Tooth pushing mechanism

Abstract

The utility model relates to the field of photovoltaic cell piece feeding and discharging equipment, in particular to a tooth ejecting mechanism. The tooth ejecting mechanism comprises a bracket and two or more limiting assemblies. The bracket comprises more than two mounting plates, and the mounting plates are arranged at intervals in the first direction. Each limiting assembly is connected with at least one mounting plate and used for supporting the multiple silicon wafers in the second direction and separating the silicon wafers, and the second direction is perpendicular to the first direction. Each limiting assembly comprises a plurality of limiting columns and a tooth supporting pad, the plurality of limiting columns are arranged on the mounting plate at equal intervals in the second direction, and a supporting groove for erecting a silicon wafer is formed between every two adjacent limiting columns; the tooth support pad is arranged on the mounting plate, a plurality of guide grooves are formed in the tooth support pad in the second direction, and the guide grooves correspond to the support grooves.

Description

Technical Field

[0001] The present application relates to the field of photovoltaic cell loading and unloading equipment, and in particular to a top gear mechanism. Background Art

[0002] Currently, the silicon wafers produced by photovoltaic cell manufacturers are essentially square wafers. Existing photovoltaic silicon wafer loading and unloading mechanisms are typically designed based on square wafers, and the wafer carriers are typically baskets, quartz boats, or trough-type fixtures. On such equipment, silicon wafers are transferred between the basket and the quartz boat using suction cups. In related art, a basket or quartz boat holds 100 or 120 wafers, with suction cups picking up 50 or 60 wafers at a time and removing the wafers from the basket in multiple passes. However, the suction cups cannot directly remove the wafers from the basket; a set of teeth is required to lift the wafers from the basket, and then the suction cups remove the wafers from the teeth. However, without considering the curvature of the wafers, the maximum retraction angle of the wafers within the top teeth mechanism is random. A group of wafers are randomly arranged, making it very easy for the suction cups to break the wafers when removing them. Utility Model Content

[0003] In view of this, the present application provides a top gear mechanism that can improve the problem of the suction cup easily breaking the silicon wafer.

[0004] An embodiment of the present application provides a top tooth mechanism, comprising a bracket and two or more limiting assemblies. The bracket comprises two or more mounting plates, which are spaced apart along a first direction. Each limiting assembly is connected to at least one mounting plate, and is used to support multiple silicon wafers along a second direction and separate each silicon wafer, wherein the second direction is perpendicular to the first direction. Each limiting assembly comprises a limiting column and a tooth support pad, wherein a plurality of limiting columns are provided, and the plurality of limiting columns are arranged on the mounting plate at equal intervals along the second direction, and a bracket for mounting the silicon wafer is formed between two adjacent limiting columns; the tooth support pad is provided on the mounting plate, and the tooth support pad is provided with a plurality of guide grooves along the second direction, and the guide grooves correspond to the brackets.

[0005] The aforementioned top gear mechanism is connected to at least one mounting plate via each limiting assembly. Each limiting assembly includes a limiting post and a tooth support pad. Multiple limiting posts are arranged on the mounting plate at equal intervals along the second direction, thereby supporting and separating multiple silicon wafers along the second direction. A bracket for mounting the silicon wafers is formed between adjacent limiting posts. The tooth support pad is provided with multiple guide grooves along the second direction. The guide grooves correspond to the brackets, so that the bottom of a silicon wafer placed between two adjacent limiting posts is supported by the guide grooves of the tooth support pad, effectively converging the bottom of the silicon wafer toward the center, thereby reducing the extreme retraction angle of the silicon wafer and improving the problem of the silicon wafer being easily broken by the suction cup.

[0006] In the above embodiment, the lowest point of the projection of the guide groove along the first direction is defined as the convergence point, and the convergence point is located within the projection of the corresponding bracket along the first direction.

[0007] In one or more of the above embodiments, the distances between the convergence point and the projections of the two side edges of the corresponding bracket along the first direction are equal.

