Shaping device for chip capacitor

By designing a shaping device including mounting frame, pneumatic rod and mold, the problems of low shaping efficiency and inconvenient collection of chip capacitor pins are solved, efficient pin shaping and automated collection are achieved, and shaping efficiency and appearance quality are improved.

CN223264671UActive Publication Date: 2025-08-26CHENZHOU JIAEN NEW ENERGY TECH CO LTD
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Patent Information

Application Number
CN202421961278.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-14
Publication Date
2025-08-26
Estimated Expiration
2034-08-14

AI Technical Summary

Technical Problem

In the prior art, the pin shaping efficiency of chip capacitors is low and the collection is inconvenient, which affects the product appearance quality and shaping efficiency.

Method used

A shaping device including a mounting frame, a pneumatic rod and a mold is adopted to control the movement of the upper and lower molds to achieve pin shaping of the patch capacitor, and to achieve the flip of the lower mold automatically pour out the shaping capacitor by using gear transmission.

Benefits of technology

It improves the shaping efficiency and collection efficiency of the patch capacitor, ensures the consistency of product appearance quality, reduces manual operations, and improves the capacitance collection efficiency after shaping.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of chip capacitor processing, in particular to a shaping device for a chip capacitor, which comprises a mounting frame, a horizontal guide block is arranged in the mounting frame, and a vertical first pneumatic rod and a vertical second pneumatic rod are inserted into the guide block. First mounting sleeve plates are sequentially arranged on a rod body of the first pneumatic rod at intervals, second mounting sleeve plates are sequentially arranged on a rod body of the second pneumatic rod at intervals, a lower die is mounted at the front end of each first mounting sleeve plate through a connecting support, and an upper die is fixedly mounted at the front end of each second mounting sleeve plate. The upper die and the lower die which are adjacent up and down form a group of shaping components of the chip capacitor; the upper die and the lower die of the shaping device can move relatively, so that the pins of the chip capacitors can be rapidly bent and shaped, and the lower die for accommodating the chip capacitors can be automatically overturned, so that the shaped capacitors can be poured out in time, and manual collection is facilitated.
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Description

Technical Field

[0001] The utility model relates to the technical field of chip capacitor processing, in particular to a shaping device for chip capacitors. Background Art

[0002] The pins of chip capacitors need to be bent and shaped. Traditionally, this process relies primarily on manual labor, resulting in low efficiency and irregular, unevenly shaped products, severely impacting product appearance. Existing technology uses upper and lower molds to improve shaping efficiency, but collecting the capacitors after shaping still requires manual labor, which is time-consuming and labor-intensive. Therefore, rapidly recovering the shaped capacitors remains a pressing issue. Utility Model Content

[0003] The purpose of the utility model is to solve the shortcomings of the prior art and to propose a shaping device for chip capacitors.

[0004] In order to achieve the above purpose, the present invention adopts the following technical solutions:

[0005] A shaping device for a chip capacitor includes a mounting frame, a horizontal guide block disposed within the mounting frame, a first vertical pneumatic rod and a second vertical pneumatic rod inserted into the guide block, a first mounting sleeve disposed on the rod body of the first pneumatic rod, and a second mounting sleeve disposed on the rod body of the second pneumatic rod, wherein a lower mold is mounted on the front end of each of the first mounting sleeves via a connecting bracket, and an upper mold is fixedly mounted on the front end of each of the second mounting sleeves, wherein the upper and lower molds adjacent to each other form a set of chip capacitor shaping components;

[0006] The sides of the first mounting sleeve all extend outwardly from connecting columns, the outer ends of the connecting columns are all fixed on the same side plate, and the side plate is provided with a number of identical gears and a sliding plate that maintains a meshing relationship with each gear. The position of the gear is flush with the position of the connecting bracket, and the front end of the rotating shaft set at the gear axis extends into the inner side of the connecting bracket and is rotatably connected to the lower mold.

[0007] In a preferred technical solution, the mounting frame is a U-shaped structure, and both arms of the mounting frame are arranged horizontally, and the two arms of the mounting frame are located at the upper and lower sides.

[0008] In a preferred technical solution, a first cylinder and a second cylinder are provided on the top of the upper cross arm of the mounting frame, and the output ends of the first cylinder and the second cylinder respectively lead downward to a first pneumatic rod and a second pneumatic rod.

