Bone voiceprint sensor and electronic equipment

Abstract

The utility model discloses a bone voiceprint sensor and an electronic device. The bone voiceprint sensor comprises a shell, wherein the shell is provided with an inner cavity; the MEMS chip is arranged in the inner cavity, the MEMS chip comprises a vibrating diaphragm, and one side of the vibrating diaphragm is connected with a load bearing piece. The weight bearing part can increase the weight of the vibrating diaphragm, so that the bone voiceprint sensor only extracts the vibration signal of the vocal cord of the user, interference signals transmitted through air are prevented from being received, and the precision of the bone voiceprint sensor is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic equipment, and more specifically, to a bone voiceprint sensor and electronic equipment. Background Art

[0002] In related technologies, with the rise of the TWS (i.e., True Wireless Stereo) headset market, headset call noise reduction is a key solution for TWS headsets. Current call noise reduction solutions mainly use multiple microphones to perform noise reduction processing, but the noise reduction effect of multiple microphones is poor. When in a noisy environment, the noise reduction effect is difficult to meet the call needs. In addition, existing bone voiceprint microphones only need to extract the vibration signal of the user's vocal cords to avoid receiving interference signals transmitted through the air, and the accuracy of current bone voiceprint sensors is poor.

[0003] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. Utility Model Content

[0004] One purpose of the utility model is to provide a new technical solution for a bone voiceprint sensor.

[0005] According to a first aspect of the present invention, a bone voiceprint sensor is provided. The bone voiceprint sensor comprises:

[0006] a housing having an inner cavity;

[0007] A MEMS chip is disposed in the inner cavity. The MEMS chip includes a diaphragm, and a weight-bearing member is connected to one side of the diaphragm.

[0008] Optionally, the weight-bearing member includes an adhesive layer, and the adhesive layer is coated on the surface of the diaphragm.

[0009] Optionally, the weight-bearing member further includes a mass block, and the mass block is bonded to the surface of the diaphragm.

[0010] Optionally, a limiting portion is provided on the inner wall of the housing, and the limiting portion is spaced apart from the mass block along the vibration direction, and the limiting portion can limit the vibration amplitude of the mass block.

[0011] Optionally, the limiting portion includes a protrusion arranged toward the mass block, and when the diaphragm vibrates, the protrusion can abut against a side of the mass block facing away from the diaphragm.

[0012] Optionally, the diaphragm includes a first diaphragm and a second diaphragm that are spaced apart, and the weight-bearing member is provided on the surface of the first diaphragm and / or the second diaphragm.

[0013] Optionally, the shell includes a cover body and a substrate, the MEMS chip is mounted on the substrate, the cover body is covered on the substrate, the cover body, the substrate and the MEMS chip form a first inner cavity around each other, a second inner cavity is formed between the MEMS chip and the substrate, and the substrate is provided with a first through hole and a second through hole, the first through hole is connected to the first inner cavity, and the second through hole is connected to the second inner cavity.

[0014] Optionally, the ratio of the volume of the first inner cavity to the volume of the second inner cavity is 1:1.

[0015] Optionally, an ASIC chip is further included, wherein the ASIC chip is arranged in the inner cavity and is electrically connected to the MEMS chip, and a protective glue is provided on the surface of the ASIC chip.

[0016] According to a second aspect of the present invention, an electronic device is provided, which includes the bone voiceprint sensor of the above embodiment.

[0017] One of the technical effects of the present application is that the MEMS chip includes a diaphragm, and a weight-bearing member is connected to one side of the diaphragm. The weight-bearing member can increase the weight of the diaphragm so that the bone voiceprint sensor only extracts the vibration signal of the user's vocal cords, avoiding receiving interference signals transmitted through the air, which is conducive to improving the accuracy of the bone voiceprint sensor.

[0018] Other features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0020] Figure 1 It is a structural diagram of a bone voiceprint sensor according to an embodiment of the present application.

[0021] Figure 2 FIG. 1 is a structural diagram of a bone voiceprint sensor according to another embodiment of the present application.

[0022] Figure 3 This is a schematic diagram of the internal structure of a bone voiceprint sensor according to an embodiment of the present application.

[0023] Figure 4 It is a bottom view of a bone voiceprint sensor according to one embodiment of the present application.

[0024] Figure 5 FIG. 4 is a bottom view of a bone voiceprint sensor according to another embodiment of the present application.