[0008] In one or more of the above embodiments, the opening width of the projection of the guide groove along the first direction is greater than the width of the projection of the corresponding bracket along the first direction. The opening angle of the guide groove is ∠1, 40°≤∠1≤60°.

[0009] In one or more of the above embodiments, each mounting plate is provided with a waist groove, each limiting assembly includes a tooth groove plate and a first connecting member, the first connecting member passes through the waist groove to connect the tooth groove plate, the length direction of the waist groove is parallel to the length direction of the tooth groove plate, and multiple limiting columns are fixed to the tooth groove plate at equal intervals along the second direction.

[0010] In one or more of the above embodiments, the toothed plate is provided with a plurality of fixing holes arranged at equal intervals along the second direction, and the limiting columns are provided in a one-to-one correspondence with the fixing holes; the toothed plate is also provided with tightening holes corresponding to the fixing holes, the tightening holes are perpendicular to and connected to the fixing holes, and the tightening holes are provided with screws for tightening the corresponding limiting columns, and the screws are engaged with the threads of the tightening holes.

[0011] In one or more of the above embodiments, the tooth groove plate includes a fixing portion and a connecting portion, the fixing portion is fixedly connected to the mounting plate, and the connecting portion is fixedly connected to a side of the tooth support pad away from the limiting column.

[0012] In one or more of the above embodiments, each limiting assembly includes a side tooth, which is fixed to the end surface of the fixing portion along the second direction, and the distance between the side tooth and the adjacent limiting column is equal to the distance between two adjacent limiting columns.

[0013] In one or more of the above embodiments, the side teeth include a first section, a second section and a third section arranged in sequence, the first section is fixedly connected to the fixed part, the distance between the second section and the adjacent limiting column is equal to the distance between the two adjacent limiting columns, and the third section gradually narrows in the direction away from the second section.

[0014] In one or more of the above embodiments, the tooth support pad is made of polyetheretherketone. The angle between the surface of the silicon wafer and the central axis of the limiting column is ∠2, and 0.3°≤∠2≤0.8°. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the top gear mechanism in one embodiment of the present application.

[0016] Figure 2This is a schematic diagram of the overall structure of the top gear mechanism from another angle in an embodiment of the present application.

[0017] Figure 3 yes Figure 2 Schematic diagram of the enlarged structure of part A.

[0018] Figure 4 It is a side view of the overall structure of the top gear mechanism in one embodiment of the present application.

[0019] Figure 5 yes Figure 4 Schematic diagram of the enlarged structure of part B.

[0020] Figure 6 yes Figure 4 Schematic diagram of the enlarged structure of part C.

[0021] Figure 7 It is a partial schematic diagram of a top gear mechanism without a gear support pad installed in the related art.

[0022] Description of main component symbols

[0023] 1. Top gear mechanism; 10. Bracket; 11. Mounting plate; 111. Waist groove; 20. Limiting assembly; 21. Limiting column; 211. Bracket; 22. Tooth support pad; 221. Guide groove; 23. Tooth plate; 231. Fixing hole; 232. Tightening hole; 233. Fixing part; 234. Connecting part; 24. Side teeth; 241. First section; 242. Second section; 243. Third section; X, first direction; Y, second direction; Z, third direction; 9. Silicon wafer. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0025] It should be noted that when an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be a centrally arranged element at the same time. When an element is considered to be "set on" another element, it may be directly set on the other element or there may be a centrally arranged element at the same time. In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be internal communication between the two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The terms "including" and "having" and any variations thereof in the specification and claims of this application and the accompanying drawings are intended to cover non-exclusive inclusions.

[0027] In the description of the embodiments of this application, the technical terms "first," "second," etc. are used only to distinguish different objects and should not be understood to indicate or imply relative importance or to implicitly indicate the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise specifically defined.

[0028] Reference to "embodiment" herein means that the specific features, structures, or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. The various embodiments in this application can be combined with each other unless there is a conflict. In the method steps, S1, S2, etc. only represent the names of the steps and do not limit the order of the steps.

