Motor controller and vehicle

Abstract

The utility model discloses a motor controller and a vehicle, the motor controller comprises a housing, and a power module, a driving board, a control board and a capacitor assembly which are arranged in the housing, the power module comprises a heat dissipation board and a plurality of single-tube power chips which are formed into independent molding parts, the plurality of single-tube power chips are independently installed on the heat dissipation plate and electrically connected with the driving plate, and the bus capacitor of the capacitor assembly is electrically connected with the plurality of single-tube power chips through the laminated busbar. According to the motor controller provided by the utility model, the plurality of single-tube power chips which are formed into independent molded parts and are independently installed are suitable for being electrically connected with the bus capacitor through the laminated busbar, so that the stray inductance in a circuit is effectively reduced, and the conversion efficiency of the motor controller is improved; moreover, the universal matching performance between the single-tube power chip which is formed into an independent molded part and the motor controller with different outflow capacity requirements is good, and the outflow capacity of the motor controller can be flexibly configured.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicles, in particular to a motor controller and a vehicle. Background Art

[0002] In the automotive field, a motor controller in a vehicle is equipped with a power module capable of energy conversion. The power module typically includes a power chip and a heat sink capable of dissipating heat from the power chip. However, in related art, the power chip is formed into a modular structure, and each modular power chip is also equipped with a corresponding heat sink. The modular power chips are integrated and mounted on the corresponding heat sink as a whole.

[0003] However, the electrical connection between the modular power chip and the busbar capacitor of the motor controller results in significant stray inductance in the circuit. Furthermore, the matching between the modular power chip and the heat sink is complex, and each modular power chip has a specific outflow capacity. This results in low universal compatibility between the modular power chip and motor controllers with different outflow capacity requirements. During the design and production of motor controllers with different outflow capacity requirements, it is necessary to specifically match the different modular power chips and heat sink structures corresponding to the different modular power diaphragms. Therefore, improvements are needed. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the present invention is to provide a power module, wherein the power module is configured to include multiple single-tube power chips, each formed into an independent molded part and independently mounted, and is suitable for being electrically connected to a bus capacitor through a laminated busbar. The laminated busbar is stacked in multiple layers, and the intermediate conductor layer surrounded by the multi-layer laminated busbar commutation circuit affects the internal electromagnetic field distribution of the laminated busbar during the switching transient process, thereby effectively reducing the stray inductance in the circuit. This can solve the problem of large stray inductance generated when the modular power chip is connected to the bus capacitor in a single layer (for example, by parallel fasteners), and the laminated busbar has a good EMC effect, which is beneficial to improving the conversion efficiency of the power module and, in turn, the conversion efficiency of the motor controller. The single-tube power chip formed into an independent molded part has good universal compatibility with motor controllers with different outflow capacity requirements, which can realize flexible configuration of the outflow capacity of the motor controller.

[0005] The utility model also provides a vehicle having the motor controller.

[0006] According to the first aspect of the present invention, the motor controller includes: a power module, including a heat sink and multiple single-tube power chips, each of the single-tube power chips is an independent molded part, and the multiple single-tube power chips are independently installed on the heat sink, and the heat sink is used to dissipate heat for the multiple single-tube power chips; a drive board, the multiple single-tube power chips of the power module are electrically connected to the drive board; a control board, which is electrically connected to the drive board; a capacitor assembly, including a bus capacitor, and the bus capacitor is electrically connected to the multiple power chips through a laminated busbar; a shell, the power module, the drive board, the control board and the capacitor assembly are arranged in the shell.

[0007] According to the motor controller of the embodiment of the present invention, by setting the power module to include multiple single-tube power chips, the single-tube power chips formed as independent molded parts and independently installed are suitable for being electrically connected to the bus capacitor through the laminated busbar. The laminated busbar is stacked in multiple layers. The intermediate conductor layer surrounded by the multi-layer laminated busbar commutation circuit will affect the internal electromagnetic field distribution of the laminated busbar during the switching transient process, thereby effectively reducing the stray inductance in the circuit. This can solve the problem of large stray inductance generated when the modular power chip is connected to the bus capacitor in a single layer (for example, through parallel fasteners), and the laminated busbar has a good EMC effect, which is beneficial to improving the conversion efficiency of the power module, and then beneficial to improving the conversion efficiency of the motor controller.

[0008] In addition, by independently mounting the multiple single-tube power chips of the power module on a heat sink, and making each single-tube power chip an independently molded part, the power module can have different outflow capacities by varying the number of single-tube power chips. By increasing or decreasing the number of single-tube power chips independently mounted on the heat sink, the motor controller can have different outflow capacities. The single-tube power chips formed as independently molded parts have good universal compatibility with motor controllers with different outflow capacity requirements, enabling flexible configuration of the outflow capacity of the motor controller. Moreover, the single-tube power chips formed as independently molded parts are independently mounted on the same heat sink, and the matching method between the single-tube power chips and the heat sink is simple. When the number of single-tube power chips is increased or decreased, the structure of the heat sink can still be well adapted to different numbers of single-tube power chips. In this way, in the design and production process for motor controllers with different outflow capacity requirements, it is no longer necessary to specifically match and set different modular single-tube power chips, nor is it necessary to specifically match and set the heat sink structure corresponding to the different modular single-tube power chips.

[0009] According to some embodiments of the present invention, the laminated busbar includes a DC negative busbar copper busbar and an AC output copper busbar arranged in a stacked manner, the DC negative busbar copper busbar is formed with three groups of first connecting terminals, each group of the first connecting terminals includes a first terminal and a second terminal, the multiple single-tube power chips are divided into multiple groups of chipsets, the multiple groups of chipsets include three groups of inverter single-tube power chipsets, the first terminal is electrically connected to the busbar capacitor, and the second terminal is electrically connected to the inverter single-tube power chipset;

[0010] The AC output copper busbar is formed with three groups of second connection terminals. Each group of the second connection terminals includes a third terminal and a fourth terminal. The third terminal is electrically connected to the inverter single-tube power chip group.

