Pressing device and nano-silver sintering machine thereof

Abstract

The utility model discloses a laminating device and a nano-silver sintering machine thereof, the laminating device comprises a fixed platform, four guide columns are fixed on the fixed platform close to four corners, the four guide columns are arranged in parallel, and the fixed platform is provided with a lifting assembly; the mounting plate is fixed to the ends, away from the fixed platform, of the four guide columns; the pressing assembly is used for processing a chip, the pressing assembly is arranged between the mounting plate and the fixed platform, and the pressing assembly is partially mounted on the mounting plate; and the weighing assembly is connected with the output end of the lifting assembly, the lifting assembly is used for driving the weighing assembly to slide along the four guide columns, and the weighing assembly is connected with the other part of the pressing assembly, so that the pressure on the chip can be detected through the weighing assembly after the lifting assembly works. According to the nano-silver sintering machine, the pressure change in the chip sintering process can be stably controlled within a set parameter error range, and high-precision pressure control is provided for sintering.

Description

Technical Field

[0001] The utility model belongs to the technical field of nano-silver sintering equipment, and particularly relates to a pressing device and a nano-silver sintering machine thereof. Background Art

[0002] Sintering is a solid-state phase change process in which powder particles are combined together through surface diffusion under external pressure to form a dense solid material. Compared with other metal materials, silver has higher thermal conductivity and low resistivity. Due to its higher strength and hardness and lower elastic modulus, it has better mechanical properties and application reliability.

[0003] Nano silver sintering machine is a device used to sinter nano-scale silver powder. Nano silver sintering is a new type of packaging material used for power semiconductor devices, specifically for soldering chips on corresponding circuit boards.

[0004] Existing nanosilver sintering machines use a pneumatic cylinder to move the second heating stage directly toward the first heating stage above it. This makes it impossible to monitor the pressure applied by the indenter on the first heating stage to the chip, resulting in low soldering accuracy. In the face of the rapidly developing semiconductor market, the industry urgently needs to improve the reliability and precision of chip soldering using nanosilver sintering machines. Utility Model Content

[0005] In response to the above-mentioned problems existing in the prior art, the utility model provides a pressing device and a nano-silver sintering machine thereof, which have a lifting assembly installed on a fixed platform. The lifting assembly drives the weighing assembly to move and process the chip. The weighing assembly can obtain the pressure of the pressure head on the chip. During the sintering process of the chip, the pressure change can be stably controlled within the set parameter error range, providing high-precision pressure control for sintering.

[0006] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0007] A pressing device, comprising:

[0008] A fixed platform, wherein four guide posts are fixed near the four corners of the fixed platform, the four guide posts are arranged parallel to each other, and the fixed platform is equipped with a lifting assembly;

[0009] A mounting plate fixed to ends of the four guide posts away from the fixed platform;

[0010] A pressing assembly for processing chips, the pressing assembly being disposed between the mounting plate and the fixed platform, and the pressing assembly being partially mounted on the mounting plate; and

[0011] A weighing assembly connected to the output end of the lifting assembly, the lifting assembly is used to drive the weighing assembly to slide along the four guide columns, and the weighing assembly is connected to another part of the pressing assembly so that the pressure on the chip can be detected by the weighing assembly when the lifting assembly is working.

[0012] Furthermore, the weighing assembly includes an intermediate platform, a weighing platform and a weighing sensor installed on the weighing platform. The weighing sensor is electrically connected to the electrical control system of the pressing device, and the electrical control system is also electrically connected to the lifting assembly. The intermediate platform is horizontally arranged and slidingly cooperates with the guide column. The weighing platform is fixed with four guide shafts parallel to each other. The four guide shafts all pass through the intermediate platform and are gap-matched with the intermediate platform. The weighing platform is connected to the pressing assembly.

[0013] Furthermore, the four guide columns are respectively sleeved with a first linear bearing, and the guide columns are slidably matched with the intermediate platform through the first linear bearing.

[0014] Furthermore, the four guide shafts are respectively sleeved with a second linear bearing, and the guide shafts are slidably engaged with the intermediate platform through the second linear bearing.

[0015] Furthermore, the weighing assembly also includes a hanging platform, which is fixed to the lower part of the intermediate platform. A connecting hole is opened in the middle of the hanging platform, and the hanging platform is fixed to the output end of the lifting assembly through the connecting hole.

[0016] Furthermore, the lifting component is one of a hydraulic cylinder, a linear motor or a pneumatic cylinder.

