line-consumption diamond wire sanding device for wafer cutting has become an urgent problem to be solved by people in this field. Summary of the Invention

[0005] The purpose of the utility model is to provide a low-line-consumption diamond wire sanding device for wafer cutting in accordance with the existing device, so as to solve the problems raised in the above-mentioned background technology.

[0006] In order to solve the above technical problems, the utility model provides the following technical solutions: a sanding device for diamond wire for low-line-consumption wafer cutting, comprising a mounting plate, the top of the mounting plate is movably connected to a plating box, and the top of the plating box is movably connected to a plating liquid adding pipe, the top of the plating box is movably connected to a water tank, and the top of the water tank is movably connected to a water inlet pipe.

[0007] One side of the water tank is movably connected to a water pump, and one side of the water pump is movably connected to a connecting pipe, the inner top of the water tank is movably connected to a conductive support plate, and the bottom of the conductive support plate is movably connected to a diverter, and the bottom of the diverter is movably connected to a nozzle, and one side of the electroplating box is movably connected to a water outlet pipe.

[0008] The present invention further describes that one end of the connecting pipe passes through the top of the electroplating box and is movably connected to the top of the diverter, and a wire outlet is provided on one side of the electroplating box.

[0009] The present invention further illustrates that the top of the mounting plate is movably connected to an upper sand box, and a wire inlet is opened on one side of the upper sand box.

[0010] The utility model further illustrates that the top of the upper sand box is movably connected to a sand inlet pipe, the top of the sand inlet pipe is movably connected to a filter screen, and the top of the filter screen is movably connected to a screw.

[0011] The utility model further describes that the bottom of the mounting plate is movably connected to a motor, and the output shaft of the motor passes through the mounting plate and the bottom of the upper sand box and is movably connected to the bottom end of the rotating rod, and the outer wall of the rotating rod is movably connected to a stirring rod.

[0012] The present invention further illustrates that the bottom of the mounting plate is movably connected to a fixing plate, and the bottom of the fixing plate is movably connected to a threaded shell.

[0013] The present invention further illustrates that the interior of the threaded shell is movably connected to a threaded leg, and the bottom end of the threaded leg is movably connected to a shock-absorbing pad.

[0014] Compared with the prior art, the beneficial effects achieved by the present invention are:

[0015] (1) By providing an electroplating box, a water tank, a water inlet pipe, a water pump, a connecting pipe, a conductive support plate, a diverter, a nozzle and a water outlet pipe, the device can clean the interior of the electroplating box after the diamond wire electroplating is completed, so that the staff can quickly clean the device after using the device, so that the staff can quickly clean the device when cleaning, thereby improving the staff's work efficiency during cleaning. In addition, by using the diverter and the nozzle in conjunction with each other, the device can better clean the inner wall, so that the staff can better clean the device when cleaning, reducing the staff's workload, and further improving the cleaning efficiency of the staff using the device.

[0016] (2) By providing a sand loading box, a sand feeding pipe, a filter screen, a screw, a motor, a rotating rod, a stirring rod and a threaded leg, the staff can stir the corundum when using the device, so that the device can stir the corundum to prevent the corundum from clumping, so that the staff can quickly load sand when using the device, and the effect of the device in loading sand can be improved. The staff can also adjust the device by using the threaded leg and the threaded shell, thereby improving the practicality of the staff when using the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2This is a diagram showing the connection structure between the water pump and the connecting pipe of the utility model;

[0020] Figure 3 This is a diagram showing the connection structure between the diverter and the nozzle of the utility model;

[0021] Figure 4 This is a diagram showing the connection structure between the rotating rod and the stirring rod of the utility model;

[0022] Figure 5 This is a diagram showing the connection structure between the sand inlet pipe and the filter screen of the utility model;

[0023] Figure 6 This is a diagram showing the connection structure between the threaded leg and the shock-absorbing pad of the utility model;

[0024] In the figure: 1. Mounting plate; 2. Plating box; 3. Plating liquid adding pipe; 4. Water tank; 5. Water inlet pipe; 6. Water pump; 7. Connecting pipe; 8. Conductive support plate; 9. Diverter; 10. Nozzle; 11. Water outlet pipe; 12. Wire inlet; 13. Sand loading box; 14. Sand inlet pipe; 15. Filter; 16. Screw; 17. Motor; 18. Rotating rod; 19. Stirring rod; 20. Fixing plate; 21. Threaded shell; 22. Threaded leg; 23. Shock-absorbing pad; 24. Wire outlet. DETAILED DESCRIPTION

