Capacitance array sensor, bending and human body posture detection device and wearable article
Through the combination of capacitive array sensors and processors, the problems of slow response speed, low accuracy, high cost and poor durability of existing morphological sensing technologies are solved, and high response speed, high accuracy and low cost morphological measurements are achieved, suitable for wearable items and human posture detection.
Patent Information
- Application Number
- CN202422275177.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-18
- Publication Date
- 2025-08-26
- Estimated Expiration
- 2034-09-18
AI Technical Summary
The existing morphological sensing technology has problems such as slow response speed, low accuracy and reliability, high cost, high environmental sensitivity, poor durability, small measurable range, and cannot be flexibly configured according to specific shapes.
Capacitor array sensors are used, including flexible circuit layer, spacer layer and electrodes, and the form changes are measured by the change of differential capacitance value, combined with the processor to perform dynamic bending detection, and are integrated into wearable items.
It realizes morphological measurements with high response speed, high accuracy, low cost, good durability and flexible configuration, and supports large-scale, high-precision, and no offset real-time dynamic attitude measurement.
Smart Images

Figure CN223271911U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of measurement technology, in particular to a capacitance array sensor, a dynamic bending detection device, a wearable article and a human body posture dynamic detection device. Background Art
[0002] Shape sensing technology aims to accurately capture and analyze changes in an object's shape, position, and posture. For example, in the medical field, shape sensing technology enables non-invasive, continuous posture tracking and analysis, supporting rehabilitation processes and providing real-time feedback to improve patient health. Currently, the following main technologies exist: inductive shape sensing, fiber optic shape sensing, and resistive shape sensing.
[0003] Inductive sensing technology measures the shape and posture of an object based on changes in the sensor's output inductance. A typical application involves sewing inductive sensors onto wearable garments. These sensors, composed of thin copper wires, are sewn into the garment's fabric in a serpentine pattern, covering the area of the body being measured. They sense movements such as extension and uprighting in the sagittal plane, monitoring changes in posture. When the person undergoes rehabilitation exercises or daily activities, any movement or change in the body causes the garment to deform, causing the shape of the sewn sensor to change, and thus, the sensor's inductance. This change in inductance can be used to monitor changes in posture. However, inductive sensing technology has the following drawbacks: The sensor has a slow response speed and a significant time delay, making it unsuitable for applications requiring rapid response, such as high-intensity training or certain rehabilitation activities. Accuracy and reliability are low; improper fit of the sensor to the garment or displacement during activity can result in erroneous data readings. Embedding the sensor requires specialized methods, which is costly, and inductive sensors have a short lifespan.
[0004] A fiber-optic shape sensor (FOSS) can be defined as a fiber-optic cable with multiple cores and embedded strain sensors. Its operating principle is as follows: In each instrumented section, three-dimensional curvature is calculated by simultaneously measuring strain in different cores. The longitudinal curvature function is determined from the strain values sensed in the instrumented section through interpolation or curve fitting, while the shape is reconstructed by numerically integrating the curvature. Fiber-optic shape sensors have the following disadvantages and issues: They typically require specialized multi-core optical fibers and high-precision optical instrumentation, which can result in high overall system costs. Fiber-optic shape sensor systems are typically complex, involving sophisticated optical equipment and complex data processing algorithms. This not only requires operator expertise but can also make maintenance and troubleshooting more complex and time-consuming. Fiber-optic shape sensors often have complex optical paths, and fiber routing and installation may be subject to certain spatial and environmental constraints. Deploying FOSS in complex or confined spaces can be challenging, and fiber routing and mounting require careful handling to avoid damage.