[0017] Furthermore, the pressing assembly includes a first heating platform, a pressing head fixed on the first heating platform and a second heating platform corresponding to the pressing head. The second heating platform is fixed on the weighing platform and is used to place the chip to be processed.

[0018] In addition, the present invention also seeks to protect a nano-silver sintering machine, comprising a base, on which any one of the above-mentioned pressing devices is installed.

[0019] Compared with the prior art, the beneficial effects of this solution are:

[0020] 1. The present invention provides a nanosilver sintering machine, comprising a pressing device with a weighing assembly. The weighing assembly's pressure control system utilizes a load cell. Pressure changes during chip sintering are stably controlled within a set parameter error range, providing high-precision pressure control for sintering. The load cell monitors the pressure applied by the indenter to the chip. The control system's detection module receives the load cell's measurement signal and, using a pressure PID control algorithm, automatically adjusts the output pressure and pressure rate of the lifting and lowering group.

[0021] 2. The guide column of this nano-silver sintering machine is set vertically. The guide column and the fixed platform are installed perpendicularly, and the fixed platform is set horizontally. The guide column and the fixed platform are rigidly connected without any mutual movement. They constitute the main force-bearing frame of the entire pressing device. After the pressure head is connected to the heating table, it is rigidly fixed to the mounting plate, which can provide a stable and accurate weighing environment for the weighing component. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is the main view of the sintering machine of the utility model;

[0023] Figure 2 for Figure 1 A magnified view of point A in the figure;

[0024] Figure 3 This is the PID control flow chart of this utility model.

[0025] The reference numerals are:

[0026] Fixed platform 1, guide column 11, first linear bearing 12, lifting assembly 13, mounting plate 2, pressing assembly 3, pressure head 31, first heating platform 32, second heating platform 33, weighing assembly 4, intermediate platform 41, weighing platform 42, weighing sensor 43, guide shaft 44, second linear bearing 441, shaft stopper 442, hanging platform 45, chip fixture 5, base 6. DETAILED DESCRIPTION

[0027] The present invention will be described in further detail below with reference to the accompanying drawings.

[0028] A pressing device, such as Figure 1 and Figure 2 Shown, including:

[0029] A fixed platform 1, wherein four guide posts 11 are fixed near the four corners of the fixed platform 1, and the four guide posts 11 are arranged parallel to each other. The fixed platform 1 is equipped with a lifting assembly 13;

[0030] A mounting plate 2, which is fixed to the ends of the four guide posts 11 away from the fixed platform 1;

[0031] A pressing assembly 3 for processing chips, the pressing assembly 3 being arranged between the mounting plate 2 and the fixed platform 1, and the pressing assembly 3 being partially mounted on the mounting plate 2; and

[0032] The weighing assembly 4 is connected to the output end of the lifting assembly 13, and the lifting assembly 13 is used to drive the weighing assembly 4 to slide along the four guide columns 11. The weighing assembly 4 is connected to another part of the pressing assembly 3 so that the pressure on the chip can be detected by the weighing assembly 4 when the lifting assembly 13 is working.

[0033] According to a specific embodiment of the present invention, the guide posts 11 are vertically mounted perpendicular to the fixed platform 1, which is horizontally mounted. The guide posts 11 and the fixed platform 1 are rigidly connected and do not move relative to each other, forming the main load-bearing frame of the entire pressing device. There are four guide posts 11. The pressing head 31 is connected to the heating table and is rigidly fixed to the mounting plate 2, which is located above the fixed platform 1.

[0034] Further, if Figure 2 As shown, the weighing assembly 4 includes an intermediate platform 41, a weighing platform 42 and a weighing sensor 43 installed on the weighing platform 42, the weighing sensor 43 is electrically connected to the electrical control system of the pressing device, and the electrical control system is also electrically connected to the lifting assembly 13, the intermediate platform 41 is horizontally arranged and slidingly matched with the guide column 11, the weighing platform 42 is fixed with four mutually parallel guide shafts 44, the four guide shafts 44 all pass through the intermediate platform 41 and are gap-matched with the intermediate platform 41, and the weighing platform 42 is connected to the pressing assembly 3.

[0035] According to a specific embodiment of the present invention, load cell 43 operates by utilizing the strain effect generated by deformation of the elastic material in the sensing area of ​​load cell 43 to convert the force acting on an object into a measurable electrical signal. However, due to the small sensing area of ​​load cell 43 and the small contact area with the object being tested, it is difficult to horizontally position the object being tested (here, weighing platform 42 in the figure) to generate a non-vertical downward force, resulting in inaccurate data from load cell 43.

