New energy automobile inverter capacitor heat dissipation structure

Abstract

The utility model relates to a new energy automobile inverter capacitor heat radiation structure. A heat conduction pad is arranged between an inverter housing and a capacitor housing. A water cooling plate is arranged on the surface of the capacitor shell; a first cooling water channel is arranged on the inner surface of one surface of the inverter shell, which is provided with the capacitor; the first cooling water channel is in contact with the heat conduction pad and the insulated gate bipolar transistor; a second cooling water channel is arranged on the outer surface of the side, provided with the capacitor, of the inverter shell, and an area defined by the first cooling section and the second cooling water channel coincides with a projection area of the capacitor on the inverter shell. Compared with the prior art, the heat conduction pad is arranged between the inverter shell and the capacitor, the water cooling plate is arranged on the surface of the shell of the capacitor, and the cooling water channel is arranged on the inverter shell, so that the heat dissipation effect is good; the first cooling water channel can cool the capacitor and the insulated gate bipolar transistor at the same time; the inside of the capacitor shell is filled with the pouring sealant, so that the heat dissipation effect is improved; and the second cooling water channel can perform heat dissipation on the control panel at the same time.

Description

Technical Field

[0001] The utility model relates to capacitor heat dissipation, in particular to a capacitor heat dissipation structure of an inverter of a new energy vehicle. Background Art

[0002] The rise of emerging industries, such as new energy vehicles, solar photovoltaics, and wind power generation, has led to a growing demand for capacitors. The expansion of these sectors has not only driven the growth of the capacitor market but also promoted advancements in film capacitor manufacturing technology, expanding the application range of capacitors.

[0003] Traditional capacitor heat dissipation methods mainly include: 1. Natural heat dissipation: This is the most classic heat dissipation method, which relies on the heat dissipation design of the capacitor itself and the natural air flow in the surrounding environment to reduce the temperature. This method does not rely on external heat dissipation equipment and is suitable for capacitors with low heat generation. 2. Exposed copper heat dissipation: By exposing the busbar (a thick copper bar used to distribute current), the heat dissipation area can be effectively increased, thereby improving heat dissipation efficiency. This method utilizes the increase in contact area with the air to promote heat dissipation. 3. Adding PAD: Adding PAD to the capacitor can improve heat exchange efficiency. However, with the rapid advancement of electric vehicle (EV) motor controllers in high voltage, high power density and high operating frequency, the high-temperature performance of DC bus film capacitors has been posed with higher challenges. Traditional heat dissipation methods cannot meet the increasingly stringent heat dissipation requirements.

[0004] In summary, how to design a capacitor heat dissipation structure with good heat dissipation effect is a technical problem that needs to be solved. Utility Model Content

[0005] The purpose of this utility model is to overcome the defects of the above-mentioned prior art and provide a capacitor heat dissipation structure for a new energy vehicle inverter.

[0006] The purpose of the utility model can be achieved through the following technical solutions:

[0007] According to one aspect of the utility model, a capacitor heat dissipation structure for an inverter of a new energy vehicle is provided. A capacitor and an insulated gate bipolar transistor are installed in an inverter housing. The capacitor includes a capacitor housing, and a thermal pad is provided between the inverter housing and the capacitor housing; a water-cooling plate is provided on the surface of the capacitor housing; a first cooling water channel is provided on the inner surface of a side of the inverter housing on which the capacitor is installed, and the first cooling water channel includes a first cooling section and a second cooling section, the first cooling section is in contact with the thermal pad, and the second cooling section is in contact with the insulated gate bipolar transistor; a second cooling water channel is provided on the outer surface of a side of the inverter housing on which the capacitor is installed, and the area enclosed by the first cooling section and the second cooling water channel coincides with the projected area of ​​the capacitor on the inverter housing.

[0008] As a preferred technical solution, a mounting hole is provided on the capacitor housing, and the water-cooling plate is installed in the mounting hole.

[0009] As a preferred technical solution, the mounting hole is provided on the surface where the capacitor housing contacts the inverter housing.

[0010] As a preferred technical solution, the water cooling plate and the capacitor housing are an integrally formed structure.

[0011] As a preferred technical solution, the water-cooling plate is a water-cooling plate made of copper or aluminum.

[0012] As a preferred technical solution, the capacitor further includes a negative copper busbar, and a thermal pad is provided between the negative copper busbar and the water cooling plate.

[0013] As a preferred technical solution, the thermal pad is installed between the first cooling section and the water-cooling plate.

[0014] As a preferred technical solution, the gap inside the capacitor housing is filled with potting glue.

[0015] As a preferred technical solution, the first cooling water channel and the second cooling water channel are linear or serpentine.

