Chip micro-jet liquid cooling and immersed liquid cooling module combination device

Abstract

The utility model discloses a chip micro-jet liquid cooling and immersed liquid cooling module combination device, which comprises a liquid cooling rack, a heat exchanger, a pump and a main liquid cooling joint are fixed on the liquid cooling rack, a micro-jet liquid cooling plate and an immersed liquid cooling plate are further inserted on the liquid cooling rack, a fan is fixed on the heat exchanger, and a fan is fixed on the immersed liquid cooling plate. The micro-jet liquid cooling plate and the immersed liquid cooling plate are both arranged on one side of the heat exchanger, the fan is arranged on the other side of the heat exchanger, an internal pipeline is arranged in the liquid cooling rack, the two ends of the internal pipeline are communicated with the two main liquid cooling connectors respectively, and the two ends of the internal pipeline are communicated with the heat exchanger. And joints for enabling the internal pipelines to be communicated with the interiors of the micro-jet liquid cooling plate and the immersed liquid cooling plate are respectively arranged at the mounting positions of the micro-jet liquid cooling plate and the immersed liquid cooling plate on the liquid cooling rack. The LED lamp has the advantages of being efficient in heat dissipation, simple in structure, high in reliability, energy-saving, environment-friendly, high in adaptability and wide in application prospect.

Description

Technical Field

[0001] The utility model relates to a chip micro-spray liquid cooling and immersion liquid cooling module combination device, belonging to the technical field of electronic device heat dissipation. Background Art

[0002] With the rapid development of electronic information technology, chips, as core components of electronic devices, are experiencing continuous improvements in integration and performance, leading to a sharp increase in heat generation. Excessive temperatures can affect chip stability and lifespan, making effective heat dissipation a key issue hindering further improvements in chip performance. Traditional air cooling methods have limited heat dissipation efficiency and are unable to meet the cooling requirements of high-power chips. Liquid cooling technology, due to its efficient heat dissipation, has become a research hotspot.

[0003] Liquid cooling technology removes the heat generated by the chip by flowing coolant across the chip surface or inside structural components. Currently, common liquid cooling methods include immersion liquid cooling and cold plate liquid cooling. However, while these liquid cooling methods solve the chip heat dissipation problem to a certain extent, they still have some shortcomings. For example, cold plate liquid cooling may affect the efficiency of heat dissipation due to the contact thermal resistance between the chip and the cold plate and the limitations of the internal flow channel design of the cold plate. Immersion liquid cooling has very high requirements for the insulation of the coolant, as well as the compatibility requirements for electronic components and the coolant. It may also have the disadvantages of coolant leakage and excessive coolant leading to increased weight. In addition, a simple immersion liquid cooling system is expensive and difficult to maintain. Utility Model Content

[0004] The technical problem to be solved by the present invention is: how to avoid the cold plate liquid cooling which may affect the heat dissipation efficiency due to the contact thermal resistance between the chip and the cold plate and the limitations of the internal flow channel design of the cold plate; the immersion liquid cooling has very high requirements on the insulation of the coolant, and at the same time has relatively high requirements on the compatibility of electronic components and the coolant, and there may be problems such as coolant leakage and excessive coolant leading to increased weight.

[0005] In order to solve the above technical problems, the technical solution of the present invention is to provide a chip micro-spray liquid cooling and immersion liquid cooling module combination device, which is characterized in that it includes a liquid cooling rack, a heat exchanger, a pump, and a total liquid cooling joint fixed on the liquid cooling rack, a micro-spray liquid cooling plate and an immersion liquid cooling plate plugged into the liquid cooling rack, a fan is fixed on the heat exchanger, the micro-spray liquid cooling plate and the immersion liquid cooling plate are both arranged on one side of the heat exchanger, the fan is arranged on the other side of the heat exchanger, there are at least two total liquid cooling joints, an internal pipeline is provided in the liquid cooling rack, and the two ends of the internal pipeline are respectively connected to the two total The liquid cooling joint is connected, and the installation positions of the micro-spray liquid cooling plate and the immersion liquid cooling plate on the liquid cooling rack are respectively provided with joints that connect the internal pipes to the micro-spray liquid cooling plate and the immersion liquid cooling plate; the micro-spray liquid cooling plate includes a spray chamber, the upper part of the spray chamber is connected to the condenser inlet through a pipeline, the condenser outlet is connected to the pump inlet through a pipeline, the lower end of the spray chamber is connected to the pump inlet through a pipeline, the pump outlet is connected to the heat exchanger inlet through a pipeline, and the heat exchanger outlet is connected to the nozzle located at the upper part of the spray chamber through a pipeline, and a micro-spray main chip is provided directly below the nozzle in the spray chamber.

