Multicolor patterned Mini-LED indicating device

Through the combination of Mini-LED chip arraying and fluorescent blocks, the problem of single display patterns of traditional digital tubes is solved, and multi-color dynamic indication and mechanical strength are improved.

CN223260319UActive Publication Date: 2025-08-22XIAMEN GUANGHONG ELECTRONICS
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Patent Information

Application Number
CN202422529312.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-19
Publication Date
2025-08-22
Estimated Expiration
2034-10-19

AI Technical Summary

Technical Problem

Traditional digital tube display patterns are single, cannot be changed as needed, and cannot meet the complexity of information interaction.

Method used

The array arrangement of Mini-LED chips is adopted, combined with different combinations of fluorescent blocks, and the multi-color indicator pattern is realized by controlling the energized luminescence of the Mini-LED chips, and the structural design of the multi-porous plate and the light-shading plate is used to improve the mechanical strength.

Benefits of technology

Dynamic multi-color indicator pattern display is realized, which improves the readability and mechanical strength of information interaction.

✦ Generated by Eureka AI based on patent content.

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Abstract

The multicolor patterned Mini-LED indicating device is provided with a perforated plate, a circuit board and a light shielding plate, the perforated plate is provided with through holes, the through holes are arranged in an array mode, the top of the circuit board is provided with Mini-LED chips, the Mini-LED chips correspond to the through holes of the perforated plate in a one-to-one mode, the Mini-LED chips are embedded into the through holes, and the light shielding plate is arranged on the circuit board. The light shielding plate is arranged in the second sinking groove, fluorescent blocks and a bonding layer are arranged on the bottom face of the light shielding plate, the fluorescent blocks face the through holes and correspond to the through holes in a one-to-one mode, the thickness of the bonding layer is larger than that of the fluorescent blocks, and light holes are formed in the positions, where the fluorescent blocks are located, of the bonding layer. And the bottom surface of the bonding layer is bonded with the bottom surface of the second sinking groove.
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Description

Technical Field

[0001] The present disclosure relates to the field of LED technology, and in particular to a multi-color patterned Mini-LED indicator device. Background Art

[0002] Digital tubes have been widely used in home appliances, switch panels, instruments, meters, and other fields. However, with the increasing complexity of information interaction, traditional digital tubes face shortcomings in application, such as a single display pattern and the inability to change on demand. Digital tubes use LED chips as light sources. With the development of Mini-LED chip technology, the size of LED chips has been greatly reduced, making it possible for the chip pitch to become smaller, and more Mini-LED chips can be accommodated per unit area, making digital indicator devices based on arrayed Mini-LED chips possible. With the arrayed arrangement of Mini-LED chips, it is possible to select and turn on specific Mini-LED chips in the array through driver control, thereby realizing a unique display pattern, thereby achieving a dynamic indication pattern presentation effect and improving the readability of interactive information. Utility Model Content

[0003] In view of this, the present invention provides a multi-color patterned Mini-LED indicator device, which at least partially solves the problems existing in the prior art.

[0004] A multi-color patterned Mini-LED indicator device comprises a porous plate, a circuit board, and a light shielding plate. The porous plate is provided with through-holes, a plurality of which are arranged in an array. A first sink is provided at the bottom of the porous plate, and a second sink is provided at the top of the porous plate. Mini-LED chips are provided on the top of the circuit board. The Mini-LED chips are arranged in an array and correspond one-to-one with the through-holes of the porous plate. The circuit board is installed in the first sink, so that the Mini-LED chips are embedded in the through-holes.

[0005] The light shielding plate is arranged in the second sink groove, and a fluorescent block and an adhesive layer are provided on the bottom surface of the light shielding plate. The fluorescent block faces the through hole and corresponds to the through hole one by one. The thickness of the adhesive layer is greater than the thickness of the fluorescent block. The adhesive layer is provided with a light-transmitting hole at the position where the fluorescent block is located, and the bottom surface of the adhesive layer is bonded to the bottom surface of the second sink groove.

[0006] The width of the Mini-LED chip is smaller than the width of the through hole, and the center distance between the Mini-LED chips is equal to the center distance between the through holes.

[0007] The width of the fluorescent block is greater than the width of the through hole, and the center distance between the fluorescent blocks is equal to the center distance between the through holes.