[0005] Resistive shape sensors consist of two layers of high-aspect-ratio polyurethane-based nanofibers (platinum (Pt) coatings). These fibers form a microscopic mechanical interlocking through van der Waals forces when in contact. When a mechanical load (such as pressure, shear, or torsion) is applied, the relative position of the fibers changes, resulting in a change in resistance or conductivity that can be detected as an electrical signal. The sensor utilizes the piezoresistive effect to convert mechanical deformation into an electrical signal. The tiny displacement between the fibers changes their contact resistance, thereby altering the current or voltage passing through the sensor. Resistive shape sensors have the following drawbacks and challenges: Their fabrication involves the use of high-aspect-ratio nanofibers and platinum (Pt) coating processes. These processes require high-precision control and sophisticated manufacturing techniques, potentially increasing production complexity and cost. Due to the characteristics of the Pt and nanofiber structure, the sensor may be sensitive to environmental conditions such as temperature, humidity, and chemicals. This sensitivity can reduce the sensor's durability, stability, and lifespan, potentially limiting its application in certain environments or requiring additional protective measures to ensure performance. The techniques used to manufacture high-aspect-ratio nanofibers may also limit the size and shape of the sensor. This may affect the suitability of the sensor for applications requiring a specific shape or flexible configuration.
[0006] The above information is presented only as background information to help understand the present invention. No confirmation or other relevant meaning is given as to whether any of the above can be used as prior art applications with respect to the present invention. Utility Model Content
[0007] The embodiments of the present utility model solve the problems of the aforementioned sensing system technology, such as slow response speed, low accuracy and reliability, high cost, high environmental sensitivity, poor durability, small measurable range, and inability to be flexibly configured according to specific shapes. A capacitive array sensor with high response speed, high accuracy, reliability and durability, low cost and flexible configuration is provided. A dynamic bending detection device is also provided to solve the problem of remote dynamic detection of the posture of the measured object. A wearable item is also provided to solve the problem of human body posture detection. A human body posture dynamic detection device is also provided to solve the problem of dynamic detection of human body posture. Capacitive array sensors and the aforementioned related devices can be used in the field of morphological sensing to perform morphological measurement of the measured object, and can achieve real-time dynamic posture measurement with large range, high precision, high refresh rate and no offset.
[0008] The first aspect of the present invention provides a capacitive array sensor, comprising: a first flexible circuit layer 1, a flexible spacer layer 2, a second flexible circuit layer 3 and a plurality of capacitors 4;
[0009] Wherein, the first flexible circuit layer 1, the flexible spacer layer 2 and the second flexible circuit layer 3 are stacked in sequence;
[0010] The capacitor includes a first electrode 411, a second electrode 412 and a reference electrode 413, wherein the first electrode 411 and the second electrode 412 are adjacently arranged on the first flexible circuit layer 1, and the reference electrode 413 is arranged on the second flexible circuit layer 3;
[0011] An overlapping region exists between the reference electrode 413 and at least one of the first electrode 411 and the second electrode 412 . The area of the overlapping region varies with the curvature of the capacitive array sensor.
[0012] For example, in at least one embodiment, there is a first overlapping region 414 between the reference electrode 413 and the first electrode 411, and a second overlapping region 415 between the reference electrode 413 and the second electrode 412. At least a portion of the capacitive array sensor is bent along a bending direction, and one of the areas of the first overlapping region 414 and the second overlapping region 415 gradually increases along the bending direction, while the other gradually decreases along the bending direction.
[0013] For example, in at least one embodiment, a connector 5 is further included, which is arranged at the end of the capacitive array sensor and is configured to receive the respective signals of the first electrode 411, the second electrode 412 and the reference electrode 413, and to connect to an external device to transmit the signals.
[0014] For example, in at least one embodiment, it further includes a fixing device 6 and / or a covering layer 7; the fixing device 6 is arranged at at least one end of the capacitive array sensor and is configured to fixedly connect the first flexible circuit layer 1, the flexible spacer layer 2 and the second flexible circuit layer 3; the covering layer 7 fully or partially covers the first flexible circuit layer 1, the flexible spacer layer 2 and the second flexible circuit layer 3.
[0015] For example, in at least one embodiment, the first flexible circuit layer 1 , the flexible spacer layer 2 and the second flexible circuit layer 3 are configured as flexible silicone circuit boards; and the covering layer 7 is configured as a flexible plastic layer.
