PCB reflow soldering device

Abstract

The utility model discloses a reflow soldering device for a PCB (Printed Circuit Board). The reflow soldering device comprises a device main body, a first conveying belt on the conveying mechanism is composed of a plurality of clamped connecting strips, each connecting strip comprises a U-shaped beam with a downward opening, a connecting rod extending obliquely upwards from the end of the U-shaped beam and a limiting rod extending outwards from the end of the connecting rod, and the limiting rod of one connecting strip abuts against the inner side of the U-shaped beam of the adjacent connecting strip. The guide mechanisms are arranged on the two sides of the conveying mechanism; the waste tray is arranged below the conveying mechanism; the heating mechanism is provided with an air supply pipeline located in the middle and air return pipelines on the two sides, and a heating module is arranged in the heating mechanism. Through the design of the heating module, the air supply pipeline and the air return pipeline, bidirectional air supply in the heating mechanism according to the temperature trend is achieved, the stable and continuous temperature changing process is achieved, the reflow soldering quality is improved, heat utilization is improved, and energy consumption is reduced. The first conveying belt is of a hollow chain type conveying belt structure and is convenient to disassemble, assemble, maintain and clean.

Description

Technical Field

[0001] The utility model relates to the technical field of reflow soldering devices, in particular to a PCB board reflow soldering device. Background Art

[0002] A reflow oven is also called a reflow soldering machine. It provides a heating environment to melt the solder paste, allowing the surface mount components and PCB pads to be reliably bonded together through the solder paste alloy. The solder used in the reflow oven is solder paste. An appropriate amount of solder paste is applied to the pads of the circuit board in advance, and then the SMT components are placed in the corresponding positions. The solder paste has a certain viscosity, which fixes the components. The circuit board with the components mounted on it then enters the reflow equipment. The conveyor system drives the circuit board through the various set temperature zones in the equipment. The solder paste is dried, preheated, melted, moistened, and cooled to solder the components to the pads.

[0003] Currently, in common reflow soldering devices, the conveying device that transports PCBs between various temperature zones will have solder paste residue on its surface during use, which reduces the neatness of the device and the stability of subsequent PCB conveying. It also cannot be fully and quickly cleaned, affecting its service life. The use of different temperature zones and heating devices also leads to high energy consumption of the device. Utility Model Content

[0004] The purpose of the utility model is to provide a PCB reflow soldering device in order to solve the problems that, in a common reflow soldering device, a conveying device for conveying PCB boards in various temperature zones has solder paste residue on its surface when the device is in use, which reduces the neatness of the device and the subsequent conveying stability of the PCB boards, and cannot be fully and quickly cleaned, thus shortening its service life. The use of different temperature zones and heating devices also results in high energy consumption of the device.

[0005] In order to achieve the above-mentioned purpose, the present invention adopts the following technical solution: a PCB board reflow soldering device, comprising:

[0006] Device body;

[0007] a conveying mechanism disposed in a bottom cavity of the device body, comprising a first driving roller and a first conveyor belt, wherein the first conveyor belt is composed of a plurality of clamped connecting strips, wherein the connecting strips include a U-shaped beam with a downward opening, a connecting rod extending obliquely upward from the end of the U-shaped beam, and a limiting rod extending outward from the end of the connecting rod, wherein the limiting rod of one connecting strip abuts against the inner side of the U-shaped beam of an adjacent connecting strip;

[0008] A guide mechanism, which is arranged on both sides of the conveying mechanism and includes a second driving roller and a second conveying belt;

[0009] A waste tray is provided below the conveying mechanism and has a waste trough on the top;

[0010] The heating mechanism is provided with an air supply pipeline in the middle and return air pipelines on both sides, and a heating module is provided inside.

[0011] As a further description of the above technical solution:

[0012] A bayonet is provided at one end of the connecting rod close to the limiting rod, and the U-shaped beam is rotatably clamped on the bayonet.

[0013] As a further description of the above technical solution:

[0014] When adjacent connecting strips are connected, the top surface of the U-shaped beam and the top surface of the limiting rod are at the same horizontal height.

[0015] As a further description of the above technical solution:

[0016] The second conveyor belt is a chain-type conveyor belt composed of a plurality of chain monomers hingedly connected with a connecting shaft, and a limiting column is provided on the inner side of the chain monomer.

[0017] As a further description of the above technical solution:

[0018] An opening is provided on the bottom side of the device body, and positioning beams are provided on both sides of the opening of the bottom cavity of the device body. The splints extending from the sides of the waste tray are sleeved on the positioning beams, and the opening matches the shape and size of the waste tray.

[0019] As a further description of the above technical solution:

[0020] The heating module is provided with a high-efficiency heater, a medium-efficiency heater and a low-efficiency heater in sequence from the center of the heating mechanism to both sides thereof. The air supply duct is located above the high-efficiency heater, and the return air duct is located above the low-efficiency heater. The heating mechanism is provided with a frustum or prism-shaped vent at the interface of the air supply duct and the return air duct.