[0036] like Figure 3 As shown, using a cylinder as an example, the pressure control system utilizes a load cell 43. During chip sintering, pressure changes are stably controlled within the set parameter error range, providing high-precision pressure control for sintering. Load cell 43 monitors the pressure applied by the indenter 31 to the chip. The control system's detection module receives the measurement signal from load cell 43 and, using a pressure PID control algorithm, automatically adjusts the output pressure of the cylinder's proportional pressure control valve, thereby controlling the cylinder's output pressure and pressure rate.

[0037] Furthermore, each of the four guide posts 11 is fitted with a first linear bearing 12, and the guide posts 11 are slidably engaged with the intermediate platform 41 via the first linear bearings 12. In this embodiment, the horizontally disposed intermediate platform 41 is rigidly connected to the four first linear bearings 12, and the four guide posts 11 concentrically pass through the first linear bearings 12, allowing the intermediate platform 41 to slide up and down along the guide posts 11.

[0038] Furthermore, each of the four guide shafts 44 is sleeved with a second linear bearing 441 , and the guide shafts 44 are slidably engaged with the intermediate platform 41 via the second linear bearing 441 .

[0039] The first linear bearing 12 and the second linear bearing 441 are different in size, but both are linear bearings. Linear bearings are a type of linear motion system used in conjunction with cylindrical shafts for linear travel. Because the load-bearing balls are in point contact with the bearing outer casing, the steel balls roll with minimal frictional resistance. Therefore, linear bearings have low friction and are relatively stable, not changing with bearing speed, and can achieve smooth linear motion with high sensitivity and high precision. Linear bearings are widely used in sliding parts of industrial machinery such as precision machine tools, textile machinery, food packaging machinery, and printing machinery. Because the load-bearing balls are in point contact with the bearings, the load is small. The steel balls rotate with minimal frictional resistance, thereby achieving smooth motion with high precision.

[0040] According to a specific embodiment provided by the present invention, four guide shafts 44 are vertically mounted around a horizontally arranged weighing platform 42, and four second linear bearings 441 are vertically fixedly mounted on the intermediate platform 41. The guide shafts 44 are concentrically mounted within the second linear bearings 441. A shaft stopper 442 is provided at the bottom of the second linear bearings 441 to prevent the guide shafts 44 from disengaging when the weighing platform 42 moves upward under the action of the lifting assembly 13. This structure allows the second linear bearings 441 to automatically adjust their center of gravity when the weighing platform 42 is slightly offset by the weight of the heating table and the chip fixture 5, so that the weight applied to it is always directed vertically downward.

[0041] Furthermore, the weighing assembly 4 also includes a hanging platform 45, which is fixed to the lower part of the intermediate platform 41. A connecting hole is opened in the middle of the hanging platform 45, and the hanging platform 45 is fixed to the output end of the lifting assembly 13 through the connecting hole.

[0042] Furthermore, the lifting component 13 is one of a hydraulic cylinder, a linear motor or a pneumatic cylinder.

[0043] In an embodiment of the present utility model, the lifting assembly 13 is arranged vertically, and the upper end of its cylinder body is fixed to the bottom of the fixed platform 1. The piston rod of the lifting assembly 13 passes through the opening on the fixed platform 1 and is threadedly connected to the hanging platform 45, and the hanging platform 45 is fixed to the bottom of the intermediate platform 41; the weighing sensor 43 is fixed between the intermediate platform 41 and the weighing platform 42, and is located at the center of gravity of the weighing platform 42.

[0044] Furthermore, the pressing assembly 3 includes a first heating platform 32, a pressing head 31 fixed on the first heating platform 32 and a second heating platform 33 arranged corresponding to the pressing head 31. The second heating platform 33 is fixed on the weighing platform 42, and the second heating platform 33 is used to place the chip to be processed.

[0045] In this embodiment, the bottom of the second heating platform 33 is fixed to the upper part of the weighing platform 42 and moves up and down along with the weighing platform 42 under the action of the lifting assembly 13 .

[0046] In addition, the present invention also seeks to protect a nano-silver sintering machine, including a base 6 , on which any one of the above-mentioned pressing devices is installed, specifically, the fixed platform 1 is horizontally fixed on the upper part of the base 6 .