[0011] According to some embodiments of the present invention, the motor controller also includes a filter component and a boost inductor arranged in the shell, the capacitor component also includes a low-voltage side capacitor, the multiple single-tube power chips are divided into multiple groups of chipsets, the multiple groups of chipsets include a boost single-tube power chipset, and the boost inductor is electrically connected to the boost single-tube power chipset; the bus capacitor and the power module are arranged along the third direction, and the low-voltage side capacitor, the boost inductor and the filter component are located on the same side of the power module along the second direction.

[0012] According to some optional embodiments of the present invention, the low-voltage side capacitor and the bus capacitor are arranged along the second direction, the boost inductor and the filter component are arranged along the second direction, and the boost inductor and the filter component are located along the third direction on the side of the low-voltage side capacitor close to the power module.

[0013] According to some optional embodiments of the present invention, the boost inductor is located between the power module and the filter component along the second direction, and the boost single-tube power chipset is located at one end of the power module close to the boost inductor along the third direction.

[0014] According to some embodiments of the present invention, multiple single-tube power chips are arranged on one side of the heat sink along the first direction; multiple single-tube power chips are divided into two rows arranged along a third direction, and each row of single-tube power chips is divided into multiple columns arranged along the second direction, and the first direction, the second direction and the third direction intersect each other.

[0015] According to some embodiments of the present invention, the plurality of single-tube power chips are divided into a plurality of chip groups arranged at intervals along the second direction, each chip group includes a plurality of single-tube power chips, and the plurality of chip groups include three groups of inverter single-tube power chip groups, which are respectively a U-phase single-tube power chipset, a V-phase single-tube power chipset and a W-phase single-tube power chipset arranged in sequence along the second direction.

[0016] According to some optional embodiments of the present invention, each group of the inverter single-tube power chipset includes an upper bridge single-tube power chipset and a lower bridge single-tube power chipset arranged along a third direction, the upper bridge single-tube power chipset includes one or more of the single-tube power chips, the lower bridge single-tube power chipset includes one or more of the single-tube power chips, and the number of single-tube power chips of the upper bridge single-tube power chipset and the lower bridge single-tube power chipset is the same and corresponds one to one.

[0017] According to some optional embodiments of the present invention, the plurality of chipsets further include a boost single-tube power chipset, and the boost single-tube power chipset is located on one side of the inverter single-tube power chipset along the second direction.

[0018] According to some embodiments of the present invention, the heat sink is a water-cooled plate, and the multiple single-tube power chips are connected to the heat sink by sintering or welding; it also includes an installation frame, which is installed on the heat sink, and a plurality of installation slots are formed on the installation frame, and the multiple single-tube power chips are respectively accommodated in the multiple installation slots, and a partition plate is provided between two adjacent chip groups, and the partition plate is an insulating part, and the partition plate is provided on the installation frame; the installation frame is a plastic frame; and / or the installation frame is an integrally molded part.

[0019] According to some optional embodiments of the present invention, the mounting frame is detachably connected to the heat sink; it also includes a plurality of connecting members, a plurality of first mounting holes arranged along the circumferential direction are formed on the mounting frame, and a plurality of second mounting holes arranged along the circumferential direction of the mounting frame 4 are formed on the heat sink. The number of the plurality of first mounting holes is the same as that of the plurality of second mounting holes and they are arranged one-to-one, and the connecting members are passed through the first mounting holes and the second mounting holes along the first direction.

[0020] According to some optional embodiments of the present invention, the single-tube power chip is a silicon carbide single-tube chip or an IGBT single-tube chip.

[0021] According to some embodiments of the present invention, the driving board and the control board are arranged along a direction perpendicular to the first direction; the driving board and the control board are arranged along a third direction.

[0022] According to some optional embodiments of the present invention, the drive plate includes a first plate body and a first component group arranged on the first plate body, the control plate includes a second plate body and a second component group arranged on the second plate body, the second plate body is connected to the first plate body, and the first plate body and the second plate body are integrally formed.

[0023] According to some optional embodiments of the present invention, the driving board and the control board are located on the same side of the power module along the first direction, and in the first direction, the driving board and the power module are arranged opposite to each other.

[0024] A vehicle according to an embodiment of the second aspect of the present utility model includes: a motor controller according to an embodiment of the first aspect of the present utility model.

[0025] According to the vehicle of the embodiment of the present invention, by setting the above-mentioned motor controller, by setting the power module to include multiple single-tube power chips, the single-tube power chips formed as independent molded parts and independently installed are suitable for being electrically connected to the bus capacitor through the laminated busbar. The laminated busbar is stacked in multiple layers, and the intermediate conductor layer surrounded by the multi-layer laminated busbar commutation circuit will affect the internal electromagnetic field distribution of the laminated busbar during the switching transient process, thereby effectively reducing the stray inductance in the circuit. This can solve the problem of large stray inductance generated when the modular power chip is connected to the bus capacitor in a single layer (for example, through parallel fasteners), and the laminated busbar has a good EMC effect, which is beneficial to improving the conversion efficiency of the power module, and then beneficial to improving the conversion efficiency of the motor controller.

[0026] In addition, by independently mounting the multiple single-tube power chips of the power module of the motor controller on a heat sink, and making each single-tube power chip an independently molded part, the power module can have different outflow capacities by varying the number of single-tube power chips. By increasing or decreasing the number of single-tube power chips independently mounted on the heat sink, the motor controller can have different outflow capacities. The single-tube power chips formed as independently molded parts have good universal compatibility with motor controllers with different outflow capacity requirements, enabling flexible configuration of the outflow capacity of the motor controller. Moreover, the single-tube power chips formed as independently molded parts are independently mounted on the same heat sink, and the matching method between the single-tube power chips and the heat sink is simple. When the number of single-tube power chips is increased or decreased, the structure of the heat sink can still be well adapted to different numbers of single-tube power chips. In this way, in the design and production process of motor controllers with different outflow capacity requirements, it is no longer necessary to specifically match and set different modular single-tube power chips, nor is it necessary to specifically match and set the heat sink structure corresponding to the different modular single-tube power chips.

