Local electroplating tool
By designing local electroplating tooling, the problems of high plating cost and low production efficiency are solved, and the demand for large-scale local electroplating and post-plating bonding of small components is achieved, reducing the cost of electroplating and improving production efficiency.
Patent Information
- Application Number
- CN202422597666.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-28
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-10-28
AI Technical Summary
In the prior art, electroplating costs are high and conventional boiling plating methods are difficult to meet the large-scale production needs of small components, especially when local electroplating is high, and it is difficult to meet the post-electroplating bonding needs.
A local electroplating tool is designed, including substrate, positioning keys, electroplating tank positions and protection plates. A counterhole and processing table are provided on the substrate. The positioning keys are used for stable clamping of the substrate. The electroplating tank positions are used to place the parts to be plating, and the protective plate is used to protect the local electroplating area to achieve efficient local electroplating.
Through the design of substrate and positioning keys, stable clamping of substrates and efficient local electroplating are achieved, which reduces electroplating costs, improves production efficiency, and meets the mass production needs of small components.
Smart Images
Figure CN223268796U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of local electroplating, in particular to a local electroplating tool. Background Art
[0002] During the electroplating process, due to the high cost of electroplating and the need for bonding after electroplating, the conventional roll plating method is difficult to meet the needs and the cost is high. It is difficult to meet the cost requirements and mass production requirements when producing small components in large quantities. Therefore, a new local electroplating tooling has become an urgent problem that technical personnel in this field need to solve. Utility Model Content
[0003] The present application provides a local electroplating tool, comprising a substrate, for local electroplating of a part to be electroplated;
[0004] Positioning keys are arranged at the four corners of the substrate, the top surfaces of the four positioning keys maintain the same horizontal position, and the height of the top surface of the positioning keys is greater than or equal to the part to be electroplated;
[0005] A plurality of electroplating slots, each of which is a countersunk hole arranged on the substrate, wherein a processing table is provided inside the countersunk hole, and the processing table is used to place the parts to be electroplated;
[0006] A groove is provided at a position at the bottom end of the substrate corresponding to the positioning key, the inner shape of the groove is adapted to the shape of the positioning key, and the groove is used for inserting and placing the positioning key;
[0007] A protective plate is installed above the substrate, and a plurality of through holes are provided on the protective plate. The positions, shapes and numbers of the through holes are adapted to the positions, shapes and numbers of the parts to be electroplated that are not inserted into the electroplating tanks.
[0008] Optionally, the electroplating tanks are arranged in a matrix.
[0009] Optionally, the depth of the countersunk hole is adapted to the height of the area where the workpiece to be electroplated is placed, and the cross-sectional area of the countersunk hole is adapted to the cross-sectional area of the workpiece to be electroplated.
[0010] Optionally, the bottom surface of the processing table is connected to the bottom surface of the countersunk hole, and the processing table is used to place and position the part to be electroplated.
[0011] Optionally, the processing table is a column structure, the workpiece to be electroplated is sleeved on the outside of the column of the processing table, and the outside of the workpiece to be electroplated is in contact with the side wall of the countersunk hole.
[0012] The beneficial effects of this application are:
[0013] The substrate provided in the present application has countersunk holes arranged in a regular pattern, a processing table is provided inside the countersunk holes, the parts to be electroplated are placed on the processing table, the parts to be processed are exposed above the substrate, and the exposed parts are electroplated. The local electroplating operation of the parts to be electroplated on the entire substrate can be completed at one time, and the positioning keys provided at the four corners of the substrate can enable each substrate to be stacked, which is convenient for storing the entire version of the parts to be electroplated, reducing the cost of electroplating and saving the time of local electroplating. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a schematic diagram of the top view of the electroplating tooling;
[0015] Figure 2 This is a schematic diagram of the assembly cross section of the electroplating tooling;
[0016] Figure 3 Schematic diagram of the top view of the protection plate;
[0017] In the figure: 1. Base plate; 2. Parts to be electroplated; 3. Positioning key; 4. Electroplating slot; 5. Countersunk hole; 6. Processing table; 7. Protective plate. DETAILED DESCRIPTION
[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0019] Please refer to Figure 1 、 Figure 2 and Figure 3 As shown, the present application provides a local electroplating tool, including a substrate 1, which is used for local electroplating of the part 2 to be electroplated. The shape of the substrate 1 can be set to a square for easy storage and placement, and chamfers are made at the four corners to form a smooth curved surface. The thickness of the substrate 1 is set according to the height at which the part 2 to be electroplated needs to be inserted.
[0020] Positioning keys 3 are arranged at the four corners of the substrate 1 , with the top surfaces of the four positioning keys 3 maintaining the same horizontal position, and the height of the top surface of the positioning keys 3 being greater than or equal to the workpiece 2 to be electroplated;
[0021] A groove is provided at the bottom end of the substrate 1 at a position corresponding to the positioning key 3 . The inner shape of the groove is adapted to the shape of the positioning key 3 , and the groove is used for inserting and placing the positioning key 3 .