[0025] Description of reference numerals:

[0026] 1. Housing; 11. Substrate; 111. First through hole; 112. Second through hole; 113. Pad; 12. Cover; 13. Limiting portion; 14. First inner cavity; 2. MEMS chip; 21. Diaphragm; 3. Weight-bearing part; 31. Mass block; 4. Second inner cavity; 5. ASIC chip; 51. Protective glue; 6. Gold wire. DETAILED DESCRIPTION

[0027] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0028] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present invention, its application, or uses.

[0029] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0030] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0031] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0032] According to one embodiment of the present application, a bone voiceprint sensor is provided. Figures 1 to 5 As shown, the bone voiceprint sensor includes a housing 1 and a MEMS chip 2. The housing 1 has an inner cavity. The MEMS chip 2 is disposed in the inner cavity and includes a diaphragm 21. A weight 3 is connected to one side of the diaphragm 21.

[0033] In this example, the MEMS chip 2 includes a diaphragm 21, and a weight member 3 is connected to one side of the diaphragm 21. The weight member 3 can increase the weight of the diaphragm 21 so that the bone voiceprint sensor can only extract the vibration signal of the user's vocal cords, avoiding receiving interference signals transmitted through the air, which is beneficial to improving the accuracy of the bone voiceprint sensor.

[0034] In this example, the bone voiceprint sensor can be a bone voiceprint microphone, which collects audio signals by sensing the sound vibrations conducted by the human bones. This technology utilizes the process of sound being directly transmitted to the inner ear through media such as the skull and bony labyrinth, eliminating the step of sound waves propagating in the air, thereby achieving clear sound restoration even in noisy environments. The diaphragm 21 of the bone voiceprint sensor in this application is connected to one side with a weight-bearing member 3, which can increase the weight of the diaphragm 21. When the user is in a noisy environment, the bone voiceprint sensor can only extract the vibration signal of the user's vocal cords and avoid receiving interference signals transmitted through the air, which is beneficial to improving the accuracy of the bone voiceprint sensor to meet the user's call needs.

[0035] Of course, the bone voiceprint sensor of the present application can also be used in other aspects, such as vibration sensor, frequency sensor, etc. Those skilled in the art may determine the method according to the actual situation, and no specific limitation is made here.

[0036] In this example, the MEMS chip 2 is capable of converting bone-conducted sound vibrations into electrical signals for processing. When the MEMS chip 2 senses sound vibrations, it converts these mechanical vibrations into electrical signals and transmits the electrical signals to the ASIC chip 5 for further processing. By providing a weight-bearing member 3 on the diaphragm 21 of the MEMS chip 2, the weight of the diaphragm 21 can be increased, and bone-contact vibration conduction can cause the diaphragm 21 to vibrate to receive vibration signals. Sound signals conducted through air do not cause the diaphragm 21 to vibrate, thereby isolating the interfering signals propagating in the air.

[0037] In this example, the MEMS chip 2 further includes a back electrode, a diaphragm 21 and the back electrode are spaced apart, with a certain gap between the back electrode and the diaphragm 21, and the two form a capacitor structure. The weight 3 is provided on the surface of the diaphragm 21 facing away from the back electrode.

[0038] In one example, the weight-bearing member 3 includes an adhesive layer, and the adhesive layer is coated on the surface of the diaphragm 21 .

[0039] like Figure 1 As shown, in this example, the weight-bearing member 3 can be a layer of glue applied to the surface of the diaphragm 21. Applying the glue layer on one side of the diaphragm 21 can increase the weight of the diaphragm 21. The glue application is convenient and the process is simple, which helps improve the production efficiency of bone voiceprint sensors.

[0040] It should be noted that for adhesive layers formed using the same type of glue, the thicker the adhesive layer, the heavier it is. In other words, those skilled in the art can select an appropriate adhesive layer thickness based on actual conditions to adjust the weight of the diaphragm 21 to an appropriate value, thereby enabling more accurate reception of the user's skull vibration signal.

[0041] The type of glue may be epoxy resin glue or silicone glue, and those skilled in the art may determine the type according to actual conditions, and no specific limitation is made here.

[0042] In this example, the glue can be applied to the surface of one side of the diaphragm 21, and the glue layer completely covers the diaphragm 21. Alternatively, the glue can be applied to only a portion of the diaphragm 21. Those skilled in the art can determine the method based on actual conditions, and this is not specifically limited here.

