Computing node and computing device

Abstract

The utility model provides a computing node and computing equipment, the computing node comprises a shell, a function card module and a backboard module, the shell comprises a box body, a first cover plate, a second cover plate and a third cover plate, and the box body comprises a first accommodating area, a second accommodating area and a third accommodating area; the first cover plate is fixedly connected to the box body and covers the opening of the first accommodating area, the second cover plate is fixedly connected to the box body and covers the opening of the second accommodating area, and the third cover plate is detachably connected to the box body and covers the opening of the third accommodating area; the shell comprises a first window and a second window, and the first window and the second window are located at the two ends of the shell in the first direction respectively; a part of the function card module is inserted into the first accommodating area from the first window, and a part of the function card module enters the second accommodating area from the second window; the backboard module is located in the third containing area. The maintenance process of the computing node provided by the embodiment of the utility model is time-saving and labor-saving.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of computing devices, and in particular to a computing node and a computing device. Background Art

[0002] With the development of big data, cloud computing and artificial intelligence (AI), the maintenance frequency of computing nodes in computing devices is becoming increasingly higher.

[0003] The computing device includes a cabinet and multiple computing nodes, which are arranged in sequence in the cabinet along the height direction of the cabinet. The computing node includes a housing and components such as a circuit board and a processor located in the housing. The housing includes a bottom shell and an upper cover. The bottom shell includes a bottom plate and side walls. The side walls are arranged around the sides of the bottom plate to form a storage cavity with an opening. The circuit board, processor and other components are located in the storage cavity, and the upper cover is arranged on the opening. When maintenance is required on the components in the computing node, it is necessary to first power off the computing node, remove the computing node from the cabinet, and then open the upper cover of the computing node to perform maintenance on the components in the computing node.

[0004] In related technologies, the maintenance process of computing nodes is complicated, time-consuming and labor-intensive. Utility Model Content

[0005] The embodiments of the present application provide a computing node and a computing device, which saves time and effort in the maintenance process of the computing node.

[0006] In the first aspect, an embodiment of the present application provides a computing node, comprising a shell, multiple functional card modules and a backplane module, the shell comprising a box body, a first cover plate, a second cover plate and a third cover plate, the box body comprising a first accommodating area, a second accommodating area and a third accommodating area; the third accommodating area is located between the first accommodating area and the second accommodating area along the first direction; the first cover plate is fixedly connected to the box body and covers the opening of the first accommodating area, the second cover plate is fixedly connected to the box body and covers the opening of the second accommodating area, the third cover plate is detachably connected to the box body and covers the opening of the third accommodating area; the shell body comprises a first window and a second window, the first window and the second window are respectively located at the two ends of the shell along the first direction, the first window is connected to the first accommodating area, and the second window is connected to the second accommodating area; a part of the functional card modules are inserted into the first accommodating area from the first window, and the other part of the functional card modules are inserted into the second accommodating area from the second window; the backplane module is located in the third accommodating area, and multiple functional card modules are all plugged into the backplane module.

[0007] The computing node provided in the embodiment of the present application divides the box into three accommodating areas, the first window is connected to the first accommodating area, the second window is connected to the second accommodating area, the third cover is detachably connected to the box and covers the opening of the third accommodating area, a part of the function card modules are inserted into the first accommodating area from the first window, and when this part of the function card modules in the computing node is needed, it is only necessary to pull out this part of the function card modules from the first window, and the other part of the function card modules are inserted into the second accommodating area from the second window, and when this part of the function card modules in the computing node is needed, it is only necessary to pull out this part of the function card modules from the second window, and when it is necessary to maintain the backplane module located in the middle accommodating area (the third accommodating area), it is only necessary to remove the third cover, so that the maintenance process of the computing node is time-saving and labor-saving.

[0008] In one possible implementation, the computing node provided in an embodiment of the present application has a slot on a side of the third cover plate facing the second cover plate, and the second cover plate has an extension portion that is inserted into the slot. When the third cover plate is installed, the extension portion is inserted into the slot, thereby connecting the third cover plate to the second cover plate. Fasteners are not required to connect the third cover plate and the second cover plate, making the connection between the third cover plate and the second cover plate relatively simple.

[0009] In one possible implementation, in the computing node provided in an embodiment of the present application, the third cover plate has a first bent portion on a side facing the first cover plate, the first cover plate has a second bent portion, and the first bent portion is hooked to the second bent portion. When the third cover plate is installed, the first bent portion hooks to the second bent portion, thereby connecting the third cover plate to the first cover plate. Fasteners are not required to connect the third cover plate and the first cover plate, simplifying the connection method.