[0021] In summary, due to the adoption of the above technical solution, the present invention has the following advantages compared with the prior art:

[0022] Beneficial effects:

[0023] 1. The utility model realizes two-way air supply inside the heating mechanism according to the temperature trend through the design of the heating module, air supply pipeline and return air pipeline, and transfers heat from the high temperature area to the low temperature area, thereby realizing a smooth and continuous heating and cooling process, improving the reflow soldering quality, improving heat utilization and reducing energy consumption.

[0024] 2. The first conveyor belt adopts a hollow chain conveyor belt structure, which has a simple structure, reduces costs, and can control the conveyor belt length. It has strong adaptability and is easy to disassemble, maintain and clean. The hollow structure ensures stable support and transportation of PCB boards while preventing the outflowing solder paste from being retained on the conveyor belt, ensuring the cleanliness of the conveyor belt; the waste tray adopts a drawer-type detachable structure to facilitate the cleaning of solder paste waste. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 The figure is a structural diagram of a PCB reflow soldering device.

[0027] Figure 2 This is a front view of the first conveyor belt in a PCB reflow soldering device.

[0028] Figure 3 This is a top view of the first conveyor belt in a PCB reflow soldering device.

[0029] Figure 4 This is a front view of the second conveyor belt in a PCB reflow soldering device.

[0030] Legend:

[0031] 1. Device body; 11. Positioning beam; 12. Opening; 2. First drive roller; 3. First conveyor belt; 30. Connecting bar; 31. U-shaped beam; 32. Connecting rod; 321. Bayonet; 33. Limiting rod; 4. Second drive roller; 5. Second conveyor belt; 51. Chain unit; 52. Coupling; 53. Limiting column; 6. Waste tray; 61. Waste chute; 7. Heating mechanism; 71. Vent; 8. Heating module; 9. Air supply duct; 10. Return air duct. DETAILED DESCRIPTION

[0032] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0033] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limitations on the present invention.

[0034] See also Figure 1-4 The utility model provides a technical solution: a PCB board reflow soldering device, comprising:

[0035] Device body 1;

[0036] The conveying mechanism is disposed in the bottom cavity of the device body 1 and includes a first drive roller 2 and a first conveyor belt 3. The first conveyor belt 3 is composed of a plurality of clamped connecting strips 30. The connecting strips 30 include a U-shaped beam 31 with an opening facing downward, a connecting rod 32 extending obliquely upward from the end of the U-shaped beam 31, and a limiting rod 33 extending outward from the end of the connecting rod 32. The limiting rod 33 of one connecting strip 30 abuts against the inner side of the U-shaped beam 31 of the adjacent connecting strip 30.

[0037] A guide mechanism, which is arranged on both sides of the conveying mechanism, includes a second driving roller 4 and a second conveyor belt 5;

[0038] A waste tray 6 is provided below the conveying mechanism and has a waste trough 61 on the top;

[0039] The heating mechanism 7 is provided with an air supply pipe 9 in the middle and return air pipes 10 on both sides, and a heating module 8 is provided inside.

[0040] The connecting rod 32 has a bayonet 321 at one end near the limiting rod 33. The U-shaped beam 31 is rotatably engaged with the bayonet 321. The U-shaped beam 31, connecting rod 32, and limiting rod 33 together form a hollow chain conveyor belt structure. This structure is simple, reduces costs, and allows for control of conveyor belt length. It is highly adaptable and easy to disassemble, maintain, and clean. The hollow structure ensures stable support and conveyance of PCBs while preventing solder paste from accumulating on the conveyor belt, ensuring a clean and tidy conveyor belt. The first drive roller 2 is detachably mounted on the drive motor, pneumatic cylinder, or hydraulic cylinder of the device body 1 to facilitate disassembly and assembly of the conveyor belt.

[0041] When the adjacent connecting strips 30 are connected, the top surface of the U-shaped beam 31 and the top surface of the limiting rod 33 are at the same level, thereby increasing the contact area between the hollow structure and the PCB board, thereby increasing the friction between the two and achieving stable transportation.

[0042] The second conveyor belt 5 is a chain-type conveyor belt composed of several chain monomers 51 hinged with a connecting shaft 52. A limiting column 53 is set on the inner side of the chain monomer 51. The limiting column 53 is used to limit and guide the side of the PCB board. Compared with directly using the conveyor chain for limiting, the contact surface is reduced, so that the relative resistance between the two is reduced.

[0043] An opening 12 is provided on the bottom side of the device body 1, and positioning beams 11 are provided on both sides of the opening 12 in the bottom cavity of the device body 1. The splints extending from the sides of the waste tray 6 are sleeved on the positioning beams 11. The opening 12 matches the shape and size of the waste tray 6, which facilitates the disassembly, assembly and cleaning of the waste tray 6.