[0009] In a preferred technical solution, the connecting bracket is a U-shaped bracket, the lower mold is located on the inner side of the connecting bracket, one end of the lower mold is rotatably mounted on the inner wall of the connecting bracket through a bearing, and the other end of the lower mold is connected to the rotating shaft set at the center of the gear axis.

[0010] In a preferred technical solution, a third cylinder is provided on the top of the side plate, and a third pneumatic rod provided at the output end of the third cylinder extends downward and is connected to the sliding plate, and the sliding plate is provided with teeth on the side facing the gear to maintain meshing with the gear.

[0011] In a preferred technical solution, support legs are provided at the bottom of the mounting frame, and the mounting frame is mounted on the operating table through the support legs.

[0012] The beneficial effects of the utility model are:

[0013] The shaping device proposed in this solution solves the problem that the capacitor products are inconvenient to collect quickly after the chip capacitors are pressed and shaped by the upper and lower molds. On the one hand, the upper and lower molds can move relative to each other, so that the pins of the chip capacitors can be quickly bent and shaped, and the shaping efficiency is high. On the other hand, the lower mold for storing the chip capacitors can be automatically flipped, so that the shaped capacitors can be poured out in time, which is convenient for manual collection and ultimately improves the work efficiency of collecting and sorting the chip capacitors. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of the shaping device proposed by the present invention;

[0015] Figure 2 This is a schematic diagram of the component distribution on the side panel proposed by the present invention;

[0016] Figure 3 This is a structural diagram of the assembly of the side panel and the first mounting sleeve proposed by the present invention.

[0017] In the figure: 1. Mounting frame; 2. Guide block; 3. First cylinder; 4. Second cylinder; 5. First pneumatic rod; 6. Second pneumatic rod; 7. First mounting plate; 8. Second mounting plate; 9. Upper die; 10. Connecting bracket; 11. Lower die; 12. Side plate; 13. Third cylinder; 14. Sliding plate; 15. Gear; 16. Connecting column. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0019] In this embodiment, refer to Figure 1-3 A shaping device for chip capacitors, comprising a mounting frame 1, as shown in the attached Figure 1 or attached Figure 2 As shown, the mounting frame 1 is a U-shaped structure, with both arms of the mounting frame 1 arranged horizontally, and the arms of the mounting frame 1 are located at the upper and lower sides. Support legs are provided at the bottom of the mounting frame 1, and the mounting frame 1 is mounted on the operating table via the support legs. A horizontal guide block 2 is provided inside the mounting frame 1, into which a vertical first pneumatic rod 5 and a second pneumatic rod 6 are inserted. Here, a first cylinder 3 and a second cylinder 4 are provided at the top of the upper cross arm of the mounting frame 1. The output ends of the first cylinder 3 and the second cylinder 4 respectively lead downward to the first pneumatic rod 5 and the second pneumatic rod 6.

[0020] The first pneumatic cylinder 3 and the second pneumatic cylinder 4 are used to control the extension and retraction of the first pneumatic rod 5 and the second pneumatic rod 6 respectively.

[0021] The rod body of the first pneumatic rod 5 is provided with first mounting sleeves 7 arranged in sequence at intervals, and the rod body of the second pneumatic rod 6 is provided with second mounting sleeves 8 arranged in sequence at intervals.

[0022] The front end of the first mounting plate 7 is mounted with a lower die 11 via a connecting bracket 10. The structure of the connecting bracket 10 needs to be specifically described. Figure 3 As shown, the connecting bracket 10 is a U-shaped bracket, and the lower mold 11 is located on the inner side of the connecting bracket 10 .

[0023] The front end of the second mounting plate 8 is fixedly mounted with an upper die 9 , and the upper and lower adjacent upper dies 9 and lower dies 11 form a group of shaping components of the chip capacitor.

[0024] During the shaping stage, the chip capacitor is placed in the lower mold 11. The first cylinder 3 and the second cylinder 4 are controlled to start respectively, so that the lower mold 11 is lifted and the upper mold 9 is lowered. The upper mold 9 and the lower mold 11 are relatively close to each other, so that the chip capacitor in the middle can be shaped.

[0025] Since multiple groups of upper molds 9 and lower molds 11 are provided, that is, the number of shaping components is provided in multiple groups and arranged in sequence up and down, the shaping operation of multiple groups of chip capacitors can be carried out at the same time, which can effectively improve the shaping efficiency.

