Stamping device and stamping equipment for copper-aluminum composite terminal
The copper-aluminum composite terminals are stamped first and secondly through the double stamping mechanism, scraping off the aluminum layer of the copper-aluminum connection interface, solving the problem of uneven copper-aluminum connection and improving product yield and conductive properties.
Patent Information
- Application Number
- CN202422270388.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-09-14
AI Technical Summary
During the stamping and forming process of existing copper-aluminum composite terminals, the copper-aluminum connection interface is uneven, resulting in poor conductivity and low product yield.
The double stamping mechanism is designed. After the first stamping is formed, the copper-aluminum connection interface is scraped twice through the scraping ring to ensure that the sides of the copper-aluminum connection are flat.
The product yield of copper-aluminum composite terminals is improved, ensuring the flat interface of copper-aluminum connection and improving conductive performance.
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Figure CN223250311U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of stamping equipment, and in particular to a stamping device and stamping equipment for copper-aluminum composite terminals. Background Art
[0002] Terminal blocks are a type of connector that enables electrical connections and are widely used in electronic, electrical, and communications equipment. Terminals made of copper-aluminum composite material are typically formed by stamping the material strip using stamping equipment.
[0003] For example, the Chinese patent application number CN202011451337.6 discloses a one-time stamping forming device for manufacturing copper-aluminum terminal blocks, including a base, a bracket, a stamping device, a cooling device, a cutting device and a heat dissipation device. The base includes an upper base plate, the bracket includes a load-bearing plate and a top plate, the lower surface of the load-bearing plate is connected to the upper surface of the upper base plate, the stamping device includes a hydraulic pump and a push rod, the lower surfaces of the two hydraulic pumps are connected to the upper surface of the top plate, the upper surface of the top plate is provided with two through holes, the two push rods are respectively slidably matched with the two through holes, and one end of the two push rods is respectively connected to the lower surfaces of the two hydraulic pumps.
[0004] However, the structural design of the above-mentioned stamping forming device has the following problems during use:
[0005] The above-mentioned stamping forming device uses a hydraulic pump to push the top plate to move so as to stamp the material strip in one step. However, in the actual production process, since the hardness of aluminum is lower than that of copper, when the copper-aluminum strip is stamped, the interface between the copper and aluminum will be aluminum-clad, which makes the copper-aluminum connection interface uneven. Figure 1 As shown, this results in poor terminal conductivity and low product yield.
[0006] Therefore, there is an urgent need for a stamping device that can make the copper-aluminum connection interface smooth and improve product yield. Utility Model Content
[0007] The purpose of the present disclosure is to overcome the deficiencies in the prior art and provide a stamping device and stamping equipment for copper-aluminum composite terminals that can make the copper-aluminum connection interface smooth and improve product yield.
[0008] The purpose of this disclosure is achieved through the following technical solutions:
[0009] A stamping device for copper-aluminum composite terminals, comprising:
[0010] a first stamping mechanism, the first stamping mechanism comprising a first upper die, a first upper punch, a first lower die, and a first lower punch, the first upper punch being mounted on the first upper die, the first lower punch being mounted on the first lower die, the first upper punch being arranged opposite to the first lower punch so that the first upper die and the first lower die are moved toward each other to perform a first stamping forming on the material;
[0011] The second stamping mechanism includes a second upper die, a second upper punch, a second lower die, a second lower punch and an ejector. The second upper punch is installed on the second upper die, and the second lower punch is installed on the second lower die. A receiving groove is provided in the second lower punch. The ejector is located in the receiving groove and is connected to the second lower die. The ejector is used to eject the material out of the receiving groove. The second lower punch is provided with a scraper ring on the end face adjacent to the second upper punch. The scraper ring is used to scrape off the aluminum layer on the side of the material.
[0012] In one embodiment, the scraper ring and the end surface of the second lower punch form a preset angle.
[0013] In one embodiment, the preset angle is 30°-45°.
[0014] In one embodiment, a boss is provided on the end surface of the ejector adjacent to the second upper punch, and the boss is used to form a groove at the bottom of the material.
[0015] In one embodiment, the boss is flush with the end of the scraper ring.
[0016] In one embodiment, the end surface of the second upper punch adjacent to the second lower punch is a plane.
[0017] In one embodiment, the end surface of the first upper punch adjacent to the first lower punch is a plane.
[0018] In one embodiment, an embedding groove is provided in the first lower punch, and the embedding groove is used for embedding materials.
[0019] In one embodiment, the end surface of the first lower punch adjacent to the first upper punch is a plane.
