LED light-emitting array structure and light-emitting module

Abstract

The utility model provides an LED light-emitting array structure and a light-emitting module, and the LED light-emitting array structure comprises an LED light-emitting array which comprises a plurality of LED light-emitting units which are arranged in an array, and the light-emitting surfaces of the LED light-emitting units face the same direction; the protection substrate is arranged on one side of the non-light-emitting surface of the LED light-emitting array; the non-light-emitting surface is opposite to the light-emitting surface; a plurality of first through holes are formed in the protection substrate; each first through hole is filled with first metal as a positive metal column, the positive metal columns are in one-to-one correspondence with the LED light-emitting units, the positive metal columns are used for leading positive electrodes of the LED light-emitting units to the surface of the protection substrate, and the surface of the protection substrate refers to the side, away from the LED light-emitting array, of the protection substrate; and the fluorescent layer is arranged on one side of the light-emitting surface of the LED light-emitting array. According to the technical scheme of the utility model, the protection substrate can protect the LED light-emitting array, and the electrodes are led out, so that the bonding short circuit risk is low; therefore, the heat dissipation effect is good.

Description

Technical Field

[0001] The utility model relates to the technical field of light emitting arrays, and in particular to an LED light emitting array structure and a light emitting module. Background Art

[0002] With further breakthroughs in micro-LED technology and the booming development of smart driving, adaptive headlights are becoming increasingly popular. Major international LED manufacturers, in particular, have successively launched pixel headlight chip modules based on LEDs or micro-LEDs.

[0003] The existing light-emitting array mainly consists of 10,000-30,000 microLED chips (size 40-60um) bump-to-bump bonded to CMOS to form a 10,000-level array LED chip, which is then attached to a ceramic perforated copper-clad circuit substrate and then encapsulated with white light to form a light source module.

[0004] This solution has the following disadvantages: the P and N bumps in bump-to-bump bonding are close to each other, and the risk of bonding short circuit is high. Utility Model Content

[0005] The utility model provides an LED light-emitting array structure and a light-emitting module to solve the problem of high bonding short-circuit risk in the prior art.

[0006] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0007] According to a first aspect of the present invention, there is provided an LED light emitting array structure, comprising:

[0008] An LED light-emitting array comprises a plurality of LED light-emitting units arranged in an array, wherein the light-emitting surfaces of the LED light-emitting units are oriented in the same direction;

[0009] a protective substrate disposed on a side of the non-light-emitting surface of the LED light-emitting array; the non-light-emitting surface is opposite to the light-emitting surface of the LED light-emitting array; a plurality of first through holes are formed in the protective substrate, each of which penetrates the protective substrate; each of the first through holes is filled with a first metal serving as a positive metal column, the positive metal column corresponding one-to-one to the LED light-emitting unit, the positive metal column being used to lead the positive electrode of the LED light-emitting unit to the surface of the protective substrate, the surface of the protective substrate referring to the side of the protective substrate away from the LED light-emitting array;

[0010] The fluorescent layer is arranged on one side of the light emitting surface of the LED light emitting array.

[0011] Optionally, it further includes: a reflective isolation wall, which is arranged on one side of the light emitting surface of the LED light emitting array;

[0012] The reflective isolation wall is in a grid shape, and the grid corresponds to the LED light-emitting unit;

[0013] The fluorescent layer is filled in the grid.

[0014] Optionally, the negative electrodes of adjacent LED light-emitting units are electrically connected via an air bridge;

[0015] The reflective isolation wall is a metal reflective isolation wall, and the metal reflective isolation wall covers part or all of the air bridge.

[0016] Optionally, the height of the reflective isolation wall is any value between 20 microns and 100 microns.

[0017] Optionally, a second through hole is provided in the protective substrate along the depth direction of the protective substrate, and the second through hole is filled with a second metal as a negative metal column, which is used to lead the negative electrode of the LED light-emitting unit to the surface of the protective substrate.

[0018] Optionally, the negative electrodes of adjacent LED light-emitting units are electrically connected via an air bridge; and the second through hole is provided at a position of the protective substrate corresponding to the position between the adjacent LED light-emitting units.

[0019] Optionally, the negative electrodes of the LED light-emitting units in each row and / or column are electrically connected through an air bridge, and the second through hole is arranged at a position of the protective substrate corresponding to the edge of the LED light-emitting array, and the edge of the LED light-emitting array refers to the periphery of the LED light-emitting unit.