[0027] Additional aspects and advantages of the present invention will be given in part in the following description and will become apparent from the following description or learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0029] Figure 1 is an exploded schematic diagram of a motor controller according to some embodiments of the present invention;

[0030] Figure 2 yes Figure 1 A top view of a portion of the motor controller structure;

[0031] Figure 3 yes Figure 1 A top view of another part of the structure of the motor controller;

[0032] Figure 4 yes Figure 1 A schematic diagram of a three-dimensional structure of another part of the structure of the motor controller;

[0033] Figure 5 yes Figure 1 A bottom view of a partial structure of the motor controller;

[0034] Figure 6 Schematic diagram of the electrical connection relationship between the laminated busbar and the inverter single-tube power chip according to some embodiments of the present utility model;

[0035] Figure 7 yes Figure 1 Schematic diagram of the motor controller installation frame and the assembly of multiple single-tube power chips;

[0036] Figure 8 yes Figure 1 Schematic diagram of the mounting box for the motor controller.

[0037] Reference numerals:

[0038] 100. Power module;

[0039] 200, motor controller;

[0040] 1. Heat sink;

[0041] 2. Single-tube power chip; 21. Inverter single-tube power chipset; 211. U-phase single-tube power chipset; 212. V-phase single-tube power chipset; 213. W-phase single-tube power chipset; 22. Boost single-tube power chipset;

[0042] 31. Upper bridge single-tube power chipset; 311. Upper bridge single-tube power chip source; 312. Upper bridge single-tube power chip drain; 32. Lower bridge single-tube power chipset; 321. Lower bridge single-tube power chip source; 322. Lower bridge single-tube power chip drain;

[0043] 4. Mounting frame; 41. Mounting slot; 42. First mounting hole; 43. Connector; 44. Separator;

[0044] 51. Driver board; 52. Control board;

[0045] 61, busbar capacitor; 611, first pin; 612, second pin; 62, low-voltage side capacitor;

[0046] 7. Housing; 71. Low-voltage DC connector; 72. High-voltage DC connector; 73. AC connector; 75. Cooling medium inlet pipe; 76. Cooling medium outlet pipe; 77. Housing cover; 78. Housing body;

[0047] 81, DC negative busbar copper busbar; 811, first terminal; 812, second terminal; 82, AC output copper busbar; 821, third terminal; 822, fourth terminal;

[0048] 9. Filter components;

[0049] 10. Boost inductor;

[0050] 20. DC current sensor;

[0051] 30. AC current sensor. DETAILED DESCRIPTION

[0052] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0053] Reference below Figures 1-8 A power module 100 , a motor controller 200 , and a vehicle according to embodiments of the present invention are described.

[0054] refer to Figure 1-Figure 5 According to the motor controller 200 of the first embodiment of the present invention, the motor controller 200 includes a housing 7 and a power module 100, a driver board 51, a control board 52, and a capacitor assembly disposed therein. The power module 100 includes a heat sink 1 and multiple single-tube power chips 2. Each single-tube power chip 2 is an independently molded component. The multiple single-tube power chips 2 are independently mounted on the heat sink 1. In this way, each single-tube power chip 2 can be individually mounted on the heat sink 1 as an independent component. The matching method between the single-tube power chip 2 and the heat sink 1 is simple, and the difficulty of mounting multiple single-tube power chips 2 on the heat sink 1 is relatively low.

[0055] Different numbers of single-tube power chips 2 can make the power module 100 have different outflow capabilities. By increasing or decreasing the number of single-tube power chips 2 independently installed on the heat sink 1, the motor controller 200 can have different outflow capabilities. The single-tube power chip 2 formed as an independent molded part has good universal matching with the motor controller 200 with different outflow capacity requirements, which can realize flexible configuration of the outflow capacity of the motor controller 200.

[0056] The heat sink 1 is used to dissipate heat for the multiple single-tube power chips 2 , which is beneficial to prolonging the service life of the multiple single-tube power chips 2 and facilitating long-term and stable operation of the power module 100 .

[0057] Optionally, the heat sink 1 may have multiple heat dissipation methods. For example, the heat sink 1 may dissipate heat through water cooling, or through air cooling.

[0058] Optionally, the plurality of single-tube power chips 2 may be mounted on the heat sink 1 by welding; the plurality of single-tube power chips 2 may also be mounted on the heat sink 1 by sintering.

[0059] Optionally, the single-tube power chip 2 can be used to implement power conversion, such as DC-DC conversion, AC-DC conversion, or voltage regulation.

[0060] The multiple single-tube power chips 2 of the power module 100 are electrically connected to the driving board 51, the control board 52 is electrically connected to the driving board 51, and the capacitor assembly includes a bus capacitor 61, and the bus capacitor 61 is electrically connected to the multiple single-tube power chips 2 through a laminated busbar.

[0061] For example, the laminated busbar includes a DC negative busbar copper busbar 81 and an AC output copper busbar 82 that are stacked. One end of the DC negative busbar copper busbar 81 is electrically connected to the busbar capacitor 61, and the other end of the DC negative busbar copper busbar 81 is electrically connected to multiple single-tube power chips 2; one end of the AC output copper busbar 82 is electrically connected to multiple single-tube power chips 2, and the other end of the AC output copper busbar 82 is connected to the AC current sensor 30 of the motor controller.

[0062] Optionally, the control board 52 may be used to monitor current signals, voltage signals, and temperature signals of various components of the motor controller 200 so that the motor controller 200 can operate normally.

[0063] Optionally, the driving board 51 may receive a control signal and provide a driving signal to the power module 100 .

[0064] Optionally, the housing 7 includes a housing cover 77 and a housing body 78 detachably connected along a first direction.

[0065] By increasing or decreasing the number of single-tube power chips 2 independently installed on the heat sink 1, the motor controller 200 has different outflow capacities. In this way, the overall structure of the power module 100 changes less, and the power module 100 has less impact on the overall structure and layout of the motor controller 200. For example, there is no need to significantly change the layout design between the drive board 51, the control board 52 and the capacitor assembly according to the power module 100, nor is there any need to significantly change the shape of the shell 7 and other structural designs according to the power module 100.