[0020] A stamping device comprises the stamping device for copper-aluminum composite terminals described in any one of the above embodiments.
[0021] Compared with the prior art, the present disclosure has at least the following advantages:
[0022] In the aforementioned stamping device for copper-aluminum composite terminals, when the first upper die and the first lower die move toward each other, the first upper punch and the first lower punch perform a first stamping operation on the material to initially form the material into the corresponding shape. However, at this time, the side surfaces of the copper-aluminum connection are uneven. A second stamping operation is then performed on the material by a second stamping mechanism. When the first upper punch and the second punch move toward each other, the ejector member presses against the bottom of the material, and the scraper ring scrapes off the aluminum layer on the side surfaces of the material, making the side surfaces of the copper-aluminum connection of the material smooth. Specifically, the material is stamped for the first time by the first stamping mechanism, and for the second time by the second stamping mechanism. During the second stamping operation, the scraper ring scrapes off the aluminum layer on the side surfaces of the material, making the copper-aluminum connection interface smooth, thereby improving the product yield. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.
[0024] Figure 1 This is a schematic structural diagram of a stamping device for a copper-aluminum composite terminal according to one embodiment;
[0025] Figure 2 for Figure 1 Another structural schematic diagram of a stamping device for a copper-aluminum composite terminal is shown;
[0026] Figure 3 for Figure 1 A schematic structural diagram of a second lower punch of a stamping device for a copper-aluminum composite terminal is shown;
[0027] Figure 4 for Figure 1 A schematic structural diagram of an ejector of a stamping device for a copper-aluminum composite terminal is shown;
[0028] Figure 5 for Figure 1 Another structural schematic diagram of a stamping device for copper-aluminum composite terminals is shown. DETAILED DESCRIPTION
[0029] To facilitate understanding of the present disclosure, a more comprehensive description of the present disclosure will be provided below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present disclosure. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure.
[0030] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.
[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. The terms used herein in the specification of this disclosure are intended only to describe specific embodiments and are not intended to limit this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0032] The present disclosure provides a stamping device for a copper-aluminum composite terminal, comprising a first stamping mechanism and a second stamping mechanism, wherein the first stamping mechanism comprises a first upper die, a first upper punch, a first lower die and a first lower punch, the first upper punch being mounted on the first upper die, the first lower punch being mounted on the first lower die, the first upper punch and the first lower punch being arranged opposite to each other, so that the first upper die and the first lower die are subjected to a first stamping forming on the material when they move toward each other; a second stamping mechanism, wherein the second stamping mechanism comprises a second upper die, a second upper punch, a second lower die, a second lower punch and an ejector, the second upper punch being mounted on the second upper die, the second lower punch being mounted on the second lower die, a receiving groove being provided in the second lower punch, the ejector being located in the receiving groove and connected to the second lower die, the ejector being used to eject the material out of the receiving groove, the second lower punch being provided with a scraper ring on an end face adjacent to the second upper punch, the scraper ring being used to scrape off the aluminum layer on the side of the material.
[0033] In the aforementioned stamping device for copper-aluminum composite terminals, when the first upper die and the first lower die move toward each other, the first upper punch and the first lower punch perform a first stamping operation on the material to initially form the material into the corresponding shape. However, at this time, the side surfaces of the copper-aluminum connection are uneven. A second stamping operation is then performed on the material by a second stamping mechanism. When the first upper punch and the second punch move toward each other, the ejector member presses against the bottom of the material, and the scraper ring scrapes off the aluminum layer on the side surfaces of the material, making the side surfaces of the copper-aluminum connection of the material smooth. Specifically, the material is stamped for the first time by the first stamping mechanism, and for the second time by the second stamping mechanism. During the second stamping operation, the scraper ring scrapes off the aluminum layer on the side surfaces of the material, making the copper-aluminum connection interface smooth, thereby improving the product yield.
[0034] In order to better understand the technical solutions and beneficial effects of the present disclosure, the present disclosure is further described in detail below with reference to specific embodiments:
[0035] like Figures 1 to 3 As shown, a stamping device 10 for a copper-aluminum composite terminal in one embodiment includes a first stamping mechanism 100 and a second stamping mechanism 200, wherein the first stamping mechanism 100 includes a first upper die 110, a first upper punch 120, a first lower die 130 and a first lower punch 140, wherein the first upper punch 120 is mounted on the first upper die 110, and the first lower punch 140 is mounted on the first lower die 130, and the first upper punch 120 and the first lower punch 140 are arranged opposite to each other so that the material is stamped and formed for the first time when the first upper die 110 and the first lower die 130 move toward each other.