[0029] It should be noted that the thickness, length, width and other dimensions of various components in the embodiments of the present application shown in the drawings, as well as the overall thickness, length, width and other dimensions of the integrated device are only exemplary and should not constitute any limitation to the present application.

[0030] One embodiment of the present application provides a top gear mechanism, comprising a bracket and two or more limiting assemblies. The bracket comprises two or more mounting plates, which are spaced apart along a first direction. Each limiting assembly is connected to at least one mounting plate, and is used to support and separate multiple silicon wafers along a second direction, wherein the second direction is perpendicular to the first direction. Each limiting assembly comprises a limiting column and a tooth support pad, and a plurality of limiting columns are provided, and the plurality of limiting columns are equidistantly provided on the mounting plate along the second direction, and a bracket for mounting the silicon wafer is formed between two adjacent limiting columns; the tooth support pad is provided on the mounting plate, and the tooth support pad is provided with a plurality of guide grooves along the second direction, and the guide grooves correspond to the brackets. At least one mounting plate is connected by each limiting assembly, and each limiting assembly comprises a limiting column and a tooth support pad, and the plurality of limiting columns are equidistantly provided on the mounting plate along the second direction, thereby supporting and separating multiple silicon wafers along the second direction. A bracket for mounting a silicon wafer is formed between two adjacent limiting columns, and a plurality of guide grooves are provided on the tooth support pad along the second direction. The guide grooves correspond to the brackets, so that the bottom of the silicon wafer placed between two adjacent limiting columns is supported by the guide grooves of the tooth support pad, which has the effect of gathering the bottom of the silicon wafer toward the middle, thereby reducing the extreme lodging angle of the silicon wafer and improving the problem of the silicon wafer being easily broken by the suction cup.

[0031] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. Unless there is a conflict, the features in the following embodiments and examples can be combined with each other.

[0032] Figure 1 A schematic diagram of the overall structure of the top gear mechanism 1 in one embodiment of the present application is shown, which shows the state after supporting multiple silicon wafers 9. Figure 2 A schematic diagram of the overall structure of the top gear mechanism 1 at another angle in an embodiment of the present application is shown, which shows a state where no silicon wafer 9 is supported.

[0033] See also Figure 1 and Figure 2 One embodiment of the present application provides a top gear mechanism 1, comprising a bracket 10 and two or more position limiting assemblies 20. The bracket 10 comprises two or more mounting plates 11, which are spaced apart along a first direction X. Each position limiting assembly 20 is connected to at least one mounting plate 11 and is used to support and separate multiple silicon wafers 9 along a second direction Y, wherein the second direction Y is perpendicular to the first direction X.

[0034] In some embodiments, the silicon wafer 9 is a whole silicon wafer, two limiting assemblies 20 are provided, and the bracket 10 includes two mounting plates 11, which are spaced apart along the first direction X. Each limiting assembly 20 is connected to a mounting plate 11, and the whole silicon wafer is mounted on the limiting assemblies 20 of the two mounting plates 11.

[0035] In other embodiments, the silicon wafer 9 is composed of two half-wafers, four limiting assemblies 20 are provided, and the bracket 10 includes four mounting plates 11, which are spaced apart along the first direction X. Each limiting assembly 20 is connected to a mounting plate 11, and one half-wafer is mounted on the limiting assemblies 20 of two mounting plates 11, while the other half-wafer is mounted on the limiting assemblies 20 of the other two mounting plates 11.

[0036] In some embodiments, there is a symmetry plane P between the two mounting plates 11 , and the limiting components 20 on the two mounting plates 11 are mirror-symmetrical about the symmetry plane P. For ease of description, one of the limiting components 20 is described in detail below.

[0037] In some embodiments, each limiting assembly 20 includes a limiting column 21 and a tooth support pad 22. There are multiple limiting columns 21, and the central axes of the multiple limiting columns 21 are parallel to the third direction Z, wherein the third direction Z is perpendicular to the first direction X and the second direction Y at the same time.

