Display substrate and display device

Abstract

The utility model discloses a display substrate and a display device. The display substrate comprises a substrate; the light-emitting devices and the packaging film layer are located on the substrate, and the light-emitting devices are located between the substrate and the packaging film layer; wherein the surface, far away from the substrate, of the packaging film layer is a concave-convex surface, the average roughness of the concave-convex surface ranges from 1.2 micrometers to 1.9 micrometers, the packaging film layer comprises at least one packaging sub-layer, and the haze of the packaging sub-layer farthest away from the substrate ranges from 40% to 70%.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display substrate and a display device. Background Art

[0002] During the various processes of LED (Light-Emitting Diode, LED) direct display products, such as lighting testing, assembly and debugging, disassembly and packaging, dirt will inevitably be introduced into the screen surface, which has a great impact on screen maintenance and viewing. How to minimize the dirt left on the screen surface is an important issue for current LED direct display products. Summary of the Invention

[0003] The present disclosure aims to solve at least one of the technical problems existing in the prior art and provides a display substrate and a display device.

[0004] In a first aspect, the present disclosure provides a display substrate, comprising:

[0005] substrate;

[0006] A plurality of light-emitting devices and an encapsulation film layer are located on the substrate, wherein the light-emitting devices are located between the substrate and the encapsulation film layer;

[0007] The surface of the packaging film layer away from the substrate is a concave-convex surface, and the average roughness of the concave-convex surface is between 1.2 and 1.9 microns. The packaging film layer includes at least one packaging sublayer, and the haze of the packaging sublayer farthest from the substrate is between 40% and 70%.

[0008] In some embodiments, the average roughness of the concave-convex surface is between 1.3 and 1.9 micrometers, and the haze of the encapsulation sublayer farthest from the substrate is between 55% and 65%.

[0009] In some embodiments, the average roughness of the concave-convex surface is between 1.5 and 1.9 micrometers, and the haze of the encapsulation sublayer farthest from the substrate is between 58% and 62%.

[0010] In some embodiments, the concave-convex surface has M protrusions, and the orthographic projections of at least N of the protrusions on the substrate are figures without inflection points. M and N are both positive integers greater than 1, and N / M≥95%.

[0011] In some embodiments, the inflection point-free shape includes one or more of a circle, an ellipse, a rounded polygon, and an irregular shape.

[0012] In some embodiments, the concave-convex surface has M protrusions, the longitudinal section of the protrusions has a curved edge protruding away from the base, and the curved edges of at least P of the protrusions are curves without inflection points. M and P are both positive integers greater than 1, and P / M ≥ 95%.

[0013] In some embodiments, the curve without inflection points is a combination of one or more of the following curves:

[0014] a part of a circle;

[0015] a portion of an ellipse;

[0016] a portion of a rounded polygon;

[0017] A portion of a sine wave graph;

[0018] A portion of a cosine wave graph;

[0019] Part of an irregular shape.

[0020] In some embodiments, the concave-convex surface has a plurality of protrusions, each of which has a first orthographic projection on the substrate, and a size of the first orthographic projection in any direction parallel to the substrate is greater than or equal to 10 microns and less than or equal to 300 microns.

[0021] In some embodiments, the concave-convex surface has M protrusions, and the size of the first orthographic projections of at least Q of the protrusions in any direction parallel to the substrate is between 50 and 200 microns, M and Q are both positive integers greater than 1, and Q / M ≥ 90%.

[0022] In some embodiments, the display substrate further comprises a fluoride layer located on a side of the encapsulation film layer away from the substrate, the fluoride layer covers the concave-convex surface, and a surface of the fluoride away from the substrate is conformal to the concave-convex surface;

[0023] The thickness of the fluoride layer is less than 1 micron.

[0024] In some embodiments, the encapsulation film layer includes multiple encapsulation sublayers, the multiple encapsulation sublayers include a first encapsulation sublayer and a second encapsulation sublayer sequentially arranged in a direction away from the substrate, the first encapsulation sublayer covers the multiple light-emitting devices and is bonded to the second encapsulation sublayer, and the concave-convex surface is the surface of the second encapsulation sublayer away from the substrate;

[0025] The material of the second encapsulation sublayer includes any one of polyethylene terephthalate, polyimide, triacetyl cellulose, polycarbonate, polymethyl methacrylate, and polyethylene.