[0006] Preferably, a fluid control valve is provided on the pipeline between the outlet end of the heat exchanger and the spray chamber.

[0007] Preferably, the micro-spray liquid cooling plate includes a jet evaporation condensation device and a micro-spray liquid cooling device arranged on the jet evaporation condensation device, the micro-spray liquid cooling device includes an inlet pipe, the outlet end of the inlet pipe is connected to one end of the cold liquid chamber, and the other end of the cold liquid chamber is connected to the nozzle plate, the nozzle plate is provided with multiple holes, and is connected to one end of multiple nozzles, the other end of the multiple nozzles is arranged in the steam chamber, and multiple steam branch pipes are also provided in the steam chamber, the top of the steam chamber is connected to one end of the steam main pipe, and the other end of the steam main pipe is connected to the outlet pipe, the other end of the multiple nozzles and one end of the multiple steam branch pipes are all arranged directly above the micro-spray main chip and close to the position of the micro-spray main chip, and one side of the bottom of the steam chamber is connected to the outlet pipe; the steam chamber and the cold liquid chamber are not directly connected, and the two are separated by the nozzle plate and the nozzle; the inlet pipe, the cold liquid chamber, and the steam chamber together constitute a spray chamber.

[0008] Preferably, the outside of the spray chamber is evenly distributed with multiple screw holes, and the micro-spray liquid cooling device is fastened to the fixing bracket on the back of the printed circuit board by installing screws through the screw holes and the holes of the printed circuit board, and then a micro-spray main chip is provided between the spray chamber and the printed circuit board.

[0009] Preferably, a thermal pad is provided between the surface of the micro-spray main chip and the micro-spray liquid cooling device.

[0010] Preferably, the jet evaporation condensation device includes a printed circuit board, on which a micro-spray main chip and a micro-spray sub-chip are fixed, and a micro-spray internal pipeline is provided in the jet evaporation condensation device, and the two ends of the micro-spray internal pipeline are respectively connected to two micro-spray joints, and the two micro-spray joints are provided on the side of the jet evaporation condensation device; when the micro-spray liquid cooling plate is installed on the liquid cooling rack, the two micro-spray joints are respectively connected to the joints of the internal pipeline on the liquid cooling rack at the position of the micro-spray liquid cooling plate; the micro-spray internal pipeline is provided with joints connecting the inlet pipe and the outlet pipe respectively at the position of the micro-spray main chip on the jet evaporation condensation device.

[0011] Preferably, the immersion liquid cooling plate includes a sealed cold plate, an immersion cavity is provided in the sealed cold plate, two immersion joints connected to the immersion cavity are provided on the outside of the sealed cold plate, the immersion cavity is connected to the immersion main chip and the immersion low-power chip respectively, the immersion main chip and the immersion low-power chip are both immersed in the immersion cavity, and a heat sink is provided on the outside of the immersion main chip; when the immersion liquid cooling plate is installed on the liquid cooling rack, the two immersion joints are respectively connected to the joints of the internal pipeline on the liquid cooling rack located at the position of the immersion liquid cooling plate.

[0012] Preferably, the two total liquid cooling joints are connected to an external cooling liquid circulation system; or when the internal pipeline is filled with cooling liquid, the two total liquid cooling joints are directly blocked.

[0013] Preferably, the micro-spray liquid cooling plate includes a jet evaporation condensation device and a micro-spray liquid cooling device provided on the jet evaporation condensation device, the micro-spray liquid cooling device includes a shell, the top of the shell is an inlet pipe and a steam chamber, the outlet end of the inlet pipe is connected to one end of the cold liquid chamber, and the other end of the cold liquid chamber is connected to a nozzle plate, a plurality of holes are provided on the nozzle plate, a flow stabilizing plate is provided in the cold liquid chamber facing the outlet end of the inlet pipe, the flow stabilizing plate is directly or indirectly connected to the inner wall of the shell, and a channel connected to the nozzle plate is provided between the flow stabilizing plate and the inner wall of the shell or on the flow stabilizing plate, the bottom of the shell is sealed and fixed to the printed circuit board, a micro-spray main chip is provided in the shell, the micro-spray main chip is fixed on the printed circuit board and is located directly below the nozzle plate; the bottom of the nozzle plate is connected to the steam chamber, the top of the steam chamber is connected to one end of the steam main pipe, the other end of the steam main pipe is connected to the outlet pipe, and the bottom of one side of the shell is connected to the outlet pipe; the steam chamber and the cold liquid chamber are not directly connected, and the two are separated by the nozzle plate.