[0066] According to the motor controller 200 of the embodiment of the present invention, by setting the power module 100 to include multiple single-tube power chips 2, the single-tube power chips 2 formed as independent molded parts and independently installed are suitable for being electrically connected to the bus capacitor 61 through the laminated busbar. The laminated busbar is stacked in multiple layers. The intermediate conductor layer surrounded by the multi-layer laminated busbar commutation circuit will affect the internal electromagnetic field distribution of the laminated busbar during the switching transient process, thereby effectively reducing the stray inductance in the circuit. This can solve the problem of large stray inductance generated when the modular power chip is connected to the bus capacitor in a single layer (for example, through parallel fasteners), and the laminated busbar has a good EMC effect, which is beneficial to improving the power conversion efficiency of the power module 100, and further beneficial to improving the power conversion efficiency of the motor controller 200.

[0067] Furthermore, by independently mounting multiple single-tube power chips 2 on the heat sink 1, with each single-tube power chip 2 being an independently molded component, the power module 100 can have different outflow capacities by varying the number of single-tube power chips 2. By increasing or decreasing the number of single-tube power chips 2 independently mounted on the heat sink 1, the motor controller 200 can have different outflow capacities. The independently molded single-tube power chips 2 provide excellent compatibility with motor controllers 200 with different outflow capacity requirements, enabling flexible configuration of the outflow capacity of the motor controller 200. Furthermore, the independently molded single-tube power chips 2 are independently mounted on the same heat sink 1, simplifying the matching between the single-tube power chips 2 and the heat sink 1. Even when the number of single-tube power chips 2 is increased or decreased, the heat sink 1 structure can still effectively accommodate different numbers of single-tube power chips 2. Thus, during the design and production of motor controllers 200 with different outflow capacity requirements, there is no longer a need to specifically match different modular power chips or heat sink structures corresponding to the different modular power chips.

[0068] refer to Figure 4 and Figure 6According to some embodiments of the present invention, the laminated busbar includes a DC negative busbar copper busbar 81 and an AC output copper busbar 82 arranged in a stacked manner. The DC negative busbar copper busbar 81 has three sets of first connecting terminals, each set of first connecting terminals including a first terminal 811 and a second terminal 812. Multiple single-tube power chips 2 are divided into multiple chipset groups, each of which includes three inverter single-tube power chipset groups 21. The first terminal 811 is electrically connected to the busbar capacitor 61, and the second terminal 812 is electrically connected to the inverter single-tube power chipset group 21. The AC output copper busbar 82 has three sets of second connecting terminals, each set of second connecting terminals including a third terminal 821 and a fourth terminal 822. The third terminal 821 is electrically connected to the inverter single-tube power chipset group 21.

[0069] Optionally, the motor controller 200 further includes an AC current sensor 30 , which is connected to the fourth terminal 822 of the AC output copper busbar 82 .

[0070] By making the laminated busbar include a DC negative busbar copper busbar 81 and an AC output copper busbar 82, the mutual inductance between the laminated DC negative busbar copper busbar 81 and the AC output copper busbar 82 is small, thereby making the overall stray inductance in the circuit small; and by forming the DC negative busbar copper busbar 81 with three groups of first connecting terminals and the AC output copper busbar 82 with three groups of second connecting terminals, the laminated busbar can simultaneously form an effective electrical connection relationship with multiple groups of inverter single-tube power chip groups 21.

[0071] refer to Figure 6 According to some embodiments of the present invention, the upper bridge single-tube power chipset 31 includes a single upper bridge power chip, and the lower bridge single-tube power chipset 32 includes a single lower bridge power chip. The first pin 611 of the bus capacitor 61 is connected to the drain 312 of the upper bridge single-tube power chip, the second pin 612 of the bus capacitor 61 is connected to the first terminal 811 of the DC negative bus copper busbar 81, the source 311 of the upper bridge single-tube power chip is connected to the drain 322 of the lower bridge single-tube power chip, and the second terminal 812 of the DC negative bus copper busbar 81 is connected to the source 321 of the lower bridge single-tube power chip. The third terminal 821 of the AC output copper busbar 82 is connected to the source 311 of the upper bridge single-tube power chip and the drain 322 of the lower bridge single-tube power chip via a copper sheet. The fourth terminal 822 of the AC output copper busbar 82 is connected to the AC current sensor of the motor controller.

[0072] Optionally, the laminated busbar is welded to the source and drain of the single-tube power chip 2 by laser welding.

[0073] refer to Figure 1-Figure 5According to some embodiments of the present invention, the motor controller 200 further includes a filter assembly 9 and a boost inductor 10 disposed within the housing 7. The capacitor assembly further includes a low-voltage side capacitor 62. The bus capacitor 61 is used for energy storage, and the low-voltage side capacitor 62 is used for voltage stabilization and filtering. Multiple single-tube power chips 2 are divided into multiple chipsets, each of which includes a boost single-tube power chipset 22. The boost inductor 10 is electrically connected to the boost single-tube power chipset 22. The bus capacitor 61 and the power module 100 are arranged along the third direction. The low-voltage side capacitor 62, the boost inductor 10, and the filter assembly 9 are located on the same side of the power module 100 along the second direction. The layout of the motor controller 200 is reasonable and helps simplify the circuit layout and design of the motor controller 200.

[0074] refer to Figure 1-Figure 5 According to some optional embodiments of the present invention, the low-voltage side capacitor 62 and the bus capacitor 61 are arranged along the second direction, the boost inductor 10 and the filter component 9 are arranged along the second direction, and the boost inductor 10 and the filter component 9 are located on the side of the low-voltage side capacitor 62 close to the power module 100 along the third direction. The layout of the motor controller 200 is reasonable and is conducive to simplifying the circuit layout and design of the motor controller 200.

[0075] refer to Figure 1-Figure 5 According to some optional embodiments of the present invention, the boost inductor 10 is located between the power module 100 and the filter assembly 9 along the second direction, and the boost single-transistor power chipset 22 is located at one end of the power module 100 that is proximate to the boost inductor 10 along the third direction. By locating the boost inductor 10 between the power module 100 and the filter assembly 9 along the second direction and the boost single-transistor power chipset 22 at one end of the power module 100 that is proximate to the boost inductor 10 along the third direction, the boost inductor 10 is easily connected to the boost single-transistor power chip 2, thereby simplifying the electrical connection structure between the boost inductor 10 and the boost single-transistor power chip 2.