[0016] For example, in at least one embodiment, the flexible spacer layer 2 includes a plurality of flexible spacers 21 , and the plurality of flexible spacers 21 are disposed between the first flexible circuit layer 1 and the second flexible circuit layer 3 and are stacked on each other.
[0017] For example, in at least one embodiment, the flexible spacer layer 2 includes 2-5 flexible spacer sheets 21 stacked on each other, and the flexible spacer sheets 21 are thin sheets with a thickness of 0-0.5 mm.
[0018] For example, in at least one embodiment, the first flexible circuit layer 1 , the second flexible circuit layer 3 , and the plurality of flexible spacers 21 can slide independently of each other.
[0019] For example, in at least one embodiment, the planar shapes of the first electrode 411 and the second electrode 412 are semicircular or triangular; the semicircular straight sides or triangular short sides of two adjacent first electrodes 411 and second electrodes 412 are adjacently arranged.
[0020] A second aspect of the present invention provides a bending detection device, comprising a capacitive array sensor and a processor as described in any one of the above items, wherein the processor receives a capacitive signal sent by the capacitive array sensor and generates a dynamic bending detection result based on the capacitive signal; the processor comprises an analog-to-digital conversion module, an expansion module, a microprocessing module and a display module; the analog-to-digital conversion module is configured to convert the capacitive signal collected by the capacitive array sensor and output the converted digital signal to the expansion module; the expansion module is configured to receive the digital signal output by the analog-to-digital conversion module and output it to the microprocessing module; the microprocessing module is configured to receive data output by the expansion module, process the data, and obtain the dynamic bending detection result; the display module is configured to receive and display the dynamic bending detection result output by the microprocessing module.
[0021] A third aspect of the present invention provides a wearable article, comprising any of the above-mentioned capacitive array sensors.
[0022] A fourth aspect of the present invention provides a human body posture detection device, comprising any one of the capacitive array sensors described above, and the capacitive array sensor is configured to detect the posture of a human body. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present invention, rather than limiting the present invention.
[0024] Figure 1 1 is a schematic cross-sectional structural diagram of a capacitance array sensor in an initial state according to an embodiment of the present utility model;
[0025] Figure 2 is a schematic cross-sectional structural diagram of a capacitive array sensor in a bent state according to an embodiment of the present utility model;
[0026] Figure 3 is another cross-sectional structural schematic diagram of the initial state of the capacitance array sensor according to an embodiment of the present utility model;
[0027] Figure 4 is a planar schematic diagram of a first electrode and a second electrode in a semicircular shape according to an embodiment of the present utility model;
[0028] Figure 5 is a planar schematic diagram of a first electrode and a second electrode in a triangular shape according to an embodiment of the present utility model;
[0029] Figure 6 This is a partial plan view of an embodiment of the present invention in which the first electrode and the second electrode are semicircular or triangular, and the reference electrode is rectangular;
[0030] Figure 7 It is a measurement principle diagram according to an embodiment of the present utility model. DETAILED DESCRIPTION
[0031] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0032] Unless otherwise defined, the technical or scientific terms used in this utility model shall have the usual meanings understood by persons of ordinary skill in the field to which this utility model belongs. The words "first", "second" and similar terms used in this utility model do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly. In this utility model, "multiple" refers to two or more.
[0033] According to the embodiment of the present utility model, Figure 1 Disclosed is a capacitive array sensor comprising: a first flexible circuit layer 1, a flexible spacer layer 2, a second flexible circuit layer 3, and a plurality of capacitors 4. The first flexible circuit layer 1, the flexible spacer layer 2, and the second flexible circuit layer 3 are stacked in sequence. Any capacitor 4 includes an electrode pair consisting of a first electrode 411 and a second electrode 412, and a reference electrode 413. The first electrode 411 and the second electrode 412 included in any capacitor 4 are adjacently arranged on the first flexible circuit layer 1 to form an electrode pair. For each electrode pair, the first electrode 411 and the second electrode 412 included therein are insulated and have a gap therebetween. The reference electrode 413 included in any capacitor 4 is arranged on the second flexible circuit layer 3, and the electrode pair consisting of the first electrode 411 and the second electrode 412 is arranged corresponding to the reference electrode 413 and has an overlapping area. In any capacitor 4, there is a first overlapping area 414 between the reference electrode 413 and the first electrode 411, and a second overlapping area 415 between the reference electrode 413 and the second electrode 412.
