Foam tape convenient to bend
By setting flat, convex and concave structures and heat dissipation holes in the foam tape, the problem of the decrease in the protection force of the foam tape after bending is solved, and the comprehensive protection and heat dissipation effect of electronic products is achieved.
Patent Information
- Application Number
- CN202422162906.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-04
- Publication Date
- 2025-08-22
- Estimated Expiration
- 2034-09-04
AI Technical Summary
When the foam tape is bent and applied to the corners of the electronic product, the foam material becomes thinner, resulting in a decrease in protection.
A foam tape is designed, including a foam layer, a base film layer, an adhesive layer and a release film. The foam layer is provided with a plane, a convex and a concave structure to adapt to the plane, a convex and a concave surface of electronic products, and add heat dissipation holes to dissipate heat, and avoid foam stretching or extrusion deformation.
Through structural design and the setting of heat dissipation holes, we ensure that the foam tape can effectively protect electronic products after bent, maintain the protective performance of foam, and improve the heat dissipation efficiency of electronic products through heat dissipation holes.
Smart Images
Figure CN223255143U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of foam, in particular to a foam tape which is easy to bend. Background Art
[0002] Foam tape typically consists of a foam material coated with a pressure-sensitive adhesive. Foam tape is lightweight and flexible, making it suitable for cushioning and shock absorption in electronic products and is widely used in packaging.
[0003] To protect electronic products, foam tape can be bent and applied to adjacent corners, simultaneously protecting multiple surfaces. The cushioning and protective capabilities of foam tape depend on the thickness of the foam material. However, when applied to the corners of electronic products, the tape bends and stretches, thinning the foam at the corners and reducing its protective strength. Utility Model Content
[0004] The main purpose of the utility model is to provide a foam tape that is easy to bend, so as to solve the above technical problems and ensure the protective performance of the foam.
[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0006] A foam tape that is easy to bend and is attached to the surface of an electronic product. The foam tape comprises a foam layer, a base film layer, an adhesive layer and a release film. The adhesive layer is coated on the lower surface of the base film layer, the release film is coated on the outer surface of the adhesive layer, the foam layer is arranged above the base film layer, and the foam layer comprises a bottom layer, a planar structure, a convex structure and a concave structure. The planar structure, the convex structure and the concave structure are arranged on the bottom layer. The planar structure is aligned with the plane of the electronic product, the convex structure is aligned with the convex surface of the electronic product, and the concave structure is aligned with the concave surface of the electronic product.
[0007] As a preferred technical solution, the convex structure includes a plurality of first bumps, and gaps between the plurality of first bumps are arranged on the bottom layer.
[0008] As a preferred technical solution, the cross-sectional shape of the first protrusion is an inverted trapezoid.
[0009] As a preferred technical solution, the gap between two adjacent first bumps is a first heat dissipation hole.
[0010] As a preferred technical solution, the concave structure includes a plurality of second protrusions, and the plurality of second protrusion gaps are arranged on the bottom layer.
[0011] As a preferred technical solution, the cross-sectional shape of the second protrusion is an inverted trapezoid.
[0012] As a preferred technical solution, the gap between two adjacent second bumps is a second heat dissipation hole.
[0013] As a preferred technical solution, third heat dissipation holes are provided on the planar structure. The third heat dissipation holes are arranged in order on the side surfaces of the planar structure and pass through the planar structure.
[0014] As a preferred technical solution, a PET protective film layer is further provided on the foam layer, and the PET protective film layer is provided on the upper surfaces of the planar structure, the convex structure and the concave structure.
[0015] As a preferred technical solution, it further includes a heat dissipation layer, which is compounded between the foam layer and the base film layer.
[0016] The beneficial effect of the present invention is that the above-mentioned foam tape that is easy to bend is provided with a convex structure and a concave structure to fit the convex and concave surfaces of the electronic device, thereby preventing the foam from being stretched and thinned on the convex surface and squeezed and deformed on the concave surface, thereby ensuring the protective ability of the foam. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 This is a schematic structural diagram of the bendable foam tape involved in the present invention;
[0018] Figure 2 This is a cross-sectional view of the bendable foam tape of the present invention;
[0019] Figure 3 This is a schematic diagram of the installation of the easily bendable foam tape involved in the present invention. DETAILED DESCRIPTION
[0020] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0021] Please combine Figure 1-3As shown, a foam tape that is easy to bend is attached to the surface of an electronic product A, including a foam layer 5, a heat dissipation layer 4, a base film layer 3, an adhesive layer 2 and a release film 1. The adhesive layer 2 is coated on the lower surface of the base film layer 3, and the release film 1 is covered on the outer surface of the adhesive layer 2. The foam layer 5 is arranged above the base film layer 3, and the heat dissipation layer 4 is compounded between the foam layer 5 and the base film layer 3. The foam layer 5 can protect the electronic product A. The base film layer 3 is a PC film layer. The PC film has low cost and good waterproof effect. The adhesive layer 2 is a PET tape layer. The foam layer 5 is a PE foam layer with good rebound performance. The heat dissipation layer 4 is a graphene layer. The graphene has good thermal conductivity.