[0010] In one possible embodiment, the computing node provided by the embodiment of the present application has a box body including a bottom plate and side plates connected to both sides of the bottom plate along the second direction, and the first cover plate, the second cover plate and the third cover plate are all connected to the side plates; a guide groove is provided at a position where the side plate is opposite to the third cover plate; a guide column is provided on the third cover plate, and the guide column can be moved in the guide groove along the first direction toward the second cover plate, so that the first bending portion is hooked with the second bending portion and the extension portion is inserted into the slot. When installing the third cover plate, it is only necessary to slide the guide column in the guide groove toward the second cover plate to connect the third cover plate and the second cover plate as well as the first cover plate. When removing the third cover plate, it is only necessary to move the guide column in the guide groove toward the first cover plate. The installation and removal of the third cover plate are simple, which makes the maintenance process of the backplane module in the computing node relatively simple.

[0011] In a possible embodiment, the third cover plate has a lock buckle, and the box body has a lock head. The lock buckle is locked with the lock head, thereby realizing a detachable connection between the third cover plate and the box body. When the third cover plate needs to be removed, it is only necessary to operate the lock buckle, and the cover opening method is simple and reliable.

[0012] In one possible implementation, in the computing node provided in an embodiment of the present application, locking latches are provided at both ends of the third cover plate along the second direction, and the locking heads are locked in a one-to-one correspondence with the locking latches. The third cover plate is connected to the first cover plate and the second cover plate at both ends along the first direction, respectively. By providing locking latches at both ends of the third cover plate along the second direction and locking the locking latches with the locking heads, the third cover plate can also be secured in the second direction. Therefore, the third cover plate has fixing devices on all four circumferential sides, making the third cover plate more securely secured.

[0013] In one possible implementation, the computing node provided in an embodiment of the present application further comprises a first partition in the first storage area. The first partition extends along a first direction, and the spacing between the first partition and the side panels is adjustable. The spacing between the first partition and the side panels can be adjusted based on the size of the function card module along a second direction. This allows for the insertion of different function card modules in the first sub-storage area, thereby increasing the compatibility of the first storage area.

[0014] In one possible implementation, the computing node provided in an embodiment of the present application further comprises a second partition in the second storage area. The second partition extends along the first direction, and the spacing between the second partition and the side panel is adjustable. The spacing between the second partition and the side panel can be adjusted based on the size of the function card module along the second direction. This allows for different function card modules to be inserted into the second sub-storage area, thereby increasing the compatibility of the second storage area.

[0015] In one possible implementation, the computing node provided in an embodiment of the present application further includes a fan module and two backplane modules; a function card module is plugged into a backplane module adjacent to the function card module. The function card module can be plugged into a backplane module adjacent to the function card module, simplifying the installation and removal of the function card module.

[0016] In a possible implementation, in the computing node provided in the embodiment of the present application, the functional card module is a processor module, a hard disk module, a PCIE card module or a power supply module.

[0017] In a second aspect, an embodiment of the present application provides a computing device, comprising a cabinet and a plurality of the above-mentioned computing nodes, wherein the computing nodes are arranged in sequence along the height direction of the cabinet. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the structure of a data center provided in an embodiment of the present application;

[0019] Figure 2 A schematic diagram of the structure of a computing device provided in an embodiment of the present application;

[0020] Figure 3 A schematic diagram of the structure of a computing node provided in an embodiment of the present application;

[0021] Figure 4 An exploded diagram of a computing node provided in an embodiment of the present application;

[0022] Figure 5 for Figure 4 Another angle of view;

[0023] Figure 6 An exploded diagram of a processor module in a computing node provided in an embodiment of the present application;

[0024] Figure 7 An exploded diagram of a PCIE card module in a computing node provided in an embodiment of the present application;

[0025] Figure 8 An exploded diagram of a hard disk module in a computing node provided in an embodiment of the present application;

[0026] Figure 9 An exploded diagram of a power supply module in a computing node provided in an embodiment of the present application;

[0027] Figure 10 Another exploded schematic diagram of a computing node provided in an embodiment of the present application;

[0028] Figure 11 Another exploded schematic diagram of a computing node provided in an embodiment of the present application;

[0029] Figure 12 A schematic diagram of the structure of the third cover plate in the computing node provided in an embodiment of the present application;

[0030] Figure 13 A schematic diagram of the connection between the third cover plate, the first cover plate, and the second cover plate in the computing node provided in an embodiment of the present application;

[0031] Figure 14 for Figure 12 Enlarged view of point A in the middle;

[0032] Figure 15 for Figure 12 Enlarged view of point B in the middle;

[0033] Figure 16 A schematic diagram of the structure of a shell in a computing node provided in an embodiment of the present application;

[0034] Figure 17 for Figure 16 A structural diagram from another angle.