[0034] In any capacitor 4, a capacitance is generated between the first electrode 411 and the second electrode 412, respectively, and the reference electrode 413. The difference between the two capacitance values of any capacitor 4 is used to generate the required differential capacitance. Sensor arrays that perform bending measurement based on differential capacitance have the advantages of high precision and high refresh rate, enabling wide-range, offset-free shape and posture measurement.
[0035] Preferably, in at least one embodiment, Figure 1As shown, the capacitive array sensor further includes a connector 5. The connector 5 is disposed at an end of the capacitive array sensor and is configured to receive signals from the first electrode 411, the second electrode 412, and the reference electrode 413, and to connect to an external device to transmit the received signals. The connector 5 can be configured as a signal connector or data interface in the prior art, and can transmit multiple signals collected by the capacitive array sensor to an external device.
[0036] Preferably, the external device includes a connecting board, which is connected to the connector 5 of one or more capacitive array sensors, receives the signal output by the connector 5 of one or more capacitive array sensors, and transmits the signal output by the connector 5 of one or more capacitive array sensors to the analog-to-digital conversion module.
[0037] Preferably, in at least one embodiment, Figure 1 As shown, the capacitive array sensor further includes a fixture 6. The fixture 6 is disposed at at least one end of the capacitive array sensor and is configured to securely connect the first flexible circuit layer 1, the flexible spacer layer 2, and the second flexible circuit layer 3. The fixture 6 helps eliminate slippage between the first flexible circuit layer 1, the flexible spacer layer 2, and the second flexible circuit layer 3 due to factors other than bending of the capacitive array sensor, thereby reducing measurement errors. The fixture 6 can be integrated into the existing structure of the object being measured, thereby ensuring that the capacitive array sensor remains stable on the object being measured and preventing misalignment between the layers.
[0038] Preferably, in at least one embodiment, Figure 1 As shown, the capacitive array sensor further includes a covering layer 7. Covering layer 7 fully or partially covers first flexible circuit layer 1, flexible spacer layer 2, and second flexible circuit layer 3. Covering layer 7 also helps eliminate slippage between first flexible circuit layer 1, flexible spacer layer 2, and second flexible circuit layer 3 due to factors other than bending of the capacitive array sensor, thereby reducing measurement errors and avoiding misalignment between the layers.
[0039] Preferably, in at least one embodiment, the first flexible circuit layer 1, flexible spacer layer 2, and second flexible circuit layer 3 of the capacitive array sensor are integrated into a wearable article, for example, sewn into clothing. The structural features of the wearable article ensure that when the measured object is not bent, the first flexible circuit layer 1, flexible spacer layer 2, and second flexible circuit layer 3 will not slip or misalign due to other factors.
[0040] Preferably, in at least one embodiment, the first flexible circuit layer 1, the flexible spacer layer 2, and the second flexible circuit layer 3 are configured as flexible silicone circuit boards, for example, fabricated from various dielectric materials commonly used in the prior art, such as FPCBs or other silicon-based materials. The greater the dielectric constant of the dielectric material, the thinner the flexible circuit layer can be. The thinner the flexible circuit layer, the higher the measurement accuracy of the capacitive array sensor. Therefore, the most economical and suitable dielectric material can be selected to fabricate the flexible silicone circuit board, tailored to varying measurement accuracy and sensor space requirements.
[0041] Preferably, the covering layer 7 is configured as a flexible plastic layer. The flexible plastic layer is light and thin, which helps to avoid the covering layer 7 from causing additional influence on the bending of the capacitive array sensor.
[0042] Preferably, there are gaps between the first flexible circuit layer 1 , the flexible spacer layer 2 , and the second flexible circuit layer 3 to ensure that the layers can slide independently when the capacitive array sensor is dynamically bent.
