Light emitting device and display apparatus

Abstract

The utility model relates to a light-emitting device and display equipment. The light-emitting device comprises a driving substrate, a light-emitting element, a bottom color layer, a packaging layer, a transparent base material layer and an ink layer, the driving substrate is provided with a working surface, and the light-emitting element and the ground color layer are arranged on the working surface; the packaging layer is arranged on the driving substrate and covers the light-emitting element and the bottom color layer; the transparent substrate layer is arranged on the surface, away from the driving substrate, of the packaging layer, the ink layer is arranged on the surface, away from the packaging layer, of the transparent substrate layer, and the ink layer forms texture patterns on the surface of the transparent substrate layer. The light-emitting device can achieve uniform display and is not prone to color cast, and then the effect of hiding splicing seams in the splicing process can be achieved.

Description

Technical Field

[0001] The present application relates to the technical field of light-emitting devices, and in particular to a light-emitting device and a display device. Background Art

[0002] New display screens that can display natural or unique textures like wood and stone grain when off, while remaining functional when on, are gaining adoption in automotive, commercial, and home displays. The principle behind these off-screen texture displays is to overlay a translucent plastic shell or film onto the display surface. This surface is then printed with translucent colored ink to create a pattern. The ink then reflects ambient light, creating a colorful texture.

[0003] In traditional off-screen texture displays, the differences in ink thickness and color in different areas of the texture pattern can easily cause local color cast during display, and can also easily lead to seams when multiple displays are spliced together. Utility Model Content

[0004] Based on this, it is necessary to provide a light emitting device and a display device. The light emitting device of the present application can achieve uniform display without color cast, and further can achieve the effect of hiding the splicing seam when splicing.

[0005] In a first aspect, the present application provides a light-emitting device, comprising: a driving substrate, a light-emitting element, a base color layer, an encapsulation layer, a transparent substrate layer, and an ink layer;

[0006] The driving substrate has a working surface, and the light-emitting element and the base color layer are arranged on the working surface;

[0007] The encapsulation layer is provided on the driving substrate, and the encapsulation layer covers the light-emitting element and the base color layer;

[0008] The transparent substrate layer is disposed on a surface of the encapsulation layer away from the driving substrate. The ink layer is disposed on a surface of the transparent substrate layer away from the encapsulation layer. The ink layer forms a texture pattern on the surface of the transparent substrate layer.

[0009] In some embodiments, the base color layer is disposed outside the region where the light emitting element is located, and the base color layer covers a portion of the working surface that is not covered by the light emitting element.

[0010] In some embodiments, the top surface of the light-emitting element is higher than the top surface of the base color layer.

[0011] In some embodiments, a distance between a top surface of the encapsulation layer and a top surface of the light-emitting element is 50 μm to 200 μm.

[0012] In some embodiments, the ink layer has a thickness of 5 μm to 40 μm.

[0013] In some embodiments, the transparent substrate layer has a thickness of 40 μm to 100 μm.

[0014] In some embodiments, the light emitting device further includes an adhesive layer disposed between the encapsulation layer and the transparent substrate layer.

[0015] In some embodiments, the thickness of the adhesive layer is 20 μm to 50 μm.

[0016] In some embodiments, the light-emitting device further includes a protective layer, which is disposed on a surface of the ink layer away from the transparent substrate layer, and covers the ink layer.

[0017] In a second aspect, the present application provides a display device comprising any of the light-emitting devices described above.

[0018] The aforementioned light-emitting device includes a base layer and an ink layer. The ink layer forms a textured pattern on the surface of the transparent substrate layer. The base layer and the ink layer interact to create a textured effect, reducing the impact of the ink layer's texture on the bright screen display and improving the consistency of the light transmittance and brightness uniformity of the light-emitting device during bright screen display. The textured effect created by the ink layer and the base layer allows the light-emitting device to achieve a uniform display with minimal color cast, thereby concealing seams during splicing. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic structural diagram of a light-emitting device provided in one embodiment of the present application;

[0020] Figure 2 A schematic structural diagram of a light-emitting device provided in one embodiment of the present application.