[0035] Description of reference numerals:

[0036] 10. Computing equipment;

[0037] 100. Compute nodes;

[0038] 110, housing; 110a, box body; 110b, bottom plate; 110c, side plate;

[0039] 111, first storage area; 111a, first sub-storage area; 1111, first window; 1112, first bottom plate section; 1113, first side plate section; 1114, first partition; 1116, first cover plate; 1116a, second bent portion;

[0040] 112, second accommodating area; 112a, second sub-accommodating area; 1121, second window; 1122, second bottom plate section; 1123, second side plate section; 1124, second partition; 1126, second cover plate; 1126a, extension portion;

[0041] 113, third accommodating area; 1131, third cover; 1131a, slot; 1131b, first bent portion; 1131c, guide post; 1131d, cover body; 1131e, side wall; 1131f, lock catch; 1132, third bottom plate section; 1133, third side plate section; 1133a, guide slot; 1133b, extension slot; 1133c, opening;

[0042] 114. handle;

[0043] 120. Function card module;

[0044] 121, processor module; 121a, first processor module; 121b, second processor module; 1211, first sub-housing; 1212, first board; 1213, processor; 1214, memory; 1215, radiator; 1216, air guide cover;

[0045] 122, hard disk module; 1221, third sub-housing; 1222, hard disk;

[0046] 123, PCIE card module; 1231, second sub-housing; 1232, PCIE card;

[0047] 124, power module; 1241, fourth sub-housing; 1242, power module;

[0048] 130. Fan module; 131. Fan;

[0049] 140. Backplane module; 141. First backplane module; 142. Second backplane module;

[0050] 150. Circuit board;

[0051] 200, cabinet body; 210, front cabinet door;

[0052] 300, power supply unit;

[0053] 1000, data center;

[0054] X, first direction;

[0055] Y, second direction;

[0056] Z. Third direction. DETAILED DESCRIPTION

[0057] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0058] With the development of big data, cloud computing and AI (artificial intelligence), the frequency of installation and operation and maintenance of computing equipment is increasing.

[0059] Figure 1 A schematic diagram of the structure of a data center provided in an embodiment of the present application.

[0060] See also Figure 1 As shown, the data center 1000 may include at least one computing device 10 .

[0061] The data center 1000 may be provided with only one computing device 10 or may be provided with multiple computing devices 10. When the data center is provided with multiple computing devices 10, each computing device 10 may be identical, partially identical, or completely different. The computing device 10 may be a whole cabinet server.

[0062] Whole-cabinet servers are widely used in cloud computing, high-performance computing (C), big data, artificial intelligence and other fields due to their high space utilization.

[0063] The structure of the computing device is described below by taking a whole cabinet server as an example.

[0064] Figure 2 A schematic diagram of the structure of a computing device provided in an embodiment of the present application.

[0065] See also Figure 2As shown, the computing device 10 includes a cabinet 200 and a plurality of computing nodes 100 installed in the cabinet 200, wherein the computing nodes 100 can be servers or switches. The servers can be blade servers, rack servers or tower servers. Figure 2 The example of computing node being a rack server is used for explanation. The cabinet 200 serves as a supporting component of the computing node 100. For details, please continue to refer to Figure 2 As shown, the cabinet 200 includes a first direction X, a second direction Y, and a third direction Z, wherein the first direction X is the depth direction of the cabinet 200, the second direction Y is the width direction of the cabinet 200, and the third direction Z is the height direction of the cabinet 200. Multiple computing nodes 100 are sequentially spaced and arranged in the cabinet 200 along the third direction Z.

[0066] The cabinet 200 includes a front cabinet door 210 and a rear cabinet door (not shown in the figure). The computing node 100 can be put on and taken off the cabinet from the side of the front cabinet door 210. Putting on the cabinet refers to the process of installing the computing node 100 on the cabinet 200 and locking it with the cabinet 200, and taking off the cabinet refers to the process of unlocking the computing node 100 from the cabinet 200 and removing it from the cabinet 200.

[0067] Please continue to see Figure 2 As shown, computing device 10 further includes a power supply unit 300, which is also disposed within cabinet 200 and can be disposed at the upper end of the cabinet. Power supply unit 300 supplies power to computing node 100 via a copper bus or cable, wherein the copper bus or cable is electrically connected to computing node 100 from one side of the rear cabinet door.

[0068] The computing nodes and computing devices provided in the embodiments of the present application save time and effort in the maintenance process of the computing nodes.

[0069] Figure 3 A schematic diagram of the structure of a computing node provided in an embodiment of the present application; Figure 4 An exploded diagram of a computing node provided in an embodiment of the present application; Figure 5 for Figure 4 Another angle view.

[0070] See also Figures 3 to 5As shown, the computing node 100 provided in the embodiment of the present application includes: a shell 110, multiple function card modules 120 and a backplane module 140, the shell 110 includes a box body 110a, a first cover 1116, a second cover 1126 and a third cover 1131, the box body 110a includes a first accommodating area 111, a second accommodating area 112 and a third accommodating area 113, the third accommodating area 113 is located between the first accommodating area 111 and the second accommodating area 112 along the first direction X, the first cover 1116 is fixedly connected to the box body 110a and covers the opening of the first accommodating area 111, the second cover 1126 is fixedly connected to the box body 110a and covers the opening of the second accommodating area 112; the third cover 1131 is detachably connected to the box body 110a and covers the opening of the third accommodating area 113. For example, the third cover 1131 has a lock 1131f, and the box body 110a has a lock head, and the lock 1131f is locked with the lock head; the shell 110 includes a first window 1111 and a second window 1121, and the first window 1111 and the second window 1121 are respectively located at the two ends of the shell 110 along the first direction X, the first window 1111 is connected to the first accommodating area 111, and the second window 1121 is connected to the second accommodating area 112; a part of the function card module 120 is inserted into the first accommodating area 111 from the first window 1111, and the other part of the function card module 120 is inserted into the second accommodating area 112 from the second window 1121; the backplane module 140 is located in the third accommodating area 113, and multiple function card modules 120 are all plugged into the backplane module 140.