[0043] According to the embodiment of the present utility model, Figure 2 As shown, the stacked structure of the capacitive array sensor, consisting of the first flexible circuit layer 1, the flexible spacer layer 2, and the second flexible circuit layer 3, can be bent along the extension direction of the capacitor 4. When the stacked structure, consisting of the first flexible circuit layer 1, the flexible spacer layer 2, and the second flexible circuit layer 3, is bent, the first flexible circuit layer 1, the flexible spacer layer 2, and the second flexible circuit layer 3 can slide relative to each other. The relative sliding between the first flexible circuit layer 1, the flexible spacer layer 2, and the second flexible circuit layer 3 varies with the curvature of the capacitive array sensor. Correspondingly, the areas of the overlapping regions, first overlapping region 414 and second overlapping region 415, between the electrode pair consisting of the first electrode 411 and the second electrode 412 and the reference electrode 413, also vary with the curvature of the capacitive array sensor.
[0044] The area of the overlapping area between the first overlapping area 414 and the second overlapping area 415 changes, causing the differential capacitance value generated by capacitor 4 to change accordingly. Therefore, based on the correspondence between the predetermined differential capacitance value generated by capacitor 4 and the curvature of the capacitor array sensor region where the capacitor 4 is located, the curvature of the capacitor array sensor region where the capacitor 4 is located can be determined based on the differential capacitance value generated by capacitor 4. Based on the differential capacitance values generated by multiple capacitors 4 in the capacitor array sensor, the curvature of the capacitor array sensor region where each capacitor 4 is located can be determined, and the shape of the capacitor array sensor can be obtained by fitting. When the capacitor array sensor is fitted to the object to be measured, the shape and posture of the object to be measured can be determined based on the shape of the capacitor array sensor.
[0045] According to the embodiment of the present utility model, Figure 2As shown, when the capacitive array sensor bends along a bending direction, the second flexible circuit layer 3 and the reference electrode 413 disposed thereon slide relative to the first flexible circuit layer 1 along the bending direction, causing the area of the first overlapping region 414 and the area of the second overlapping region 415 to gradually change with the sliding. Because the first electrode 411 and the second electrode 412 are arranged in pairs on the first flexible circuit layer 1, the relative position of the paired first electrode 411 and second electrode 412 remains unchanged. Thus, one of the areas of the first overlapping region 414 and the second overlapping region 415 gradually increases along the bending direction, while the other gradually decreases. Compared to a differential capacitance sensor solution in which a single overlapping region changes while the other remains unchanged, the change in the differential capacitance value generated by any one capacitor 4 during sliding in this embodiment doubles, and the corresponding measurement accuracy and sensitivity are also doubled.
[0046] It should be noted that in Figure 1 、 Figure 2 The invention discloses an embodiment in which four capacitors 4 are arranged along the length direction and bent in a single direction. Since any one capacitor 4 independently generates a differential capacitance value without being affected by other capacitors 4, in another embodiment, more capacitors 4 can be arranged in a larger range to achieve a larger range of measurements. Or the arrangement density of capacitors 4 can be increased per unit area to improve the accuracy of the measurement. In another embodiment, the object to be measured may have a reverse bend, such as a wavy line shape. The differential capacitance values generated by multiple capacitors 4 can be used to fit the surface shape and posture of the object to be measured, including protrusions and depressions.
[0047] According to the embodiment of the present utility model, Figure 3 As shown, the flexible spacer layer 2 of the capacitive array sensor may include a plurality of flexible spacers 21, and the plurality of flexible spacers 21 are arranged between the first flexible circuit layer 1 and the second flexible circuit layer 3 and stacked on each other. Preferably, the flexible spacer layer 2 includes 2-5 flexible spacers 21 stacked on each other, and the flexible spacers 21 are thin sheets with a thickness of 0-0.5 mm. Among them, the first flexible circuit layer 1, the second flexible circuit layer 3, and the plurality of flexible spacers 21 can slide independently. The use of multiple flexible spacers 21 can enhance the sliding performance of the flexible spacer layer 2. It is ensured that when the capacitive array sensor is bent, any two adjacent layers of the first flexible circuit layer 1, the plurality of flexible spacers 21, and the second flexible circuit layer 3 can slide independently without interfering with each other, so that the capacitive array sensor can better fit the measured object, which is conducive to enhancing the accuracy of the measurement and the flexibility of the application of the capacitive array sensor.