[0026] In this embodiment, the side surfaces of the first mounting sleeve 7 all extend outwardly with connecting columns 16, and the outer ends of the connecting columns 16 are all fixed on the same side panel 12. The side panel 12 and the first mounting sleeve 7 will maintain the same movement state, that is, during the shaping process, the first mounting sleeve 7 will be lifted to a high place, and the side panel 12 will also be lifted accordingly.

[0027] The side plate 12 is equipped with several identical gears 15 and a sliding plate 14 that meshes with each gear 15. The transmission structure requires detailed description. A third pneumatic cylinder 13 is mounted on the top of the side plate 12. A third pneumatic rod, located at the output end of the third cylinder 13, extends downward and connects to the sliding plate 14. The side of the sliding plate 14 facing the gears 15 is equipped with teeth that mesh with the gears 15. The third cylinder 13 controls the sliding plate 14 to slide up and down, thereby rotating the gears 15.

[0028] From the attached Figure 3 It can be seen that the position of the gear 15 is flush with the position of the connecting bracket 10, one end of the lower mold 11 is rotatably mounted on the inner wall of the connecting bracket 10 through a bearing, and the other end of the lower mold 11 is connected to the rotating shaft set at the axis of the gear 15. Here, the flipping of the lower mold 11 is controlled by the gear 15, and the position of the connecting bracket 10 is not affected.

[0029] In the collection stage after shaping, the upper mold 9 and the lower mold 11 are first controlled to separate, and then the third cylinder 13 is started to control the sliding plate 14 to slide, so that the gear 15 rotates, so that the lower molds 11 of the upper and lower layers can be turned over synchronously. The shaped chip capacitors will be automatically dumped out due to the turning of the lower mold 11, which is convenient for manual collection and sorting.

[0030] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A shaping device for chip capacitors, characterized in that: The invention comprises a mounting frame (1), wherein a horizontal guide block (2) is provided inside the mounting frame (1), a vertical first pneumatic rod (5) and a second pneumatic rod (6) are inserted into the guide block (2), a rod body of the first pneumatic rod (5) is provided with a first mounting sleeve (7) arranged in sequence at intervals, and a rod body of the second pneumatic rod (6) is provided with a second mounting sleeve (8) arranged in sequence at intervals, the front end of the first mounting sleeve (7) is provided with a lower mold (11) via a connecting bracket (10), and the front end of the second mounting sleeve (8) is fixedly provided with an upper mold (9), and the upper and lower adjacent upper molds (9) and lower molds (11) form a group of patch capacitor shaping components; The side surfaces of the first mounting sleeve (7) are provided with connecting columns (16) extending outwards, and the outer ends of the connecting columns (16) are fixed on the same side plate (12). The side plate (12) is provided with a plurality of identical gears (15) and a sliding plate (14) that maintains a meshing relationship with each gear (15). The position of the gear (15) is flush with the position of the connecting bracket (10), and the front end of the rotating shaft arranged at the axis of the gear (15) extends into the inner side of the connecting bracket (10) and is rotatably connected to the lower mold (11).

2. A shaping device for a chip capacitor according to claim 1, characterized in that: The mounting frame (1) is a U-shaped structure, and both arms of the mounting frame (1) are arranged horizontally, and the two arms of the mounting frame (1) are located at the upper and lower sides.

3. The shaping device for a chip capacitor according to claim 2, characterized in that: A first cylinder (3) and a second cylinder (4) are provided on the top of the upper cross arm of the mounting frame (1), and the output ends of the first cylinder (3) and the second cylinder (4) respectively lead downward to a first pneumatic rod (5) and a second pneumatic rod (6).

4. The shaping device for a chip capacitor according to claim 1, characterized in that: The connecting bracket (10) is a U-shaped bracket, the lower die (11) is located on the inner side of the connecting bracket (10), one end of the lower die (11) is rotatably mounted on the inner wall of the connecting bracket (10) via a bearing, and the other end of the lower die (11) is connected to a rotating shaft provided at the axis of the gear (15).

5. The shaping device for a chip capacitor according to claim 1, characterized in that: A third cylinder (13) is provided on the top of the side plate (12), and a third pneumatic rod provided at the output end of the third cylinder (13) extends downward and is connected to the sliding plate (14). The sliding plate (14) is provided with teeth that mesh with the gear (15) on one side facing the gear (15).

6. The shaping device for a chip capacitor according to claim 1, characterized in that: Support legs are provided at the bottom of the mounting frame (1), and the mounting frame (1) is mounted on the operating table via the support legs.