[0014] The present invention can be applied to the field of electronic equipment cooling, and can realize the free combination and application of a single module or several modules. The present invention can be flexibly used in combination with existing liquid cooling modules. The focus of the micro-spray liquid cooling technology is a liquid-gas two-phase exchange heat transfer technology. Fine droplets are formed by micro-nozzles and sprayed onto the contact surface with the chip. The cooling of the chip relies on the boiling phase change of the droplets, and the release of heat relies on the condensation phase change. There are gas and liquid phase changes and two-phase mixing, which greatly improves the heat exchange efficiency. At the same time, the structure of the micro-spray liquid cooling device is miniaturized to meet the needs of modular structure. This type of module with a micro-spray structure can meet the design of 1 to 2 high-power CPU\GPU and other chips within a limited size. The immersion cooling module used in combination can meet the scenario where multiple high-power chips are more evenly distributed.

[0015] Compared with the prior art, the present invention has at least one of the following beneficial effects:

[0016] 1. Efficient heat dissipation

[0017] Micro-spraying technology sprays coolant in the form of tiny mist droplets onto the chip's contact surface, forming a uniform liquid film. When the chip heats up, the mist droplets evaporate, absorbing the heat generated by the chip and transforming into a gas, thereby improving heat dissipation efficiency. Compared with traditional liquid cooling methods, this chip micro-spraying device has higher heat dissipation efficiency.

[0018] The immersion cooling module can immerse the entire circuit board in the FC coolant, greatly reducing thermal resistance, improving the heat dissipation capacity of the entire module, and reducing the temperature difference of the module.

[0019] 2. Simple structure and high reliability

[0020] This new chip micro-spray and immersion cooling module combines a compact, simple structure, is easy to process and manufacture, and allows for independent chip installation. Compared to traditional liquid cooling methods, this new chip micro-spray or immersion cooling module provides a more stable working environment.

[0021] 3. Energy saving and environmental protection

[0022] This innovative chip micro-spray liquid cooling device utilizes a circulating cooling method based on phase change cooling. The main processes include coolant injection, atomization, evaporation, condensation, and circulation, which can conserve coolant usage. The immersion liquid cooling module design improves the energy efficiency of electronic devices. Compared with traditional liquid cooling methods, this innovative chip micro-spray liquid cooling device is more energy-efficient and environmentally friendly.

[0023] 4. Strong adaptability and broad application prospects

[0024] The chip micro-spray liquid cooling device of this utility model is chip-level, and the cooling device can be designed individually for each chip. At the same time, the device can also be combined with other heat dissipation methods to form a hybrid heat dissipation system to further improve heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic diagram of a chip micro-spray liquid cooling and immersion liquid cooling module combination device;

[0026] Figure 2 This is the working principle diagram of the micro-spray liquid cold plate;

[0027] Figure 3 This is a schematic diagram of the installation of the micro-spray liquid cooling device;

[0028] Figure 4 It is a structural diagram of the micro-spray liquid cooling device;

[0029] Figure 5 This is a schematic diagram of the liquid flow in the micro-spray liquid cooling device;

[0030] Figure 6 It is a schematic diagram of the jet evaporation condensation device;

[0031] Figure 7 This is the overall schematic diagram of the immersion liquid cold plate;

[0032] Figure 8 Schematic diagram of the internal structure of the micro-spray liquid cooling device. DETAILED DESCRIPTION

[0033] In order to make the present invention more clear and easy to understand, preferred embodiments are described in detail below with reference to the accompanying drawings.