[0048] According to the embodiment of the present utility model, Figure 4As shown, the plane shape of the first electrode 411 and the second electrode 412 is a semicircle; the semicircular straight sides of two adjacent first electrodes 411 and second electrodes 412 are adjacent to each other. In the embodiment of the present invention, the reference electrode 413 is set to be a rectangle. Optionally, the reference electrode 413 can also be set to other shapes, such as a rhombus, a parallelogram, a trapezoid, a polygon with wide sides and a narrow middle, etc. Figure 6 As shown, when the planar shape of the first electrode 411 and the second electrode 412 is a relative semicircle, when the reference electrode 413 is displaced per unit distance w relative to the first electrode 411 and the second electrode 412, the ratio of the area change of the overlapping region caused is greater than when the planar shape of the first electrode 411 and the second electrode 412 is a rectangle. In capacitor 4, the area change of the overlapping region will produce a change in capacitance value. When the overlapping area change ratio increases under the condition that other conditions remain unchanged, the variation of capacitance value is also greater. Since the first electrode 411 and the second electrode 412 are both semicircular and the straight edges are arranged adjacent to each other, one of the two overlapping areas increases and the other decreases during sliding, and the ratio of their variation increases, the variation of the two capacitance values also increases, and the differential capacitance value variation produced by capacitor 4 further increases, specifically twice the variation of a single capacitance value. When the capacitance array sensor produces a slight bend, the differential capacitance value variation produced by capacitor 4 will be more obvious, thereby improving the accuracy and sensitivity of capacitance array sensor measurement.
[0049] According to the embodiment of the present utility model, Figure 5 As shown, the planar shape of the first electrode 411 and the second electrode 412 is a triangle; the short sides of the triangles of two adjacent first electrodes 411 and second electrodes 412 are adjacent to each other. Figure 6 As shown, when the planar shape of the first electrode 411 and the second electrode 412 is a triangle, when the reference electrode 413 is displaced per unit distance w relative to the first electrode 411 and the second electrode 412, the ratio of the area change of the overlapping region caused is greater than when the planar shape of the first electrode 411 and the second electrode 412 is a rectangle or a semicircle. In capacitor 4, the area change of the overlapping region will produce a change in capacitance value. When the ratio of the change of the overlapping area increases under the condition that other conditions remain unchanged, the amount of change in capacitance value is also greater. Since the first electrode 411 and the second electrode 412 are both triangular and relatively arranged, one of the two overlapping areas increases and the other decreases during sliding, the ratio of their changes increases, the amount of change in the two capacitance values also increases, and the amount of change in the differential capacitance value produced by capacitor 4 further increases, specifically twice the amount of change in a single capacitance value. When the capacitance array sensor produces a slight bend, the amount of change in the differential capacitance value produced by capacitor 4 will be more obvious, thereby improving the accuracy and sensitivity of the capacitance array sensor measurement.
[0050] According to an embodiment of the present invention, a bending detection device is also provided. Figure 7As shown, the dynamic bending detection device includes a capacitance array sensor and a processor. The processor receives capacitance signals sent by the capacitance array sensor and generates dynamic bending detection results based on the capacitance signals. The differential capacitance value generated by any capacitor 4 corresponds to the degree of local bending in the area where the capacitor 4 is located, and changes with the degree of local bending in the area where the capacitor 4 is located on the capacitance array sensor.
[0051] The processor includes an analog-to-digital conversion module, an expansion module, a microprocessor module, and a display module. The analog-to-digital conversion module is configured to convert capacitance signals collected by the capacitance array sensor and output the converted digital signals to the expansion module. The analog-to-digital conversion module can be selected from existing analog-to-digital conversion chips, such as the AD7746 analog-to-digital conversion chip.