[0036] Furthermore, the second stamping mechanism 200 includes a second upper die 210, a second upper punch 220, a second lower die 230, a second lower punch 240 and an ejector 250. The second upper punch 220 is installed on the second upper die 210, and the second lower punch 240 is installed on the second lower die 230. A receiving groove 242 is provided in the second lower punch 240. The ejector 250 is located in the receiving groove 242 and is connected to the second lower die 230. The ejector 250 is used to eject the material out of the receiving groove 242. The second lower punch 240 is provided with a scraper ring 241 on the end face of the second upper punch 220 adjacent to the second upper punch 220. The scraper ring 241 is used to scrape off the aluminum layer on the side of the material.
[0037] In this embodiment, the aluminum layer of the copper-aluminum composite strip is located at the bottom and the copper layer is located at the top. The first stamping mechanism 100 performs the first stamping on the copper-aluminum composite strip. The strip is located between the first upper punch 120 and the first lower punch 140. The first upper die 110 and the first lower die 130 move toward each other under the drive device, so that the first upper punch 120 and the first lower punch 140 abut against each other, and then the strip is punched into a T shape. However, since the hardness of aluminum is lower than that of copper, during the first stamping, the aluminum layer below wraps the copper layer. At this time, the peripheral side of the connection interface between the aluminum layer and the copper layer of the middle column of the material is uneven, and the aluminum layer at the peripheral connection interface needs to be scraped off. Furthermore, the second stamping mechanism 200 stamps the material for the second time, and the second upper punch 220 and the second lower punch 240 move toward each other under the drive of the driving device. At this time, the ejector 250 holds the material at the notch of the accommodating groove 242, and the scraper ring 241 abuts against the peripheral side of the material. When the second upper punch 220 and the second lower punch 240 continue to move, the sharp edge of the scraper ring 241 scrapes off the aluminum layer on the peripheral side of the material, so that the side of the copper-aluminum connection of the material is smooth.
[0038] In the above-mentioned stamping device 10 for copper-aluminum composite terminals, when the first upper die 110 and the first lower die 130 move toward each other, the first upper punch 120 and the first lower punch 140 perform a first stamping and forming on the material to preliminarily form the material into a corresponding shape. However, at this time, the side of the copper-aluminum connection is uneven, and the material is stamped a second time by the second stamping mechanism 200. When the first upper punch 120 and the second punch move toward each other, the ejector 250 supports the bottom of the material, and the scraper ring 241 scrapes off the aluminum layer on the side of the material, so that the side of the copper-aluminum connection of the material is flat. Specifically, the material is stamped for the first time by the first stamping mechanism 100, and the material is stamped for the second time by the second stamping mechanism 200. During the second stamping, the scraper ring 241 scrapes off the aluminum layer on the side of the material, so that the copper-aluminum connection interface is flat, thereby improving the product yield.
[0039] In one embodiment, the scraper ring 241 forms a preset angle with the end surface of the second lower punch 240. In this embodiment, the scraper ring 241 and the second lower punch 240 are integrally formed, and the scraper ring 241 is tilted relative to the second lower punch 240 to ensure that the scraper ring 241 and the side of the material are more closely contacted.
[0040] In one embodiment, the preset angle is 30°-45°. In this embodiment, the preset angle is 45°.
[0041] like Figure 4 As shown, in one embodiment, the ejector 250 has a boss 251 protruding from the end surface adjacent to the second upper punch 220. The boss 251 is used to form a groove at the bottom of the material. As will be understood, when the ejector 250 abuts the bottom of the material and the second upper punch 220 abuts the second lower punch 240, the bottom of the material is clamped by the second upper punch 220 and the boss 251. Under the continuous pressure, a groove is formed at the bottom of the material, which is used to connect the product to the electronic device.
[0042] In one embodiment, the boss 251 is flush with the end of the scraper ring 241 so that a groove of corresponding size is formed at the bottom of the material.
[0043] In one embodiment, the end surface of the second upper punch 220 adjacent to the second lower punch 240 is a plane. In this embodiment, the end surface of the second upper punch 220 adjacent to the second lower punch 240 is a plane, so that the upper surface of the material after the second stamping is a planar structure.
[0044] In one embodiment, the end surface of the first upper punch 120 adjacent to the first lower punch 140 is a plane. In this embodiment, the end surface of the first upper punch 120 adjacent to the first lower punch 140 is a surface, so that the upper surface of the material after the first stamping is a planar structure.