[0038] A plurality of limiting posts 21 are arranged at equal intervals on the mounting plate 11 along the second direction Y. Brackets 211 for mounting the silicon wafers 9 are formed between two adjacent limiting posts 21 to separate each silicon wafer 9 along the second direction Y. A tooth support pad 22 is disposed on the mounting plate 11 and has a plurality of guide grooves 221 disposed along the second direction Y. The guide grooves 221 correspond to the brackets 211.

[0039] Figure 3 yes Figure 2 The enlarged structural diagram of part A shows the installation relationship of the limiting component 20.

[0040] See also Figure 2 and Figure 3 In some embodiments, the limiting assembly 20 further includes a toothed plate 23 and a first connecting member (not shown). The length of the toothed plate 23 is parallel to the second direction Y, and a plurality of limiting posts 21 are fixed to the toothed plate 23 at equal intervals along the second direction Y. The mounting plate 11 is provided with a waist groove 111 extending through the first direction X. The first connecting member passes through the waist groove 111 and connects to the toothed plate 23 to removably secure the toothed plate 23 to the mounting plate 11. The length of the waist groove 111 is parallel to the length of the toothed plate 23, allowing the toothed plate 23 to be finely adjusted in the second direction Y to facilitate alignment with the toothed plate 23 on another mounting plate 11.

[0041] In some embodiments, the upper surface of the toothed plate 23 is provided with a plurality of fixing holes 231 arranged at equal intervals along the second direction Y, and the limiting posts 21 are provided in a one-to-one correspondence with the fixing holes 231. The side of the toothed plate 23 is also provided with a tightening hole 232 corresponding to the fixing hole 231. The tightening hole 232 is perpendicular to and connected to the fixing hole 231. A jackscrew (not shown) is provided in the tightening hole 232. The jackscrew is threadedly engaged with the tightening hole 232 to tighten the corresponding limiting post 21, thereby fixing the limiting post 21. The limiting post 21 forms a hole-axis fit with the fixing hole 231, thereby improving the verticality of the installation of the limiting post 21. The jackscrew tightens the corresponding limiting post 21 from the side to facilitate the disassembly and installation of the limiting post 21.

[0042] In other embodiments, the upper surface of the toothed plate 23 is provided with a plurality of threaded holes arranged at equal intervals along the second direction Y, and the limiting posts 21 are threadedly connected to the corresponding threaded holes. The limiting posts 21 and the toothed plate 23 are directly connected by threads, which reduces the difficulty of assembling the limiting posts 21 and improves the convenience of assembly and disassembly of the limiting posts 21.

[0043] In some embodiments, the top of the limiting pillars 21 is conical and gradually narrows from bottom to top, so as to facilitate the silicon wafer 9 to be inserted between two adjacent limiting pillars 21.

[0044] In some embodiments, the limiting pillars 21 are made of ceramic, which has a smooth surface and can effectively prevent the surface of the silicon wafer 9 from being scratched.

[0045] In some embodiments, the tooth plate 23 includes a fixing portion 233 and a connecting portion 234. The fixing portion 233 is fixedly connected to the mounting plate 11, and the tooth support pad 22 is fixedly connected to the connecting portion 234. The connecting portion 234 is located on the side of the tooth support pad 22 away from the limiting column 21. Specifically, a through hole is provided on the side of the connecting portion 234. The limiting assembly 20 also includes a second connecting member (not shown). The second connecting member passes through the through hole and is threadedly connected to the tooth support pad 22, thereby fixing the relative position of the tooth support pad 22 and the connecting portion 234.

[0046] In some embodiments, the limiting assembly 20 includes side teeth 24 , which are fixed to the end surface of the fixing portion 233 along the second direction Y. The distance between the side teeth 24 and adjacent limiting posts 21 is equal to the distance between two adjacent limiting posts 21 .

[0047] In some embodiments, side teeth 24 are fixed to two end surfaces of the fixing portion 233 along the second direction Y.