[0052] The expansion module is configured to receive the digital signal output by the analog-to-digital conversion module and output it to the microprocessor module. The expansion module is used to expand the number of devices that can be connected to the bus, ensuring accurate signal transmission. Because the capacitance array sensor has a large measurement range, the number of capacitors configured is also large. The configuration of the expansion module facilitates maintaining measurement precision and accuracy when connecting multiple capacitance array sensors or multiple capacitors included in a single capacitance array sensor. The expansion module can be selected from existing I2C expansion boards, such as the TCA9548A expansion board.
[0053] The microprocessing module is configured to receive data output by the expansion module, process the data, and obtain dynamic bending detection results. The microprocessing module can calculate the local curvature of the area where each capacitor is located by aggregating, preprocessing, analyzing and calculating the differential capacitance values obtained by precise measurement, and then calculate the shape and posture of the entire capacitor array sensor and the measured object. Based on the local curvature of the areas where multiple capacitors are located and the dynamic changes of the local curvature, the microprocessing module can reconstruct complex dynamic shapes and postures. This is conducive to real-time and accurate measurement and analysis of the dynamic shape and posture of the measured object. The microprocessing module can have wired or wireless communication functions in existing technologies such as Bluetooth and Wi-Fi. The microprocessing module uses, for example, an Arduino Nano 33BLE model microprocessor.
[0054] The display module is configured to receive and display the dynamic bending test results output by the microprocessor module. The display module facilitates visualization of the measurement results and can intuitively display the dynamic results obtained from the measurement. For example, the display module can be a PC display interface.
[0055] The dynamic bending detection device can be widely used in fields such as robotics, human health monitoring and virtual reality.
[0056] According to an embodiment of the present invention, a wearable article is also provided, which includes the capacitive array sensor of the previous embodiment. For example, the wearable article is a device that can be worn or installed on the human body, such as a watch, jewelry, accessories, electronic device, etc., and the capacitive array sensor of any of the above embodiments is integrated on the device. For example, the wearable article is a piece of clothing that can be worn on the human body, such as gloves, vests, underwear, pants, socks, etc., and the capacitive array sensor of any of the above embodiments is integrated on the clothing. For example, the capacitive array sensor of any of the above embodiments is integrated in an invisible manner inside the wearable article to maintain the appearance of the wearable article. For example, the capacitive array sensor of any of the above embodiments is integrated in a visible manner on the outside of the wearable article to facilitate integrated installation.
[0057] According to an embodiment of the present invention, a human body posture detection device is also provided, and the human body posture dynamic detection device includes any of the capacitive array sensors of the aforementioned embodiments, and the capacitive array sensor is configured to detect the posture of the human body. For example, the human body posture dynamic detection device can be used to perform health management of human body posture. For example, a capacitive array sensor can be embedded in clothing along the spine direction to detect the state of the spine, and used in scenarios such as spinal diagnosis and correction. When teenagers wear clothing embedded with capacitive array sensors, by recording the spine shape data for a period of time, their daily habits and exercise postures can be analyzed, and targeted corrections can be performed. The human body posture dynamic detection device is also applicable to other groups of people such as the elderly.
[0058] This dynamic human posture detection device can not only collect one-dimensional posture data, but also two-dimensional posture data by adding capacitive array sensors in two dimensions. In this case, clothing embedded with capacitive array sensors can not only detect the one-dimensional state of the spine, but also the posture of the entire back, constructing a real-time two-dimensional image of the human back. This allows for more accurate spinal monitoring and a wider range of application scenarios.
[0059] There are a few points to note:
[0060] (1) The drawings of the embodiments of the present invention only relate to the structures related to the embodiments of the present invention. Other structures may refer to conventional designs.
[0061] (2) For the sake of clarity, the thickness of devices, layers, or regions in the drawings used to describe the embodiments of the present invention are exaggerated or reduced, that is, these drawings are not drawn to scale. It is understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or intervening elements may be present.
