Automatic intelligent gluing machine for IGBT (Insulated Gate Bipolar Translator) semiconductor

Abstract

The utility model relates to the technical field of semiconductor gluing, in particular to an automatic intelligent gluing machine for an IGBT (Insulated Gate Bipolar Translator) semiconductor, and provides the following scheme aiming at the problems that the gluing is solidified, the gluing operation cannot be carried out and the distribution of the gluing is not uniform due to the fact that the gluing cannot be effectively subjected to soaking treatment when the gluing operation is carried out in the prior art. The table comprises a table body; the glue storage machine is arranged on the table body, a plurality of sliding rails are fixedly installed on the table body, sliding grooves are formed in the sliding rails, a first sealing box and a second sealing box are connected to the sliding rails in a sliding mode respectively, the glue storage machine is fixedly installed between the first sealing box and the second sealing box, and a box cover is installed on the glue storage machine in a rotating mode. The glue in the glue storage machine is continuously subjected to uniform heat treatment, and meanwhile, a plurality of pulp plates on a plurality of fluctuation plates assist the glue, so that the glue in the glue storage machine can be effectively and uniformly heated, and the glue is prevented from being solidified.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor gluing, in particular to an IGBT semiconductor automatic intelligent gluing machine. Background Art

[0002] IGBT (Insulated Gate Bipolar Transistor) is a composite fully controlled voltage-driven power semiconductor device that combines the advantages of bipolar junction transistor (BJT) and insulated gate field effect transistor (MOS). When producing IGBT, it needs to be coated with glue, which requires the use of an IGBT semiconductor automatic intelligent coating machine.

[0003] In the prior art, during the gluing process, the glue cannot be effectively heat-treated, resulting in the glue solidifying, making it impossible to proceed with the gluing process, and the glue distribution is uneven.

[0004] Therefore, we proposed an IGBT semiconductor automatic intelligent glue coating machine to solve the above problems. Utility Model Content

[0005] The purpose of the utility model is to solve the shortcomings of the prior art in that during the gluing operation, the glue cannot be effectively heat-treated, resulting in the glue solidifying, making the gluing operation impossible and the glue distribution uneven, and to propose an IGBT semiconductor automatic intelligent gluing machine.

[0006] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0007] An IGBT semiconductor automatic intelligent glue coating machine, comprising:

[0008] Table body;

[0009] The glue depositor is arranged on a table body, wherein a plurality of slide rails are fixedly mounted on the table body, each of the plurality of slide rails is provided with a slide groove, and the plurality of slide rails are respectively slidably connected to the sealed box 1 and the sealed box 2, the glue depositor is fixedly mounted between the sealed box 1 and the sealed box 2, and a box cover is rotatably mounted on the glue depositor, and a buckle is fixedly mounted on the box cover;

[0010] The uniform heating mechanism is installed in the glue depositor and is used to perform uniform heat treatment on the glue;

[0011] The reciprocating mechanism is arranged in the second sealing box and is used for realizing reciprocating movement.

[0012] Preferably, a mounting plate is fixedly mounted on the bottom end of the sealing box 1 and the sealing box 2, and a plurality of driving pulleys are rotatably mounted on the plurality of mounting plates, and the plurality of driving pulleys are slidably connected to the plurality of sliding grooves.

[0013] Preferably, a chassis is fixedly mounted on the sealed box 1, a motor is fixedly mounted in the chassis, a transmission shaft 1 is fixedly mounted on the output shaft of the motor, and the transmission shaft 1 is rotatably mounted in the sealed box 1.

[0014] Preferably, the uniform heating mechanism includes a heating roller and multiple fluctuating plates, the heating roller is fixedly connected to a transmission shaft, the glue depositor is provided with multiple sliding grooves, the multiple sliding grooves are respectively slidably connected to the multiple fluctuating plates, and the multiple pulp plates are respectively fixedly mounted with multiple pulp plates.

[0015] Preferably, the reciprocating mechanism includes a second transmission shaft, which is fixedly connected to the heating roller, a semicircular gear fixedly mounted on the second transmission shaft, a rectangular rack meshed with the semicircular gear, and the rectangular rack fixedly connected to a plurality of wave plates.

[0016] Preferably, the semicircular gear is rotatably installed in the second sealing box, and the rectangular rack is slidably installed in the second sealing box.

[0017] Preferably, the transmission shaft 1 and the transmission shaft 2 are both sleeved with sealing rubber rings, and the plurality of sealing rubber rings are rotatably connected to the sealing box 1 and the sealing box 2 respectively.