[0022] The foam layer 5 includes a bottom layer 54, a plane structure 51, a convex structure 52, a concave structure 53 and a PET protective film layer 55. The plane structure 51, the convex structure 52 and the concave structure 53 are arranged on the bottom layer 54. The plane structure 51 is aligned with the plane A1 of the electronic product, the convex structure 52 is aligned with the convex surface A2 of the electronic product, and the concave structure 53 is aligned with the concave surface A3 of the electronic product, thereby providing all-round protection for the electronic product. The PET protective film layer 55 is arranged on the upper surface of the plane structure 51, the convex structure 52 and the concave structure 53, thereby extending the service life of the foam layer 5.
[0023] The planar structure 51 is provided with third heat dissipation holes 511 . The third heat dissipation holes 511 are arranged in order on the side of the planar structure 51 and pass through the planar structure 51 , so that heat dissipated by electronic products can be dissipated through the third heat dissipation holes 511 .
[0024] The convex structure 52 includes a plurality of first bumps 521, and the gaps between the plurality of first bumps 521 are arranged on the bottom layer 54. The cross-sectional shape of the first bump 521 is an inverted trapezoid, so that the surface with a large area of the first bump 521 faces outward, so that the plurality of first bumps 521 are evenly distributed on the convex surface a2 of the electronic product to prevent the foam from stretching and thinning. The gap between two adjacent first bumps 521 is a first heat dissipation hole 522, which can allow the heat emitted by the electronic product to be dissipated through the first heat dissipation hole 522.
[0025] The concave structure 53 includes a plurality of second bumps 531, and the plurality of second bumps 531 are arranged in gaps on the bottom layer 54. The cross-sectional shape of the second bump 531 is trapezoidal, so that the surface with a small area of the second bump 531 faces outward, so that the plurality of second bumps 531 are gathered at the concave surface a3 of the electronic product to avoid foam squeezing and wrinkling. The gap between two adjacent second bumps 531 is a second heat dissipation hole 532, which can allow the heat dissipated by the electronic product to be dissipated through the second heat dissipation hole 532.
[0026] The above-described embodiments are merely preferred examples of the present invention and are not intended to limit the scope of implementation of the present invention. Therefore, any equivalent changes or modifications made based on the structures, features, and principles described in the scope of the patent application of the present invention should be included in the scope of the patent application of the present invention.
Claims
1. A flexible foam tape, attached to the surface of an electronic product, characterized in that: The electronic product comprises a foam layer, a base film layer, an adhesive layer and a release film, wherein the adhesive layer is coated on the lower surface of the base film layer, the release film is coated on the outer surface of the adhesive layer, the foam layer is arranged above the base film layer, the foam layer comprises a bottom layer, a plane structure, a convex structure and a concave structure, the plane structure, the convex structure and the concave structure are arranged on the bottom layer, the plane structure is aligned with the plane of the electronic product, the convex structure is aligned with the convex surface of the electronic product, and the concave structure is aligned with the concave surface of the electronic product.
2. The bendable foam tape according to claim 1, characterized in that: The convex structure includes a plurality of first convex blocks, and the plurality of first convex block gaps are arranged on the bottom surface layer.
3. The bendable foam tape according to claim 2, characterized in that: The cross-section of the first bump is an inverted trapezoid.
4. The bendable foam tape according to claim 3, characterized in that: The gap between two adjacent first bumps is a first heat dissipation hole.
5. The bendable foam tape according to claim 1, characterized in that: The concave structure includes a plurality of second bumps, and the gaps between the plurality of second bumps are arranged on the bottom layer.
6. The bendable foam tape according to claim 5, characterized in that: The cross-section of the second protrusion is an inverted trapezoid.
7. The bendable foam tape according to claim 6, characterized in that: The gap between two adjacent second bumps is a second heat dissipation hole.
8. The bendable foam tape according to claim 1, characterized in that: The planar structure is provided with third heat dissipation holes, which are arranged in order on the side surface of the planar structure and pass through the planar structure.
9. The bendable foam tape according to claim 1, characterized in that: A PET protective film layer is also provided on the foam layer, and the PET protective film layer is provided on the upper surfaces of the planar structure, the convex structure and the concave structure.
10. The bendable foam tape according to claim 1, characterized in that: It further includes a heat dissipation layer, which is compounded between the foam layer and the base film layer.