[0034] Example 1

[0035] The utility model provides a chip micro-spray liquid cooling and immersion liquid cooling module combination device, such as Figures 1-8As shown, it includes a liquid cooling rack 1, a heat exchanger 2, a fan 3, a pump 6 (a gear pump is optional), a main liquid cooling connector 5, a micro-spray liquid cooling plate 4, an immersion liquid cooling plate 7, and FC (fluorinated liquid) coolant (which has the characteristics of electrical insulation and good compatibility with electronic devices and PCBs (printed circuit boards)). The fan 3 is fixed to the heat exchanger 2. The heat exchanger 2, pump 6, main liquid cooling connector 5, micro-spray liquid cooling plate 4, and immersion liquid cooling plate 7 are all fixed to the liquid cooling rack 1. There are two main liquid cooling connectors 5. The liquid cooling rack 1 is provided with internal piping, and the ends of the internal piping are connected to the two main liquid cooling connectors 5. The liquid cooling rack 1 is provided with connectors at the installation locations of the micro-spray liquid cooling plate 4 and the immersion liquid cooling plate 7, respectively, so that the internal piping connects to the micro-spray liquid cooling plate 4 and the immersion liquid cooling plate 7 (and is equipped with sealing plugs that match each connector). The micro-spray liquid cooling plate 4 and the immersion liquid cooling plate 7 are both arranged on one side of the heat exchanger 2 , and the fan 3 is arranged on the other side of the heat exchanger 2 .

[0036] The two total liquid cooling joints 5 can be connected to an external cooling liquid circulation system, or the two total liquid cooling joints 5 can be directly blocked to form a circulation pipeline through the cooling liquid in the internal pipeline of the liquid cooling rack 1.

[0037] The key components mentioned above can be integrated into a system to form a standardized electronic product (ATR chassis). In this embodiment, the liquid cooling rack 1 is a through-type liquid cooling rack. The pump 6 is a liquid pump.

[0038] The selection and function of each component are as follows:

[0039] (1) Liquid cooling rack 1 provides module installation and cooling liquid circulation, and is equipped with internal pipes;

[0040] (2) The heat exchanger 2 provides a heat exchange environment between the coolant and the external air, and then transfers a large amount of heat to the surrounding environment through the fan 3;

[0041] (3) The choice of pump 6 can be based on different operating environment conditions. When the fluid power is provided by an external device, the pump 6 can be omitted. When the coolant circulation power is provided by the system itself, a gear pump can be preferably selected as the power source to meet the requirements of miniaturization and high power.

[0042] (4) Liquid cooling joints are divided into two types: rack-level joints (i.e., total liquid cooling joints 5) and module-level joints (i.e., micro-spray joints 403, immersion joints 71). Both are self-sealing sealing joints to ensure that there is no leakage during the plug-in and unplugging process and the fluid circulation process. The rack-level liquid cooling joints are installed at the inlet and outlet positions of the liquid cooling rack 1, and the number can be adjusted according to actual needs. The socket of the module-level liquid cooling joint is installed near the backplane of the liquid cooling rack 1, and forms a corresponding relationship with the plug of the module-level liquid cooling joint. After the module is inserted, the module position is fixed by the locking strip and the pull-out aid to avoid the module falling off or leakage at the module-level liquid cooling joint during vibration;

[0043] (5) The overall schematic diagram of the chip micro-spray liquid cooling system is as follows Figure 2 As shown, the system primarily consists of a spray chamber 41, a condenser 42, a pump 6, a heat exchanger 2, and a fluid control valve 45. The upper portion of the spray chamber 41 is connected to the inlet of the condenser 42 via a pipeline, while the outlet of the condenser 42 is connected to the inlet of the pump 6 via a pipeline. The lower portion of the spray chamber 41 is connected to the inlet of the pump 6 via a pipeline, while the outlet of the pump 6 is connected to the inlet of the heat exchanger 2 via a pipeline. The outlet of the heat exchanger 2 is connected to the nozzle located at the top of the spray chamber 41 via a pipeline. A micro-spray main chip 401 is located directly below the nozzle in the spray chamber 41. A fluid control valve 45 is provided on the pipeline between the outlet of the heat exchanger 2 and the spray chamber 41.

[0044] The principle of micro-spraying is phase change cooling, and the main processes include coolant injection, atomization, evaporation, condensation, external heat exchange and circulation. Specifically:

[0045] When the micro-spray main chip 401 is working, the pump 6 transports the coolant in the condenser 42 to the nozzle of the spray chamber 41 through the heat exchanger 2, and sprays tiny mist coolant through the nozzle to form a uniform coolant film on the contact surface with the micro-spray main chip 401. On the one hand, the coolant film will evaporate when it encounters the hot micro-spray main chip 401, thereby taking away the heat generated by the micro-spray main chip 401 and then flowing back to the condenser 42; on the other hand, the coolant film can also take away part of the heat generated by the micro-spray main chip 401 after absorbing the heat generated by the micro-spray main chip 401. The coolant that has absorbed the heat flows back to the pump 6 from the surface of the micro-spray main chip 401 and is cooled through the heat exchanger 2, forming a cycle. Figure 3 、 Figure 4 and Figure 5 shown.