[0020] Optionally, along the depth direction of the LED light-emitting unit, the LED light-emitting unit includes: an N-type structure, a quantum well, a P-type structure, a reflective layer, and a positive electrode structure in sequence;

[0021] The LED light emitting unit further includes:

[0022] a passivation insulating layer, which at least wraps the P-type structure and the sidewalls of the quantum well;

[0023] A negative electrode structure, wherein the edge of the N-type structure is not covered by the quantum well, and the negative electrode structure wraps the sidewall and a portion of the bottom surface of the N-type structure; the portion of the bottom surface refers to the surface of the N-type structure adjacent to the quantum well and not covered by the quantum well.

[0024] Optionally, the light-emitting surface of the LED light-emitting unit is a rough surface, which improves light-emitting efficiency.

[0025] Optionally, the protective substrate is a silicon substrate, a glass substrate, or a ceramic substrate.

[0026] According to a second aspect of the present invention, a light-emitting module is provided, comprising:

[0027] An LED light-emitting array structure, which is any of the LED light-emitting array structures described above;

[0028] A driving chip is bonded to the LED light-emitting array structure.

[0029] The LED light-emitting array structure and light-emitting module provided by the present invention can protect the LED light-emitting array by providing a protective substrate on the side of the non-light-emitting surface of the LED light-emitting array. In addition, the positive electrode of the LED light-emitting array is led to the surface of the protective substrate, and the problem of the P and N bumps being close to each other does not exist. The risk of bonding short circuit is low and the reliability is high. As a result, the size of the LED light-emitting unit can be made relatively small, thereby improving the resolution.

[0030] In addition, the LED light-emitting array structure and light-emitting module provided by the present invention have a light-emitting surface of the LED light-emitting unit that does not include sapphire. The LED light-emitting unit is separated from the sapphire, which has better lighting effect and better heat dissipation effect than those with sapphire.

[0031] In an optional solution of the present invention, a grid-shaped reflective isolation wall is provided on one side of the light-emitting surface of the LED light-emitting array, and the fluorescent layer is filled in the grid. The reflective isolation wall isolates the fluorescent layer, thereby performing light isolation and improving contrast.

[0032] In an optional solution of the present invention, the negative electrodes of adjacent LED light-emitting units are electrically connected through an air bridge, thereby realizing a common cathode; by setting the reflective isolation wall as a metal reflective isolation wall, it covers part or all of the air bridge; it is equivalent to connecting a resistor in parallel on the air bridge, so that its resistance is reduced, that is, the wire group driven to the LED light-emitting units is reduced, thereby reducing the voltage drop of the wire group and improving the luminous brightness; in addition, when the LED light-emitting units share a common cathode, the distance from the cathode bonding position of the driver chip and the LED light-emitting unit increases from near to far, and due to the effect of the voltage drop, the luminous brightness will become lower and lower, and the wire group voltage drop is reduced by the above method, that is, the difference in luminous brightness between different LED light-emitting units is reduced, thereby improving the luminous uniformity.

[0033] In an optional solution of the present invention, the negative electrode of the LED light-emitting array is led out to the surface of the protective substrate through the second through hole, and the negative electrodes of adjacent LED light-emitting units are connected through an air bridge. The second through hole is arranged at a position corresponding to the adjacent LED light-emitting units on the protective substrate, that is, one second through hole can correspond to every two adjacent LED light-emitting units, and / or one second through hole can correspond to every four adjacent LED light-emitting units, thereby reducing the number of second through holes and thus reducing the through hole density of the protective substrate, that is, increasing the distance between the first through hole and the second through hole, further reducing the risk of bonding short circuit.