[0021] Description of Reference Numerals

[0022] 10. Driving substrate; 20. Light-emitting element; 30. Base color layer; 40. Encapsulation layer; 50. Adhesive layer; 60. Transparent substrate layer; 70. Ink layer; 80. Protective layer. DETAILED DESCRIPTION

[0023] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0025] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0026] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0027] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0028] Reference Figures 1 and 2As shown, an embodiment of the present application provides a light-emitting device, including: a driving substrate 10, a light-emitting element 20, a background layer 30, an encapsulation layer 40, a transparent substrate layer 60 and an ink layer 70; the driving substrate 10 has a working surface, and the light-emitting element 20 and the background layer 30 are arranged on the working surface; the encapsulation layer 40 is arranged on the driving substrate 10, and the encapsulation layer 40 covers the light-emitting element 20 and the background layer 30; the transparent substrate layer 60 is arranged on the surface of the encapsulation layer 40 away from the driving substrate 10, and the ink layer 70 is arranged on the surface of the transparent substrate layer 60 away from the encapsulation layer 40, and the ink layer 70 forms a texture pattern on the surface of the transparent substrate layer 60.

[0029] The aforementioned light-emitting device includes a base layer 30 and an ink layer 70. The ink layer 70 forms a textured pattern on the surface of the transparent substrate layer 60. The base layer 30 and the ink layer 70 interact to create a textured effect, reducing the impact of the ink layer 70's texture on the bright screen display and improving the consistency of the light transmittance and brightness uniformity of the light-emitting device during bright screen display. The textured effect created by the ink layer 70 and the base layer 30 enables the light-emitting device to display a uniform, less prone to color cast, thereby concealing seams during splicing.

[0030] In one embodiment, a plurality of light emitting elements 20 are distributed at intervals on the surface of the driving substrate 10 .

[0031] In some embodiments, the light emitting element 20 includes an LED chip.

[0032] In some embodiments, the light emitting element 20 includes a MIP (Mini / Micro LED in Package) lamp bead.

[0033] In some embodiments, the light emitting element 20 includes an SMT (surface mount) lamp bead.

[0034] In some embodiments, the base color layer 30 is a colored polymer layer.

[0035] It is understood that the base color layer 30 can have one or more colors and can be prepared using filler inks known in the art. For example, the filler ink includes the following components in parts by weight: 30-60 parts modified acrylic resin, 2-4 parts red pigment, 2-4 parts matting agent, 5-10 parts silicon oxide nanoparticles, 30-60 parts diformate, 10-20 parts butyl acetate, and 5-10 parts additives, including at least one of a dispersant, a leveling agent, a defoaming agent, and an adhesion agent.

[0036] In some embodiments, the base color layer 30 includes a base film layer and a color layer stacked together.

[0037] It is understood that the ink layer 70 forming the textured pattern on the surface of the transparent substrate layer 60 can be made from reflective ink known in the art. For example, the reflective ink includes the following components in parts by weight: 70-90 parts of transparent varnish, 5-10 parts of organosilicon powder, 5-10 parts of silicon oxide particles, 1-2 parts of dispersant, 1-2 parts of leveling agent, 1-2 parts of defoaming agent, 1-2 parts of adhesion agent, and 4-8 parts of diluent.

[0038] In some embodiments, the base layer 30 is disposed outside the region where the light-emitting element 20 is located, and the base layer 30 covers the portion of the working surface not covered by the light-emitting element 20 .

[0039] In some embodiments, the top surface of the light-emitting element 20 is higher than the top surface of the base color layer 30 .

[0040] The top surface of the light emitting element 20 is higher than the top surface of the base layer 30 , so that the base layer 30 does not affect the light emission of the light emitting element 20 , thereby achieving a better light emission effect of the light emitting device.

[0041] In some embodiments, the distance between the top surface of the encapsulation layer 40 and the top surface of the light emitting element 20 is 50 μm to 200 μm.

[0042] Optionally, the distance between the top surface of the encapsulation layer 40 and the top surface of the light-emitting element 20 is 50μm, 60μm, 70μm, 80μm, 90μm, 100μm, 110μm, 120μm, 130μm, 140μm, 150μm, 160μm, 170μm, 180μm, 190μm or 200μm, or the distance between the top surface of the encapsulation layer 40 and the top surface of the light-emitting element 20 may also be within the range between any two of the above distances.

[0043] In some embodiments, the thickness of the ink layer 70 is 5 μm to 40 μm.

[0044] Optionally, the thickness of the ink layer 70 is 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm or 40 μm, or the thickness of the ink layer 70 may be within a range between any two of the above thicknesses.

[0045] In some embodiments, the transparent substrate layer 60 has a thickness of 40 μm to 100 μm.

[0046] Optionally, the thickness of the transparent substrate layer 60 is 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, 95 μm or 100 μm, or the thickness of the transparent substrate layer 60 can also be within the range between any two of the above thicknesses.

[0047] In some embodiments, the light emitting device further includes an adhesive layer 50 , which is disposed between the encapsulation layer 40 and the transparent substrate layer 60 .

[0048] In some embodiments, the adhesive layer 50 has a thickness of 20 μm to 50 μm.