[0008] The porous plate is integrally injection-molded, and the inner wall of the through hole has a high reflectivity to the light emitted by the Mini-LED chip.

[0009] The thickness of the circuit board is smaller than the depth of the first sink.

[0010] A black light-shielding layer is also provided on the top of the light-shielding plate, and the bonding layer is a black colloid.

[0011] The Mini-LED chip emits blue light, and the fluorescent blocks are provided with three types: red fluorescent block, green fluorescent block, and transparent block.

[0012] The depth of the through hole is greater than the height of the Mini-LED chip.

[0013] An icon is also provided on the surface of the black light-shielding layer by silk-screen printing.

[0014] Further preferably, the Mini-LED chip emits blue light, and the fluorescent block is a yellow fluorescent block.

[0015] Beneficial effects of the technical solution:

[0016] (1) By controlling the power and light emission of different Mini-LED chips, different color indication patterns can be displayed. Combined with the timing control of the power and light emission of the Mini-LED chips, the effect of dynamic indication pattern display can be achieved.

[0017] (2) By setting different combinations of fluorescent blocks, different color indication effects can be achieved.

[0018] (3) The one-piece injection-molded porous plate serves as the structural support body, with good mechanical strength and high reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0020] Figure 1 This is a schematic structural diagram of the multi-color patterned Mini-LED indicator device of Example 1;

[0021] Figure 2 This is a schematic diagram of the light path in the through-hole of the multi-color patterned Mini-LED indicator device of Example 1;

[0022] Figure 3 Schematic diagram of the structure of the multi-color patterned Mini-LED indicator device of Example 2. DETAILED DESCRIPTION

[0023] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0024] The following describes the embodiments of the present disclosure through specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present disclosure.

[0025] It should be noted that various aspects of the embodiments within the scope of the appended claims are described below. It should be apparent that the aspects described herein can be embodied in a wide variety of forms, and any specific structure and / or function described herein is merely illustrative. Based on this disclosure, it should be understood by those skilled in the art that an aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects described herein can be used to implement an apparatus and / or practice a method. In addition, other structures and / or functionalities other than one or more of the aspects described herein can be used to implement this apparatus and / or practice this method.

[0026] It should also be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present disclosure. The illustrations only show components related to the present disclosure and are not drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component can be changed at will, and the component layout type may also be more complicated.

[0027] Additionally, in the following description, specific details are provided to provide a thorough understanding of the examples. However, one skilled in the art will appreciate that the aspects described can be practiced without these specific details. Example 1

[0028] See also Figures 1 to 2A multi-color patterned Mini-LED indicator device is provided with a porous plate 1, a circuit board 2, and a light shielding plate 3. The porous plate 1 is provided with a through hole 11, and a plurality of through holes 11 are provided, and the through holes 11 are arranged in an array. The bottom of the porous plate 1 is provided with a first sink 12, and the top of the porous plate 1 is provided with a second sink 13. Mini-LED chips 21 are provided on the top of the circuit board 2. The Mini-LED chips 21 are arranged in an array and correspond one-to-one with the through holes 11 of the porous plate 1. The circuit board 2 is installed in the first sink 12, and the Mini-LED chips 21 are embedded in the through holes 11.

[0029] The shading plate 3 is arranged in the second sink 13. The bottom surface of the shading plate 3 is provided with a fluorescent block 31 and an adhesive layer 32. The fluorescent block 31 faces the through hole 11 and corresponds to the through hole 11 one by one. The thickness of the adhesive layer 32 is greater than that of the fluorescent block 31. The adhesive layer 32 is provided with a light-transmitting hole at the position where the fluorescent block 32 is located. The bottom surface of the adhesive layer 32 is bonded to the bottom surface of the second sink 13.

[0030] The width of the Mini-LED chip 21 is smaller than the width of the through hole 11 , and the center distance between the Mini-LED chips 21 is equal to the center distance between the through holes 11 .

[0031] The width of the fluorescent block 31 is greater than the width of the through hole 11 , and the center distance between the fluorescent blocks 31 is equal to the center distance between the through holes 11 .

[0032] The porous plate 1 is integrally injection-molded, and the inner wall of the through hole 11 has a high reflectivity for the light emitted by the Mini-LED chip 21 .