[0071] The housing 110 may be a rectangular parallelepiped structure. The first direction X, second direction Y, and third direction Z of the housing 110 are the same as the first direction X, second direction Y, and third direction Z of the cabinet 200. Multiple function card modules 120 may be disposed in the housing 110. The function card modules 120 may be processor modules 121, hard disk modules 122, PCIE card modules 123, or power supply modules 124. A backplane module 140 is also disposed in the housing 110, and the function card modules 120 are plugged into the backplane module 140.

[0072] Specifically, the first accommodating area 111 and the second accommodating area 112 are located on opposite sides of the housing 110 along the first direction X. A first cover plate 1116 is disposed over the opening of the first accommodating area 111 and can be fixedly connected to the housing 110a via rivets. A second cover plate 1126 is disposed over the opening of the second accommodating area 112 and can also be fixedly connected to the housing 110a via rivets.

[0073] Among them, Figures 3 to 5In the illustrated embodiment, the first window 1111 faces the front door 210 of the cabinet 200, and the second window 1121 faces the rear door of the cabinet 200. The housing 110 is further provided with handles 114 on both sides of the first window 1111 along the second direction Y. When loading or unloading the computing node 100, the operator can grip the two handles 114 to apply force to the computing node 100. The first window 1111 can be the front window of the computing node, and the second window 1121 can be the rear window of the computing node.

[0074] exist Figure 4 and Figure 5 In the example, two processor modules 121, a hard disk module 122, and a PCIE card module 123 are inserted into the first accommodation area 111 through the first window 1111. Two processor modules 121 and a power supply module 124 are inserted into the second accommodation area 112 through the second window 1121. The processor module 121 inserted through the first window 1111 is the first processor module 121a. The processor module 121 inserted through the second window 1121 is the second processor module 121b.

[0075] The backplane module 140 is located in the third accommodating area 113. When two first processor modules 121a, a hard disk module 122 and a PCIE card module 123 are inserted into the first accommodating area 111 from the first window 1111, they are plugged into the side of the backplane module 140 facing the first window 1111, thereby being electrically connected to the backplane module 140; when two second processor modules 121b and a power supply module 124 are inserted into the second accommodating area 112 from the second window 1121, they are plugged into the side of the backplane module 140 facing the second window 1121, thereby being electrically connected to the backplane module 140.

[0076] Specifically, Figure 6 An exploded diagram of a processor module in a computing node provided in an embodiment of the present application.

[0077] See also Figure 6 As shown, processor module 121 includes a first sub-housing 1211 and a first board 1212. First board 1212 is mounted in first sub-housing 1211 and is equipped with a processor 1213, memory 1214, and other electronic components. Processor 1213 is the core working component for computing node 100. Processor 1213 is also equipped with a heat sink 1215, which is attached to processor 1213 to dissipate heat from processor 1213.

[0078] The housing 110 may be a 2U high housing (where U is a unit representing the external dimensions of a computing device, and is the abbreviation of unit. 1U is 4.445 cm, 2U is twice 1U, or 8.89 cm, and so on). The first sub-housing 1211 of the processor module 121 is a 1U high housing. When the two first processor modules 121a are inserted into the housing 110, the two first processor modules 121a may be arranged along the third direction Z. The two first processor modules 121a are inserted into the first accommodating area 111 through the first window 1111.

[0079] Figure 7 An exploded diagram of a PCIE card module in a computing node provided in an embodiment of the present application.

[0080] See also Figure 7 As shown, the PCIE card module 123 includes a second sub-housing 1231 and a PCIE card 1232 located in the second sub-housing 1231. Figure 7 Schematically showing four PCIE cards 1232 , the four PCIE cards 1232 are arranged in the second sub-housing 1231 along the third direction Z. The PCIE card module 123 is inserted into the first accommodating area 111 through the first window 1111 .

[0081] Figure 8 An exploded diagram of a hard disk module in a computing node provided in an embodiment of the present application.

[0082] See also Figure 8 As shown, the hard disk module 122 includes a third sub-housing 1221 and a hard disk 1222 located in the third sub-housing 1221. Figure 8 Schematically, eight hard disks 1222 are shown, and the eight hard disks 1222 are arranged in the third sub-housing 1221 along the second direction Y. The hard disk module 122 is inserted into the first accommodating area 111 through the first window 1111 .

