Single-sided copper-clad plate

Abstract

A single-sided copper-clad plate comprises a first insulating layer which comprises at least one layer of prepreg; the conductive layer is arranged on the surface of one side of the first insulating layer, and the conductive layer is a metal foil; the second insulating layer is arranged on the surface of the side, away from the conductive layer, of the first insulating layer, and the second insulating layer is a cured layer. The single-sided copper-clad plate is provided with the second insulating layer in a completely solidified state, the second insulating layer and the conductive layer are respectively positioned on the two sides of the first insulating layer, and the second insulating layer cannot be fused under high temperature and high pressure, has no cohesiveness, cannot be bonded after being pressed, and plays a role in self-release; hot pressing of the two single-face copper-clad plates can be completed in the one-time hot pressing process, a release film does not need to be used, the placing and removing procedures of the release film are reduced, the efficiency is higher, meanwhile, the stainless steel template does not make contact with the release film, and the situation that the stainless steel template is polluted by a release agent on the surface of the release film is avoided.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit boards, and in particular relates to a single-sided copper clad board. Background Art

[0002] Single-sided copper-clad laminates (SCCLs) are circuit boards with copper foil on one side and an insulating structure on the other. They are the base material for single-sided circuit boards. Single-sided circuit boards have a conductive layer on only one side, so all electronic components are concentrated on one side of the board, while wires are concentrated on the other side. Single-sided circuit boards have simple functions and are primarily used in simple electronic products such as radios, heaters, refrigerators, washing machines, and other household appliances, as well as commercial equipment such as printers, vending machines, circuit boards, and electronic components.

[0003] The structure of a single-sided circuit board mainly includes an insulating layer composed of a semi-cured sheet and a conductive layer composed of a metal copper foil. The insulating layer and the conductive layer are hot-pressed together to form a single-sided circuit board. The existing manufacturing process of single-sided circuit boards is to stack the insulating layer and the conductive layer between stainless steel templates for pressing. During the pressing process, the conductive layer and the insulating layer are opposite to the stainless steel templates respectively. Since the insulating layer is a semi-cured sheet, the semi-cured sheet is sticky under high temperature and high pressure. In order to prevent the insulating layer and the stainless steel template from sticking together, a release film needs to be used to separate the insulating layer and the stainless steel template, and the release film is removed after the lamination is completed. However, during the high-temperature hot pressing process, the release film may cause the mold to stick to the plate, and the release agent on the surface of the release film will contaminate the stainless steel template. In addition, when using the release film to separate the insulating layer and the stainless steel template, the release film must be laid on the steel plate, which makes the process complicated and the cost high. Utility Model Content

[0004] The utility model aims to provide a single-sided copper clad plate which can avoid the contamination of the template by a release agent and simplify the production process.

[0005] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A single-sided copper-clad laminate comprises: a first insulating layer, the first insulating layer comprising at least one layer of prepreg; a conductive layer arranged on one surface of the first insulating layer, the conductive layer being a metal foil; and a second insulating layer arranged on a surface of the first insulating layer facing away from the conductive layer, the second insulating layer being a cured layer.

[0007] In some embodiments, the thickness of the conductive layer is 10-105 μm.

[0008] In some embodiments, the thickness of the first insulating layer is 0.08-0.30 mm.

[0009] In some embodiments, the thickness of the second insulating layer is 0.08-0.30 mm.

[0010] In some embodiments, the prepreg comprises glass fiber cloth and semi-cured resin glue.

[0011] In some embodiments, the second insulating layer includes glass fiber cloth and cured resin glue.

[0012] In some embodiments, it includes a conductive layer, at least one first insulating layer and at least one second insulating layer, the first insulating layer and the second insulating layer are alternately arranged, one side surface of the single-sided copper clad laminate is the conductive layer, and the other side surface is the second insulating layer.

[0013] In some embodiments, during hot pressing, the conductive layer and the second insulating layer are respectively opposite to a stainless steel template; or the conductive layer is opposite to the stainless steel template, and the second insulating layer is opposite to the second insulating layer.