[0076] refer to Figure 1-Figure 5 Optionally, the motor controller 200 further includes a DC current sensor 20 and an AC current sensor 30 , the DC current sensor 20 is connected to the boost inductor 10 and the low-voltage side capacitor 62 , and the AC current sensor 30 is connected to the fourth terminal 822 of the AC output copper bus 82 .

[0077] refer to Figure 1 、 Figure 3-Figure 4 According to some embodiments of the present invention, multiple single-tube power chips 2 are arranged on one side of the heat sink 1 along the first direction (see direction e1 in the figure). By arranging multiple single-tube power chips 2 on one side of the heat sink 1 along the first direction, the layout relationship between the multiple single-tube power chips 2 and the heat sink 1 is simplified, making it easier to install the multiple single-tube power chips 2 on the heat sink 1.

[0078] refer to Figure 1 、 Figure 3-Figure 4 According to some optional embodiments of the present invention, multiple single-tube power chips 2 are divided into two rows arranged along a third direction (as shown in the direction e3 in the figure), and each row of single-tube power chips 2 is divided into multiple columns arranged along the second direction (as shown in the direction e2 in the figure). By dividing multiple single-tube power chips 2 into two rows arranged along the third direction, and each row of single-tube power chips 2 into multiple columns arranged along the second direction, it is beneficial to arrange multiple single-tube power chips 2 in a regular manner, and it is helpful to arrange more single-tube power chips 2 in the limited space on one side of the heat sink 1, and the heat sink 1 to evenly dissipate heat for multiple single-tube power chips 2, and it is also beneficial to optimize the circuit layout related to multiple single-tube power chips 2. Among them, the first direction, the second direction and the third direction intersect with each other, for example, the first direction, the second direction and the third direction are perpendicular to each other. For example, the first direction is the height direction of the housing of the motor controller. When the motor controller is applied to a vehicle, the first direction is the up and down direction of the vehicle body.

[0079] refer to Figure 1 、 Figure 3-Figure 4 According to some embodiments of the present invention, a power module 100 includes multiple chipsets arranged in a spaced relationship along a second direction. Each chipset includes multiple single-transistor power chips 2. The multiple chipsets include three inverter single-transistor power chipsets 21. The three inverter single-transistor power chipsets 21 are respectively arranged in sequence along the second direction: a U-phase single-transistor power chipset 211, a V-phase single-transistor power chipset 212, and a W-phase single-transistor power chipset 213. By having each chipset include multiple single-transistor power chipsets 2, the power capacity of the chipset can be easily adjusted by changing the number of single-transistor power chipsets 2. For example, by increasing the number of single-transistor power chipsets 2 in each chipset, the power capacity of the chipset can be expanded.

[0080] By making the multiple chipsets include three groups of inverter single-tube power chipsets 21, namely a U-phase single-tube power chipset 211, a V-phase single-tube power chipset 212, and a W-phase single-tube power chipset 213, the power module 100 can be used to achieve the conversion of DC current into three-phase AC current. The three groups of inverter single-tube power chipsets 21 are arranged in sequence along the second direction. This arrangement method is conducive to reducing the interference between the U-phase single-tube power chipset 211, the V-phase single-tube power chipset 212, and the W-phase single-tube power chipset 213, and helps to optimize their corresponding circuit layout structure.

[0081] refer to Figure 1 、 Figure 3-Figure 4According to some optional embodiments of the present invention, each group of inverter single-tube power chipsets 21 includes an upper bridge single-tube power chipset 31 and a lower bridge single-tube power chipset 32 arranged along a third direction. By making each group of inverter single-tube power chipsets 21 include an upper bridge single-tube power chipset 31 and a lower bridge single-tube power chipset 32 arranged along the third direction, the upper bridge single-tube power chipset 31 generally controls the flow of forward current, while the lower bridge single-tube power chipset 32 generally controls the flow of reverse current. By coordinating the switching actions of the two, the output current direction and amplitude can be effectively controlled to achieve the generation of alternating current.

[0082] The upper-bridge single-tube power chipset 31 includes one or more single-tube power chips 2, and the lower-bridge single-tube power chipset 32 includes one or more single-tube power chips 2. The upper-bridge single-tube power chipset 31 and the lower-bridge single-tube power chipset 32 contain the same number of single-tube power chips 2, with a one-to-one correspondence. This arrangement facilitates changing the output current capacity of the inverter single-tube power chipset 21 by varying the number of single-tube power chips 2 in the upper-bridge single-tube power chipset 31 and the lower-bridge single-tube power chipset 32. This facilitates the design of motor controllers 200 with different output current capacities using the power module 100.

[0083] refer to Figure 1 、 Figure 3-Figure 4 According to some optional embodiments of the present invention, a separator 44 is provided between two adjacent chipsets, and the separator 44 is an insulating member. By providing a separator 44 formed as an insulating member between two adjacent chipsets, the separator 44 forms an electrical isolation between the two adjacent chipsets, and also helps reduce mutual interference between the two adjacent chipsets. Furthermore, the separator 44 can help distinguish the mounting areas corresponding to different chipsets, facilitating the precise positioning of the single-tube power chip 2 relative to the heat sink 1 and accurate installation in the corresponding mounting area on the heat sink 1, thereby improving the convenience and efficiency of the installation operation.

[0084] refer to Figure 3-Figure 4 According to some optional embodiments of the present invention, the multiple chipsets further include a boost single-tube power chipset 22, which is located to one side of the inverter single-tube power chipset 21 along the second direction. By including the boost single-tube power chipset 22, the multiple single-tube power chips 2 can further boost a lower input voltage to the required level to meet the voltage requirements of the motor controller 200 equipped with the power module 100. By locating the boost single-tube power chipset 22 to one side of the inverter single-tube power chipset 21 along the second direction, mutual interference between the boost single-tube power chipset 22 and the inverter single-tube power chipset 21 can be reduced, and the circuit layout structure associated with the boost single-tube power chipset 22 and the inverter single-tube power chipset 21 can be simplified.