[0046] The micro-spray liquid cooling plate 4 includes a jet evaporation condensation device 43 and a micro-spray liquid cooling device 44. The micro-spray liquid cooling device 44 includes an inlet pipe 440. The outlet end of the inlet pipe 440 is connected to one end of the cold liquid chamber 441. The other end of the cold liquid chamber 441 is connected to the nozzle plate 442. The nozzle plate 442 is provided with multiple holes and is connected to one end of multiple nozzles 443. The other end of the multiple nozzles 443 is arranged in the steam chamber 446. The steam chamber 446 is also provided with multiple steam branch pipes 445. The top of the steam chamber 446 is connected to one end of the steam main pipe 447, and the other end of the steam main pipe 447 is connected to the outlet pipe 448. The other end of the multiple nozzles 443 and one end of the multiple steam branch pipes 445 are all arranged directly above the micro-spray main chip 401 and close to the position of the micro-spray main chip 401. One side of the bottom of the steam chamber 446 is connected to the outlet pipe 448. The steam chamber 446 and the cold liquid chamber 441 are not directly connected, but are separated by the nozzle plate 442 and the nozzle 443 .

[0047] The inlet pipe 440, the cooling liquid chamber 441, and the steam chamber 446 together form the spray chamber 41. Multiple screw holes 444 are evenly distributed on the outside of the spray chamber 41 (in this embodiment, four screw holes 444 are located at the four corners of the spray chamber 41). The micro-spray liquid cooling device 44 is fastened to a fixing bracket 49 on the back of the printed circuit board 47 (the fixing bracket 49 has corresponding threaded holes) by means of mounting screws 46 that pass through the screw holes 444 and the holes in the printed circuit board 47. The fixing bracket 49 is then fastened to the back of the printed circuit board 47. A micro-spray main chip 401 is provided between the spray chamber 41 and the printed circuit board 47.

[0048] A high thermal conductivity heat dissipation material is added between the surface of the micro-spray main chip 401 and the micro-spray liquid cooling device 44 to improve the chip heat dissipation efficiency. In this embodiment, a thermal pad 48 is added between the spray chamber 41 and the micro-spray main chip 401.

[0049] The nozzle structure can be optimized to expand the coolant spray range and improve the coolant atomization ability. The solution adopts a uniformly distributed multi-nozzle system.

[0050] Within the limited size, the nozzle density is increased as much as possible and evenly distributed to expand the actual contact area between the coolant and the chip (i.e., the micro-spray main chip 401); it also helps to reduce the height of the micro-spray liquid cooling device 44 to adapt to the modular structure.

[0051] The evaporation and condensation temperature ranges can be determined based on the actual operating temperature, and a coolant with corresponding temperature characteristics can be selected. To improve external heat exchange efficiency, a coolant with high thermal conductivity should be selected based on comprehensive considerations. In this embodiment, the FC coolant model can be FC-40.

[0052] The jet evaporation condensation device 43 includes a printed circuit board 47, on which a micro-spray main chip 401 and a micro-spray sub-chip 402 are fixed. A micro-spray internal pipeline is provided in the jet evaporation condensation device 43, and the two ends of the micro-spray internal pipeline are respectively connected to two micro-spray joints 403, and the two micro-spray joints 403 are provided on the side of the jet evaporation condensation device 43. When the micro-spray liquid cooling plate 4 is installed on the liquid cooling rack 1, the two micro-spray joints 403 are respectively connected to the joints of the internal pipeline located at the position of the micro-spray liquid cooling plate 4 on the liquid cooling rack 1. The micro-spray internal pipeline is provided with joints connected to the inlet pipe 440 and the outlet pipe 448 respectively at the position of the micro-spray main chip 401 on the jet evaporation condensation device 43. The circuit board and pressure plate integrated jet evaporation condensation module of the micro-spray structure and the high-power chip are as shown in FIG. Figure 6 shown.