[0034] In an optional solution of the present invention, the negative electrodes of the LED light-emitting units in each row and / or column are electrically connected through an air bridge, and the second through holes are arranged at positions of the protective substrate corresponding to the edges of the LED light-emitting array; each row and / or column of the LED light-emitting units corresponds to one or two second through holes, and the second through holes are only arranged at the edge positions of the protective substrate, which further reduces the through hole density of the protective substrate, further increases the distance between the first through holes and the second through holes, and further reduces the risk of bonding short circuits. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0036] Figure 1 This is a schematic longitudinal cross-sectional view of an LED light emitting array structure according to an embodiment of the present invention;

[0037] Figure 2 A longitudinal cross-sectional schematic diagram of an LED light emitting array structure according to another embodiment of the present invention;

[0038] Figure 3 A top view of an LED light emitting array structure according to an embodiment of the present invention;

[0039] Figure 4 A longitudinal cross-sectional view of an LED light emitting array structure according to an embodiment of the present invention;

[0040] Figure 5 A top perspective view of an LED light emitting array structure according to an embodiment of the present invention;

[0041] Figure 6 A top perspective view of an LED light emitting array structure according to another embodiment of the present invention;

[0042] Figure 7 A longitudinal cross-sectional view of an LED light-emitting array structure according to another embodiment of the present invention;

[0043] Figure 8 A top perspective view of an LED light emitting array structure according to another embodiment of the present invention;

[0044] Figure 9 A top perspective view of an LED light emitting array structure according to another embodiment of the present invention;

[0045] Figure 10 A top perspective view of an LED light emitting array structure according to another embodiment of the present invention;

[0046] Description of reference numerals:

[0047] 1-LED light array,

[0048] 11-LED light emitting unit;

[0049] 1101-N type structure,

[0050] 1102-quantum well,

[0051] 1103-P type structure,

[0052] 1104-reflective layer,

[0053] 1105-positive electrode structure,

[0054] 1106-passivation insulating layer,

[0055] 1107-negative electrode structure;

[0056] 1108-rough surface;

[0057] 12-air bridge;

[0058] 13-LED unit;

[0059] 2- Protective substrate,

[0060] 201-first through hole,

[0061] 2011-First Metal,

[0062] 2012-first insulation layer;

[0063] 202- second through hole,

[0064] 2021-Second Metal,

[0065] 2022- second insulation layer;

[0066] 21-Insulation glue;

[0067] 3- fluorescent layer,

[0068] 4-Reflective isolation wall. DETAILED DESCRIPTION

[0069] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0070] In the description of the specification of the present invention, it should be understood that the terms "upper part", "lower part", "upper end", "lower end", "lower surface", "upper surface", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as limitations on the present invention.

[0071] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include one or more of such features.

[0072] In the description of the present invention, “a plurality of” means multiple, such as two, three, four, etc., unless otherwise clearly defined.

[0073] In the description of this utility model, unless otherwise specified or limited, the term "connection" and other terms should be understood in a broad sense. For example, it can mean fixed connection, detachable connection, or integration; it can mean mechanical connection, electrical connection, or mutual communication; it can mean direct connection or indirect connection through an intermediate medium; it can mean internal communication between two components or interaction between two components. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0074] The following specific embodiments are used to describe the technical solution of the present invention in detail. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0075] In one embodiment, an LED light emitting array structure is provided, please refer to Figure 1, which includes an LED light-emitting array 1, a protective substrate 2, and a fluorescent layer 3.

[0076] The LED array 1 includes a plurality of LED light-emitting units 11 arranged in an array, with the light-emitting surfaces of the LED light-emitting units oriented in the same direction. A protective substrate 2 is disposed on the non-light-emitting side of the LED array; the non-light-emitting side is opposite the light-emitting side of the LED array. A phosphor layer 3 is disposed on the light-emitting side of the LED array. Figure 1 The block diagram of the LED light-emitting unit is only a schematic diagram and does not represent its actual shape.

[0077] In practice, the protective substrate 2 is provided with a plurality of first through-holes 201, each of which penetrates the protective substrate 2. Each first through-hole 201 is filled with a first metal 2011, which serves as a positive metal column. The positive metal columns correspond one-to-one with the LED light-emitting units and are used to lead the positive electrodes of the LED light-emitting units to the surface of the protective substrate, which refers to the side of the protective substrate away from the LED light-emitting array.

[0078] In one embodiment, the first through hole may be opened at a position of the protective substrate corresponding to the positive electrode of each LED light-emitting unit.

[0079] In one embodiment, the protective substrate may be a silicon substrate, a glass substrate, or a ceramic substrate.

[0080] In the LED light-emitting array structure of the above embodiment, a protective substrate is provided on the side of the non-light-emitting surface of the LED light-emitting array, which can protect the LED light-emitting array; in addition, the positive electrode of the LED light-emitting array is led to the surface of the protective substrate, and finally the alignment and bonding of the protective substrate and the driver chip are achieved, which has higher reliability and reduces the risk of bonding short circuit. As a result, the size of the LED light-emitting unit can be made relatively small, thereby improving the resolution.