[0043] In one example, Figure 2 As shown, the weight-bearing member 3 further includes a mass block 31 , and the mass block 31 is bonded to the surface of the diaphragm 21 .

[0044] like Figure 2 As shown, in this example, the weight-bearing member 3 includes a mass block 31, which is bonded to the surface of the diaphragm 21 to further adjust the weight of the diaphragm 21. In addition, the connection operation of the mass block 31 to the surface of the diaphragm 21 is simple, which is conducive to improving the production efficiency of the bone voiceprint sensor.

[0045] In this example, mass block 31 can be made of a metal material, such as aluminum, iron, copper, or an alloy such as stainless steel or aluminum alloy. Alternatively, mass block 31 can be made of a non-metallic material, such as ceramic, glass, or plastic. Of course, the specific material of mass block 31 can be determined by those skilled in the art based on actual circumstances and is not specifically limited here.

[0046] It should be noted that those skilled in the art can select a suitable weight for the mass block 31 according to actual conditions to adjust the weight of the diaphragm 21 to an appropriate value, thereby enabling more accurate reception of the user's skull vibration signal. The mass block 31 can be made of a material with a higher density to reduce its volume, thereby saving installation space.

[0047] In this example, an adhesive layer may be provided between the mass block 31 and the diaphragm 21 , and the mass block 31 and the diaphragm 21 are connected via the adhesive layer. In addition, the adhesive layer and the mass block 31 can cooperate to increase the weight of the diaphragm 21 .

[0048] In one example, Figure 2 As shown, a limiting portion 13 is provided on the inner wall of the housing 1 . The limiting portion 13 and the mass block 31 are spaced apart along the vibration direction. The limiting portion 13 can limit the vibration amplitude of the mass block 31 .

[0049] like Figure 2As shown, in this example, a limiter 13 is provided on the inner wall of the housing 1. The limiter 13 is spaced apart from the mass 31 along the vibration direction. The limiter 13 can limit the vibration amplitude of the mass 31, thereby controlling the displacement of the mass 31 and preventing damage to the diaphragm 21 caused by excessive displacement. For example, when the diaphragm 21 drives the mass 31 to vibrate upward, the mass 31 can abut against the limiter 13, thereby limiting further upward vibration of the mass 31 and preventing damage to the diaphragm 21 caused by excessive displacement of the mass 31.

[0050] In one example, Figure 2 As shown, the limiting portion 13 includes a protrusion arranged toward the mass block 31 . When the diaphragm 21 vibrates, the protrusion can abut against the side of the mass block 31 away from the diaphragm 21 .

[0051] In this example, the inner wall of the housing 1 is provided with a protrusion extending toward the mass block 31, with a gap between the protrusion and the mass block 31. When the diaphragm 21 drives the mass block 31 to vibrate upward, the mass block 31 can abut against the protrusion, thereby limiting further upward vibration of the mass block 31 and preventing damage to the diaphragm 21 due to excessive displacement of the mass block 31.

[0052] The protrusion can be integrally formed with the housing 1, thereby saving assembly steps. Alternatively, the protrusion can be a metal block or a non-metal block, and the protrusion can be bonded to the inner wall of the housing 1. The protrusion is arranged opposite to the mass block 31.

[0053] In one example, the diaphragm 21 includes a first diaphragm and a second diaphragm that are spaced apart, and the weight-bearing member 3 is provided on the surface of the first diaphragm and / or the second diaphragm.

[0054] In this example, the MEMS chip 2 may also have a dual-diaphragm 21 structure, that is, the diaphragm 21 includes a first diaphragm and a second diaphragm. The first diaphragm and the second diaphragm are spaced apart, and a back electrode is provided between the first diaphragm and the second diaphragm. For example, the first diaphragm is provided at one end of the support portion, the back electrode is installed in the middle of the support portion, and the second diaphragm is provided at the other end of the support portion. The back electrode can form a capacitor structure with the first diaphragm and the second diaphragm respectively. The support portion is made of an insulating material, which not only plays a supporting role but also ensures insulation between the two diaphragms 21 and the back electrode.