[0026] In some embodiments, the first encapsulation sublayer includes: a first bonding portion and a second bonding portion, the first bonding portion is located on a side of the light-emitting device away from the substrate, and the second bonding portion is located between two adjacent light-emitting devices; the first bonding portion and the second bonding portion are in contact with each other.

[0027] In some embodiments, the encapsulation film layer includes a layer of the encapsulation sublayer, the first part of the encapsulation sublayer is located on the side of the light-emitting device away from the substrate, and the second part of the encapsulation sublayer is located between two adjacent light-emitting devices; the first part and the second part are an integral structure.

[0028] In some embodiments, the display substrate further comprises: a light shielding layer, the light shielding layer and the light emitting device are located on the same side of the substrate, the light shielding layer has a hollow portion, and an orthographic projection of the hollow portion on the substrate overlaps with an orthographic projection of the light emitting device on the substrate;

[0029] The packaging film layer is located on a side of the light-shielding layer and the light-emitting device away from the substrate.

[0030] In some embodiments, at least one of the encapsulation sub-layers is a dark film layer.

[0031] In some embodiments, the light-emitting device is a Mini-LED light-emitting chip or a Micro-LED light-emitting chip.

[0032] In a second aspect, the present disclosure provides a display device comprising the above-mentioned display substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following detailed description, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0034] Figure 1 This is a schematic diagram of a display substrate provided in some embodiments of the present disclosure.

[0035] Figure 2 This is a schematic diagram of another display substrate provided in some embodiments of the present disclosure.

[0036] Figure 3 This is a partial schematic diagram of an encapsulation sublayer having a concave-convex surface provided in some embodiments of the present disclosure.

[0037] Figure 4 Schematic diagram of height variation of a local area of a concave-convex surface provided in some embodiments of the present disclosure.

[0038] Figure 5Schematic diagrams of display substrates provided in other embodiments of the present disclosure.

[0039] Figure 6 Schematic diagram of a display substrate provided in some further embodiments of the present disclosure.

[0040] Figure 7 Schematic diagram of a display substrate provided in some further embodiments of the present disclosure. DETAILED DESCRIPTION

[0041] The following describes the specific embodiments of the present disclosure in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present disclosure and are not intended to limit the present disclosure.

[0042] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0043] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should have the usual meanings understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0044] As used herein, "parallel" and "perpendicular" include the conditions described and conditions similar to the conditions described, and the range of the similar conditions is within an acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range for approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range for approximate perpendicularity can also be, for example, a deviation within 5°.

[0045] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0046] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thicknesses of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0047] It should be noted that the description of the numerical range "m1-m2" in the embodiments of the present disclosure includes the endpoint values m1 and m2.

[0048] During the various processes of LED (Light-Emitting Diode, LED) direct display products, such as lighting testing, assembly and debugging, disassembly and packaging, dirt will inevitably be introduced onto the screen surface. Among them, fingerprint dirt accounts for the highest proportion. Fingerprints are composed of a mixture of internal secretions (mainly secreted by the epidermis and dermis) and external pollutants (such as shampoo products, cosmetics, sludge and grease), and are more easily introduced during various inspection and installation processes.

[0049] Figure 1 is a schematic diagram of a display substrate provided in some embodiments of the present disclosure, Figure 2 This is a schematic diagram of another display substrate provided in some embodiments of the present disclosure, such as Figure 1 and Figure 2 As shown, the display substrate includes: a base 1, and a plurality of light-emitting devices 2 and an encapsulation film layer 3 located on the base 1. The plurality of light-emitting devices 2 are located between the base 1 and the encapsulation film layer 3. Exemplarily, the light-emitting devices 2 are Mini-LED light-emitting chips or Micro-LED light-emitting chips.