[0018] Preferably, a guide plate is fixedly mounted on the glue depositing machine, and a plurality of glue application holes are provided on the guide plate for performing glue application on the IGBT semiconductor.

[0019] In the present invention, the beneficial effects of the IGBT semiconductor automatic intelligent glue coating machine are as follows:

[0020] (1) By driving the heating roller to rotate differently by the motor, the glue in the glue depositor can be effectively heated evenly to prevent the glue from solidifying.

[0021] (2) The multiple pulp plates on the multiple fluctuating plates can effectively and evenly move the glue in the glue depositor to prevent the glue on the top from solidifying.

[0022] The utility model uses the self-rotation of the heating roller to continuously and evenly heat the glue in the glue depositor. At the same time, the multiple pulp plates on the multiple undulating plates assist it, which can effectively heat the glue in the glue depositor evenly and avoid the glue solidification. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a structural diagram of an IGBT semiconductor automatic intelligent glue coating machine proposed by the utility model;

[0024] Figure 2 This is a schematic diagram of the exploded structure of a glue depositor of an IGBT semiconductor automatic intelligent glue coating machine proposed in the present invention;

[0025] Figure 3 This is a schematic diagram of the rectangular rack structure of an IGBT semiconductor automatic intelligent gluing machine proposed in the utility model.

[0026] In the figure: 1. Table body; 2. Slide rail; 3. Slide groove; 4. Sealed box 1; 5. Sealed box 2; 6. Chassis; 7. Glue depositor; 8. Box cover; 9. Buckle; 10. Motor; 11. Mounting plate; 12. Drive pulley; 13. Transmission shaft 1; 14. Heating roller; 15. Fluctuation plate; 16. Semicircular gear; 17. Rectangular rack; 18. Guide plate; 19. Glue application hole. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0028] Example 1

[0029] Reference Figure 1-Figure 3 , an IGBT semiconductor automatic intelligent glue coating machine, comprising:

[0030] Table 1;

[0031] The glue depositor 7 is provided on the table 1. A plurality of slide rails 2 are fixedly mounted on the table 1. Each of the slide rails 2 is provided with a slide groove 3. The plurality of slide rails 2 are respectively slidably connected to the sealing box 1 4 and the sealing box 2 5. The glue depositor 7 is fixedly mounted between the sealing box 1 4 and the sealing box 2 5. A box cover 8 is rotatably mounted on the glue depositor 7. A buckle 9 is fixedly mounted on the box cover 8.

[0032] The uniform heating mechanism is provided in the glue depositor 7 and is used to perform a uniform heat treatment on the glue;

[0033] The reciprocating mechanism is arranged in the sealing box 2 5 and is used to realize reciprocating movement.

[0034] In the present invention, a mounting plate 11 is fixedly mounted on the bottom end of the sealing box 1 4 and the sealing box 2 5 , and a plurality of driving pulleys 12 are rotatably mounted on the plurality of mounting plates 11 , and the plurality of driving pulleys 12 are slidably connected to the plurality of chutes 3 .

[0035] In the present invention, a chassis 6 is fixedly mounted on the sealed box 4, a motor 10 is fixedly mounted in the chassis 6, a transmission shaft 13 is fixedly mounted on the output shaft of the motor 10, and the transmission shaft 13 is rotatably mounted in the sealed box 4.

[0036] In the present invention, the uniform heating mechanism includes a heating roller 14 and a plurality of fluctuating plates 15. The heating roller 14 is fixedly connected to the transmission shaft 13. The glue depositor 7 is provided with a plurality of sliding grooves, which are respectively slidably connected to the plurality of fluctuating plates 15. The plurality of fluctuating plates 15 are respectively fixedly mounted with a plurality of pulp plates.

[0037] In the present invention, the reciprocating mechanism includes a transmission shaft 2, which is fixedly connected to the heating roller 14. A semicircular gear 16 is fixedly mounted on the transmission shaft 2, and a rectangular rack 17 is meshed on the semicircular gear 16. The rectangular rack 17 is fixedly connected to multiple fluctuating plates 15.

[0038] In the present invention, the semicircular gear 16 is rotatably mounted in the sealing box 2 5 , and the rectangular rack 17 is slidably mounted in the sealing box 2 5 .

[0039] In the present invention, a sealing rubber ring is sleeved on the transmission shaft 13 and the transmission shaft 2, and a plurality of sealing rubber rings are rotatably connected to the sealing box 1 4 and the sealing box 2 5 respectively.

[0040] In the present invention, a guide plate 18 is fixedly mounted on the glue depositor 7 , and a plurality of glue application holes 19 are provided on the guide plate 18 for performing glue application on the IGBT semiconductor.