[0045] like Figure 5 As shown, in one embodiment, an embedding groove 141 is formed in the first lower punch 140, and the embedding groove 141 is used to embed the material. In this embodiment, the material strip is placed on the embedding groove 141, and the size of the material strip is larger than the size of the embedding groove 141. When the first upper punch 120 and the first lower punch 140 move toward each other, the material strip is clamped between the first upper punch 120 and the first lower punch 140. Under the action of the pressing force, the bottom of the material extends into the embedding groove 141, so that the material forms a T-shape after the first stamping.
[0046] In one embodiment, the end surface of the first lower punch 140 adjacent to the first upper punch 120 is a plane. In this embodiment, the end surface of the first lower punch 140 adjacent to the first upper punch 120 is a plane, so that the inner side surface of the top of the material after the first stamping is a planar structure.
[0047] The present application also provides a stamping device, comprising the stamping device 10 for the copper-aluminum composite terminal described in any one of the above embodiments.
[0048] Compared with the prior art, the present disclosure has at least the following advantages:
[0049] In the above-mentioned stamping device 10 for copper-aluminum composite terminals, when the first upper die 110 and the first lower die 130 move toward each other, the first upper punch 120 and the first lower punch 140 perform a first stamping and forming on the material to preliminarily form the material into a corresponding shape. However, at this time, the side of the copper-aluminum connection is uneven, and the material is stamped a second time by the second stamping mechanism 200. When the first upper punch 120 and the second punch move toward each other, the ejector 250 supports the bottom of the material, and the scraper ring 241 scrapes off the aluminum layer on the side of the material, so that the side of the copper-aluminum connection of the material is flat. Specifically, the material is stamped for the first time by the first stamping mechanism 100, and the material is stamped for the second time by the second stamping mechanism 200. During the second stamping, the scraper ring 241 scrapes off the aluminum layer on the side of the material, so that the copper-aluminum connection interface is flat, thereby improving the product yield.
[0050] The above-described embodiments merely represent several implementation methods of the present disclosure. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person of ordinary skill in the art could make various modifications and improvements without departing from the scope of the present disclosure, all of which fall within the scope of protection of the present disclosure. Therefore, the scope of protection of the present patent shall be determined by the appended claims.
Claims
1. A stamping device for a copper-aluminum composite terminal, comprising a first stamping mechanism, wherein the first stamping mechanism comprises a first upper die, a first upper punch, a first lower die, and a first lower punch, wherein the first upper punch is mounted on the first upper die, and the first lower punch is mounted on the first lower die, and the first upper punch and the first lower punch are arranged opposite to each other so that the first upper die and the first lower die move toward each other to perform a first stamping forming on the material, characterized in that: The stamping device also includes a second stamping mechanism, which includes a second upper die, a second upper punch, a second lower die, a second lower punch and an ejector. The second upper punch is installed on the second upper die, and the second lower punch is installed on the second lower die. A receiving groove is provided in the second lower punch. The ejector is located in the receiving groove and connected to the second lower die. The ejector is used to eject the material out of the receiving groove. The second lower punch is provided with a scraper ring on the end face adjacent to the second upper punch. The scraper ring is used to scrape off the aluminum layer on the side of the material.
2. The punching device for copper-aluminum composite terminals according to claim 1, characterized in that: The scraper ring and the end surface of the second lower punch form a preset angle.
3. The punching device for copper-aluminum composite terminals according to claim 2, characterized in that: The preset angle is 30°-45°.
4. The punching device for copper-aluminum composite terminals according to claim 1, characterized in that: The ejector is provided with a boss on the end surface adjacent to the second upper punch, and the boss is used to form a groove at the bottom of the material.
5. The punching device for copper-aluminum composite terminals according to claim 4, characterized in that: The boss is flush with the end of the scraper ring.
6. The punching device for copper-aluminum composite terminals according to claim 1, characterized in that: An end surface of the second upper punch adjacent to the second lower punch is a plane.
7. The punching device for copper-aluminum composite terminals according to claim 1, characterized in that: An end surface of the first upper punch adjacent to the first lower punch is a plane.
8. The punching device for copper-aluminum composite terminals according to claim 1, characterized in that: An embedding groove is provided in the first lower punch, and the embedding groove is used for embedding materials.
9. The punching device for copper-aluminum composite terminals according to claim 1, characterized in that: An end surface of the first lower punch adjacent to the first upper punch is a plane.
10. A stamping device, characterized in that: A punching device for a copper-aluminum composite terminal comprising any one of claims 1 to 9.
Citation Information
Patent Citations
One-time punch forming device for manufacturing copper-aluminum wiring terminal
CN112589460A