[0050] The surface of the packaging film layer 3 away from the substrate 1 is a concave-convex surface. The setting of the concave-convex surface can prevent ambient light from being reflected by the packaging film layer 3 and directly entering the eyes, thereby effectively reducing glare and reflection.

[0051] The average roughness Ra of the concave and convex surface is between 1.2 and 1.9 microns, and the "average roughness" refers to the arithmetic mean of the absolute value of the deviation of the height of each point on the surface recorded within the evaluation length from the average height.

[0052] The encapsulation film layer 3 includes at least one encapsulation sublayer 30, and the haze of the encapsulation sublayer 30 farthest from the substrate 1 is between 40% and 70%. The haze of the encapsulation sublayer 30 is between 40% and 70%.

[0053] The haze of a film is the ratio of the scattered light flux transmitted through the film and deviating from the incident light direction by more than 2.5 degrees to the transmitted light flux, expressed as a percentage. "More than 2.5 degrees" does not include 2.5°.

[0054] The inventors found that when the haze and average roughness of the encapsulation sublayer 30 farthest from the substrate 1 are too low (for example, the haze is less than 20% and the average roughness is less than 0.5 microns), fingerprints and chemical reagents such as fluorinating agents introduced in general processes can be wiped clean with alcohol, but the microstructure on the surface of the encapsulation film layer 3 is not obvious, resulting in poor dark ink color consistency when the display substrate is used in a spliced display product. Among them, the display substrate is black, dark gray or other dark colors when it is not lit. "Dark ink color consistency" refers to the situation where the visual blackness and glossiness of each display substrate are consistent when the spliced display product is not lit. When the haze of the encapsulation sublayer 30 farthest from the substrate 1 is too high, regardless of whether the average roughness of the surface is low or high, fingerprints and chemical reagents such as fluorinating agents introduced in general processes are difficult to wipe clean. In the embodiment of the present disclosure, the haze value of the encapsulation sublayer 30 farthest from the substrate 1 is between 40% and 70%, and the average surface roughness is between 1.2 and 1.9 microns. In this case, the height difference in the same area is small, and dirt and foreign matter on the surface can be easily wiped out, and the surface of the encapsulation film layer 3 forms a concave-convex structure with a certain roughness, which is beneficial to improving the dark ink color consistency of the screen when the display substrate is used in splicing display products.

[0055] In some embodiments, the average roughness of the concave-convex surface is between 1.3 and 1.9 microns, and the haze of the encapsulation sublayer 30 furthest from the substrate 1 is between 55% and 65%, thereby further improving the wipeability of the display substrate surface and the consistency of the dark ink color of the screen. For example, the average roughness of the concave-convex surface is between 1.3 and 1.5 microns, or between 1.5 and 1.7 microns, or between 1.7 and 1.9 microns; for example, the haze of the encapsulation sublayer 30 furthest from the substrate 1 is between 55% and 60%, or between 60% and 65%.

[0056] Preferably, the average roughness of the concave-convex surface is between 1.5 and 1.9 microns, and the haze of the encapsulation sublayer 30 furthest from the substrate 1 is between 58% and 62%, thereby maximizing the ease of wiping the display substrate surface and the consistency of the dark ink color of the screen. For example, the average roughness of the concave-convex surface is between 1.5 and 1.6 microns, or between 1.6 and 1.7 microns, or between 1.7 and 1.8 microns, or between 1.8 and 1.9 microns; for example, the haze of the encapsulation sublayer 30 furthest from the substrate 1 is between 58% and 60%, or between 60% and 62%.