[0014] In some embodiments, the glass fiber cloth is a plain woven glass fiber cloth, and the model of the glass fiber cloth is 7626, 7638, 7628, 2116, 3313, 2313, 1506, or 1080.

[0015] From the above technical solution, it can be seen that the single-sided copper clad laminate of the utility model has a second insulating layer in a fully solidified state. The second insulating layer and the conductive layer are respectively located on both sides of the first insulating layer. The second insulating layer will not melt under high temperature and high pressure, has no adhesiveness, and will not adhere after the pressing is completed, playing the role of self-release. The hot pressing of two single-sided copper clad laminates can be completed in one hot pressing process, and there is no need to use a release film. This not only reduces the placement and removal process of the release film, but also increases efficiency. At the same time, the stainless steel template does not contact the release film, avoiding the release agent on the surface of the release film from contaminating the stainless steel template. The single-sided copper clad laminate of the utility model can adopt the same stacking method as the double-sided copper clad laminate, without any adjustment, convenient production, and high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 A schematic diagram of the stacking structure of an existing single-sided copper clad laminate when pressed together;

[0018] Figure 2This is a structural schematic diagram of an embodiment of the single-sided copper clad laminate of the utility model;

[0019] Figure 3 This is a structural schematic diagram of another embodiment of the single-sided copper clad laminate of the utility model;

[0020] Figure 4 This is a schematic diagram of the single-sided copper clad laminate of the present invention being placed between stainless steel templates for pressing;

[0021] Figure 5 This is a schematic diagram of the laminated structure of the "one opening" pressing process of the single-sided copper clad laminate of the utility model;

[0022] Figure 6 Schematic diagram of the laminated structure of a conventional single-sided copper clad laminate with "one opening" pressing process.

[0023] The specific implementation of the present invention will be further described in detail below with reference to the accompanying drawings. DETAILED DESCRIPTION

[0024] The present invention is described in detail below in conjunction with the accompanying drawings. When describing the embodiments of the present invention in detail, for the sake of convenience, the drawings showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. It should be noted that the drawings are simplified and use non-precise scales, which are only used to facilitate and clearly assist in explaining the purpose of the embodiments of the present invention. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated; the terms "front", "back", "bottom", "upper", "lower", "front", "back", "left", "right", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present invention.

[0025] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "connected" and "connection" should be understood in a broad sense. For example, it can mean a fixed connection, a detachable connection, or an integral connection; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean internal communication between two components; it can mean a wireless connection or a wired connection. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0026] Single-sided copper-clad laminates (SCCLs) are single-sided circuit boards with a conductive layer on one side and an insulating layer on the other. The insulating layer is typically composed of multiple prepreg sheets stacked together. Prepreg sheets are made by impregnating fiberglass with resin and baking it at high temperatures to semi-cure the resin. The conductive layer is typically made of metal foil.

[0027] When pressing single-sided copper clad laminates, the conductive layer and the insulating layer are stacked together and placed between two stainless steel templates for hot pressing. The conductive layer and the insulating layer are facing the stainless steel templates. In order to avoid the insulating layer and the stainless steel template from sticking together, such as Figure 1 As shown, during hot pressing, a release film 300 is used to separate the insulating layer 100 and the stainless steel template 200. Figure 1 The stacked structure shown is composed of the following from top to bottom: stainless steel template 200, conductive layer 101, insulating layer 100, release film 300 and stainless steel template 200. After the hot pressing is completed, the release film 300 needs to be removed.

[0028] The conventional single-sided copper clad laminate preparation process requires the use of a release film, which is a thin film. When placing the release film, it is laid on the stainless steel template. During the hot pressing process, the release film may shift, wrinkle, deform, or stick to the mold, affecting product quality. In addition, the processes of placing and removing the release film will also increase the complexity of the preparation process.

[0029] In response to the above problems, the utility model provides a single-sided copper clad laminate. By improving the layer structure of the copper clad laminate, a release film is no longer needed during the hot pressing process, thereby solving the problems of easy sliding, wrinkling, breakage, high-temperature melting of the release film when laying it, and easy migration of the release material causing pollution.