[0025] The following is a non-limiting detailed description of the technical solution of the present invention in conjunction with preferred embodiments and their accompanying drawings. Obviously, the described embodiments are only a portion of the embodiments of the present invention, and not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without inventive effort are also within the scope of protection of the present invention. Example

[0026] See also Figure 1-6 As shown, a sanding device for diamond wire for low-line consumption wafer cutting includes a mounting plate 1, a plating box 2 is movably connected to the top of the mounting plate 1, a plating liquid adding pipe 3 is movably connected to the top of the plating box 2, a water tank 4 is movably connected to the top of the water tank 4, and a water inlet pipe 5 is movably connected to the top of the water tank 4.

[0027] One side of the water tank 4 is movably connected to a water pump 6, one side of the water pump 6 is movably connected to a connecting pipe 7, the inner top of the water tank 4 is movably connected to a conductive support plate 8, the bottom of the conductive support plate 8 is movably connected to a diverter 9, the bottom of the diverter 9 is movably connected to a nozzle 10, and one side of the electroplating box 2 is movably connected to a water outlet pipe 11, so that the device can clean the inside of the electroplating box 2 after the diamond wire electroplating is completed, so that the staff can quickly clean the device after using the device, so that the staff can quickly clean the device when cleaning, thereby improving the work efficiency of the staff during cleaning.

[0028] In this embodiment, the electroplating box 2, water tank 4, water inlet pipe 5, water pump 6, connecting pipe 7, conductive support plate 8, diverter 9, nozzle 10 and outlet pipe 11 are used in coordination with each other so that the device can clean the interior of the electroplating box 2 after the diamond wire electroplating is completed, so that the staff can quickly clean the device after using the device, so that the staff can quickly clean the device when cleaning, thereby improving the work efficiency of the staff during cleaning. The coordinated use of the diverter 9 and the nozzle 10 allows the device to clean the inner wall better, so that the staff can clean the device better when cleaning, reducing the workload of the staff and further improving the cleaning efficiency of the staff using the device.

[0029] In this embodiment, one end of the connecting pipe 7 passes through the top of the electroplating box 2 and is movably connected to the top of the diverter 9. An outlet 24 is provided on one side of the electroplating box 2, so that the staff can clean the device better, reduce the workload of the staff, and further improve the cleaning efficiency of the staff using the device. Example

[0030] like Figure 1-6 As shown, on the basis of Example 1, the utility model provides a technical solution, the top of the mounting plate 1 is movably connected to an upper sand box 13, a wire inlet 12 is provided on one side of the upper sand box 13, the top of the upper sand box 13 is movably connected to a sand inlet pipe 14, the top of the sand inlet pipe 14 is movably connected to a filter screen 15, and the top of the filter screen 15 is movably connected to a screw 16.

[0031] The bottom of the mounting plate 1 is movably connected to a motor 17, the output shaft of the motor 17 passes through the bottom of the mounting plate 1 and the upper sand box 13 and is movably connected to the bottom end of the rotating rod 18, and the outer wall of the rotating rod 18 is movably connected to a stirring rod 19, so that the device can stir the corundum to prevent the corundum from clumping, so that the staff can quickly apply sand when using the device and can improve the effect of the device when applying sand.

[0032] In this embodiment, the sand loading box 13, the sand feeding pipe 14, the filter screen 15, the screw 16, the motor 17, the rotating rod 18, the stirring rod 19 and the threaded leg 22 are used in coordination with each other so that the staff can stir the corundum when using the device, so that the device can stir the corundum to prevent the corundum from clumping, so that the staff can quickly load sand when using the device, and can improve the effect of the device when loading sand. The staff can adjust the device by using the threaded leg 22 in coordination with the threaded shell 21, thereby improving the practicality of the staff when using the device.

[0033] In this embodiment, the bottom of the mounting plate 1 is movably connected to a fixed plate 20, the bottom of the fixed plate 20 is movably connected to a threaded shell 21, the inside of the threaded shell 21 is movably connected to a threaded leg 22, and the bottom end of the threaded leg 22 is movably connected to a shock-absorbing pad 23. The staff can adjust the device by using the threaded leg 22 in conjunction with the threaded shell 21, thereby improving the practicality of the staff in using the device.