[0057] Figure 3 is a partial schematic diagram of an encapsulation sublayer 30 having a concave-convex surface provided in some embodiments of the present disclosure, Figure 4 The height distribution diagram and height variation curve of the local area of the concave-convex surface provided in some embodiments of the present disclosure are as follows: Figure 4 Figure (a) is a height distribution diagram, where the depth of color represents the height of each position; Figure (b) is a height curve diagram, and Figure (b) is a curve distribution along the A-A' line in Figure (a), which can also be regarded as a cross-sectional diagram along the A-A' line in Figure (a). Among them, the vertical axis in Figure (b) represents the height from the reference plane, and the reference plane is a plane located between the concave-convex surface and the surface of the encapsulation sublayer facing the substrate 1. In some embodiments, as Figure 3 As shown, the concave-convex surface has M protrusions 3a, and at least N of the protrusions 3a have orthographic projections on the substrate 1 that are free of inflection points. M and N are both positive integers greater than 1, and N / M ≥ 95%. In other words, the orthographic projections of the majority of the protrusions 3a on the substrate 1 are free of inflection points. In the disclosed embodiments, "free of inflection points" refers to a smooth pattern without sharp points. By setting the orthographic projections of the majority of the protrusions 3a on the substrate 1 to be free of inflection points, the wiping properties of the display substrate surface can be further improved.

[0058] For example, the graphics without inflection points include one or more of a circle, an ellipse, a rounded polygon, and an irregular graphic.

[0059] Combine Figure 3 and Figure 4 As shown, in some embodiments, the concave-convex surface has M protrusions 3a, and the longitudinal cross-sections of the protrusions 3a have curved edges that protrude away from the substrate 1. The curved edges of at least P protrusions 3a are curves without inflection points. In the embodiments of the present disclosure, "curves without inflection points" refer to smooth curves without sharp points. M and P are both integers greater than 1, and P / M ≥ 95%. By setting the curved edges of the longitudinal cross-sections of most protrusions 3a to curves without inflection points, the wiping properties of the display substrate surface can be further improved.

[0060] For example, the curve without inflection points is a combination of one or more of the following curves: a portion of a circle, a portion of an ellipse, a portion of a rounded polygon, a portion of a sine wave pattern, a portion of a cosine wave pattern, or a portion of an irregular pattern.

[0061] In some embodiments, the concave-convex surface has a plurality of protrusions 3a, and the protrusions 3a have a first orthographic projection on the substrate 1. The size of the first orthographic projection in any direction parallel to the substrate 1 is greater than or equal to 10 microns and less than or equal to 300 microns, so that the orthographic projection of the protrusions 3a on the substrate 1 will not be too large or too small, which is beneficial to improving the wipeability of dirt on the surface of the packaging film layer 3, and at the same time is beneficial to improving the consistency of the dark ink color.

[0062] Furthermore, the concave-convex surface has M protrusions 3a, and the first orthographic projections of at least Q protrusions 3a in any direction parallel to the substrate 1 have a size between 50 and 200 microns, M and Q are both positive integers greater than 1, and Q / M ≥ 90%. In other words, the first orthographic projections of more than 90% of the protrusions 3a in any direction parallel to the substrate 1 have a size between 50 and 200 microns, thereby further improving the wipeability of dirt on the surface of the encapsulating film layer 3 and the consistency of the dark ink color.

[0063] In some embodiments, the sizes of the first orthographic projections of the plurality of protrusions 3 a in the first direction are various, and the first direction is a direction parallel to the substrate 1 .

[0064] In some embodiments, as Figure 1 and Figure 2 As shown, the packaging film layer 3 includes a multi-layer packaging sublayer 30, and the multi-layer packaging sublayer 30 includes a first packaging sublayer 31 and a second packaging sublayer 32 arranged in sequence along the direction away from the substrate 1. The first packaging sublayer 31 covers a plurality of light-emitting devices 2 and is bonded to the second packaging sublayer. The concave and convex surface is the surface of the second packaging sublayer 32 away from the substrate 1.

[0065] In some embodiments, the first encapsulation sub-layer 31 is a cured colloid material.

[0066] In some embodiments, the material of the second encapsulation sublayer 32 may include any one of PET (polyethylene terephthalate), PI (polyimide), TAC (triacetyl cellulose), PC (polycarbonate), PMMA (polymethyl methacrylate), and PE (polyethylene).