[0053] like Figure 7As shown, the immersion liquid cold plate 7 includes a sealed cold plate with an immersion cavity 72 disposed therein. Two immersion joints 71 are disposed on the outside of the sealed cold plate and connect to the immersion cavity 72. The immersion cavity 72 is connected to an immersion main chip 73 and an immersion low-power chip 74, respectively. Both the immersion main chip 73 and the immersion low-power chip 74 are immersed in the immersion cavity 72. A heat sink is disposed on the outside of the immersion main chip 73. When the immersion liquid cold plate 7 is mounted on the liquid cooling rack 1, the two immersion joints 71 connect to the internal piping joints on the liquid cooling rack 1 located at the location where the immersion liquid cold plate 7 is located.

[0054] The immersion principle of the immersion liquid cold plate 7 is solid-liquid heat exchange and phase change cooling. The main process includes coolant injection, heat exchange between the heat sink (or chip packaging surface) and the coolant, phase change, and coolant outflow to the external heat exchange equipment. Specifically:

[0055] When the submerged main chip 73 and the submerged low-power chip 74 are operating, pump 6 delivers coolant from the condenser 42 to the sealed cold plate. Direct heat exchange occurs between the coolant and the chip heat sink or chip package surface. When the coolant encounters the hot chip or heat sink, solid-liquid heat exchange occurs. Alternatively, the coolant partially evaporates, removing heat generated by the chip and then flows back into the condenser.

[0056] The immersion liquid cooling module is a beneficial supplement to the above-mentioned jet evaporation condensation module. It can realize the situation where there are multiple main chips with lower power consumption relative to the jet evaporation condensation module or there are multiple small-sized high heat flux density chips, and the allowable temperature of multiple chips is lower.

[0057] Immersion cooling modules use FC coolant, and module components are compatible with FC coolant. The components within the module that require additional heat sinks to improve heat dissipation efficiency can be adjusted based on actual needs. The module must be sealed to prevent FC coolant leakage. Module connectors must be located outside the sealed area to ensure smooth module insertion and removal.

[0058] The micro-spray cooling device 44 is chip-level and can be customized to the chip's shape, size, and power distribution. The immersion cooling plate 7 is module-level and can provide partial or full immersion cooling to meet the cooling needs of different module chips. The immersion main chip 73 uses full immersion cooling, while the immersion low-power chip 74 uses partial immersion cooling. Multiple heat sinks are provided on the immersion main chip 73 to facilitate better cooling in the coolant. The micro-spray cooling device 44 is similar to a traditional radiator, making it easy to assemble and disassemble. Since the micro-spray cooling device 44 does not directly contact the chip, the risk of leakage is low and reliability is high. With the micro-spray cooling plate 4, the chip can be positioned anywhere desired simply by adding a micro-spray cooling device at the chip location and sealing it within the spray chamber 41. In contrast, chips using the immersion cooling plate 7 must be immersed in the immersion chamber 72, and their position cannot be freely adjusted.

[0059] For boards with fewer high-power chips and higher heat flux, the micro-spray liquid cooling plate 4 is preferred. This structure offers high heat dissipation efficiency and is suitable for single chips approaching 500W or above. The immersion liquid cooling plate 7, on the other hand, offers the advantage of submerging all of the board's chips within a single space, making it suitable for cooling chips under 300W. Therefore, depending on the needs, the board or its chips can be placed within either the micro-spray liquid cooling plate 4 or the immersion liquid cooling plate 7.

[0060] Figure 2 The condenser 42 shown can be placed separately outside the system, or the metal cold plate structure part that changes the atomized coolant from gas to liquid in the entire circuit can be regarded as the condenser.

[0061] Example 2

[0062] In this embodiment, Figure 8As shown, the micro-spray liquid cooling plate 4 includes a jet evaporation condensation device 43 and a micro-spray liquid cooling device 44 provided on the jet evaporation condensation device 43. The micro-spray liquid cooling device 44 includes a shell 40. The top of the shell 40 is an inlet pipe 440 and a steam chamber 446. The outlet end of the inlet pipe 440 is connected to one end of the cold liquid chamber 441. The other end of the cold liquid chamber 441 is connected to a nozzle plate 442. A plurality of holes are provided on the nozzle plate 442. The plurality of holes are evenly arranged according to the jet array. A flow stabilizing plate 449 is provided in the cold liquid chamber 441, facing the outlet end of the inlet pipe 440. The flow stabilizing plate 449 is directly or indirectly connected to the nozzle plate 442. The inner wall of the shell 40 is connected, and a channel connected to the nozzle plate 442 is provided between the flow stabilizing plate 449 and the inner wall of the shell 40 or on the flow stabilizing plate 449. After the high-speed liquid enters the nozzle plate 442, the flow stabilizing plate 449 ensures that the jet state of the array nozzle is basically consistent; the bottom of the shell 40 is sealed and fixed on the printed circuit board 47, and a micro-spray main chip 401 is provided in the shell 40. The micro-spray main chip 401 is fixed on the printed circuit board 47 and is located directly below the nozzle plate 442; the shell 40 and the printed circuit board 47 together form a water-sealed structure to minimize the direct thermal resistance between the device and the cold plate. The bottom of the nozzle plate 442 is connected to the steam chamber 446, the top of the steam chamber 446 is connected to one end of the steam main pipe 447, the other end of the steam main pipe 447 is connected to the outlet pipe 448, and the bottom of one side of the shell 40 is connected to the outlet pipe 448; the steam chamber 446 and the cold liquid chamber 441 are not directly connected, and the two are separated by the nozzle plate 442.