[0083] When maintenance is required on one or more of the first processor module 121a, PCIE card module 123, or hard disk module 122 in the computing node 100, one only needs to open the front door 210 of the cabinet 200 and pull out one or more of the first processor module 121a, PCIE card module 123, or hard disk module 122 from the first window 1111. Compared to the related art, which requires removing the computing node from the cabinet, powering off the computing node, and opening the upper cover of the computing node using a tool, the maintenance process of the computing node 100 provided by the present application saves time and effort.

[0084] Figure 9 An exploded diagram of a power supply module in a computing node provided in an embodiment of the present application.

[0085] See also Figure 9 As shown, the power module 124 includes a fourth sub-housing 1241 and a power module 1242 located in the fourth sub-housing 1241. Figure 9 The schematic diagram shows four power modules 1242 arranged in a matrix within the fourth sub-housing 1241. The power supply unit 300 is electrically connected to the power modules 1242 via cables or copper busbars. The power modules 1242 convert the voltage from the power supply unit 300 to the voltage required for operation of the compute node 100, thereby powering the other modules within the compute node 100. The power modules 124 are inserted through the second window 1121 into the second accommodating area 112. The two second processor modules 121b are inserted through the second window 1121 into the second accommodating area 112.

[0086] When it is necessary to perform maintenance on the second processor module 121b in the computing node 100, it is only necessary to open the rear cabinet door of the cabinet 200 and pull out the second processor module 121b from the second window 1121. Compared with the related art of removing the computing node from the cabinet, powering off the computing node, and opening the upper cover of the computing node with a tool, the maintenance process of the computing node 100 provided by the implementation of the present application is time-saving and labor-saving. When it is necessary to perform maintenance on the power supply module 124 in the computing node 100, it is only necessary to open the rear cabinet door of the cabinet 200, disconnect the electrical connection between the power supply module 124 and the power supply unit 300, and pull out the power supply module 124 from the second window 1121. Compared with the related art of removing the computing node from the cabinet, powering off the computing node, and opening the upper cover of the computing node with a tool, the maintenance process of the computing node 100 provided by the implementation of the present application is time-saving and labor-saving.

[0087] Figure 10 Another exploded schematic diagram of a computing node provided in an embodiment of the present application; Figure 11 Another exploded schematic diagram of a computing node provided in an embodiment of the present application.

[0088] See also Figure 3 、 Figure 10 and Figure 11 As shown, the third cover 1131 is detachably connected to the box body 110a and covers the opening of the third accommodating area 113. The third cover 1131 is detachably connected to the box body 110a. For example, a lock 1131f is provided on the third cover 1131. Figure 10 and Figure 11Two locks 1131f are schematically shown in the figure. A lock head that matches the lock head 1131f is provided on the box body 110a. When it is necessary to maintain the backplane module 140, it is only necessary to unlock the lock head 1131f and the lock head to remove the third cover 1131. No operating tools are required during the unlocking process. In the computing node 100 provided in the embodiment of the present application, the third cover 1131 does not need to be connected to the box body 110a by fasteners, and the removal process of the third cover 1131 is simple. In addition, the computing node 100 provided in the embodiment of the present application only needs to open the third cover 1131 when maintaining the backplane module 140.

[0089] Of course, in other embodiments, the number of locks 1131f can also be one, or they can be set near both ends of the first direction of the third cover. The embodiments of the present application do not limit the structural form, setting position and number of the locks, as long as the third cover 1131 can be detachably connected to the box body 110a.

[0090] The computing node 100 provided by the embodiment of the present application is provided with a shell 110, multiple function card modules 120 and a backplane module 140. The shell 110 includes a box body 110a, a first cover 1116, a second cover 1126 and a third cover 1131. The box body 110a includes a first accommodating area 111, a second accommodating area 112 and a third accommodating area 113. The third accommodating area 113 is located between the first accommodating area 111 and the second accommodating area 112 along the first direction X. The first cover 1116 is fixedly connected to the box body 110a and covers the opening of the first accommodating area 111. The second cover 1126 is fixedly connected to the box body 110a and covers the opening of the second accommodating area 112. The third cover 1131 is detachably connected to the box body 110a and covers the opening of the third accommodating area 113. The third cover 1131 is detachably connected to the box body 110a. The body 110a is divided into three accommodating areas, the first window 1111 is connected to the first accommodating area 111, and the second window 1121 is connected to the second accommodating area 112. A part of the function card module 120 is inserted into the first accommodating area 111 from the first window 1111. When this part of the function card module 120 in the computing node 100 is needed, it is only necessary to pull out this part of the function card module 120 from the first window 1111, and insert the other part of the function card module 120 into the second accommodating area 112 from the second window 1121. When this part of the function card module 120 in the computing node 100 is needed, it is only necessary to pull out this part of the function card module 120 from the second window 1121. When it is necessary to maintain the backplane module 140 located in the middle accommodating area (the third accommodating area 113), it is only necessary to remove the third cover 1131. The maintenance process of the computing node 100 is time-saving and labor-saving.