[0067] In some embodiments, the first encapsulation sublayer 31 includes a first adhesive portion 311 and a second adhesive portion 312. The first adhesive portion 311 is located on the side of the light-emitting device 2 away from the substrate 1, and the second adhesive portion 312 is located between two adjacent light-emitting devices 2. The first adhesive portion 311 and the second adhesive portion 312 are in contact with each other. In this case, the thickness of the second adhesive portion 312 is greater than the thickness of the light-emitting device 2 to achieve contact between the first adhesive portion 311 and the second adhesive portion 312. In this way, each light-emitting device 2 can be completely covered by the first adhesive portion 311 and the second adhesive portion 312, thereby better protecting the light-emitting device 2 and preventing the light-emitting device 2 from being squeezed and damaged.

[0068] In some embodiments, the first adhesive portion 311 and the second adhesive portion 312 are arranged in contact with each other, with the second adhesive portion 312 contacting the substrate 1 and the second encapsulation sublayer 32, respectively, while the first adhesive portion 311 contacts the light-emitting device 2 and the second encapsulation sublayer 32, respectively. In this case, the thickness of the second adhesive portion 312 is equal to or greater than the sum of the thicknesses of the first adhesive portion 311 and the light-emitting device 2. In this way, the first adhesive portion 311 and the second adhesive portion 312 can completely fill the space between the second encapsulation sublayer 32 and the substrate 1, thereby better protecting the light-emitting device 2.

[0069] In some embodiments, multiple light-emitting devices 2 are separated by the second adhesive portion 312, and the light-emitting device 2 is in direct contact with the second adhesive portion 312. In this way, the second adhesive portion 312 can protect the light-emitting device 2 at the periphery of the light-emitting device 2 to prevent the light-emitting device 2 from being squeezed and damaged by contact with the second encapsulation sublayer 32.

[0070] In some embodiments, the orthographic projection of the first bonding portion 311 on the substrate 1 covers the center of the orthographic projection of the light emitting region of the light emitting device 2 on the substrate 1 . The first bonding portion 311 may partially cover the light emitting region of the light emitting device 2 .

[0071] In some embodiments, the orthographic projection of the first bonding portion 311 on the substrate 1 covers the orthographic projection of the light emitting region of the light emitting device 2 on the substrate 1 . The first bonding portion 311 may completely cover the light emitting region of the light emitting device 2 .

[0072] In some examples, the surface of the first encapsulation sublayer 31 facing the substrate 1 is the first surface, and the substrate 1 and the light-emitting device 2 are assembled into a light board. The first surface is conformal to the surface of the light board facing the encapsulation film layer 3 .

[0073] In some embodiments, as Figure 1 As shown, the first encapsulation sublayer 31 is a single-layer structure, and the first bonding portion 311 and the second bonding portion 312 are made of the same material. For example, the first bonding portion 311 and the second bonding portion 312 are both made of acrylic resin.

[0074] In other embodiments, Figure 2 As shown, the first encapsulation sublayer 31 is a composite layer formed of a multi-layer structure. For example, the first encapsulation adhesive layer includes a stacked filling layer 31a and a bonding layer 31b, wherein the bonding layer 31b is located between the filling layer 31a and the second encapsulation sublayer 32.

[0075] For example, the material of the filling layer 31 a may include an epoxy resin material, and the material of the adhesive layer 31 b may include an acrylic resin material.

[0076] When the first encapsulation sublayer 31 is a composite layer, a portion of the filling layer 31a is located on the side of the light emitting device 2 away from the substrate 1, and the relationship between the thickness of the adhesive layer 31b and the height of the light emitting device 2 is not limited. Figure 2 As shown, the second bonding portion 312 includes a portion of the filling layer 31a and a portion of the bonding layer 31b, and the first bonding portion 311 may include a portion of the filling layer 31a and a portion of the bonding layer 31b; of course, the first bonding portion 311 may also only include a portion of the bonding layer 31b.

[0077] In this case, the first encapsulation sublayer 31 can be formed on the lamp board by pressing.