[0049] Optionally, the thickness of the adhesive layer 50 is 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm or 50 μm, or the thickness of the adhesive layer 50 may be within a range between any two of the above thicknesses.

[0050] In some embodiments, the light-emitting device further includes a protective layer 80 . The protective layer 80 is disposed on a surface of the ink layer 70 away from the transparent substrate layer 60 , and the protective layer 80 covers the ink layer 70 .

[0051] Another embodiment of the present application provides a method for preparing a light-emitting device, comprising the following steps:

[0052] Providing a substrate, the substrate including a driving substrate 10 and a light emitting element 20 disposed on a working surface of the driving substrate 10;

[0053] A base color layer 30 is formed on the portion of the working surface not provided with the light emitting element 20;

[0054] An encapsulation layer 40 is formed on the driving substrate 10 , and the encapsulation layer 40 covers the light emitting element 20 and the base color layer 30 ;

[0055] A transparent substrate layer 60 is formed on the surface of the encapsulation layer 40 away from the driving substrate 10 . An ink layer 70 is formed on the surface of the transparent substrate layer 60 away from the encapsulation layer 40 . The ink layer 70 forms a texture pattern on the surface of the transparent substrate layer 60 .

[0056] Another embodiment of the present application provides a method for preparing a light-emitting device, comprising the following steps:

[0057] Providing a substrate, the substrate including a driving substrate 10 and a light emitting element 20 disposed on a working surface of the driving substrate 10;

[0058] A base color layer 30 is formed on the portion of the working surface not provided with the light emitting element 20;

[0059] An encapsulation layer 40 is formed on the driving substrate 10 , and the encapsulation layer 40 covers the light emitting element 20 and the base color layer 30 ;

[0060] forming an adhesive layer 50 on a surface of the encapsulation layer 40 away from the driving substrate 10;

[0061] A transparent substrate layer 60 is formed on a surface of the adhesive layer 50 away from the driving substrate 10 , and an ink layer 70 is formed on a surface of the transparent substrate layer 60 away from the encapsulation layer 40 , wherein the ink layer 70 forms a texture pattern on the surface of the transparent substrate layer 60 ;

[0062] A protective layer 80 is formed on the transparent substrate layer 60 , and the protective layer 80 covers the ink layer 70 .

[0063] Yet another embodiment of the present application provides a display device comprising any of the above-mentioned light-emitting devices.

[0064] The following are specific embodiments

[0065] Example 1

[0066] (1) Setting a base color layer 30: Provide an MLED die-bonding lamp board with a process edge, and provide a color filling ink, which contains the following components in parts by weight: 30 to 60 parts of modified acrylic resin, 2 to 4 parts of red pigment, 2 to 4 parts of matting agent, 5 to 10 parts of silicon oxide nanoparticles, 30 to 60 parts of diformate, 10 to 20 parts of butyl acetate, and 5 to 10 parts of auxiliary agents, the auxiliary agents including at least one of a dispersant, a leveling agent, a defoaming agent, and a sealant. Use an inkjet printing process to spray the color filling ink onto the PCB along the lamp seam, heat and cure at 80°C for 30 minutes, and form a base color layer 30 covering the portion of the working surface not covered by the light-emitting element 20.

[0067] (2) Setting the encapsulation layer 40: providing an AB component thermosetting epoxy resin glue, setting it on the surface of the MLED lamp board by using a membrane pressure vacuum degassing process, and heating it at 120°C for 3 hours to complete the curing.

[0068] (3) Setting the ink layer 70: Provide a PET substrate film with a release film, the release film thickness is 70μm, the OCA (adhesive layer 50) thickness is 25μm, and the PET film thickness is 50μm. Provide a transparent white ink, comprising the following components in parts by weight: 70-90 parts of transparent varnish, 5-10 parts of organosilicon micropowder, 5-10 parts of silicon oxide particles, 1-2 parts of polymer dispersant, 1-2 parts of leveling agent, 1-2 parts of defoaming agent, 1-2 parts of acrylic adhesive and 4-8 parts of diluent. Mix the transparent white ink and the oil-water in a mass ratio of (10-5):1 and stir evenly, then screen print on the surface of the PET film, with a screen printing thickness of 40μm, a drying temperature of 80℃, and a drying time of 30min. After the release film is torn off, use a vacuum laminating machine to roll the PET film onto the surface of the encapsulation layer 40.

[0069] (4) Setting a protective layer 80: Provide a high-hardness silicone resin glue, use a 40μm coating rod to apply the covering ink layer 70, dry it at 80℃ for 30 minutes, and cure it at room temperature for 24 hours.