[0085] According to some embodiments of the present invention, multiple single-tube power chips 2 are connected to the heat sink 1 by sintering or welding. For example, the multiple single-tube power chips 2 are connected to the heat sink 1 by a silver sintering process. By connecting the multiple single-tube power chips 2 to the heat sink 1 by sintering or welding, good thermal contact is formed between the single-tube power chips 2 and the heat sink 1, reducing thermal resistance and thus optimizing the heat dissipation effect.

[0086] refer to Figure 1 、 Figure 3-Figure 4 、 Figure 7-Figure 8 According to some embodiments of the present invention, the power module 100 further includes a mounting frame 4, which is mounted on the heat sink 1. A plurality of mounting grooves 41 are formed on the mounting frame 4, and a plurality of single-tube power chips 2 are respectively accommodated in the plurality of mounting grooves 41. By providing a mounting frame 4 with a plurality of mounting grooves 41 and accommodating a plurality of single-tube power chips 2 in the plurality of mounting grooves 41, it is convenient to position the single-tube power chips 2 relative to the heat sink 1 with reference to the mounting grooves 41 during the installation process, so that the plurality of single-tube power chips 2 are accurately and correspondingly installed on the heat sink 1. In addition, the mounting grooves 41 can form a limiting effect on the single-tube power chips 2. For example, in the process of installing the single-tube power chips 2 on the heat sink 1 by sintering, the positional displacement of the single-tube power chips 2 relative to the heat sink 1 when receiving the pressing force can be reduced or avoided; and the mounting grooves 41 contribute to thermal isolation and electrical isolation between the single-tube power chips 2.

[0087] refer to Figure 7-Figure 8 According to some optional embodiments of the present invention, mounting frame 4 is a plastic frame. This plastic frame, with its excellent insulation properties, effectively prevents electrical short circuits between individual power chips 2. Optionally, a partition plate 44 is provided on mounting frame 4, and optionally, partition plate 44 forms part of mounting frame 4.

[0088] refer to Figure 7-Figure 8 According to some optional embodiments of the present invention, the mounting frame 4 is an integrally formed part. By making the mounting frame 4 an integrally formed part, the mounting frame 4 can be integrally mounted on the heat sink 1, which is beneficial to improving the installation production efficiency.

[0089] refer to Figure 1 、 Figure 3-Figure 4 According to some optional embodiments of the present invention, the mounting frame 4 is detachably connected to the heat sink 1. By making the mounting frame 4 detachably connected to the heat sink 1, it is convenient to maintain and replace the mounting frame 4 and the heat sink 1 separately.

[0090] refer to Figure 1 、 Figure 3-Figure 4 、 Figure 7-Figure 8According to some optional embodiments of the present invention, multiple connectors 43 are further included. The mounting frame 4 is formed with a plurality of first mounting holes 42 spaced circumferentially, and the heat sink 1 is formed with a plurality of second mounting holes spaced circumferentially. The plurality of first mounting holes 42 and the plurality of second mounting holes are equal in number and correspond to each other. The connectors 43 are inserted through the first and second mounting holes along the first direction. This arrangement simplifies the connection between the mounting frame 4 and the heat sink 1, facilitating installation and removal.

[0091] For example, the assembly process of the power module 100 may include the following steps: first, the mounting frame 4 is placed on one side of the heat sink 1 along the first direction, and the first mounting hole 42 and the second mounting hole are opposite to each other along the first direction; then, the connecting member 43 is passed through the first mounting hole 42 and the second mounting hole to connect the mounting frame 4 to the heat sink 1; then, multiple single-tube power chips 2 are respectively installed in the multiple mounting slots 41 by silver sintering.

[0092] According to some embodiments of the present invention, the heat sink 1 is a water-cooled plate. This provides high heat dissipation efficiency, effectively dissipating heat from multiple single-tube power chips 2. Water-cooled plates require less heat dissipation area, which helps reduce the volume of the heat sink 1, thereby reducing the volume of the power module 100 and the motor controller 200 equipped with the power module 100, thereby increasing the power density of the motor controller 200.

[0093] refer to Figure 1 、 Figure 3-Figure 4 According to some optional embodiments of the present invention, the single-tube power chip 2 can be a silicon carbide single-tube chip or an IGBT single-tube chip, preferably a silicon carbide single-tube chip. Optionally, multiple silicon carbide single-tube chips are connected in parallel, or multiple IGBT single-tube chips are connected in parallel. By making the single-tube power chip 2 a silicon carbide single-tube chip, silicon carbide is an excellent semiconductor material. Silicon carbide is a unipolar device that can achieve faster switching speeds and lower switching losses. Silicon carbide has many advantages such as high breakdown field strength, high saturation drift rate, high thermal conductivity, faster switching speed, and smaller conduction loss. These advantages make the single-tube power chip 2 formed as a silicon carbide single-tube chip have less loss during the electric energy conversion process, which is beneficial to improving the electric energy conversion efficiency of the motor controller 200, thereby helping to improve the power density of the motor controller 200. Under the same outflow capacity requirement of the power module 100, a smaller number of single-tube power chips 2 can meet the corresponding requirement, and the volume of the silicon carbide single tube is smaller, which is conducive to reducing the volume of the power module 100 and reducing the volume of the motor controller 200 equipped with the power module 100.

[0094] Optionally, the silicon carbide single-tube chip is a TPAK chip.

[0095] refer to Figure 1-Figure 2 According to some embodiments of the present invention, the drive board 51 and the control board 52 are arranged in a direction perpendicular to the first direction. By arranging the drive board 51 and the control board 52 in a direction perpendicular to the first direction, the drive board 51 and the control board 52 are located in the same plane perpendicular to the first direction. The drive board 51 and the control board 52 make full use of the space in the plane in the shell, which is conducive to optimizing the spatial layout of the motor controller 200 and improving space utilization, thereby facilitating the miniaturization of the motor controller 200. In this way, when the motor controller 200 has a certain conversion efficiency, it is conducive to improving the power density of the motor controller 200. For example, the first direction is the height direction of the shell 7 of the motor controller 200. When the motor controller 200 is applied to a vehicle, the first direction is the up and down direction of the vehicle body.