[0078] Figure 5 Schematic diagrams of display substrates provided in other embodiments of the present disclosure, Figure 5 The display substrate shown is Figure 1 Similar, but different. Figure 5 The display substrate further includes a light-shielding layer 4. The light-shielding layer 4 and the light-emitting device 2 are located on the same side of the substrate 1. The light-shielding layer 4 has a hollow portion, and the orthographic projection of the hollow portion on the substrate 1 overlaps with the orthographic projection of the light-emitting device 2 on the substrate 1. The encapsulation film layer 3 is located on the side of the light-shielding layer 4 and the light-emitting device 2 that is away from the substrate 1. The light-shielding layer 4 may be a black coating. The provision of the light-shielding layer 4 can make the display substrate appear darker in the dark state.

[0079] It should be noted that Figure 5 The first encapsulation sublayer 31 is shown as a single-layer structure. Figure 5 The first encapsulation sublayer 31 in Figure 2 The method is set to composite layer structure.

[0080] It should also be noted that the display substrate may not be provided with the light shielding layer 4, but at least one encapsulation sublayer 30 may be provided as a dark film layer. Figure 1 For the display substrate shown in FIG. 1 , at least one of the first encapsulation sublayer 31 and the second encapsulation sublayer 32 can be set as a dark film layer; Figure 2For the display substrate shown, at least one of the filling layer 31 a , the adhesive layer 31 b , and the second encapsulation sublayer 32 may be set as a dark film layer.

[0081] The “dark film layer” in the embodiment of the present disclosure refers to a film layer that has a low transmittance to visible light (for example, not exceeding 75%) and visually appears to be a dark color such as black or dark gray.

[0082] Figure 6 Schematic diagram of a display substrate provided in some embodiments of the present disclosure, such as Figure 6 As shown, the encapsulation film layer 3 in the display substrate can include only one encapsulation sublayer 30. In this case, the surface of the encapsulation sublayer 30 away from the substrate is a concave-convex surface with an average roughness of 1.2 to 1.9 microns. The haze of the encapsulation sublayer 30 is between 40% and 70%. Figure 6 In the embodiment, the morphology of the concave-convex surface and the haze of the encapsulation sublayer 30 are all described in the above embodiment.

[0083] exist Figure 6 In the embodiment, the first portion 301 of the encapsulation sublayer 30 is located on the side of the light emitting device 2 away from the substrate 1, and the second portion 302 of the encapsulation sublayer 30 is located between two adjacent light emitting devices 2; the first portion 301 and the second portion 302 are an integral structure. Figure 6 In the embodiment, each light-emitting device 2 can be completely covered by the first portion 301 and the second portion 302 of the encapsulation sublayer 30, thereby better protecting the light-emitting device 2 and preventing the light-emitting device 2 from being squeezed and damaged.

[0084] In one example, the second portion 302 may be in contact with the substrate 1; in another example, a light-shielding layer 4 may be provided between the second portion 302 and the substrate 1; or, the light-shielding layer 4 may not be provided, and the encapsulation sublayer 30 may be provided as a dark film layer.

[0085] In one example, Figure 6 The surface of the encapsulation sublayer 30 facing the substrate 1 is conformal to the surface of the light board facing the encapsulation sublayer 30 .

[0086] Figure 7 Schematic diagram of a display substrate provided in some embodiments of the present disclosure, such as Figure 7 As shown, in some embodiments, the display substrate further includes a fluoride layer 5 located on the side of the encapsulation film layer 3 away from the substrate 1. The fluoride layer 5 covers the concave and convex surface, and the surface of the fluoride layer 5 away from the substrate 1 is conformal to the concave and convex surface. The provision of the fluoride layer 5 can increase the contact angle of the surface of the encapsulation film layer 3, making the surface of the encapsulation film layer 3 more hydrophobic, thereby making it easier to wipe away dirt on the surface of the display substrate.

[0087] The contact angle is the angle θ between the solid-liquid boundary and the tangent line of the gas-liquid interface at the intersection of the gas, liquid, and solid phases. This angle, θ, is a measure of wettability. If θ is less than 90°, the solid surface is hydrophilic, meaning liquids easily wet the solid. The smaller the angle, the better the wettability. If θ is greater than 90°, the solid surface is hydrophobic, meaning liquids do not easily wet the solid and migrate easily across the surface.