[0016] As a preferred technical solution, a control board is provided on the outside of the inverter housing, and the second cooling water channel is in contact with the control board.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1) The present invention provides a thermal pad between the inverter housing and the capacitor, a water-cooling plate on the surface of the capacitor housing, and a cooling water channel on the inverter housing, thereby improving the heat dissipation effect of the capacitor; the first cooling water channel can simultaneously dissipate heat for the capacitor and the insulated gate bipolar transistor;

[0019] 2) The mounting holes of the utility model are opened on the surface where the capacitor housing contacts the inverter, which can maximize the use of the inverter housing for heat dissipation; the water cooling plate and the capacitor housing are integrally formed, which not only makes the overall structure more solid, but also reduces the thermal resistance of the capacitor housing, improving its ability to withstand high temperatures and ripple currents; a thermal pad is provided between the negative copper busbar and the water cooling plate, which improves the heat dissipation effect of the capacitor;

[0020] 3) The thermal pad of the utility model is installed between the first cooling section and the water-cooled plate to further improve the heat dissipation effect; filling the capacitor housing with potting glue can make the heat dissipation effect of the entire capacitor better; the second cooling water channel can also dissipate heat for the control board. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is an exploded diagram of the capacitor and thermal pad structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the structure of the first cooling water channel of the inverter housing of the utility model;

[0023] Figure 3 This is a schematic diagram of the structure of the second cooling water channel of the inverter housing of the utility model;

[0024] The numbers in the figure show:

[0025] 11. Water cooling plate, 12. Mounting hole, 13. Positive copper busbar, 14. Capacitor core, 15. Capacitor housing, 16. Negative copper busbar, 17. Potting compound, 2. Inverter housing, 21. First cooling water channel, 211. First cooling section,

[0026] 212. Second cooling section, 22. Second cooling water channel, 3. Thermal pad. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0028] The capacitors in new energy vehicle inverters generate heat during operation. The main reasons are as follows:

[0029] 1. Dielectric loss: The dielectric material of the film capacitor will undergo dipole oscillation under the action of the electric field, and this oscillation will generate heat;

[0030] 2. Ripple current: When a capacitor is subjected to ripple current or AC current, it will cause internal heating of the capacitor;

[0031] 3. Parasitic resistance (ESR): The parasitic resistance inside the capacitor causes energy loss, thereby generating heat;

[0032] 4. Ambient temperature: High ambient temperature will increase the heating of the capacitor, especially in the case of poor heat dissipation.

[0033] The utility model provides a capacitor heat dissipation structure for an inverter of a new energy vehicle. A capacitor and an insulated gate bipolar transistor are installed in an inverter housing 2 .

[0034] like Figure 2As shown, the inverter housing 2 is provided with a first cooling water channel 21. The first cooling water channel 21 includes a first cooling section 211 and a second cooling section 212. The first cooling section 211 contacts the thermal pad 3, and the second cooling section 212 contacts the insulated gate bipolar transistor (IGBT), thereby cooling both the capacitor and the IGBT. If the inverter housing 2 already has a cooling water channel for the IGBT, this cooling water channel can be extended to the location where the capacitor is installed, achieving cooling of the capacitor with minimal modification to the inverter housing 2.

[0035] like Figure 3 As shown, a second cooling channel 22 is provided on the outside of the inverter housing 2. The area enclosed by the second cooling channel 22 and the first cooling section 211 completely covers the projected area of ​​the capacitor on the inverter housing 2, achieving comprehensive heat dissipation for the capacitor. A control board is provided on the outside of the inverter housing 2, and the second cooling channel 22 contacts the control board, thereby simultaneously cooling the control board.

[0036] The shape of the first cooling water channel 21 can be linear or serpentine. The linear water channel is suitable for simple heat dissipation needs and can be matched with the aluminum water-cooling plate 11, which is low in cost and easy to process. The serpentine water channel increases the fluid contact surface, so a copper water-cooling plate 11 with better thermal conductivity can be selected to improve heat dissipation efficiency.

[0037] like Figure 1 As shown, the capacitor includes a water-cooling plate 11 , a positive copper busbar 13 , a capacitor core 14 , a capacitor housing 15 and a negative copper busbar 16 .

[0038] The material of the capacitor housing 15 is generally PBT / PPS+30GF, which is a crystalline linear saturated polyester with excellent mechanical properties, electrical properties, heat resistance and processing properties. PBT / PPS+30GF is widely used in the fields of electronics, automotive industry, machinery, instrumentation and household appliances. However, the thermal conductivity of PBT / PPS+30GF is only about 0.22W / (m·K), which is lower than other materials. This means that during use, PBT / PPS+30GF is likely to cause the internal temperature to rise, thereby affecting the physical properties of the material.