[0030] like Figure 2 As shown, the single-sided copper-clad laminate of this embodiment includes a first insulating layer 1, a conductive layer 2, and a second insulating layer 3. The conductive layer 2 and the second insulating layer 3 are respectively located on either side of the first insulating layer 1, that is, the conductive layer 2 is disposed on one surface of the first insulating layer 1, and the second insulating layer 3 is disposed on the surface of the first insulating layer 1 facing away from the conductive layer 2. After the conductive layer 2, the first insulating layer 1, and the second insulating layer 3 are stacked in sequence, they are subjected to high temperature and high pressure pressing to form a single-sided copper-clad laminate.

[0031] The conductive layer 2 is a metal foil, such as an electrolytic copper foil, and has a thickness of 10 to 105 μm.

[0032] The first insulating layer 1 is a prepreg layer, comprising n layers of prepreg sheets, where n ≥ 1. The first insulating layer 1 primarily serves as insulation and bonding. The prepreg sheets are plain-woven glass fiber cloth impregnated with resin adhesive and then baked at high temperature to a semi-cured state. The resin adhesive used is the same as that used for FR-4.0 copper-clad laminates. The prepreg sheets can be baked at a temperature of 175°C for 5 to 15 minutes. In specific applications, the glass fiber cloth models include 7626, 7638, 7628, 2116, 3313, 2313, 1506, and 1080. The thickness of the first insulating layer 1 is 0.08 to 0.30 mm.

[0033] The second insulating layer 3 is a cured layer. The second insulating layer 3 is a plain woven glass fiber cloth impregnated with resin glue and baked until the resin glue is completely cured. The thickness of the second insulating layer 3 is 0.08 to 0.30 mm. The model of the glass fiber cloth used in the second insulating layer 3 can be 7626, 7638, 7628, 2116, 3313, 2313, 1506, and 1080. The baking temperature of the second insulating layer 3 is 175°C, and the baking time is 10 to 25 minutes. After the second insulating layer 3 is baked until it is completely cured, it will not be sticky during the high temperature and high pressure pressing process, and can play a role in release.

[0034] The single-sided copper clad plate of the present invention can be as follows Figure 2 The stacked structure shown is a conductive layer 2, a first insulating layer 1, and a second insulating layer 3. Figure 3 The stacked structure shown is a conductive layer 2, a first insulating layer 1, a second insulating layer 3, a first insulating layer 1, a second insulating layer 3, a first insulating layer 1, and a second insulating layer 3, that is, includes a conductive layer 2, at least one first insulating layer 1 and at least one second insulating layer 3.

[0035] like Figure 4As shown, when the conductive layer 2, first insulating layer 1, and second insulating layer 3, which are stacked in sequence, are hot-pressed into a single-sided copper-clad laminate, the conductive layer of the single-sided copper-clad laminate is aligned with the stainless steel template 200, and the second insulating layer 3 of one single-sided copper-clad laminate is aligned with the second insulating layer 3 of another single-sided copper-clad laminate. That is, the panel assembly for the single-sided copper-clad laminate manufacturing process of this embodiment is: stainless steel template 200—conductive layer 2, first insulating layer 1, second insulating layer 3—second insulating layer 3, first insulating layer 1, conductive layer 2—stainless steel template 200. This allows the same stacking method as double-sided copper-clad laminates to be used, with two single-sided copper-clad laminates being pressed together at once without any adjustments, facilitating production and increasing efficiency. In other embodiments, one single-sided copper clad laminate can also be pressed at a time. When one single-sided copper clad laminate is pressed at a time, the panel combination is: stainless steel template 200—conductive layer 2, first insulating layer 1, second insulating layer 3—stainless steel template 200. Since the second insulating layer 3 is in a completely cured state and has no adhesion under high temperature and high pressure, it will not stick after the pressing is completed, and plays the role of self-release.