[0048] In some embodiments, the side teeth 24 include a first section 241, a second section 242 and a third section 243. The second section 242 is located between the first section 241 and the third section 243. The first section 241 is fixedly connected to the fixing portion 233. The distance between the second section 242 and the adjacent limiting column 21 is equal to the distance between the two adjacent limiting columns 21. The third section 243 gradually narrows in the direction away from the second section 242, thereby facilitating the silicon wafer 9 to be stuck between the side teeth 24 and the adjacent limiting columns 21.

[0049] Figure 4 A side view of the overall structure of the top gear mechanism 1 in one embodiment of the present application is shown. Figure 5 yes Figure 4 Schematic diagram of the enlarged structure of part B.

[0050] See also Figure 3 、 Figure 4 and Figure 5 In some embodiments, when observed along the first direction X, a guide groove 221 is correspondingly provided between two adjacent limiting columns 21, that is, the projection of the guide groove 221 along the first direction X partially overlaps with the projection of the corresponding two adjacent limiting columns 21 along the first direction X.

[0051] By providing a limiting assembly 20 on each mounting plate 11, each limiting assembly 20 includes a limiting post 21 and a tooth support pad 22. Multiple limiting posts 21 are arranged on the mounting plate 11 at equal intervals along the second direction Y, thereby supporting and separating the multiple silicon wafers 9 along the second direction Y. When viewed along the first direction X, guide grooves 221 are provided between two adjacent limiting posts 21. This allows the bottom of a silicon wafer 9 placed between two adjacent limiting posts 21 to be supported by the guide grooves 221 of the tooth support pad 22, thereby bringing the bottom of the silicon wafer 9 toward the center. This reduces the maximum lodging angle of the silicon wafer 9, ignoring the bending of the silicon wafer 9, and alleviates the problem of the suction cup easily breaking the silicon wafer 9.

[0052] In some embodiments, the tooth support pad 22 is made of polyetheretherketone (PEEK). PEEK has excellent sliding properties and is suitable for applications requiring a low coefficient of friction and high wear resistance. The inclusion of PEEK in the tooth support pad 22 reduces the coefficient of friction between the silicon wafer 9 and the tooth support pad 22, thereby alleviating frictional damage between the sides of the silicon wafer 9 and the tooth support pad 22.

[0053] Figure 6 yes Figure 4 Schematic diagram of the enlarged structure of part C. Figure 7 It is a partial schematic diagram of the top gear mechanism 1 without the tooth support pad 22 installed in the related art.

[0054] See also Figure 5 and Figure 6In some embodiments, the lowest point of the projection of the guide groove 221 along the first direction X is defined as the convergence point, and the convergence point is located between the projections of the corresponding brackets 211 along the first direction X, so that after the silicon wafer 9 is inserted between two adjacent limiting pillars 21, the bottom of the silicon wafer 9 can reach the lowest point of the projection of the guide groove 221 along the first direction X, i.e., the convergence point, along the guide groove 221. Without considering the bending of the silicon wafer 9, the maximum lodging angle of the silicon wafer 9 is reduced.

[0055] In some embodiments, the opening angle of the guide groove 221 is ∠1, and 40°≤∠1≤60°.

[0056] In some embodiments, the distance between the folding point and the projection of the two side edges of the corresponding bracket 211 along the first direction X is equal, so that after the silicon wafer 9 is inserted between two adjacent limiting columns 21, the bottom of the silicon wafer 9 is equal to the distance between the two adjacent limiting columns 21, and the inclination angle of the silicon wafer 9 to both sides is the same, which is conducive to the suction cup to pick up the wafer.

[0057] In some embodiments, after the silicon wafer 9 is inserted between two adjacent limiting pillars 21, the angle between the surface of the silicon wafer 9 and the central axis of the limiting pillar 21 is ∠2. Figure 7 In the top tooth mechanism 1 in which the tooth support pad 22 is not installed, the angle between the surface of the silicon wafer 9 and the central axis of the limiting column 21 is ∠3, 0.3°≤∠2≤0.8°, 0.6°≤∠3≤1.6°, and ∠3=2∠2. The tooth support pad 22 can greatly reduce the maximum falling angle of the silicon wafer 9 without reducing the distance between the limiting columns 21, thereby improving the problem that the suction cup easily breaks the silicon wafer 9.