[0088] Here, “the surface of the fluoride layer 5 away from the substrate 1 is conformal to the concavo-convex surface” means that the fluoride layer 5 is a film layer with uniform thickness. Therefore, the morphology of the surface of the fluoride layer 5 away from the substrate 1 is roughly the same as that of the concavo-convex surface.

[0089] In one example, the thickness of the fluoride layer 5 is less than 1 micrometer, for example, the thickness of the fluoride layer 5 is less than 500 nm; or less than 300 nm; or less than 100 nm.

[0090] Among them, after the fluoride layer 5 is formed on the encapsulation film layer 3 and the thickness of the fluoride layer 5 is less than 1 micron, the haze of the overall film layer composed of the encapsulation sublayer 30 farthest from the substrate 1 and the fluoride layer 5 is the same or substantially the same as the haze of the encapsulation sublayer 30 farthest from the substrate 1; the roughness of the surface of the above-mentioned overall film layer away from the substrate 1 is the same or substantially the same as the surface roughness of the encapsulation sublayer 30 farthest from the substrate 1.

[0091] In actual applications, when a fluoride layer 5 is formed on the encapsulation film layer 3 and the thickness of the fluoride layer 5 is less than 1 micron, when measuring the roughness of the concave-convex surface and the haze of the encapsulation sublayer 30 farthest from the substrate 1, the roughness of the above-mentioned overall film layer away from the surface of the substrate 1 and the haze of the overall film layer are respectively used as the roughness of the above-mentioned concave-convex surface and the haze of the encapsulation sublayer 30 farthest from the substrate 1.

[0092] It should be noted that Figure 7 is Figure 1 The fluoride layer 5 is added to the display substrate shown in the figure. Figure 2 、 Figures 5 and 6 The display substrate shown may also be provided with a fluoride layer 5 .

[0093] In each embodiment of the present disclosure, an injection molding process can be used to form an encapsulation sublayer 30 with a concave-convex surface. The mold used in the injection molding process has a rough surface that matches the concave-convex surface of the encapsulation sublayer 30. The rough surface can be formed by sandblasting or laser engraving. Sandblasting refers to a process in which a special abrasive is sprayed onto the mold surface by mechanical or chemical means to form different morphologies on the mold surface. The specific process is as follows: 1) Pretreatment: This includes cleaning the mold surface, removing grease and impurities on the surface, and polishing the mold surface. 2) Designing the sandblasting location and technical parameters such as sandblasting pressure, angle, and speed. 3) Material preparation. Commonly used sandblasting materials include aluminum sand, quartz sand, glass beads, etc. These sandblasting materials can be used for different workpiece surface treatments based on their different particle size, shape, hardness, and other characteristics. 4) Sandblasting. When sandblasting, it is necessary to ensure the stability of the sandblasting equipment, sandblasting pressure, angle, speed, and other technical parameters so that the sandblasting material can be evenly covered on the mold surface. After sandblasting is completed, the mold needs to be cleaned to remove excess sandblasting materials and impurities on the surface to ensure the surface smoothness and quality of the mold.

[0094] Laser engraving achieves the desired topography on the mold surface by controlling relevant parameters such as laser energy, spot size, spot trajectory, and speed. The process is as follows: First, clean the mold roller to be engraved. Next, select the appropriate spot size using a power meter, engrave along the designed path, and finally inspect the results.

[0095] An embodiment of the present disclosure further provides a display device, comprising the display substrate in the above embodiment.

[0096] In some examples, the display device may be a tiled display device.

[0097] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display substrate, characterized in that: include: substrate; A plurality of light-emitting devices and an encapsulation film layer are located on the substrate, wherein the light-emitting devices are located between the substrate and the encapsulation film layer; The surface of the packaging film layer away from the substrate is a concave-convex surface, and the average roughness of the concave-convex surface is between 1.2 and 1.9 microns. The packaging film layer includes at least one packaging sublayer, and the haze of the packaging sublayer farthest from the substrate is between 40% and 70%.

2. The display substrate according to claim 1, wherein: The average roughness of the concave-convex surface is between 1.3 and 1.9 micrometers, and the haze of the encapsulation sublayer farthest from the substrate is between 55% and 65%.