[0036] Figure 5 This is a pressing process laminated structure of a single-sided copper clad laminate with "one opening" of the utility model, which is, from top to bottom: buffer material 5 - stainless steel template 6 - conductive layer 2, first insulating layer 1, second insulating layer 3 - second insulating layer 3, first insulating layer 1, conductive layer 2 - stainless steel template 6 - conductive layer 2, first insulating layer 1, second insulating layer 3 - second insulating layer 3, first insulating layer 1, conductive layer 2 - stainless steel template 6 -... - stainless steel template 6 - conductive layer 2, first insulating layer 1, second insulating layer 3 - second insulating layer 3, first insulating layer 1, conductive layer 2 - stainless steel template 6 - buffer material 5 - drag plate 4.

[0037] Figure 6 It is a conventional single-sided copper clad laminate with "one opening" laminated structure made by the pressing process, and from top to bottom it is: buffer material 5 - stainless steel template 6 - conductive layer 101, insulating layer 100, release film 300 - stainless steel template 6 - conductive layer 101, insulating layer 100, release film 300 - stainless steel template 6 - ... - stainless steel template 6 - conductive layer 101, insulating layer 100, release film 300 - stainless steel template 6 - buffer material 5 - drag plate 4.

[0038] The laminated structure of the single-sided copper clad laminate of the present invention can complete the hot pressing of two single-sided copper clad laminates in one hot pressing process, and does not require the use of a release film. Figure 1The conventional single-sided copper-clad laminate production process shown (stainless steel template 200 - conductive layer 101, insulating layer 100, release film 300 - stainless steel template 200) is not only more efficient (pressing two single-sided copper-clad laminates at once), but also reduces the release film placement and removal steps, thus reducing costs. The present production process laminates the two second insulating layers together during the assembly process. The second insulating layer is fully cured and has no adhesive properties under high temperature and pressure. After pressing, it will not stick to the laminate, thus providing a self-release effect.

[0039] The single-sided copper clad laminate structure of the present invention has at least one layer of prepreg between the conductive layer 2 and the second insulating layer 3, that is, the conductive layer 2 and the second insulating layer 3 cannot be in direct contact. One side surface of the single-sided copper clad laminate is the conductive layer 2, and the other side surface is the second insulating layer 3 in a completely cured state.

[0040] When hot pressing the single-sided copper clad laminate of the present invention, the hot pressing temperature can be 175°C, the time can be 60 to 120 minutes, and the pressure can be 35Kg / cm 2 .

[0041] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A single-sided copper clad laminate, characterized in that: include: a first insulating layer, the first insulating layer comprising at least one layer of prepreg; A conductive layer provided on one side surface of the first insulating layer, wherein the conductive layer is a metal foil; A second insulating layer is provided on a surface of the first insulating layer facing away from the conductive layer, and the second insulating layer is a solidified layer.

2. The single-sided copper clad laminate according to claim 1, wherein: The thickness of the conductive layer is 10 to 105 μm.

3. The single-sided copper clad laminate according to claim 1, wherein: The thickness of the first insulating layer is 0.08-0.30 mm.

4. The single-sided copper clad laminate according to claim 1, wherein: The thickness of the second insulating layer is 0.08-0.30 mm.

5. The single-sided copper clad laminate according to claim 1, wherein: The semi-cured sheet comprises glass fiber cloth and semi-cured resin glue.

6. The single-sided copper clad laminate according to claim 1, wherein: The second insulating layer includes glass fiber cloth and cured resin glue.

7. The single-sided copper clad laminate according to claim 1, wherein: It includes a conductive layer, at least one first insulating layer and at least one second insulating layer, the first insulating layer and the second insulating layer are arranged alternately, one side surface of the single-sided copper clad plate is the conductive layer, and the other side surface is the second insulating layer.

8. The single-sided copper clad laminate according to claim 1, wherein: During hot pressing, the conductive layer and the second insulating layer are respectively opposite to the stainless steel template; or the conductive layer is opposite to the stainless steel template, and the second insulating layer is opposite to the second insulating layer.

9. The single-sided copper clad laminate according to claim 5 or 6, wherein: The glass fiber cloth is a plain woven glass fiber cloth, and the models of the glass fiber cloth are 7626, 7638, 7628, 2116, 3313, 2313, 1506, and 1080.

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