[0062] (3) In the absence of conflict, the embodiments of the present invention and the features therein may be combined with each other to obtain new embodiments.
[0063] The above are only specific implementation methods of the present invention, but the protection scope of the present invention is not limited thereto. The protection scope of the present invention shall be based on the protection scope of the claims.
Claims
1. A capacitance array sensor, characterized in that: a first flexible circuit layer, a flexible spacer layer, a second flexible circuit layer, and a plurality of capacitors; Wherein, the first flexible circuit layer, the flexible spacer layer and the second flexible circuit layer are stacked in sequence; The capacitor includes a first electrode, a second electrode and a reference electrode, the first electrode and the second electrode are adjacently arranged on the first flexible circuit layer, and the reference electrode is arranged on the second flexible circuit layer; An overlapping region exists between the reference electrode and at least one of the first electrode and the second electrode, and an area of the overlapping region changes with a curvature of the capacitive array sensor.
2. The capacitance array sensor according to claim 1, wherein: There is a first overlapping area between the reference electrode and the first electrode, There is a second overlapping area between the reference electrode and the second electrode, At least a portion of the capacitive array sensor is bent along a bending direction, and one of the areas of the first overlapping region and the second overlapping region gradually increases along the bending direction, while the other gradually decreases along the bending direction.
3. The capacitance array sensor according to claim 1, wherein: The sensor further includes a connector, which is disposed at an end of the capacitive array sensor and configured to receive signals from the first electrode, the second electrode, and the reference electrode, and to connect to an external device to transmit the signals.
4. The capacitance array sensor according to claim 1, wherein: Also includes fixtures and / or cladding; The fixing device is provided at at least one end of the capacitive array sensor and is configured to fixedly connect the first flexible circuit layer, the flexible spacer layer and the second flexible circuit layer; The covering layer completely or partially covers the first flexible circuit layer, the flexible spacer layer and the second flexible circuit layer.
5. The capacitance array sensor according to claim 4, wherein: The first flexible circuit layer, the flexible spacer layer and the second flexible circuit layer are configured as a flexible silicone circuit board; The covering layer is configured as a flexible plastic layer.
6. The capacitance array sensor according to claim 1, wherein: The flexible spacer layer includes a plurality of flexible spacers, and the plurality of flexible spacers are disposed between the first flexible circuit layer and the second flexible circuit layer and are stacked on each other.
7. The capacitive array sensor according to claim 6, wherein: The flexible spacer layer includes 2-5 flexible spacers stacked on each other, and the flexible spacers are thin sheets with a thickness of 0-0.5 mm.
8. The capacitance array sensor according to claim 6, wherein: The first flexible circuit layer, the second flexible circuit layer, and the plurality of flexible spacers can slide independently of each other.
9. The capacitance array sensor according to claim 1, wherein: The planar shape of the first electrode and the second electrode is semicircular or triangular; The semicircular straight sides or triangular short sides of two adjacent first electrodes and second electrodes are arranged adjacent to each other.
10. A bending detection device, characterized in that: comprising the capacitive array sensor according to any one of claims 1 to 9 and a processor, wherein the processor receives a capacitive signal sent by the capacitive array sensor and generates a dynamic bending detection result based on the capacitive signal; The processor includes an analog-to-digital conversion module, an expansion module, a microprocessor module and a display module; The analog-to-digital conversion module is configured to convert the capacitance signal collected by the capacitance array sensor and output the converted digital signal to the expansion module; The expansion module is configured to receive the digital signal output by the analog-to-digital conversion module and output it to the microprocessing module; The micro-processing module is configured to receive data output by the expansion module, process the data, and obtain the dynamic bending detection result; The display module is configured to receive and display the dynamic bending detection result output by the micro-processing module.
11. A wearable article, characterized in that: The wearable article comprises the capacitive array sensor according to any one of claims 1 to 9.
12. A human posture detection device, characterized in that: The human body posture dynamic detection device comprises the capacitive array sensor according to any one of claims 1 to 9, and the capacitive array sensor is configured to detect the posture of a human body.