[0070] (5) Cutting and splicing: Use a dicing machine to cut the edges of the LED light panels and splice them into LED display screens.

[0071] Example 2

[0072] (1) Preparation of base color layer 30: Provide a self-adhesive PET substrate film with a release film having a thickness of 70 μm, an OCA having a thickness of 25 μm, and a PET film having a thickness of 50 μm. Provide a single-component dry red ink and print a red wood grain pattern on the surface of the PET film using a screen printing process with a screen printing thickness of 40 μm. Dry at 60°C for 10 min to cure.

[0073] (2) Setting the base color layer 30: Provide a small-pitch LED display module with a process edge prepared using an SMT surface mounting process, remove the release film from the base color film and cover it on the LED lamp surface, focus a laser spot on the surface of the base color film, and use laser marking to hollow out the base color film at the position corresponding to the LED lamp beads. Provide a grid-shaped fixture, with the position corresponding to the LED lamp slit being solid and the position corresponding to the lamp beads being empty. Use the grid fixture to press the base color film onto the PCB board at the lamp slit, and use a high-pressure lamination process to firmly adhere the base color layer 30 to the PCB board, and then remove the fixture.

[0074] (3) Setting the encapsulation layer 40: providing an AB component epoxy resin glue, mixing and stirring in a corresponding proportion, and then encapsulating it on the surface of the LED light board, and using the GOB film pressing process to cure it at room temperature for 24 hours.

[0075] (4) Setting the ink layer 70: Provide a PET substrate film with a release film, the release film thickness is 70 μm, the OCA thickness is 25 μm, and the PET film thickness is 50 μm. Provide a transparent black ink, comprising the following components in parts by weight: 70 to 90 parts of transparent varnish, 2 to 10 parts of carbon black, 2 to 10 parts of matting agent, 2 to 8 parts of nano-silicon oxide particles, 1 to 2 parts of polymer dispersant, 1 to 2 parts of leveling agent, 1 to 2 parts of defoaming agent, 1 to 2 parts of acrylic adhesive, and 4 to 8 parts of diluent. Screen print the transparent black ink on the surface of the PET film with a screen printing thickness of 40 μm, a drying temperature of 80°C, and a drying time of 30 minutes. After the release film is torn off, use a vacuum laminating machine to roll the PET film onto the surface of the transparent adhesive layer.

[0076] (5) Setting a protective layer 80: Provide a high-hardness silicone resin glue, use a 40μm coating rod to coat the covering ink layer 70, and cure it at room temperature for 24 hours.

[0077] (6) Cutting and splicing: Use a dicing machine to cut the edges of the LED light panels and splice them into LED display screens.

[0078] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0079] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the patent in this application shall be based on the appended claims, and the specification and drawings may be used to interpret the claims.

Claims

1. A light emitting device, characterized in that: include: Driving substrate, light emitting element, base color layer, encapsulation layer, transparent substrate layer and ink layer; The driving substrate has a working surface, and the light-emitting element and the base color layer are arranged on the working surface; The encapsulation layer is provided on the driving substrate, and the encapsulation layer covers the light-emitting element and the base color layer; The transparent substrate layer is disposed on a surface of the encapsulation layer away from the driving substrate. The ink layer is disposed on a surface of the transparent substrate layer away from the encapsulation layer. The ink layer forms a texture pattern on the surface of the transparent substrate layer.

2. The light emitting device according to claim 1, wherein The base color layer is arranged outside the area where the light emitting element is located, and the base color layer covers the portion of the working surface not covered by the light emitting element.

3. The light emitting device according to claim 1, wherein The top surface of the light emitting element is higher than the top surface of the base color layer.

4. The light emitting device according to claim 1, wherein The distance between the top surface of the encapsulation layer and the top surface of the light emitting element is 50 μm to 200 μm.

5. The light emitting device according to claim 1, wherein The thickness of the ink layer is 5 μm to 40 μm. The light emitting device according to claim 1 , wherein: The thickness of the transparent substrate layer is 40 μm to 100 μm.

7. The light emitting device according to any one of claims 1 to 6, characterized in that: The light emitting device further includes an adhesive layer disposed between the encapsulation layer and the transparent substrate layer.

8. The light emitting device according to claim 7, characterized in that The thickness of the adhesive layer is 20 μm to 50 μm.

9. The light emitting device according to any one of claims 1 to 6, characterized in that: The light emitting device further includes a protective layer, which is disposed on a surface of the ink layer away from the transparent substrate layer, and covers the ink layer.

10. A display device, characterized in that: The light-emitting device comprises the light-emitting device according to any one of claims 1 to 9.

Images