[0058] Preferably, ∠2=0.54°, ∠3=1.08°.

[0059] In some embodiments, the opening width of the projection of the guide groove 221 along the first direction X is greater than the width of the projection of the corresponding bracket 211 along the first direction X, and the opening end face of the guide groove 221 is staggered with the space between the two adjacent limiting columns 21, which is conducive to the silicon wafer 9 being able to move smoothly to the lowest point of the projection of the guide groove 221 along the first direction X after being inserted into the two adjacent limiting columns 21.

[0060] In addition, those skilled in the art can make various other corresponding changes and modifications based on the technical concept of this application, and all these changes and modifications should fall within the scope of protection of the claims of this application.

Claims

1. A top gear mechanism, characterized in that: include: The bracket includes two or more mounting plates, wherein the mounting plates are spaced apart along a first direction; Two or more limiting assemblies, each of the limiting assemblies is connected to at least one of the mounting plates, and is used to support and separate the multiple silicon wafers along a second direction, wherein the second direction is perpendicular to the first direction; Each of the limiting components includes a limiting column and a tooth support pad. There are multiple limiting columns, and the multiple limiting columns are arranged on the mounting plate at equal intervals along the second direction. A bracket for mounting the silicon wafer is formed between two adjacent limiting columns; the tooth support pad is arranged on the mounting plate, and the tooth support pad is provided with multiple guide grooves along the second direction, and the guide grooves correspond to the brackets.

2. The top gear mechanism according to claim 1, wherein: The lowest point of the projection of the guide groove along the first direction is defined as a convergence point, and the convergence point is located within the projection of the corresponding bracket along the first direction.

3. The top gear mechanism according to claim 2, wherein: The distance between the folding point and the projections of the two side edges of the corresponding bracket along the first direction is equal.

4. The top gear mechanism according to claim 2, wherein: The opening width of the projection of the guide groove along the first direction is greater than the width of the projection of the corresponding bracket along the first direction; The opening angle of the guide groove is ∠1, 40°≤∠1≤60°.

5. The top gear mechanism according to claim 1, wherein: Each of the mounting plates is provided with a waist groove, and each of the limiting components includes a tooth groove plate and a first connecting member, the first connecting member passes through the waist groove and is connected to the tooth groove plate, the length direction of the waist groove is parallel to the length direction of the tooth groove plate, and the multiple limiting columns are fixed to the tooth groove plate at equal intervals along the second direction.

6. The top gear mechanism according to claim 5, characterized in that: The toothed plate is provided with a plurality of fixing holes arranged at equal intervals along the second direction, and the limiting columns are arranged in a one-to-one correspondence with the fixing holes; the toothed plate is also provided with tightening holes corresponding to the fixing holes, the tightening holes are perpendicular to and connected to the fixing holes, and the tightening holes are provided with screws for tightening the corresponding limiting columns, and the screws are threadedly engaged with the tightening holes.

7. The top gear mechanism according to claim 5, wherein: The tooth groove plate includes a fixing portion and a connecting portion, the fixing portion is fixedly connected to the mounting plate, and the connecting portion is fixedly connected to a side of the tooth support pad away from the limiting column.

8. The top gear mechanism according to claim 7, wherein: Each of the limiting components includes a side tooth, which is fixed to the end surface of the fixing portion along the second direction. The distance between the side tooth and the adjacent limiting column is equal to the distance between two adjacent limiting columns.

9. The top gear mechanism according to claim 8, wherein: The side teeth include a first section, a second section and a third section arranged in sequence, the first section is fixedly connected to the fixing portion, the distance between the second section and the adjacent limiting columns is equal to the distance between two adjacent limiting columns, and the third section gradually narrows in the direction away from the second section.

10. The top gear mechanism according to claim 1, wherein: The material of the tooth support pad includes polyetheretherketone; The included angle between the surface of the silicon wafer and the central axis of the limiting column is ∠2, 0.3°≤∠2≤0.8°.

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