[0081] In addition, the light-emitting surface of the LED light-emitting array of the present invention does not include sapphire. The LED light-emitting array is peeled off from the sapphire, which has better lighting effect and better heat dissipation effect than the one with sapphire.

[0082] In one embodiment, the LED light array structure may further include: a reflective isolation wall 4, see Figure 2 、 Figure 3 A reflective barrier 4 is provided on one side of the light-emitting surface of the LED array. The reflective barrier 4 is arranged in a grid pattern, with each grid corresponding to each LED light-emitting unit. The phosphor layer fills the grid. The reflective barrier isolates the phosphor layers of the LED light-emitting units, improving the contrast between the LED light-emitting units.

[0083] As an embodiment, the reflective isolation wall can be a metal reflective isolation wall. The negative electrodes of adjacent LED light-emitting units are electrically connected through an air bridge; the metal reflective isolation wall covers part or all of the air bridge. As a connection line between the negative electrodes of adjacent LED light-emitting units, the air bridge has a certain resistance and a certain line voltage drop. The reflective isolation wall is set as a metal reflective isolation wall, covering the air bridge, which is equivalent to making the air bridge thicker and reducing its resistance, or equivalent to connecting a resistor in parallel on the air bridge and reducing its resistance; the negative electrode of the LED light-emitting unit is electrically connected, which is equivalent to a common cathode. From near to far from the cathode bonding position of the driver chip and the LED light-emitting unit, due to the effect of the line resistance voltage drop, the luminous brightness will become lower and lower. The line group voltage drop is reduced by the above method, that is, the difference in luminous brightness between different LED light-emitting units is reduced, and the luminous uniformity is improved.

[0084] Preferably, the height of the reflective isolation wall can be any value between 20 micrometers and 100 micrometers. The height of the reflective isolation wall can be equal to the thickness of the fluorescent layer or lower than the thickness of the fluorescent layer.

[0085] Practically, the metal reflective isolation wall can be made of a metal material with a relatively strong reflective function, such as silver, aluminum, etc.; or it can be made of a metal material with a relatively weak reflective function, but with a reflective layer added to the inner wall.

[0086] As another embodiment, the reflective isolation wall may also be a non-metallic reflective isolation wall.

[0087] Practically, the non-metallic reflective isolation wall can be made of non-metallic materials with relatively strong reflective functions, such as DBR, ODR, etc.; or, it can be made of non-metallic materials with relatively weak reflective functions, but in white, such as white walls, white glue, etc., which also have reflective functions; or, it can be made of non-metallic materials with relatively weak reflective functions, but with a reflective layer added to the inner wall.

[0088] In one embodiment, along the depth direction of the LED light emitting unit, the LED light emitting unit includes: an N-type structure 1101, a quantum well 1102, a P-type structure 1103, a reflective layer 1104, and a positive electrode structure 1105. Figure 4 .

[0089] Furthermore, the LED light emitting unit further includes:

[0090] A passivation insulating layer 1106 , which at least covers the sidewalls of the P-type structure and the quantum well;

[0091] Negative electrode structure 1107, the edges of the N-type structure not covered by the quantum well, wraps around the sidewalls and a portion of the bottom surface of the N-type structure; the portion of the bottom surface refers to the surface of the N-type structure adjacent to the quantum well and not covered by the quantum well. A passivation insulating layer 1106 isolates negative electrode structure 1107 from the other structures of the LED light-emitting unit.

[0092] In different embodiments, in order to further improve the insulation reliability, the passivation insulating layer 1106 may further wrap the sidewall of the emission layer 1104 and may further wrap part of the sidewall of the positive electrode 1105. Figure 4 .

[0093] In one embodiment, the light emitting surface of the LED light emitting unit may be a rough surface 1108, please refer to Figure 4 During the peeling process of the LED light-emitting array from the sapphire, the light-emitting surface of the LED light-emitting unit forms a rough surface, which improves the light-emitting efficiency compared to the smooth surface.

[0094] In one embodiment, the LED array 1 and the protective substrate 2 can be connected by insulating glue 21, please refer to Figure 4 .