[0091] Figure 12A schematic diagram of the structure of the third cover plate in the computing node provided in an embodiment of the present application; Figure 13 A schematic diagram of the connection between the third cover plate, the first cover plate, and the second cover plate in the computing node provided in an embodiment of the present application; Figure 14 for Figure 12 Enlarged view of point A in the middle.

[0092] See also Figures 12 to 14 As shown, the third cover plate 1131 has a slot 1131 a on one side facing the second cover plate 1126 , and the second cover plate 1126 has an extension portion 1126 a , which is inserted into the slot 1131 a .

[0093] The edge of the third cover plate 1131 toward the second cover plate 1126 is bent twice toward the box body 110a to form a slot 1131a, and the second cover plate 1126 extends toward the third cover plate 1131 to form an extension portion 1126a. When the third cover plate 1131 is installed, the extension portion 1126a is inserted into the slot 1131a to connect the third cover plate 1131 to the second cover plate 1126. The third cover plate 1131 and the second cover plate 1126 do not need to be connected by fasteners, so that the connection method between the third cover plate 1131 and the second cover plate 1126 is relatively simple.

[0094] Figure 15 for Figure 12 Enlarged view of point B in the middle.

[0095] See also Figures 11 to 13 as well as Figure 15 As shown, the third cover plate 1131 has a first bending portion 1131 b on a side facing the first cover plate 1116 , and the first cover plate 1116 has a second bending portion 1116 a , and the first bending portion 1131 b is hooked with the second bending portion 1116 a .

[0096] Specifically, the edge of the third cover plate 1131 toward the first cover plate 1116 is bent once toward the box body 110a to form a first bending portion 1131b, and the edge of the first cover plate 1116 toward the third cover plate 1131 is bent once away from the box body 110a to form a second bending portion 1116a. When the third cover plate 1131 is installed, the first bending portion 1131b is hooked with the second bending portion 1116a to connect the third cover plate 1131 and the first cover plate 1116. The third cover plate 1131 and the first cover plate 1116 do not need to be connected by fasteners, and the connection method of the third cover plate 1131 and the first cover plate 1116 is simple.

[0097] See also Figures 11 to 13 As shown, the box body 110a includes a bottom plate 110b and side plates 110c connected to both sides of the bottom plate 110b along the second direction Y, and the first cover plate 1116, the second cover plate 1126 and the third cover plate 1131 are all connected to the side plates 110c.

[0098] A guide groove 1133a is provided at a position where the side panel 110c is opposite to the third cover plate 1131; a guide column 1131c is provided on the third cover plate 1131, and the guide column 1131c can move in the guide groove 1133a along the first direction X toward the second cover plate 1126, so that the first bending portion 1131b is hooked with the second bending portion 1116a and the extension portion 1126a is inserted into the slot 1131a.

[0099] Please continue to see Figure 3 and Figure 4 As shown, the position corresponding to the bottom plate 110b and the first cover plate 1116 is the first bottom plate segment 1112, the position corresponding to the bottom plate 110b and the second cover plate 1126 is the second bottom plate segment 1122, and the position corresponding to the bottom plate 110b and the third cover plate 1131 is the third bottom plate segment 1132; please continue to refer to Figure 10 and Figure 11 As shown, the position of the side panel 110c corresponding to the first cover panel 1116 is the first side panel segment 1113, the position of the side panel 110c corresponding to the second cover panel 1126 is the second side panel segment 1123, and the position of the side panel 110c corresponding to the third cover panel 1131 is the third side panel segment 1133. The first bottom panel segment 1112 and the two first side panel segments 1113 enclose a first accommodating area 111, with the opening of the first accommodating area 111 opposite the first bottom panel segment 1112. The second bottom panel segment 1122 and the two second side panel segments 1123 on either side form a second accommodating area 112, with the opening of the second accommodating area 112 opposite the second bottom panel segment 1122, and the opening of the third accommodating area 113 opposite the third bottom panel segment 1132.

[0100] Please continue to see Figure 12 and Figure 13 As shown, the third cover plate 1131 includes a cover plate body 1131d and side walls 1131e connected to both sides of the cover plate body 1131d along the second direction Y. The two side walls 1131e have guide posts 1131c protruding from the side walls 1131e. Figure 11 In the embodiment, each side wall 1131e has two guide posts 1131c.

[0101] The third side plate section 1133 has a guide groove 1133a corresponding to the guide post 1131c. The guide groove 1133a includes an extension groove 1133b extending along the first direction X and an opening 1133c. The opening 1133c is connected to the extension groove 1133b.

[0102] Please continue to see Figure 13As shown, when the third cover plate 1131 is installed, the guide post 1131c of the third cover plate 1131 is aligned with the opening 1133c on the guide groove 1133a; the guide post 1131c enters the extension groove 1133b of the guide groove 1133a from the opening 1133c; then the guide post 1131c slides in the extension groove 1133b along the first direction X; during the sliding process of the guide post 1131c in the extension groove 1133b, the extension portion 1126a gradually enters the slot 1131a to be inserted in the slot 1131a; at the same time, the first bent portion 1131b moves relative to the second bent portion 1116a to be hooked with the second bent portion 1116a.