[0033] The thickness of the circuit board 2 is smaller than the depth of the first sink 12 .

[0034] A black light shielding layer 33 is further provided on the top of the light shielding plate 3 , and the adhesive layer 32 is a black colloid.

[0035] The Mini-LED chip 21 emits blue light, and the fluorescent block 31 is provided with three types: a red fluorescent block, a green fluorescent block, and a transparent block. The red fluorescent block, the green fluorescent block, and the transparent block form a repeating unit, and are periodically arranged with the repeating unit. The blue light emitted by the Mini-LED chip 21 is converted into red light after passing through the red fluorescent block, so that the top of the corresponding through-hole 11 appears red. The blue light emitted by the Mini-LED chip 21 is converted into green after passing through the green fluorescent block, so that the top of the corresponding through-hole 11 appears green. The blue light emitted by the Mini-LED chip 21 is still blue light after passing through the transparent block, so that the top of the corresponding through-hole 11 appears blue. With the help of this multi-color mechanism, different colors of indication patterns can be presented by controlling different Mini-LED chips 21 to power on and emit light.

[0036] The depth of the through hole 11 is greater than the height of the Mini-LED chip 21 .

[0037] The surface of the black light shielding layer 33 is also provided with icons by silk screen printing. When light is transmitted from below, it can illuminate the icons, achieving high brightness presentation of the icons. Example 2

[0038] like Figure 3 As shown, the Mini-LED chip 21 emits blue light, and the fluorescent block 31 is a yellow fluorescent block.

[0039] The rest is the same as that of the first embodiment.

[0040] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A multi-color patterned Mini-LED indicator device, characterized in that: A porous plate, a circuit board, and a light shielding plate are provided. The porous plate is provided with through holes, and there are a plurality of through holes arranged in an array. A first sink is provided at the bottom of the porous plate, and a second sink is provided at the top of the porous plate. Mini-LED chips are provided on the top of the circuit board. The Mini-LED chips are arranged in an array, and the Mini-LED chips correspond one-to-one to the through holes of the porous plate. The circuit board is installed in the first sink, and the Mini-LED chips are embedded in the through holes. The light shielding plate is arranged in the second sink groove, and a fluorescent block and an adhesive layer are provided on the bottom surface of the light shielding plate. The fluorescent block faces the through hole and corresponds to the through hole one by one. The thickness of the adhesive layer is greater than the thickness of the fluorescent block. The adhesive layer is provided with a light-transmitting hole at the position where the fluorescent block is located, and the bottom surface of the adhesive layer is bonded to the bottom surface of the second sink groove.

2. The multi-color patterned Mini-LED indicator device according to claim 1, characterized in that: The width of the Mini-LED chip is smaller than the width of the through hole, and the center distance between the Mini-LED chips is equal to the center distance between the through holes.

3. The multi-color patterned Mini-LED indicator device according to claim 1, characterized in that: The width of the fluorescent block is greater than the width of the through hole, and the center distance between the fluorescent blocks is equal to the center distance between the through holes.

4. The multi-color patterned Mini-LED indicator device according to claim 1, characterized in that: The porous plate is integrally injection-molded, and the inner wall of the through hole has a high reflectivity to the light emitted by the Mini-LED chip.

5. The multi-color patterned Mini-LED indicator device according to claim 1, characterized in that: The thickness of the circuit board is smaller than the depth of the first sink.

6. The multi-color patterned Mini-LED indicator device according to claim 1, characterized in that: A black light-shielding layer is also provided on the top of the light-shielding plate, and the bonding layer is a black colloid.

7. The multi-color patterned Mini-LED indicator device according to claim 1, characterized in that: The Mini-LED chip emits blue light, and the fluorescent blocks are provided with three types: red fluorescent block, green fluorescent block, and transparent block.

8. The multi-color patterned Mini-LED indicator device according to claim 1, characterized in that: The Mini-LED chip emits blue light, and the fluorescent block is a yellow fluorescent block.

9. The multi-color patterned Mini-LED indicator device according to claim 1, characterized in that: The depth of the through hole is greater than the height of the Mini-LED chip.

10. The multi-color patterned Mini-LED indicator device according to claim 6, characterized in that: An icon is also provided on the surface of the black light-shielding layer by silk-screen printing.