Illuminating lamp panel with heat dissipation structure

Abstract

The utility model relates to the technical field of illuminating lamp panels, in particular to an illuminating lamp panel with a heat dissipation structure, which comprises a lamp panel substrate, a plurality of LED lamp beads arranged on the lamp panel substrate, a control panel arranged in the middle of the lamp panel substrate, and a heat dissipation mechanism arranged on one surface, deviating from the LED lamp beads, of the lamp panel substrate, the heat dissipation mechanism comprises a semiconductor chilling plate and a heat dissipation assembly, wherein the semiconductor chilling plate is arranged below the lamp panel substrate and used for actively reducing the working temperature of the lamp panel substrate, the heat dissipation assembly is connected to the bottom of the semiconductor chilling plate and used for increasing the heat dissipation area, and the semiconductor chilling plate is electrically connected to the control panel. The utility model aims to improve the heat dissipation efficiency of the illuminating lamp panel.

Description

Technical Field

[0001] The utility model relates to the technical field of lighting lamp boards, in particular to a lighting lamp board with a heat dissipation structure. Background Art

[0002] Ceiling lights are typically installed in recessed recesses in the ceiling, serving as either recessed fixtures or spotlights. These fixtures typically consist of a housing and an LED lighting panel mounted within it. A lampshade is located on the opening in the housing to improve lighting quality and protect the LED panel.

[0003] However, in actual use, the relatively enclosed installation space reduces the path for heat to dissipate to the outside world, causing the internal lighting panel to generate a large amount of heat and accumulate within the lamp housing. This heat accumulation not only causes light decay and reduces the luminous efficiency of the LED, but also accelerates the aging of the electronic components on the internal lighting panel, seriously affecting the performance and service life of the lamp. Utility Model Content

[0004] In order to solve the problems in the above background technology, the utility model provides a lighting lamp board with a heat dissipation structure.

[0005] The solution adopted by the utility model to solve its technical problems is: a lighting lamp board with a heat dissipation structure is installed in a lamp housing, including a lamp board substrate, a plurality of LED lamp beads arranged on the lamp board substrate, a control board arranged in the middle position of the lamp board substrate and a heat dissipation mechanism arranged on the side of the lamp board substrate away from the LED lamp beads, the heat dissipation mechanism includes a semiconductor refrigeration plate arranged below the lamp board substrate for actively reducing the working temperature of the lamp board substrate and a heat dissipation component connected to the bottom of the semiconductor refrigeration plate for increasing the heat dissipation area, and the semiconductor refrigeration plate is electrically connected to the control board.

[0006] By adopting the above technical solution, the semiconductor cooling plate and the heat dissipation component at the bottom of the light board substrate together form a dynamic temperature adjustment mechanism, which can maintain the light board substrate within an optimal operating temperature range.

[0007] Furthermore, the heat dissipation component includes a heat sink attached to the bottom of the semiconductor refrigeration plate and a plurality of heat dissipation fins evenly arranged on the bottom of the heat sink.

[0008] By adopting the above technical solution, the combination of the heat sink and the heat dissipation fins can increase the heat dissipation area to conduct heat more effectively, thereby improving the overall heat dissipation efficiency.

[0009] Furthermore, a thermally conductive silicon pad is provided between the lamp board substrate and the semiconductor refrigeration plate to enhance the heat conduction effect.

[0010] By adopting the above technical solution, adding a thermally conductive silicon pad can fill the tiny gap and flatness difference between the lamp board substrate and the semiconductor cooling plate, reduce thermal resistance, and improve heat conduction efficiency.

[0011] Furthermore, a temperature sensor is provided on the lamp board substrate, and the temperature sensor is electrically connected to the control board, and can adjust the working state of the semiconductor refrigeration plate according to the temperature.

[0012] By adopting the above technical solution, the temperature sensor can monitor the temperature of the lamp board substrate in real time and feed the data back to the control board, so that the system can accurately adjust the working state of the semiconductor refrigeration plate according to the actual temperature.

[0013] Furthermore, a plurality of fixing parts are evenly arranged on the side ends of the light board substrate, and fastening screws for fixing the lighting light board to the lamp housing are inserted into the fixing parts.

[0014] By adopting the above technical solution, the lighting lamp panel can be firmly installed in the lamp housing.