[0047] In an embodiment of the pressing device of the present invention, a weighing sensor 43 and a lift are set at the center of gravity of the weighing platform 42, and four second linear bearings 441 are set around the weighing platform 42. When the weighing platform 42 is slightly offset in gravity under the action of the gravity of the second heating table 33 and the chip fixture 5, that is, the gravity of the chip placement plate for placing the chip, the second linear bearing 441 can automatically adjust the center of gravity so that the gravity is always vertically downward, so that the weighing platform 42 is always in a horizontal state without causing gravity center offset, making the pressure output by gravity more uniform and improving the accuracy of pressure control; the weighing sensor 43 is fixed between the intermediate platform 41 and the weighing platform 42, and the force of the lifting assembly 13 acts on the hanging platform 45 fixed at the lower part of the intermediate platform 41, so the weighing sensor 43 only acts on the weighing platform 42, the heating table and the chip fixture 5 being detected, reducing the interference of other forces (for example: the gravity of the intermediate table, the friction force of the first linear bearing 12).

[0048] The operating principle of the present utility model is as follows: the lifting component 13 drives the intermediate platform 41 to slide linearly up and down within its effective stroke range. When the lifting component 13 is extended, the intermediate platform 41 can be driven to drive the weighing platform 42, the second heating platform 33 and the chip fixture 5 to move upward, that is, move toward the direction of the pressure head 31. When the pressure head 31 contacts the chip fixture 5, pressure is generated and is heated to a certain temperature through the first heating platform 32 and the second heating platform 33 to achieve a pressure sintering process; conversely, when the lifting component 13 is shortened, the intermediate platform 41 can be driven to drive the weighing platform 42, the second heating platform 33 and the chip fixture 5 to move downward, that is, move in the opposite direction of the pressure head 31, so that the pressure head 31 and the chip fixture 5 are separated from each other, and the chip can be taken out after cooling to complete the process.

[0049] Finally, it should be noted that in the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as a limitation on the present invention.

[0050] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0051] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art will be able to modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A pressing device, characterized in that: include: A fixed platform, wherein four guide posts are fixed near the four corners of the fixed platform, the four guide posts are arranged parallel to each other, and the fixed platform is equipped with a lifting assembly; A mounting plate fixed to ends of the four guide posts away from the fixed platform; A pressing assembly for processing chips, the pressing assembly being arranged between the mounting plate and the fixed platform, and the pressing assembly being partially mounted on the mounting plate; as well as A weighing assembly connected to the output end of the lifting assembly, the lifting assembly is used to drive the weighing assembly to slide along the four guide columns, and the weighing assembly is connected to another part of the pressing assembly so that the pressure on the chip can be detected by the weighing assembly when the lifting assembly is working.

2. A pressing device according to claim 1, characterized in that: The weighing assembly includes an intermediate platform, a weighing platform and a weighing sensor installed on the weighing platform. The weighing sensor is electrically connected to the electrical control system of the pressing device, and the electrical control system is also electrically connected to the lifting assembly. The intermediate platform is horizontally arranged and slidingly cooperates with the guide column. The weighing platform is fixed with four guide shafts parallel to each other. The four guide shafts all pass through the intermediate platform and are gap-fitted with the intermediate platform. The weighing platform is connected to the pressing assembly.

3. A pressing device according to claim 2, characterized in that: The four guide columns are respectively sleeved with a first linear bearing, and the guide columns are slidably matched with the intermediate platform through the first linear bearing.

4. A pressing device according to claim 2 or 3, characterized in that: The four guide shafts are respectively sleeved with a second linear bearing, and the guide shafts are slidably matched with the intermediate platform through the second linear bearing.

5. A pressing device according to claim 4, characterized in that: The weighing assembly further comprises a hanging platform, which is fixed to the lower part of the intermediate platform. A connecting hole is provided in the middle of the hanging platform, and the hanging platform is fixed to the output end of the lifting assembly through the connecting hole.

6. A pressing device according to claim 2 or 5, characterized in that: The lifting component is one of a hydraulic cylinder, a linear motor or a pneumatic cylinder.

7. A pressing device according to claim 6, characterized in that: The pressing assembly includes a first heating platform, a pressing head fixed on the first heating platform, and a second heating platform corresponding to the pressing head. The second heating platform is fixed on the weighing platform and is used to place the chip to be processed.

8. A nano silver sintering machine, characterized by: It comprises a base, on which a pressing device according to any one of claims 1 to 7 is installed.

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