[0096] refer to Figure 1-Figure 2 According to some optional embodiments of the present invention, the drive board 51 and the control board 52 are arranged along a third direction. Arranging the drive board 51 and the control board 52 along the third direction allows the drive board 51 and the control board 52 to fully utilize the planar space along the third direction, thereby optimizing the space utilization of the motor controller 200. The third direction intersects the first direction, for example, the third direction is perpendicular to the first direction.

[0097] refer to Figure 1-Figure 2 According to some optional embodiments of the present invention, the drive board 51 includes a first board and a first component group disposed on the first board, and the control board 52 includes a second board and a second component group disposed on the second board, with the second board connected to the first board. Optionally, the second board is connected to the first board via a snap-fit connection. Connecting the second board to the first board facilitates stably arranging the drive board 51 and the control board 52 in a direction perpendicular to the first direction. For example, the drive board 51 and the control board 52 can be stably located in the same planar space along a third direction.

[0098] refer to Figure 1-Figure 2 According to some optional embodiments of the present invention, the first plate and the second plate are integrally formed. By integrally forming the first plate and the second plate, it is convenient to integrally install the drive plate 51 and the control plate 52 in the housing 7, eliminating the need to connect the first plate and the second plate, thereby improving installation efficiency.

[0099] refer to Figure 1-Figure 2According to some optional embodiments of the present invention, the driver board 51 and the control board 52 are located on the same side of the power module 100 along the first direction. In the first direction, the driver board 51 and the power module 100 are arranged opposite each other. By locating the driver board 51 and the control board 52 on the same side of the power module 100 along the first direction, the spatial layout between the driver board 51, the control board 52, and the power module 100 is optimized, and the motor controller 200 has a compact structure. By arranging the driver board 51 and the power module 100 opposite each other, the circuit connection structure between the driver board 51 and the power module 100 is simplified.

[0100] refer to Figure 1-Figure 5 According to some optional embodiments of the present invention, the outer periphery of the housing body 78 is further formed with a low-voltage DC connector 71, a high-voltage DC connector 72, and an AC connector 73. The low-voltage DC connector 71 is used for input and output of low-voltage DC, the high-voltage DC connector 72 is used for input and output of high-voltage DC, and the AC connector 73 is used for input and output of AC current. The low-voltage DC connector 71 is connected to the filter assembly 9, the high-voltage DC connector 72 is connected to the bus capacitor 61, and the AC connector 73 is connected to the AC current sensor 30.

[0101] refer to Figure 1-Figure 5 According to some optional embodiments of the present invention, a cooling medium input pipe 75 and a cooling medium output pipe 76 are further provided on the outer peripheral side of the shell body 78. The cooling medium input pipe 75 is connected to the input end of the heat sink 1, and the cooling medium output pipe 76 is connected to the output end of the heat sink 1.

[0102] The vehicle according to the second embodiment of the present invention includes the above-mentioned motor controller 200 .

[0103] According to the vehicle of the embodiment of the present utility model, by setting the above-mentioned motor controller 200, by setting the power module 100 to include multiple single-tube power chips 2, the single-tube power chips 2 formed as independent molded parts and independently installed are suitable for being electrically connected to the bus capacitor 61 through a laminated busbar. The laminated busbar is stacked in multiple layers, and the intermediate conductor layer surrounded by the multi-layer laminated busbar commutation circuit will affect the internal electromagnetic field distribution of the laminated busbar during the switching transient process, thereby effectively reducing the stray inductance in the circuit. This can solve the problem of large stray inductance generated when the modular power chip is connected to the bus capacitor in a single layer (for example, through parallel fasteners), and the laminated busbar has a good EMC effect, which is beneficial to improving the conversion efficiency of the power module 100, and further beneficial to improving the conversion efficiency of the motor controller 200.

[0104] In addition, the multiple single-tube power chips 2 of the power module 100 of the motor controller 200 are independently installed on the heat sink 1, and each single-tube power chip 2 is an independent molded part. The different number of single-tube power chips 2 can make the power module 100 have different outflow capabilities. By increasing or decreasing the number of single-tube power chips 2 independently installed on the heat sink 1, the motor controller 200 can have different outflow capabilities. The single-tube power chips 2 formed as independent molded parts have good universal matching with the motor controller 200 with different outflow capacity requirements, and the outflow capacity of the motor controller 200 can be flexibly configured; and the single-tube power chips 2 formed as independent molded parts are independently installed on the same heat sink 1. The matching method between the single-tube power chip 2 and the heat sink 1 is simple. When the number of single-tube power chips 2 is increased or decreased, the structure of the heat sink 1 can still be well adapted to different numbers of single-tube power chips 2. In this way, during the design and production process of the motor controller 200 with different outflow capacity requirements, it is no longer necessary to specially match and set up different modular single-tube power chips 2, nor is it necessary to specially match and set up the heat sink structure corresponding to the different modular single-tube power chips 2.

[0105] For example, when the vehicle is an HEV or PHEV model, in the low-speed and low-torque state of the vehicle, by setting the above-mentioned motor controller 200, the motor controller 200 has good conversion efficiency of converting DC power to three-phase power, which is beneficial to reducing the energy consumption of the vehicle.

[0106] For example, when the vehicle requires motor drive, the voltage provided by the vehicle's power supply is increased through the boost and voltage stabilization circuit inside the motor controller 200, and then the DC power is converted into AC power through multiple single-tube power chips 2 to power the internal drive motor of the vehicle's power unit (such as the transmission), so that the entire vehicle can obtain greater power; when the vehicle is cruising in a high-efficiency range or braking, the excess kinetic energy is converted into AC power through the generator, and the AC power is converted into DC power through multiple single-tube power chips 2. At this time, the motor controller 200 will decide whether to use this electrical energy to charge the vehicle power supply or directly supply the drive motor according to the vehicle's needs.