[0055] The surface of the first diaphragm and / or the second diaphragm is provided with a weight member 3. For example, both the first diaphragm and the second diaphragm may be provided with a weight member 3, i.e., the side of the first diaphragm facing away from the back pole is provided with a weight member 3, and the side of the second diaphragm facing away from the back pole is provided with a weight member 3. Alternatively, only one of the first diaphragm and the second diaphragm may be provided with a weight member 3. Those skilled in the art may determine this according to actual circumstances, and this is not specifically limited here.

[0056] In one example, Figure 1 and Figure 2 As shown, the housing 1 includes a cover body 12 and a substrate 11, the MEMS chip 2 is mounted on the substrate 11, the cover body 12 is covered on the substrate 11, the cover body 12, the substrate 11 and the MEMS chip 2 surround to form a first inner cavity 14, a second inner cavity 4 is formed between the MEMS chip 2 and the substrate 11, and the substrate 11 is provided with a first through hole 111 and a second through hole 112, the first through hole 111 is connected to the first inner cavity 14, and the second through hole 112 is connected to the second inner cavity 4.

[0057] like Figure 1 and Figure 2 As shown, in this example, the cover body 12 has an open end, and the open end of the cover body 12 is covered on the substrate 11 to form an inner cavity, wherein the cover body 12 can be welded or bonded to one side of the substrate 11. The MEMS chip 2 is arranged in the inner cavity, and the cover body 12, the substrate 11 and the MEMS chip 2 form a first inner cavity 14 around it. The MEMS chip 2 is mounted on the substrate 11, and a second inner cavity 4 can be formed between the MEMS chip 2 and the substrate 11. The substrate 11 is provided with a first through hole 111 and a second through hole 112 along the thickness direction. The second through hole 112 is located at a position corresponding to the MEMS chip 2, so that the second through hole 112 is connected to the second inner cavity 4. The first through hole 111 is located on one side of the MEMS chip 2, and the first through hole 111 is connected to the first inner cavity 14. By providing the first through hole 111 and the second through hole 112, the pressure difference between the first inner cavity 14 and the second inner cavity 4 can be balanced, which is conducive to eliminating the sound signal transmitted through the air and playing a role in sound isolation.

[0058] It should be noted that the substrate 11 will be prepared with through holes, which can balance the internal and external air pressure during assembly. In the prior art, the through holes on the substrate 11 need to be sealed after the assembly is completed. In the present application, the substrate 11 is provided with a first through hole 111 and a second through hole 112 along the thickness direction. During assembly, the first through hole 111 can balance the air pressure, and the second through hole 112 is located at a position corresponding to the MEMS chip 2, so that the second through hole 112 is connected to the second inner cavity 4. The first through hole 111 is located on one side of the MEMS chip 2, and the first through hole 111 is connected to the first inner cavity 14, so that there is no need to seal the through hole, which can save the assembly process.

[0059] In this example, the volume ratio of the first inner cavity 14 to the volume of the second inner cavity 4 is 1:1, which further helps to reduce the pressure difference between the first inner cavity 14 and the second inner cavity 4, thereby eliminating sound signals transmitted through the air and achieving a sound isolation effect.

[0060] The ratio of the volume of the first inner cavity 14 to the volume of the second inner cavity 4 is 1:1. That is, the ratio of the volume of the first inner cavity 14 to the volume of the second inner cavity 4 is 1:1 or close to 1:1. For example, the ratio of the volume of the first inner cavity 14 to the volume of the second inner cavity 4 can be 1:0.8, 1:0.9, 1:1, 1:1.1, 1:1.2, etc. Those skilled in the art may determine the ratio based on actual conditions, and this is not specifically limited here.

[0061] In one example, Figure 1 and Figure 2 As shown, the bone voiceprint sensor further includes an ASIC chip 5 , which is disposed in the inner cavity and electrically connected to the MEMS chip 2 . A protective adhesive 51 is provided on the surface of the ASIC chip 5 .

[0062] like Figure 1 and Figure 2 As shown, in this example, an ASIC chip 5 is mounted on a substrate 11 and electrically connected to the MEMS chip 2 via gold wires 6. A protective adhesive 51 is applied to the surface of the ASIC chip 5 to protect it. For example, the protective adhesive 51 can provide light shielding and corrosion protection. The protective adhesive 51 can be epoxy resin adhesive or silicone adhesive, etc., and those skilled in the art can determine the adhesive based on actual conditions, and this is not specifically limited here.