[0041] In the present invention, the glue is poured into the glue depositor 7 by opening the box cover 8, and the box cover 8 and the glue depositor 7 are fixed and sealed by a pair of buckles 9 and multiple sealing rings to prevent the glue from spilling. The motor 10 is started to drive the heating roller 14 to rotate through the transmission shaft 13, so that the glue in the glue depositor 7 is evenly heated, and the transmission shaft 2 drives the semicircular gear 16 and the rectangular rack 17 to operate in the sealing box 2 5, and drives the multiple fluctuating plates 15 to slide back and forth in the glue depositor 7, and cooperates with the multiple pulp plates to evenly move the glue inside the glue depositor 7 to achieve uniform heating, and flow out through the multiple glue holes 19 on the guide plate 18. At the same time, the driving pulleys 12 in the multiple slide rails 2 drive the sealing box 1 4, the sealing box 2 5 and the glue depositor 7 above them to slide along the slide groove 3 to perform the glue coating operation on the IGBT semiconductor on the table body 1.

[0042] Example 2

[0043] The difference between this embodiment and the first embodiment is that an air pressure valve is fixedly installed on the glue depositor 7, which can perform air pressure treatment in the glue depositor 7 to achieve more uniform glue coating by the glue depositor 7 during the glue coating operation.

[0044] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. An IGBT semiconductor automatic intelligent glue coating machine, characterized in that: include: Table (1); The glue deposit machine (7) is arranged on the table body (1). A plurality of slide rails (2) are fixedly installed on the table body (1). The plurality of slide rails (2) are all provided with slide grooves (3). The plurality of slide rails (2) are respectively slidably connected to the sealing box 1 (4) and the sealing box 2 (5). The glue deposit machine (7) is fixedly installed between the sealing box 1 (4) and the sealing box 2 (5). A box cover (8) is rotatably installed on the glue deposit machine (7), and a buckle (9) is fixedly installed on the box cover (8); A uniform heating mechanism is provided in the glue depositor (7) and is used for performing a uniform heat treatment on the glue; The reciprocating mechanism is arranged in the sealing box 2 (5) and is used to realize reciprocating movement.

2. The IGBT semiconductor automatic intelligent glue coating machine according to claim 1, characterized in that: The bottom ends of the sealing box 1 (4) and the sealing box 2 (5) are both fixedly mounted with mounting plates (11), and a plurality of driving pulleys (12) are rotatably mounted on the plurality of mounting plates (11), and the plurality of driving pulleys (12) are respectively slidably connected to the plurality of chute grooves (3).

3. The IGBT semiconductor automatic intelligent glue coating machine according to claim 1, characterized in that: The sealed box (4) is fixedly mounted with a chassis (6), the chassis (6) is fixedly mounted with a motor (10), the output shaft of the motor (10) is fixedly mounted with a transmission shaft (13), and the transmission shaft (13) is rotatably mounted in the sealed box (4).

4. The IGBT semiconductor automatic intelligent glue coating machine according to claim 1, characterized in that: The uniform heating mechanism comprises a heating roller (14) and a plurality of fluctuating plates (15). The heating roller (14) is fixedly connected to a transmission shaft (13). The glue depositor (7) is provided with a plurality of sliding grooves. The plurality of sliding grooves are respectively slidably connected to the plurality of fluctuating plates (15). The plurality of fluctuating plates (15) are respectively fixedly mounted with a plurality of pulp plates.

5. The IGBT semiconductor automatic intelligent glue coating machine according to claim 4, characterized in that: The reciprocating mechanism comprises a second transmission shaft, which is fixedly connected to the heating roller (14); a semicircular gear (16) is fixedly mounted on the second transmission shaft; a rectangular rack (17) is meshed with the semicircular gear (16); and the rectangular rack (17) is fixedly connected to a plurality of wave plates (15).

6. The IGBT semiconductor automatic intelligent glue coating machine according to claim 5, characterized in that: The semicircular gear (16) is rotatably mounted in the second sealing box (5), and the rectangular rack (17) is slidably mounted in the second sealing box (5).

7. The IGBT semiconductor automatic intelligent glue coating machine according to claim 4, characterized in that: The transmission shaft 1 (13) and the transmission shaft 2 are both sleeved with sealing rubber rings, and the plurality of sealing rubber rings are rotatably connected to the sealing box 1 (4) and the sealing box 2 (5) respectively.

8. The IGBT semiconductor automatic intelligent glue coating machine according to claim 1, characterized in that: A guide plate (18) is fixedly mounted on the glue depositing machine (7), and a plurality of glue application holes (19) are provided on the guide plate (18) for performing glue application on the IGBT semiconductor.

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