[0063] The rest is the same as Example 1.

Claims

1. A chip micro-spray liquid cooling and immersion liquid cooling module combination device, characterized in that: The invention comprises a liquid cooling rack (1), a heat exchanger (2), a pump (6), and a total liquid cooling joint (5) fixed on the liquid cooling rack (1), a micro-spray liquid cooling plate (4) and an immersion liquid cooling plate (7) plugged into the liquid cooling rack (1), a fan (3) fixed on the heat exchanger (2), the micro-spray liquid cooling plate (4) and the immersion liquid cooling plate (7) are both arranged on one side of the heat exchanger (2), the fan (3) is arranged on the other side of the heat exchanger (2), at least two total liquid cooling joints (5) are provided, an internal pipeline is provided in the liquid cooling rack (1), the two ends of the internal pipeline are respectively connected to the two total liquid cooling joints (5), and the micro-spray liquid cooling plate (4) and the immersion liquid cooling plate (7) on the liquid cooling rack (1) are provided with a fan (3). The installation position of the plate (7) is respectively provided with a joint for connecting the internal pipeline to the micro-spray liquid cooling plate (4) and the immersion liquid cooling plate (7); the micro-spray liquid cooling plate (4) includes a spray chamber (41), the upper part of the spray chamber (41) is connected to the inlet end of the condenser (42) through a pipeline, the outlet end of the condenser (42) is connected to the inlet end of the pump (6) through a pipeline, the lower end of the spray chamber (41) is connected to the inlet end of the pump (6) through a pipeline, the outlet end of the pump (6) is connected to the inlet end of the heat exchanger (2) through a pipeline, and the outlet end of the heat exchanger (2) is connected to the nozzle located at the upper part of the spray chamber (41) through a pipeline, and a micro-spray main chip (401) is provided directly below the nozzle in the spray chamber (41).

2. A chip micro-spray liquid cooling and immersion liquid cooling module combination device as claimed in claim 1, characterized in that: A fluid control valve (45) is provided on the pipeline between the outlet end of the heat exchanger (2) and the spray chamber (41).

3. A chip micro-spray liquid cooling and immersion liquid cooling module combination device as claimed in claim 1, characterized in that: The micro-spray liquid cooling plate (4) includes a jet evaporation condensation device (43) and a micro-spray liquid cooling device (44) provided on the jet evaporation condensation device (43). The micro-spray liquid cooling device (44) includes an inlet pipe (440). The outlet end of the inlet pipe (440) is connected to one end of the cold liquid chamber (441). The other end of the cold liquid chamber (441) is connected to a nozzle plate (442). The nozzle plate (442) is provided with a plurality of holes and is connected to one end of a plurality of nozzles (443). The other ends of the plurality of nozzles (443) are provided in a steam chamber (446). The steam chamber (446) is also provided with a plurality of steam branches (445). The top of the steam chamber (446) The steam chamber (446) is connected to one end of the steam main pipe (447), the other end of the steam main pipe (447) is connected to the outlet pipe (448), the other end of the plurality of nozzles (443) and one end of the plurality of steam branches (445) are all located just above and close to the micro-spray main chip (401), and one side of the bottom of the steam chamber (446) is connected to the outlet pipe (448); the steam chamber (446) and the cold liquid chamber (441) are not directly connected, and the two are separated by the nozzle plate (442) and the nozzle (443); the inlet pipe (440), the cold liquid chamber (441), and the steam chamber (446) together constitute the spray chamber (41).