[0063] In this example, if Figure 3 As shown, the substrate 11 can be a PCB board, and the ASIC chip 5 and the MEMS chip 2 are respectively bonded to the PCB board. The ASIC chip 5 and the MEMS chip 2 are electrically connected through gold wires 6, and the ASIC chip 5 and the PCB board can also be electrically connected through gold wires 6.

[0064] In this example, if Figure 5 As shown, a soldering pad 113 is provided at the bottom of the PCB board to facilitate connection with an external circuit (e.g., a main control board of an electronic device) to achieve data transmission and reception of control instructions. The soldering pad 113 can be a ring structure, thereby improving the convenience of connection with the external circuit.

[0065] In this example, the bottom of the PCB is further provided with a connection portion for fixedly connecting to an external device, and the PCB can be bonded or soldered to the external device. For example, the connection portion can be provided at the four corners of the PCB to improve the stability of the connection.

[0066] According to another embodiment of the present invention, an electronic device is provided. The electronic device includes the bone voiceprint sensor of the above-described embodiment. The bone voiceprint sensor includes a housing 1 and a MEMS chip 2. The MEMS chip 2 includes a diaphragm 21, with a weight member 3 connected to one side of the diaphragm 21. The weight member 3 can increase the weight of the diaphragm 21 so that the bone voiceprint sensor can only extract the vibration signal of the user's vocal cords, avoiding interference signals transmitted through the air, thereby improving the accuracy of the bone voiceprint sensor.

[0067] In this example, the electronic device may be a TWS headset, or other wearable smart devices, etc. Those skilled in the art may determine the method according to actual circumstances, and no specific limitation is made here.

[0068] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0069] Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art will appreciate that the above examples are for illustration only and are not intended to limit the scope of the present invention. Those skilled in the art will appreciate that modifications may be made to the above embodiments without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A bone voiceprint sensor, characterized in that: include: A housing (1), wherein the housing (1) has an inner cavity; A MEMS chip (2) is disposed in the inner cavity. The MEMS chip (2) comprises a diaphragm (21), and a weight-bearing member (3) is connected to one side of the diaphragm (21).

2. The bone voiceprint sensor according to claim 1, characterized in that: The weight-bearing member (3) comprises an adhesive layer, and the adhesive layer is coated on the surface of the diaphragm (21).

3. The bone voiceprint sensor according to claim 1, characterized in that: The weight-bearing member (3) comprises a mass block (31), and the mass block (31) is bonded to the surface of the diaphragm (21).

4. The bone voiceprint sensor according to claim 3, characterized in that: A limiting portion (13) is provided on the inner wall of the housing (1), the limiting portion (13) and the mass block (31) are spaced apart along the vibration direction, and the limiting portion (13) can limit the vibration amplitude of the mass block (31).

5. The bone voiceprint sensor according to claim 4, characterized in that: The limiting portion (13) includes a protrusion arranged toward the mass block (31); when the diaphragm (21) vibrates, the protrusion can abut against a side of the mass block (31) that faces away from the diaphragm (21).

6. The bone voiceprint sensor according to claim 1, characterized in that: The diaphragm (21) comprises a first diaphragm and a second diaphragm that are spaced apart, and the weight-bearing member (3) is provided on the surface of the first diaphragm and / or the second diaphragm.

7. The bone voiceprint sensor according to claim 1, characterized in that: The housing (1) comprises a cover body (12) and a substrate (11); the MEMS chip (2) is mounted on the substrate (11); the cover body (12) is arranged on the substrate (11); the cover body (12), the substrate (11) and the MEMS chip (2) surround and form a first inner cavity (14); a second inner cavity (4) is formed between the MEMS chip (2) and the substrate (11); the substrate (11) is provided with a first through hole (111) and a second through hole (112); the first through hole (111) is in communication with the first inner cavity (14); and the second through hole (112) is in communication with the second inner cavity (4).

8. The bone voiceprint sensor according to claim 7, characterized in that: The ratio of the volume of the first inner cavity (14) to the volume of the second inner cavity (4) is 1:

1.

9. The bone voiceprint sensor according to claim 1, characterized in that: It also includes an ASIC chip (5), which is arranged in the inner cavity and electrically connected to the MEMS chip (2), and a protective glue (51) is provided on the surface of the ASIC chip (5).

10. An electronic device, characterized in that: The device comprises the bone voiceprint sensor according to any one of claims 1 to 9.

Images