[0095] In one embodiment, a second through hole 202 is further provided in the protective substrate along the depth direction of the protective substrate. The second through hole 202 is filled with a second metal 2021, which serves as a negative metal column. The negative metal column is used to lead the negative electrode of the LED light-emitting unit to the surface of the protective substrate. Please refer to Figure 4 .

[0096] In one embodiment, the inner wall of the first through hole 201 is provided with a first insulating layer 2012, and the inner wall of the second through hole 202 is provided with a second insulating layer 2022. Figure 4 .

[0097] As an embodiment, the negative electrodes of adjacent LED light-emitting units are electrically connected via an air bridge; and the second through hole is provided at a position of the protective substrate corresponding to the position between the adjacent LED light-emitting units.

[0098] In practice, the second through hole 202 can be provided at a position corresponding to between every two adjacent LED light emitting units 11 on the protective substrate, see Figure 5 A top perspective view is shown, in which only part of the structure is shown. For the sake of convenience, the second through hole 202 is partially blocked by the LED light emitting unit 11; in addition, Figure 5 It is a perspective view. When looking down, only the fluorescent layer and the reflective isolation wall can be seen. The LED light-emitting unit, the second through hole, and the air bridge are all blocked. In fact, part of the second through hole 202 is blocked by the LED light-emitting unit, and part is blocked by the air bridge.

[0099] Alternatively, the second through hole may be provided at a position of the protective substrate corresponding to the position between each four adjacent LEDs. Figure 6 As above, the figure only shows part of the structure. Figure 6 This is a perspective view. When looking down, only the fluorescent layer and the reflective isolation wall can be seen. The LED light-emitting unit, the second through hole, and the air bridge are all blocked. The second through hole is actually blocked by the air bridge. Figure 5 How to set it up, Figure 6 In the configuration, the number of second through holes is smaller, the through hole density of the protective substrate is lower, the bonding difficulty is lower, and the risk of bonding short circuit is also lower.

[0100] As another embodiment, the negative electrodes of the LED light-emitting units in each row and / or column are electrically connected via air bridges, and the second through-holes are provided at positions of the protective substrate corresponding to the edge of the LED light-emitting array. The edge of the LED light-emitting array refers to the periphery of the LED light-emitting units. Figure 7 Leading the negative electrode to the edge of the LED light-emitting array makes bonding more convenient; in addition, the density of through holes on the surface of the protective substrate is further reduced, further reducing the risk of bonding short circuits.

[0101] In order to ensure the surface consistency of the LED light emitting array, an LED unit 13 is also set at the corresponding position of the second through hole on the edge. However, the LED unit 13 is only used to lead out the negative electrode and is non-luminous. Please refer to Figure 7 .

[0102] In one embodiment, each row of LED units corresponds to two second through holes, that is, second through holes are set on both sides of the row; each column of LED units also corresponds to two second through holes, that is, second through holes are set on both sides of the column. Figure 8 The top perspective view shows that second through holes are set around the LED light array, which can reduce the density of through holes while taking into account the conductive effect. Figure 8 It is a perspective view. When looking down, only the fluorescent layer and the reflective isolation wall can be seen. The LED light-emitting unit, the second through hole, and the air bridge are all blocked. The second through hole is actually blocked by the air bridge or the LED unit 13.

[0103] In another embodiment, each row of LED units may also correspond to only one second through hole, that is, a second through hole is provided on one side of the row. Figure 9 . Figure 9 The second through holes in each row are arranged on the same side. In different embodiments, they can also be arranged on different sides and can be freely arranged as needed.

[0104] In another embodiment, each column of LED units may also correspond to only one second through hole, that is, a second through hole is provided on one side of the row, please refer to Figure 10 . Figure 10 The second through holes in each column are arranged on the same side. In different embodiments, they can also be arranged on different sides and can be freely arranged as needed.

[0105] In different embodiments, each row of LED units may correspond to only one second through hole, and each column of LED units may correspond to only one second through hole. The arrangement is similar to the above and will not be described in detail here.

[0106] In different embodiments, multiple rows may correspond to one or two second through holes, or multiple columns may correspond to one or two second through holes, which are not listed here. Because all LED light-emitting units share a common cathode, the positions of the second through holes can be set arbitrarily as needed and do not need to follow the row or column rules.