4. A chip micro-spray liquid cooling and immersion liquid cooling module combination device as claimed in claim 3, characterized in that: The outer side of the spray chamber (41) is evenly distributed with a plurality of screw holes (444), and the micro-spray liquid cooling device (44) is passed through the screw holes (444) and the holes of the printed circuit board (47) by installing screws (46), and then is fastened to the fixing bracket (49) on the back of the printed circuit board (47). A micro-spray main chip (401) is provided between the spray chamber (41) and the printed circuit board (47).

5. A chip micro-spray liquid cooling and immersion liquid cooling module combination device as claimed in claim 3 or 4, characterized in that: A heat conducting pad (48) is provided between the surface of the micro-spray main chip (401) and the micro-spray liquid cooling device (44).

6. A chip micro-spray liquid cooling and immersion liquid cooling module combination device as claimed in claim 4, characterized in that: The jet evaporation condensation device (43) comprises a printed circuit board (47), a micro-spray main chip (401) and a micro-spray auxiliary chip (402) are fixed on the printed circuit board (47), a micro-spray internal pipeline is provided in the jet evaporation condensation device (43), two ends of the micro-spray internal pipeline are respectively connected to two micro-spray joints (403), and the two micro-spray joints (403) are provided on the side of the jet evaporation condensation device (43); when the micro-spray liquid cooling plate (4) is installed on the liquid cooling rack (1), the two micro-spray joints (403) are respectively connected to the joints of the internal pipeline located at the position of the micro-spray liquid cooling plate (4) on the liquid cooling rack (1); and joints are provided on the micro-spray internal pipeline located at the position of the micro-spray main chip (401) on the jet evaporation condensation device (43) for respectively connecting to an inlet pipe (440) and an outlet pipe (448).

7. A chip micro-spray liquid cooling and immersion liquid cooling module combination device as claimed in claim 1, characterized in that: The immersion type liquid cooling plate (7) comprises a sealed cold plate, an immersion cavity (72) is provided in the sealed cold plate, two immersion joints (71) connected to the immersion cavity (72) are provided on the outside of the sealed cold plate, the immersion cavity (72) is connected to the immersion main chip (73) and the immersion low power consumption chip (74) respectively, the immersion main chip (73) and the immersion low power consumption chip (74) are both immersed in the immersion cavity (72), and a heat sink is provided on the outside of the immersion main chip (73); when the immersion type liquid cooling plate (7) is installed on the liquid cooling rack (1), the two immersion joints (71) are respectively connected to the joints of the internal pipeline located at the position of the immersion type liquid cooling plate (7) on the liquid cooling rack (1).

8. A chip micro-spray liquid cooling and immersion liquid cooling module combination device as claimed in claim 1, characterized in that: The two total liquid cooling joints (5) are connected to an external cooling liquid circulation system; or when the internal pipeline is filled with cooling liquid, the two total liquid cooling joints (5) are directly blocked.

9. A chip micro-spray liquid cooling and immersion liquid cooling module combination device as claimed in claim 1, characterized in that: The micro-spray liquid cooling plate (4) includes a jet evaporation condensation device (43) and a micro-spray liquid cooling device (44) provided on the jet evaporation condensation device (43). The micro-spray liquid cooling device (44) includes a shell (40). The top of the shell (40) is an inlet pipe (440) and a steam chamber (446). The outlet end of the inlet pipe (440) is connected to one end of the cold liquid chamber (441). The other end of the cold liquid chamber (441) is connected to a nozzle plate (442). The nozzle plate (442) is provided with a plurality of holes. A flow stabilizing plate (449) is provided in the cold liquid chamber (441) facing the outlet end of the inlet pipe (440). The flow stabilizing plate (449) is directly or indirectly connected to the inner wall of the shell (40), and the flow stabilizing plate (449) is connected to the inner wall of the shell (40). A channel connected to the nozzle plate (442) is occasionally provided on the flow stabilizing plate (449), the bottom of the capsule (40) is sealed and fixed on the printed circuit board (47), a micro-spray main chip (401) is provided in the capsule (40), the micro-spray main chip (401) is fixed on the printed circuit board (47), and is located directly below the nozzle plate (442); the bottom of the nozzle plate (442) is connected to the steam chamber (446), the top of the steam chamber (446) is connected to one end of the steam main pipe (447), the other end of the steam main pipe (447) is connected to the outlet pipe (448), and the bottom of one side of the capsule (40) is connected to the outlet pipe (448); the steam chamber (446) and the cold liquid chamber (441) are not directly connected, and the two are separated by the nozzle plate (442).

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