[0044] The heating module 8 is sequentially arranged with a high-efficiency heater, a medium-efficiency heater and a low-efficiency heater from the center of the heating mechanism 7 to both sides thereof. The air supply duct 9 is located above the high-efficiency heater, and the return air duct 10 is located above the low-efficiency heater. The heating mechanism 7 is provided with a frustum or prism-shaped vent 71 at the interface of the air supply duct 9 and the return air duct 10, thereby realizing the process of preheating the solder paste on the PCB board by the reflow device - high-temperature melting, close connection with the electronic components and the solder pad - cooling and shaping. The heating mechanism 7 has two-way air supply according to the temperature trend, and heat is transferred from the high-temperature zone to the low-temperature zone, realizing a smooth and continuous heating and cooling process, improving the reflow soldering quality, improving heat utilization, and reducing energy consumption.

[0045] The working principle of a PCB board reflow soldering device of this embodiment includes: before use, the first conveyor belt 3 is assembled based on the size of the reflow soldering device, adjacent connecting strips 30 are arranged in the same direction, one connecting strip 30 is inserted into the U-shaped beam 31 of the other connecting strip 30, and the U-shaped beam 31 is abutted against the limit rod 33 and the bayonet 321 is engaged to complete rapid assembly, which is convenient for disassembly and cleaning; the waste tray 6 is inserted into the device body 1 from the opening 12 and is sleeved with the positioning beam 11 to complete positioning. During use, the PCB board with electronic devices and tin beads positioned thereon is transported and placed on the first conveyor belt 3. The two conveyor belts are in operation, the limiting pillars 53 of the second conveyor belt 5 limit and guide the PCB board, the heating module 8 is in operation, and the air supply duct 9 takes air into the middle of the heating mechanism 7. The air flows to both sides and flows out from the return air duct 10 to realize heat utilization and transfer. The tin beads on the PCB board are steadily heated and melted by the preheating zone of the low-efficiency heater at the inlet, melted in the high-temperature zone of the high-efficiency heater and tightly connected with the electronic devices and the soldering pads, and steadily cooled, cooled and shaped by the low-efficiency heater at the outlet, thereby completing the reflow soldering process of the PCB board.

[0046] In summary, due to the adoption of the above technical solution, the PCB reflow soldering device of this embodiment has the following beneficial effects compared with the prior art:

[0047] 1. The utility model realizes two-way air supply inside the heating mechanism according to the temperature trend through the design of the heating module, air supply pipeline and return air pipeline, and transfers heat from the high temperature area to the low temperature area, thereby realizing a smooth and continuous heating and cooling process, improving the reflow soldering quality, improving heat utilization and reducing energy consumption.

[0048] 2. The first conveyor belt adopts a hollow chain conveyor belt structure, which has a simple structure, reduces costs, and can control the conveyor belt length. It has strong adaptability and is easy to disassemble, maintain and clean. The hollow structure ensures stable support and transportation of PCB boards while preventing the outflowing solder paste from being retained on the conveyor belt, ensuring the cleanliness of the conveyor belt; the waste tray adopts a drawer-type detachable structure to facilitate the cleaning of solder paste waste.

[0049] The above is only a preferred specific implementation method of the present invention, but the protection scope of the present invention is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the present invention can make equivalent replacements or changes based on the technical solution and utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A PCB reflow device, characterized in that: include: Device body; a conveying mechanism disposed in a bottom cavity of the device body, comprising a first driving roller and a first conveyor belt, wherein the first conveyor belt is composed of a plurality of clamped connecting strips, wherein the connecting strips include a U-shaped beam with a downward opening, a connecting rod extending obliquely upward from the end of the U-shaped beam, and a limiting rod extending outward from the end of the connecting rod, wherein the limiting rod of one connecting strip abuts against the inner side of the U-shaped beam of an adjacent connecting strip; A guide mechanism, which is arranged on both sides of the conveying mechanism and includes a second driving roller and a second conveying belt; A waste tray is provided below the conveying mechanism and has a waste trough on the top; The heating mechanism is provided with an air supply pipeline in the middle and return air pipelines on both sides, and a heating module is provided inside.

2. A PCB reflow soldering device according to claim 1, characterized in that: A bayonet is provided at one end of the connecting rod close to the limiting rod, and the U-shaped beam is rotatably clamped on the bayonet.

3. A PCB reflow soldering device according to claim 2, characterized in that: When adjacent connecting strips are connected, the top surface of the U-shaped beam and the top surface of the limiting rod are at the same horizontal height.

4. A PCB reflow soldering device according to claim 1, characterized in that: The second conveyor belt is a chain-type conveyor belt composed of a plurality of chain monomers hingedly connected with a connecting shaft, and a limiting column is provided on the inner side of the chain monomer.

5. A PCB reflow soldering device according to claim 1, characterized in that: An opening is provided on the bottom side of the device body, and positioning beams are provided on both sides of the opening of the bottom cavity of the device body. The splints extending from the sides of the waste tray are sleeved on the positioning beams, and the opening matches the shape and size of the waste tray.

6. A PCB reflow soldering device according to claim 1, characterized in that: The heating module is provided with a high-efficiency heater, a medium-efficiency heater and a low-efficiency heater in sequence from the center of the heating mechanism to both sides thereof. The air supply duct is located above the high-efficiency heater, and the return air duct is located above the low-efficiency heater. The heating mechanism is provided with a frustum or prism-shaped vent at the interface of the air supply duct and the return air duct.

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