[0039] The capacitor housing 15 of the present invention is provided with a mounting hole 12, and the water-cooling plate 11 is installed in the mounting hole 12. The water-cooling plate 11 and the capacitor housing 15 are integrated by injection molding, which is not only more solid, but also reduces the thermal resistance of the capacitor and improves its ability to withstand high temperature and ripple current. The shape of the mounting hole 12 is the same as the surface shape of the capacitor housing 15 in which it is located, and the area of ​​the mounting hole 12 is as large as possible so that the largest possible water-cooling plate 11 can be installed to achieve a better heat dissipation effect. The water-cooling plate 11 can be installed between the capacitor housing 15 and the first cooling section 211 of the first cooling water channel 21, that is, between the capacitor housing 15 and the bottom surface of the inverter housing 2, and can also be installed on other surfaces where the capacitor housing 15 contacts the inverter housing 2, such as the side of the capacitor housing 15, and heat can be dissipated through the side of the inverter housing 2.

[0040] The water-cooling plate 11 can be made of copper or aluminum. Copper has a thermal conductivity of 413 W / (m·K), making it an excellent heat conductor. Aluminum has a thermal conductivity of 235 W / (m·K). Comparing the thermal conductivity of the water-cooling plate 11 with that of the capacitor housing 15 clearly demonstrates that the addition of the water-cooling plate 11 significantly improves the capacitor's heat dissipation capabilities.

[0041] A thermal pad 3 may also be installed between the negative copper bus 16 and the water-cooling plate 11 , and the gap inside the capacitor housing 15 is filled with potting compound 17 to further improve the heat dissipation effect.

[0042] Thermal pads (3) are specifically designed to improve heat conduction between electronic components and heat sinks. By filling the tiny gaps between the components and the heat sink, they enhance heat transfer efficiency, effectively lowering the component's operating temperature and ensuring stable operation. The material of thermal pads (3) can be selected based on actual needs.

[0043] The utility model can flexibly select the water channel shape and the water-cooling plate 11 of different materials; the layout of the water-cooling plate 11, the cooling water channel and the thermal pad 3 can be adjusted as needed to improve space utilization; no capacitor or inverter is required to provide additional space to accommodate new components, and the modification is convenient, which is conducive to maintaining the compactness and efficiency of the equipment.

[0044] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and such modifications or substitutions are intended to be within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. A capacitor heat dissipation structure for a new energy vehicle inverter, wherein a capacitor and an insulated gate bipolar transistor are installed in an inverter housing (2), wherein the capacitor includes a capacitor housing (15), characterized in that: A thermal pad (3) is provided between the inverter housing (2) and the capacitor housing (15); a water-cooling plate (11) is provided on the surface of the capacitor housing (15); a first cooling water channel (21) is provided on the inner surface of the side of the inverter housing (2) where the capacitor is mounted, the first cooling water channel (21) comprising a first cooling section (211) and a second cooling section (212), the first cooling section (211) being in contact with the thermal pad (3), and the second cooling section (212) being in contact with the insulated gate bipolar transistor; a second cooling water channel (22) is provided on the outer surface of the side of the inverter housing (2) where the capacitor is mounted, the area enclosed by the first cooling section (211) and the second cooling water channel (22) being coincident with the projection area of ​​the capacitor on the inverter housing (2).

2. The capacitor heat dissipation structure for an inverter of a new energy vehicle according to claim 1, characterized in that: The capacitor housing (15) is provided with a mounting hole (12), and the water-cooling plate (11) is mounted in the mounting hole (12).

3. The capacitor heat dissipation structure for an inverter of a new energy vehicle according to claim 2, characterized in that: The mounting hole (12) is formed on the surface of the capacitor housing (15) that contacts the inverter housing (2).

4. The capacitor heat dissipation structure for an inverter of a new energy vehicle according to claim 2, characterized in that: The water cooling plate (11) and the capacitor housing (15) are an integrally formed structure.

5. The capacitor heat dissipation structure for an inverter of a new energy vehicle according to claim 1, characterized in that: The water-cooling plate (11) is a water-cooling plate (11) made of copper or a water-cooling plate (11) made of aluminum.

6. The capacitor heat dissipation structure for an inverter of a new energy vehicle according to claim 1, characterized in that: The capacitor further comprises a negative copper busbar (16), and a thermal pad (3) is provided between the negative copper busbar (16) and the water cooling plate (11).

7. The capacitor heat dissipation structure for an inverter of a new energy vehicle according to claim 1, characterized in that: The thermal pad (3) is installed between the first cooling section (211) and the water-cooling plate (11).

8. The capacitor heat dissipation structure for an inverter of a new energy vehicle according to claim 1, characterized in that: The gap inside the capacitor housing (15) is filled with potting glue (17).

9. The capacitor heat dissipation structure for an inverter of a new energy vehicle according to claim 1, characterized in that: The first cooling water channel (21) and the second cooling water channel (22) are linear or serpentine.

10. The capacitor heat dissipation structure for an inverter of a new energy vehicle according to claim 1, characterized in that: A control board is provided on the outside of the inverter housing (2), and the second cooling water channel (22) is in contact with the control board.

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