[0022] Please continue to refer to Figure 1As shown, the top surface position of the positioning key 3 remains consistent, and the substrates 1 can be stacked by the positioning key 3. The height of the positioning key 3 is higher than the height of the workpiece 2 to be electroplated after it is placed on the substrate 1. The positioning key 3 can be abutted against the grooves set at the four corners of the bottom of the base 1 to form a stack of substrates 1 for easy storage.
[0023] Furthermore, the positioning keys 3 can be used to stably clamp the substrate 1 during the electroplating process. The substrate 1 can be clamped in the electroplating solution by clamping the four positioning keys 3 .
[0024] A plurality of electroplating slots 4 are provided, wherein the electroplating slots 4 are countersunk holes 5 arranged on the substrate 1 , and a processing table 6 is provided inside the countersunk holes 5 , and the processing table 6 is used to place the workpiece 2 to be electroplated.
[0025] The electroplating tanks 4 are arranged in a matrix.
[0026] The depth of the countersunk hole 5 is adapted to the height of the area where the workpiece 2 to be electroplated is placed, and the cross-sectional area of the countersunk hole 5 is adapted to the cross-sectional area of the workpiece 2 to be electroplated.
[0027] The bottom surface of the processing table 6 is connected to the bottom surface of the countersunk hole 5 , and the processing table 6 is used to place and position the workpiece 2 to be electroplated.
[0028] The processing table 6 is a column structure, the workpiece to be electroplated 2 is sleeved on the outside of the column of the processing table 6, and the outside of the workpiece to be electroplated 2 is in contact with the side wall of the countersunk hole 5.
[0029] It is worth noting that there is an annular gap between the processing table 6 and the countersunk hole 5. The area of the part to be electroplated 2 that does not need to be electroplated is placed between the annular gap, and the area that needs to be electroplated is exposed above the substrate 1. By electroplating with the upper surface of the substrate 1, the electroplating of all the parts to be electroplated 2 exposed on the upper surface of the substrate 1 is completed, and the local electroplating of small components can be completed in batches.
[0030] A protective plate 7 is installed above the substrate 1. Several through holes are opened on the protective plate 7. The position, shape and number of the through holes are adapted to the position, shape and number of the workpiece 2 to be electroplated that is not inserted into the electroplating slot 4. The protective plate 7 can seal the upper surface of the workpiece 2 to be electroplated exposed above the substrate 1. In the process of local electroplating, if it is not necessary to electroplate the upper surface of the workpiece 2 to be electroplated, the protective plate 7 is installed above the substrate 1, and the exposed structure of the workpiece 2 to be electroplated is inserted into the through holes set on the protective plate 7. If it is necessary to electroplate the upper surface of the workpiece 2 to be electroplated, the protective plate 7 can be omitted and the workpiece 2 to be electroplated can be directly placed on the substrate 1. The four positioning keys 3 are clamped to perform local electroplating on the workpiece 2 to be electroplated.
[0031] The above descriptions are merely a few embodiments of the present application and do not constitute any form of limitation to the present application. Although the present application discloses the preferred embodiments as above, they are not intended to limit the present application. Any technical personnel familiar with the present profession, without departing from the scope of the technical solution of the present application, using the technical content disclosed above to make slight changes or modifications are equivalent to equivalent implementation cases and fall within the scope of the technical solution.
Claims
1. A local electroplating tool, characterized in that: It comprises a substrate (1) used for local electroplating of a part to be electroplated (2); Positioning keys (3) are arranged at the four corners of the substrate (1), the top surfaces of the four positioning keys (3) maintain the same horizontal position, and the height of the top surface of the positioning keys (3) is greater than or equal to the height of the workpiece (2) to be electroplated; A plurality of electroplating slots (4), wherein the electroplating slots (4) are countersunk holes (5) arranged on the substrate (1), a processing table (6) is provided inside the countersunk holes (5), and the processing table (6) is used to place the workpiece (2) to be electroplated; A groove is provided at the bottom end of the base plate (1) at a position corresponding to the positioning key (3); the internal shape of the groove is adapted to the shape of the positioning key (3); the groove is used for inserting and placing the positioning key (3); A protective plate (7) is installed above the substrate (1), and a plurality of through holes are provided on the protective plate (7), wherein the positions, shapes and numbers of the through holes are adapted to the positions, shapes and numbers of the parts to be electroplated (2) not inserted into the electroplating slots (4).
2. A local electroplating tool according to claim 1, characterized in that: The electroplating slots (4) are arranged in a matrix.
3. The local electroplating tool according to claim 1, characterized in that: The depth of the countersunk hole (5) is adapted to the height of the area where the workpiece to be electroplated (2) is placed, and the cross-sectional area of the countersunk hole (5) is adapted to the cross-sectional area of the workpiece to be electroplated (2).
4. The local electroplating tool according to claim 1, characterized in that: The bottom surface of the processing table (6) is connected to the bottom surface of the countersunk hole (5), and the processing table (6) is used to place and position the part to be electroplated (2).
5. The local electroplating tool according to claim 4, characterized in that: The processing table (6) is a column structure, the workpiece to be electroplated (2) is sleeved on the outside of the column of the processing table (6), and the outside of the workpiece to be electroplated (2) is in contact with the side wall of the countersunk hole (5).