[0034] The following is a detailed description of the working principle of the diamond wire sanding device for low-line consumption wafer cutting.

[0035] The staff first passes the corundum into the interior of the upper sand box 13 through the sand inlet pipe 14 and the filter screen 15, and the filter screen 15 can remove impurities in the corundum. At this time, the staff starts the motor 17 to drive the rotating rod 18 to rotate. The rotation of the rotating rod 18 will drive the stirring rod 19 to rotate together. The stirring rod 19 will keep the corundum active, and then the diamond wire is passed through the wire inlet 12 into the interior of the upper sand box 13 for sanding. At the same time, the staff can add the electroplating liquid through the electroplating liquid pipe 3 to the interior of the electroplating box 2, and then discharge it through the conductive support plate 8. At this time, the diamond wire that has been successfully sanded enters the interior of the electroplating box 2 for reinforcement treatment, and then comes out through the wire outlet 24. When the device needs to be cleaned, the water from the water tank 4 can be pumped into the diverter 9 through the connecting pipe 7 through the water pump 6, and then the interior of the electroplating box 2 is cleaned through the nozzle 10. The staff can also adjust the height of the device through the threaded leg 22 and the threaded shell 21.

[0036] In the description of the present invention, it should be understood that the terms "up", "down", "front", "back", "left", "right", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only used to facilitate the description of the present invention, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0037] Finally, it should be pointed out that the above embodiments are intended only to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art will appreciate that modifications may be made to the technical solutions described in the above embodiments, or that some of the technical features may be replaced with equivalents. Such modifications or replacements do not deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A sanding device for diamond wire used for low-line-consumption wafer cutting, comprising a mounting plate (1), characterized in that: The top of the mounting plate (1) is movably connected to an electroplating box (2), and the top of the electroplating box (2) is movably connected to an electroplating liquid adding pipe (3), the top of the electroplating box (2) is movably connected to a water tank (4), and the top of the water tank (4) is movably connected to a water inlet pipe (5); One side of the water tank (4) is movably connected to a water pump (6), and one side of the water pump (6) is movably connected to a connecting pipe (7). The inner top of the water tank (4) is movably connected to a conductive support plate (8), and the bottom of the conductive support plate (8) is movably connected to a diverter (9), and the bottom of the diverter (9) is movably connected to a nozzle (10). One side of the electroplating box (2) is movably connected to a water outlet pipe (11).

2. The low-line-consumption diamond wire sanding device for wafer cutting according to claim 1, characterized in that: One end of the connecting pipe (7) passes through the top of the electroplating box (2) and is movably connected to the top of the diverter (9), and a wire outlet (24) is provided on one side of the electroplating box (2).

3. The low-line-consumption diamond wire sanding device for wafer dicing according to claim 1, characterized in that: The top of the mounting plate (1) is movably connected to an upper sand box (13), and a wire inlet (12) is provided on one side of the upper sand box (13).

4. The low-line-consumption diamond wire sanding device for wafer dicing according to claim 3, characterized in that: The top of the upper sand box (13) is movably connected to a sand inlet pipe (14), and the top of the sand inlet pipe (14) is movably connected to a filter screen (15), and the top of the filter screen (15) is movably connected to a screw (16).

5. The low-line-consumption diamond wire sanding device for wafer dicing according to claim 3, characterized in that: The bottom of the mounting plate (1) is movably connected to a motor (17), and the output shaft of the motor (17) passes through the bottom of the mounting plate (1) and the upper sand box (13) and is movably connected to the bottom end of the rotating rod (18), and the outer wall of the rotating rod (18) is movably connected to a stirring rod (19).

6. The low-line-consumption diamond wire sanding device for wafer dicing according to claim 1, characterized in that: The bottom of the mounting plate (1) is movably connected to a fixing plate (20), and the bottom of the fixing plate (20) is movably connected to a threaded shell (21).

7. The low-line-consumption diamond wire sanding device for wafer dicing according to claim 6, characterized in that: The threaded shell (21) is movably connected to a threaded leg (22) inside, and the bottom end of the threaded leg (22) is movably connected to a shock-absorbing pad (23).

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