[0103] That is, when installing third cover plate 1131, simply slide guide post 1131c in guide slot 1133a toward second cover plate 1126 to connect third cover plate 1131 with second cover plate 1126 and first cover plate 1116. When removing third cover plate 1131, simply move guide post 1131c in guide slot 1133a toward first cover plate 1116. This simplifies installation and removal of third cover plate 1131, simplifying maintenance of backplane module 140 in computing node 100.

[0104] Please continue to see Figure 10 and Figure 11 As shown, lock buckles 1131f are provided at both ends of the third cover plate 1131 along the second direction Y, and the lock heads and the lock buckles 1131f are locked in a one-to-one correspondence.

[0105] A lock head can be provided on the inner wall of the third side panel section 1133, and the lock head is aligned with two lock catches 1131f located at both ends of the third cover plate 1131. The third cover plate 1131 is connected to the first cover plate 1116 and the second cover plate 1126 at both ends along the first direction X, respectively. By providing lock catches 1131f at both ends of the third cover plate 1131 along the second direction Y, the lock catches 1131f are locked to the lock head, thereby also securing the third cover plate 1131 in the second direction Y. Therefore, the third cover plate 1131 has fixing devices on all four sides, making the fixing of the third cover plate 1131 more reliable.

[0106] When the third cover 1131 needs to be opened, first unlock the lock buckle 1131f and the lock head, and then apply a force toward the first cover 1131 on the lock buckle 1131f, so that the third cover 1131 moves toward the first cover 1116 in the trajectory restricted by the guide post 1131c and the guide groove 1133a; until the guide post 1131c on the third cover 1131 and the opening 1133c of the guide groove 1133a are aligned, at this time, the slot 1131a also withdraws from the extension portion 1126a, and the first bending portion 1131b also disengages from the second bending portion 1116a.

[0107] Figure 16 A schematic diagram of the structure of the shell in the computing node provided in an embodiment of the present application.

[0108] See also Figure 16 As shown, the first accommodating area 111 further includes a first partition 1114 . The first partition 1114 extends along the first direction X, and the distance between the first partition 1114 and the side plate 110 c is adjustable.

[0109] The first partition 1114 is inserted into the first receiving area 111. The size of the first partition 1114 along the first direction X is close to the size of the first side plate segment 1113 along the first direction X. The first partition 1114 and the first side plate segment 1113 divide the first receiving area 111 into a plurality of first sub-receiving areas 111a. Figure 16 In the embodiment, the first processor module 121a has a smaller size along the second direction Y, and two first partitions 1114 are provided in the first accommodating area 111. The two first partitions 1114 and the two first side plate segments 1113 divide the first accommodating area 111 into three first sub-accommodating areas 111a.

[0110] The distance between the first partition 1114 and the first side plate section 1113 can be adjusted according to the size of the function card module 120 along the second direction Y. Therefore, different function card modules 120 can be inserted into the first sub-accommodation area 111a to increase the compatibility of the first accommodation area 111.

[0111] Figure 17 for Figure 16 A structural diagram from another angle.

[0112] See also Figure 17 As shown, the second accommodating area 112 further includes a second partition 1124 . The second partition 1124 extends along the first direction X, and the distance between the second partition 1124 and the side plate 110 c is adjustable.

[0113] The second partition 1124 is inserted into the second receiving area 112. The size of the second partition 1124 along the first direction X is close to the size of the second side plate segment 1123 along the first direction X. The second partition 1124 and the second side plate segment 1123 divide the second receiving area 112 into a plurality of second sub-receiving areas 112a. Figure 17 In the embodiment, the second processor module 121b has a larger size along the second direction Y, and a second partition 1124 is provided in the second accommodating area 112. The second partition 1124 and the two second side plate segments 1123 divide the second accommodating area 112 into two second sub-accommodating areas 112a.

[0114] The distance between the second partition 1124 and the second side plate section 1123 can be adjusted according to the size of the function card module 120 along the second direction Y. Therefore, different function card modules 120 can be inserted into the second sub-accommodation area 112a to increase the compatibility of the second accommodation area 112.

[0115] Please continue to see Figure 10 and Figure 11 As shown, the computing node 100 also includes a fan module 130 and two backplane modules 140 , which are arranged on both sides of the fan module 130 along the first direction X, and the function card module 120 is plugged into the backplane module 140 close to the function card module 120 .

[0116] For example, the backplane module 140 close to the first accommodating area 111 is the first backplane module 141, and the first processor module 121a, the hard disk module 122 and the PCIE card module 123 located in the first accommodating area 111 are all plugged into the first backplane module 141, so that the first processor module 121a, the hard disk module 122 and the PCIE card module 123 are all electrically connected to the first backplane module 141.