3. The display substrate according to claim 2, wherein: The average roughness of the concave-convex surface is between 1.5 and 1.9 micrometers, and the haze of the encapsulation sublayer farthest from the substrate is between 58% and 62%.

4. The display substrate according to claim 1, wherein The concave-convex surface has M protrusions, and the orthographic projections of at least N of the protrusions on the base are figures without inflection points. Both M and N are positive integers greater than 1, and N / M≥95%.

5. The display substrate according to claim 4, wherein: The graphics without inflection points include one or more of a circle, an ellipse, a rounded polygon and an irregular graphic.

6. The display substrate according to claim 1, wherein: The concave-convex surface has M protrusions, and the longitudinal section of the protrusions has a curved edge protruding away from the base. The curved edges of at least P protrusions are curves without inflection points. M and P are both positive integers greater than 1, and P / M≥95%.

7. The display substrate according to claim 6, wherein: The curve without inflection points is a combination of one or more of the following curves: a part of a circle; a portion of an ellipse; a portion of a rounded polygon; A portion of a sine wave graph; A portion of a cosine wave graph; Part of an irregular shape.

8. The display substrate according to claim 1, wherein: The concave-convex surface has a plurality of protrusions, each of which has a first orthographic projection on the substrate, and a size of the first orthographic projection in any direction parallel to the substrate is greater than or equal to 10 micrometers and less than or equal to 300 micrometers.

9. The display substrate according to claim 8, wherein: The concave-convex surface has M protrusions, and the size of the first orthographic projections of at least Q protrusions in any direction parallel to the substrate is between 50 and 200 microns. M and Q are both positive integers greater than 1, and Q / M≥90%.

10. The display substrate according to claim 1, wherein The display substrate further comprises a fluoride layer located on a side of the packaging film layer away from the substrate, the fluoride layer covers the concave-convex surface, and a surface of the fluoride away from the substrate is conformal to the concave-convex surface; The thickness of the fluoride layer is less than 1 micron.

11. The display substrate according to any one of claims 1 to 10, characterized in that: The encapsulation film layer includes multiple encapsulation sublayers, which include a first encapsulation sublayer and a second encapsulation sublayer sequentially arranged in a direction away from the substrate, the first encapsulation sublayer covers the multiple light-emitting devices and is bonded to the second encapsulation sublayer, and the concave-convex surface is the surface of the second encapsulation sublayer away from the substrate; The material of the second encapsulation sublayer includes any one of polyethylene terephthalate, polyimide, triacetyl cellulose, polycarbonate, polymethyl methacrylate, and polyethylene.

12. The display substrate according to claim 11, wherein: The first encapsulation sublayer includes: a first bonding portion and a second bonding portion, the first bonding portion is located on a side of the light-emitting device away from the substrate, and the second bonding portion is located between two adjacent light-emitting devices; the first bonding portion and the second bonding portion are in contact with each other.

13. The display substrate according to any one of claims 1 to 10, characterized in that: The packaging film layer includes a packaging sublayer, the first part of the packaging sublayer is located on the side of the light-emitting device away from the substrate, and the second part of the packaging sublayer is located between two adjacent light-emitting devices; the first part and the second part are an integral structure.

14. The display substrate according to any one of claims 1 to 10, characterized in that: The display substrate further includes: a light shielding layer, wherein the light shielding layer and the light emitting device are located on the same side of the base, the light shielding layer has a hollow portion, and an orthographic projection of the hollow portion on the base overlaps with an orthographic projection of the light emitting device on the base; The packaging film layer is located on a side of the light-shielding layer and the light-emitting device away from the substrate.

15. The display substrate according to any one of claims 1 to 10, characterized in that: At least one of the encapsulation sub-layers is a dark film layer.

16. The display substrate according to any one of claims 1 to 10, characterized in that: The light-emitting device is a Mini-LED light-emitting chip or a Micro-LED light-emitting chip.

17. A display device, characterized in that: A display substrate comprising the display substrate according to any one of claims 1 to 16.

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