[0015] In summary, the beneficial effects of the present invention are as follows: By sequentially placing a thermally conductive silicon pad, a semiconductor cooling plate, a heat sink, and a heat dissipation fin assembly beneath the light board substrate, the present invention forms a highly efficient heat dissipation mechanism. This mechanism effectively conducts and dissipates heat generated by the light board substrate, ensuring that the substrate always remains within the optimal operating temperature range. Furthermore, by providing a temperature sensor, the temperature of the light board substrate can be monitored in real time, and the control board dynamically adjusts the operating status of the semiconductor cooling plate to ensure that the light board operates within a safe temperature range.

[0016] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In addition, in order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the structure of this embodiment;

[0018] Figure 2 It is a cross-sectional view of this embodiment.

[0019] In the figure: 1. lamp board substrate; 2. control board; 3. LED lamp beads; 4. heat dissipation mechanism; 41. semiconductor cooling plate; 42. heat sink; 43. heat dissipation fins; 44. thermal conductive silicon pad; 5. fixing part; 51. fastening screws. DETAILED DESCRIPTION

[0020] In order to make the content of the present invention more clearly understood, the present invention will be further described below based on specific embodiments in conjunction with the accompanying drawings.

[0021] It should be noted that the terms "center," "upper," "lower," "front," "back," "left," "right," "inner," and "outer" used herein to indicate positions or locations are based on the positions or locations shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Unless otherwise specified, "plurality" means two or more.

[0022] Unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of these terms in this utility model based on specific circumstances.

[0023] like Figures 1 to 2 As shown, a lighting panel with a heat dissipation structure is installed in a lamp housing. This embodiment includes a panel base 1, a plurality of LED lamp beads 3 disposed on the panel base 1, a control board 2 disposed in the middle of the panel base 1, and a heat dissipation mechanism 4 disposed on the side of the panel base 1 facing away from the LED lamp beads 3. In this embodiment, the panel base 1 is disc-shaped, with the control board 2 disposed in the middle. The control board 2 converts external power into a voltage and current suitable for the operation of the LED lamp beads 3 and other electronic components, and drives the LED lamp beads 3 according to external control signals to control their on / off state and brightness. The heat dissipation mechanism 4 includes a semiconductor cooling plate 41 disposed below the panel base 1 for actively reducing the operating temperature of the panel base 1, and a heat dissipation component connected to the bottom of the semiconductor cooling plate 41 for increasing the heat dissipation area. The semiconductor cooling plate 41 is electrically connected to the control board 2.

[0024] This embodiment features a heat dissipation mechanism 4 positioned beneath the light panel substrate 1. When the control board 2 detects that the lighting panel is overheating during use, it activates a semiconductor cooling element 41 connected to its electrical wiring. The semiconductor cooling element 41 has two ends: a cold end near the light panel substrate 1 and a hot end near the heat dissipation component below. When current flows through it, one side cools while the other heats up. The control board 2 controls the current flowing through the semiconductor cooling element 41, cooling the side near the light panel substrate 1. This cools the side, absorbing heat from the light panel substrate 1 and lowering its temperature. The other side of the semiconductor cooling element 41 heats up due to the heat transfer. This hot end is connected to a heat dissipation component, which accelerates heat dissipation to the surrounding environment by increasing its surface area in contact with air or through forced air cooling (a cooling fan can be added to the bottom). When the light panel is turned off or the temperature drops below a safe level, the control board 2 reduces or stops power to the semiconductor cooling element 41 accordingly to conserve energy.

[0025] like Figure 2 As shown, the heat dissipation assembly of this embodiment includes a heat sink 42 attached to the bottom of the semiconductor refrigeration plate 41 and a plurality of heat dissipation fins 43 evenly arranged on the bottom of the heat sink 42. The heat sink 42 is made of a high thermal conductivity material (such as copper, aluminum, etc.) and is attached to the hot end of the semiconductor refrigeration plate 41. When the semiconductor refrigeration plate 41 transfers heat from the cold end to the hot end, the heat sink 42 attached to the bottom of the semiconductor refrigeration plate 41 receives the heat and diffuses it through the bottom heat dissipation fins 43. The uniform arrangement of the bottom heat dissipation fins 43 helps to form a stable airflow path, making the air flow smoother and improving the heat dissipation efficiency.