[0117] The first backplane module 141 is positioned near the first accommodating area 111. When the first processor module 121a, the hard disk module 122, and the PCIE card module 123 are inserted into the first accommodating area 111 through the first window 1111, they can be plugged into the first backplane module 141, simplifying the installation process of the first processor module 121a, the hard disk module 122, and the PCIE card module 123. When the first processor module 121a, the hard disk module 122, and the PCIE card module 123 are removed from the first window 1111, they can be disconnected from the first backplane module 141, simplifying the removal process of the first processor module 121a, the hard disk module 122, and the PCIE card module 123. This further simplifies the maintenance process of the function card module 120.

[0118] The backplane module 140 near the second accommodating area 112 is the second backplane module 142. The process of plugging and unplugging the second processor module 121b and the power module 124 with the second backplane module 142 is the same as the above process and will not be repeated here.

[0119] The fan module 130 is located between the first backplane module 141 and the second backplane module 142. The fan module 130 includes a plurality of fans 131 arranged along the second direction Y. The airflow blown by the fans 131 flows along the first direction X. The fans 131 are used to dissipate heat for the backplane module 140 and the function card module 120. Figure 6As shown, the processor module 121 also includes an air guide cover 1216, which is provided on the processor 1213 and the memory 1214. The air guide cover 1216 can guide the airflow of the fan 131 so that more airflow in the fan 131 can enter the air guide cover 1216 to dissipate heat for the processor 1213 and the memory 1214.

[0120] Please continue to see Figure 11 As shown, the computing node 100 further includes a circuit board 150 . The circuit board 150 is located in the third accommodation area 113 . The fan module 130 and the two backplane modules 140 are electrically connected to the circuit board 150 .

[0121] The circuit board 150 can be mounted on the third bottom plate section 1132. Both backplane modules 140 can be electrically connected to the circuit board 150. Thus, the function card module 120 can be electrically connected to the circuit board 150 via the backplane module 140. The fan module 130 is also electrically connected to the circuit board 150. The processor 1213 on the processor module 121 can control the on / off and speed of the fan 131.

[0122] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0123] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A computing node, characterized in that: include: A shell, the shell comprising a box body, a first cover plate, a second cover plate and a third cover plate, the box body comprising a first accommodating area, a second accommodating area and a third accommodating area; the third accommodating area is located between the first accommodating area and the second accommodating area along the first direction; the first cover plate is fixedly connected to the box body and covers the opening of the first accommodating area, the second cover plate is fixedly connected to the box body and covers the opening of the second accommodating area, the third cover plate is detachably connected to the box body and covers the opening of the third accommodating area; the shell comprises a first window and a second window, the first window and the second window are respectively located at two ends of the shell along the first direction, the first window is connected to the first accommodating area, and the second window is connected to the second accommodating area; a plurality of function card modules, wherein a portion of the function card modules is inserted into the first accommodation area through the first window, and another portion of the function card modules is inserted into the second accommodation area through the second window; A backplane module is located in the third accommodating area, and a plurality of the function card modules are plugged into the backplane module.

2. The computing node according to claim 1, wherein: The third cover plate has a slot on one side facing the second cover plate, and the second cover plate has an extension portion, which is inserted into the slot.

3. The computing node according to claim 2, characterized in that The third cover plate has a first bending portion on a side facing the first cover plate, the first cover plate has a second bending portion, and the first bending portion is hooked to the second bending portion.

4. The computing node according to claim 3, characterized in that The box body includes a bottom plate and side plates connected to both sides of the bottom plate along the second direction, the first cover plate, the second cover plate and the third cover plate are all connected to the side plates; a guide groove is provided at a position where the side plates are opposite to the third cover plate; The third cover plate is provided with a guide post, which can move in the guide groove along the first direction toward the second cover plate, so that the first bending portion is hooked with the second bending portion and the extension portion is inserted into the slot.

5. The computing node according to any one of claims 1 to 4, characterized in that: The third cover plate is provided with a lock buckle, the box body is provided with a lock head, and the lock buckle is locked with the lock head.

6. The computing node according to claim 5, characterized in that Both ends of the third cover plate along the second direction are provided with lock buckles, and the lock heads are locked in a one-to-one correspondence with the lock buckles.

7. The computing node according to claim 4, characterized in that The first accommodating area further comprises a first partition plate, which extends along the first direction, and the distance between the first partition plate and the side plate is adjustable.

8. The computing node according to any one of claims 1 to 4, characterized in that: The computing node further includes a fan module, and there are two backplane modules; The two backplane modules are arranged on both sides of the fan module along the first direction, and the function card module is plugged into the backplane module adjacent to the function card module.

9. The computing node according to any one of claims 1 to 4, characterized in that: The function card module is a processor module, a hard disk module, a PCIE card module or a power supply module.

10. A computing device, characterized in that The utility model comprises a cabinet and a plurality of computing nodes according to any one of claims 1 to 9, wherein the computing nodes are arranged in sequence along the height direction of the cabinet.

Images