[0107] For example, when the excess kinetic energy of the vehicle is converted into AC power by the generator and used to charge the vehicle power supply, the multiple single-tube power chips 2 can also step down the current to meet the voltage requirement for charging the power supply.

[0108] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0109] In the description of the present invention, "first feature" and "second feature" may include one or more such features.

[0110] In the description of the present invention, “plurality” means two or more.

[0111] In the description of the present invention, a first feature being “above” or “below” a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact via another feature therebetween.

[0112] In the description of the present invention, a first feature “above”, “above” and “above” a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.

[0113] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the illustrative use of the above terms does not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0114] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A motor controller, characterized in that: include: A power module includes a heat sink and multiple single-tube power chips, each of which is an independently molded part. The multiple single-tube power chips are independently mounted on the heat sink, and the heat sink is used to dissipate heat for the multiple single-tube power chips. A driving board, to which the plurality of single-tube power chips of the power module are electrically connected; a control board, electrically connected to the drive board; A capacitor assembly, comprising a busbar capacitor, wherein the busbar capacitor is electrically connected to the plurality of single-tube power chips via a laminated busbar; A shell, wherein the power module, the driving board, the control board and the capacitor assembly are arranged in the shell.

2. The motor controller according to claim 1, characterized in that: The laminated busbar includes a DC negative busbar copper bar and an AC output copper bar arranged in a stacked manner. The DC negative busbar copper bar is formed with three groups of first connecting terminals, each group of first connecting terminals includes a first terminal and a second terminal. The multiple single-tube power chips are divided into multiple chip groups, and the multiple chip groups include three groups of inverter single-tube power chip groups. The first terminal is electrically connected to the busbar capacitor, and the second terminal is electrically connected to the inverter single-tube power chip group. The AC output copper busbar is formed with three groups of second connection terminals. Each group of the second connection terminals includes a third terminal and a fourth terminal. The third terminal is electrically connected to the inverter single-tube power chip group.

3. The motor controller according to claim 1, wherein: It also includes a filter component and a boost inductor arranged in the shell, the capacitor component also includes a low-voltage side capacitor, the multiple single-tube power chips are divided into multiple groups of chipsets, the multiple groups of chipsets include a boost single-tube power chipset, and the boost inductor is electrically connected to the boost single-tube power chipset; the bus capacitor and the power module are arranged along the third direction, and the low-voltage side capacitor, the boost inductor and the filter component are located on the same side of the power module along the second direction.

4. The motor controller according to claim 3, characterized in that: The low-voltage side capacitor and the bus capacitor are arranged along the second direction, the boost inductor and the filter component are arranged along the second direction, and the boost inductor and the filter component are located on the side of the low-voltage side capacitor close to the power module along the third direction.

5. The motor controller according to claim 4, characterized in that: The boost inductor is located between the power module and the filter component along the second direction, and the boost single-tube power chipset is located at one end of the power module close to the boost inductor along the third direction.

6. The motor controller according to claim 1, characterized in that: The plurality of single-tube power chips are arranged on one side of the heat dissipation plate along the first direction; The plurality of single-tube power chips are divided into two rows arranged along a third direction, and the single-tube power chips in each row are divided into multiple columns arranged along a second direction. The first direction, the second direction and the third direction intersect each other.

7. The motor controller according to claim 1, characterized in that: The multiple single-tube power chips are divided into multiple groups of chipsets arranged at intervals along the second direction, each group of chipsets includes multiple single-tube power chips, and the multiple groups of chipsets include three groups of inverter single-tube power chipsets, which are respectively a U-phase single-tube power chipset, a V-phase single-tube power chipset, and a W-phase single-tube power chipset arranged in sequence along the second direction.

8. The motor controller according to claim 7, characterized in that: Each group of the inverter single-tube power chipset includes an upper bridge single-tube power chipset and a lower bridge single-tube power chipset arranged along a third direction. The upper bridge single-tube power chipset includes one or more of the single-tube power chips, and the lower bridge single-tube power chipset includes one or more of the single-tube power chips. The number of single-tube power chips in the upper bridge single-tube power chipset and the lower bridge single-tube power chipset is the same and corresponds one to one.

9. The motor controller according to claim 7, characterized in that: The plurality of chipsets further include a boost single-tube power chipset, and the boost single-tube power chipset is located on one side of the inverter single-tube power chipset along the second direction.

10. The motor controller according to claim 7, characterized in that: The heat sink is a water-cooled plate, and the plurality of single-tube power chips are connected to the heat sink by sintering or welding; It also includes a mounting frame, the mounting frame is mounted on the heat sink, and a plurality of mounting slots are formed on the mounting frame, and the plurality of single-tube power chips are respectively accommodated in the plurality of mounting slots; A partition plate is provided between two adjacent chip groups, and the partition plate is an insulating member and is provided on the mounting frame; The installation frame is a plastic frame; and / or the installation frame is an integrally formed part.

11. The motor controller according to claim 10, characterized in that: The mounting frame is detachably connected to the heat dissipation plate; It also includes multiple connecting parts, a plurality of first mounting holes arranged along the circumferential direction are formed on the mounting frame, and a plurality of second mounting holes arranged along the circumferential direction of the mounting frame are formed on the heat dissipation plate. The number of the multiple first mounting holes is the same as the number of the multiple second mounting holes and they are arranged in a one-to-one correspondence, and the connecting parts are passed through the first mounting holes and the second mounting holes along the first direction.

12. The motor controller according to claim 1, wherein: The single-tube power chip is a silicon carbide single-tube chip or an IGBT single-tube chip.

13. The motor controller according to claim 1, wherein: The driving board and the control board are arranged along a direction perpendicular to the first direction; the driving board and the control board are arranged along a third direction.

14. The motor controller according to claim 13, characterized in that: The driving board includes a first board and a first component group provided on the first board. The control board includes a second board and a second component group provided on the second board. The second board is connected to the first board, and the first board and the second board are integrally formed.

15. The motor controller according to claim 13, characterized in that: The driving board and the control board are located on the same side of the power module along a first direction. In the first direction, the driving board and the power module are arranged opposite to each other.

16. A vehicle, characterized in that: include: A motor controller according to any one of claims 1 to 15.

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