[0026] like Figure 2 As shown, a thermally conductive silicone pad 44 is provided between the light board substrate 1 and the semiconductor cooling plate 41 in this embodiment to enhance heat conduction. Due to its flexibility and elasticity, the thermally conductive silicone pad 44 can fill the slight gap and flatness differences between the light board substrate 1 and the semiconductor cooling plate 41, reducing thermal resistance and improving heat conduction efficiency. Furthermore, the thermally conductive silicone pad 44 itself has excellent thermal conductivity, quickly transferring heat from the light board substrate 1 to the semiconductor cooling plate 41, which then transfers the heat to the heat dissipation component.

[0027] Furthermore, in this embodiment, a temperature sensor is provided on the light board substrate 1. This temperature sensor is electrically connected to the control board 2 and can adjust the operating state of the semiconductor cooling plate 41 according to the temperature. The temperature sensor monitors the temperature of the light board substrate 1 in real time and feeds this data back to the control board 2, enabling the system to precisely adjust the operating state of the semiconductor cooling plate 41 based on the actual temperature, ensuring that the light board always operates within the optimal temperature range. By dynamically adjusting the operating intensity of the semiconductor cooling plate 41, energy is avoided when high-intensity cooling is not required, thereby achieving energy savings.

[0028] like Figure 1 As shown, in this embodiment, multiple fixing portions 5 are evenly arranged on the side ends of the light board substrate 1. Fastening screws 51 are inserted into the fixing portions 5 to secure the light board to the lamp housing. The fixing portions 5 are evenly arranged on the side ends of the light board substrate 1. These fixing portions 5 can also be snap-fit ​​or other fixing structures. In this embodiment, threaded holes are provided in the fixing portions 5. Fastening screws 51 are inserted through the entire structure of the light board and into corresponding holes in the lamp housing. The screws securely secure the light board to the lamp housing.

[0029] In summary, the beneficial effects of this embodiment are as follows: By sequentially disposing a thermally conductive silicon pad 44, a semiconductor cooling plate 41, a heat sink 42, and a group of heat dissipating fins 43 beneath the light board substrate 1 to form a heat dissipation mechanism 4, this embodiment effectively conducts and dissipates heat generated by the light board substrate 1, maintaining the light board substrate 1 within an optimal operating temperature range. Furthermore, by providing a temperature sensor, the temperature of the light board substrate 1 can be monitored in real time, and the control board 2 dynamically adjusts the operating state of the semiconductor cooling plate 41 to ensure that the light board operates within a safe temperature range.

[0030] The embodiments described above are only preferred implementation methods of the present invention and cannot be used to limit the scope of protection of the present invention. Any non-substantial changes and modifications made by technicians in this field on the basis of the utility model shall fall within the scope of protection of the present invention.

Claims

1. A lighting lamp board with a heat dissipation structure, installed in a lamp housing, characterized in that: It includes a light board substrate, a plurality of LED lamp beads arranged on the light board substrate, a control board arranged in the middle position of the light board substrate, and a heat dissipation mechanism arranged on the side of the light board substrate away from the LED lamp beads. The heat dissipation mechanism includes a semiconductor refrigeration plate arranged under the light board substrate for actively reducing the working temperature of the light board substrate and a heat dissipation component connected to the bottom of the semiconductor refrigeration plate for increasing the heat dissipation area. The semiconductor refrigeration plate is electrically connected to the control board.

2. The lighting panel with a heat dissipation structure according to claim 1, characterized in that: The heat dissipation component includes a heat sink attached to the bottom of the semiconductor refrigeration plate and a plurality of heat dissipation fins evenly arranged on the bottom of the heat sink.

3. The lighting panel with a heat dissipation structure according to claim 1, characterized in that: A thermally conductive silicon pad is provided between the lamp board substrate and the semiconductor refrigeration plate to enhance the heat conduction effect.

4. The lighting panel with a heat dissipation structure according to claim 1, characterized in that: A temperature sensor is also provided on the lamp board substrate. The temperature sensor is electrically connected to the control board and can adjust the working state of the semiconductor refrigeration plate according to the temperature.

5. The lighting panel with a heat dissipation structure according to claim 1, characterized in that: A plurality of fixing parts are evenly arranged on the side ends of the lamp board substrate, and fastening screws for fixing the lighting lamp board to the lamp housing are inserted into the fixing parts.

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