[0107] The two-row and three-column LED light array in the above embodiment is only an example. In different embodiments, there is no limit on the number of rows, columns, and LED light units of the LED light array. In addition, the LED light array does not have to be square, but can also be other shapes, such as round.

[0108] The LED light-emitting unit can be a microLED light-emitting unit with a size of 5um-100um, or a LED light-emitting unit with a size of 100um-1mm.

[0109] In one embodiment, a light emitting module is further provided, comprising:

[0110] An LED light-emitting array structure, which is the LED light-emitting array structure described in any of the above embodiments;

[0111] The driver chip is bonded to the LED light-emitting array structure and is used to drive the LED light-emitting array.

[0112] Practically, each driver chip may correspond to one LED light-emitting unit or may correspond to multiple LED light-emitting units.

[0113] Throughout this specification, references to terms such as "one embodiment," "an example," "a specific implementation process," or "an example" indicate that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0114] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. An LED light emitting array structure, characterized in that: include: An LED light-emitting array comprises a plurality of LED light-emitting units arranged in an array, wherein the light-emitting surfaces of the LED light-emitting units are oriented in the same direction; a protective substrate disposed on a side of the non-light-emitting surface of the LED light-emitting array; the non-light-emitting surface is opposite to the light-emitting surface of the LED light-emitting array; a plurality of first through holes are formed in the protective substrate, each of which penetrates the protective substrate; each of the first through holes is filled with a first metal serving as a positive metal column, the positive metal column corresponding one-to-one to the LED light-emitting unit, the positive metal column being used to lead the positive electrode of the LED light-emitting unit to the surface of the protective substrate, the surface of the protective substrate referring to the side of the protective substrate away from the LED light-emitting array; The fluorescent layer is arranged on one side of the light emitting surface of the LED light emitting array.

2. The LED light emitting array structure according to claim 1, characterized in that: Also includes: a reflective isolation wall, which is arranged on one side of the light emitting surface of the LED light emitting array; The reflective isolation wall is in a grid shape, and the grid corresponds to the LED light-emitting unit; The fluorescent layer is filled in the grid.

3. The LED light emitting array structure according to claim 2, characterized in that: The negative electrodes of adjacent LED light-emitting units are electrically connected via an air bridge; The reflective isolation wall is a metal reflective isolation wall, and the metal reflective isolation wall covers part or all of the air bridge.

4. The LED light emitting array structure according to claim 1, characterized in that: A second through hole is provided in the protective substrate along the depth direction thereof. The second through hole is filled with a second metal as a negative metal column. The negative metal column is used to lead the negative electrode of the LED light-emitting unit to the surface of the protective substrate.

5. The LED light emitting array structure according to claim 4, characterized in that: The negative electrodes of the adjacent LED light-emitting units are electrically connected via an air bridge; the second through hole is provided at a position of the protective substrate corresponding to the position between the adjacent LED light-emitting units.

6. The LED light emitting array structure according to claim 5, characterized in that: The negative electrodes of the LED light-emitting units in each row and / or column are electrically connected through air bridges, and the second through holes are arranged at positions of the protective substrate corresponding to the edges of the LED light-emitting array, where the edges of the LED light-emitting array refer to the periphery of the LED light-emitting units.

7. The LED light emitting array structure according to any one of claims 1 to 6, characterized in that: Along the depth direction of the LED light-emitting unit, the LED light-emitting unit includes: an N-type structure, a quantum well, a P-type structure, a reflective layer, and a positive electrode structure in sequence; The LED light emitting unit further includes: a passivation insulating layer, which at least wraps the P-type structure and the sidewalls of the quantum well; A negative electrode structure, wherein the edge of the N-type structure is not covered by the quantum well, and the negative electrode structure wraps the sidewall and a portion of the bottom surface of the N-type structure; the portion of the bottom surface refers to the surface of the N-type structure adjacent to the quantum well and not covered by the quantum well.

8. The LED light emitting array structure according to any one of claims 1 to 6, characterized in that: The light emitting surface of the LED light emitting unit is a rough surface.

9. The LED light emitting array structure according to any one of claims 1 to 6, characterized in that: The protective substrate is a silicon substrate, a glass substrate or a ceramic substrate.

10. A light emitting module, characterized in that: include: An LED light-emitting array structure, which is the LED light-emitting array structure according to any one of claims 1 to 9; A driving chip is bonded to the LED light-emitting array structure.

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