Multipurpose semiconductor chip test fixture

Abstract

The utility model discloses a multipurpose semiconductor chip test fixture, and relates to the technical field of chip test. The chip testing device comprises a rack, the inner side of the rack is provided with a supporting table, the surface of the rack is provided with a movement adjusting assembly used for controlling the movement of the supporting table, the top surface of the movement adjusting assembly is provided with a plurality of testing seats which are different in specification and used for testing chips, and the testing seats are electrically connected with testing equipment. A chip positioning assembly used for limiting a chip is arranged above the supporting table, a lifting assembly used for controlling the test seat to be in butt joint with the chip positioning assembly is further arranged on the surface of the rack, the movement adjusting assembly comprises a motor, and the motor is fixedly installed on the inner wall of the rack. During use, the effect of quickly testing the chip is realized, and the corresponding testing seat 4 can be selected for testing according to different chips, so that the application range of the chip testing device is expanded, and the chip testing device is more convenient and flexible to use.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a multi-purpose semiconductor chip testing fixture. Background Art

[0002] In electronics, a chip is a miniaturized circuit, often manufactured on the surface of a semiconductor wafer. Chips are the core components of modern electronic products, and their performance needs to be tested after they are manufactured.

[0003] Existing test fixtures can generally only test semiconductor chips of one specification when performing chip testing. When different types of chips need to be tested, different test equipment often needs to be replaced, resulting in a more cumbersome testing process and difficulty in testing different chips with one test device.

[0004] Therefore, a multi-purpose semiconductor chip testing fixture is proposed. Utility Model Content

[0005] The purpose of the present invention is to solve the problems mentioned in the above background technology and provide a multi-purpose semiconductor chip testing fixture.

[0006] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions:

[0007] A multi-purpose semiconductor chip testing fixture includes a frame, a support platform is provided on the inner side of the frame, a movable adjustment component for controlling the movement of the support platform is provided on the surface of the frame, a plurality of test sockets of different specifications for testing chips are placed on the top surface of the movable adjustment component, the test sockets are electrically connected to the testing equipment, a chip positioning component for limiting the chip is provided above the support platform, and a lifting component for controlling the docking between the test sockets and the chip positioning component is also provided on the surface of the frame.

[0008] Furthermore, the movable adjustment component includes a motor, and the motor is fixedly mounted on the inner wall of the frame, the output end of the motor is fixedly connected to a threaded column, and the threaded column is threadedly connected to the support platform, the inner wall of the frame is fixedly connected to a sliding column, and the sliding column is slidably connected to the support platform.

[0009] Furthermore, the chip positioning assembly includes a mounting frame, and the mounting frame is fixedly connected to the frame, the front end of the mounting frame is fixedly connected to the test bench, the top surface of the mounting frame is rotatably connected to the adjusting screw, the surface of the adjusting screw is threadedly connected to the connecting column, the end of the connecting column is fixedly connected to the clamping plate, the top surface of the mounting frame is fixedly connected to the limiting rod, and the limiting rod is slidably connected to the connecting column.

[0010] Furthermore, the lifting assembly includes an electric push rod, and the electric push rod is fixedly installed on the surface of the frame. The telescopic end of the electric push rod is fixedly connected to the lifting frame. A positioning hole is opened through the surface of the support platform. A slot is opened on the bottom surface of the test seat, and the inner wall of the positioning hole and the inner wall of the slot are movably connected to the end of the lifting frame.

[0011] Furthermore, a spring is fixedly connected to the bottom of the inner wall of the support platform, and the free end of the spring is fixedly connected to the bottom surface of the test seat.

[0012] Furthermore, support blocks are fixedly connected to the left and right sides of the bottom surface of the frame, and a rubber pad is fixedly connected to the bottom surface of the pressing plate.

[0013] The beneficial effects of the utility model are as follows:

[0014] By moving the adjustment component, the support table is driven to move horizontally, so that different test sockets are aligned with the chip positioning component. The test socket required for this test is selected so that the test socket is located directly below the chip positioning component. By lifting the component, the test socket is pushed up so that the test socket is stuck in the chip positioning component. The chip to be tested is placed in the chip positioning component and is tightened and limited by the chip positioning component, so that the chip and the test socket are tightly connected. The chip can be tested at this time, which facilitates the rapid testing of the chip during use. The corresponding test socket can be selected for testing according to different chips, thereby expanding its scope of application and making it more convenient and flexible to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the three-dimensional structure of the utility model;

[0016] Figure 2 This is a side sectional view of the support platform structure of the utility model;

[0017] Figure 3 This is a side view of the chip positioning component structure of the utility model;

[0018] Figure 4 This is a side view of the lifting assembly structure of the utility model;

[0019] Figure markings: 1. Frame; 2. Movable adjustment assembly; 201. Motor; 202. Threaded column; 203. Sliding column; 3. Support platform; 4. Test seat; 5. Lifting assembly; 501. Electric push rod; 502. Lifting frame; 503. Spring; 504. Alignment hole; 505. Slot; 6. Chip positioning assembly; 601. Mounting frame; 602. Test bench; 603. Adjusting screw; 604. Connecting column; 605. Limiting rod; 606. Pressure plate. DETAILED DESCRIPTION

[0020] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0022] It should be noted that similar reference numerals and letters represent similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. In addition, the terms "first," "second," etc. are used only to distinguish the descriptions and are not to be understood as indicating or implying relative importance.

[0023] The electrical components mentioned in this article are all connected to an external main controller and 220V AC power, and the main controller can be a conventional known device that performs control such as a computer.

[0024] In the description of the embodiments of the present invention, it should be noted that the terms "inside", "outside", "upper", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the product of the present invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they cannot be understood as a limitation on the present invention.

[0025] like Figures 1 to 4As shown, a multi-purpose semiconductor chip test fixture includes a frame 1, a support table 3 is provided on the inner side of the frame 1, a movable adjustment assembly 2 is provided on the surface of the frame 1 for controlling the movement of the support table 3, and a plurality of test sockets 4 of different specifications for testing chips are placed on the top surface of the movable adjustment assembly 2. The test sockets 4 are electrically connected to the test equipment. A chip positioning assembly 6 is provided above the support table 3 for limiting the position of the chip. The surface of the frame 1 is also provided with a lifting assembly 5 for controlling the docking of the test sockets 4 with the chip positioning assembly 6. More specifically, the movable adjustment assembly 2 is operated to drive the support table 3 to move horizontally, so that different test sockets 4 are aligned with the chip positioning assembly 6. The test socket 4 required for the test is selected so that the test socket 4 is directly below the chip positioning assembly 6. The lifting assembly 5 is operated to push the test socket 4 up, so that the test socket 4 is locked into the chip positioning assembly 6. The chip to be tested is placed in the chip positioning assembly 6, and the chip positioning assembly 6 is used to press and limit the chip, so that the chip and the test socket 4 are tightly connected, and the chip can now be tested.

[0026] The movement and adjustment assembly 2 includes a motor 201, which is fixedly mounted on the inner wall of the frame 1. The output end of the motor 201 is fixedly connected to a threaded column 202, which is threadedly connected to the support platform 3. The inner wall of the frame 1 is fixedly connected to a slide column 203, which is slidably connected to the support platform 3. It should be noted that when the threaded column 202 is driven to rotate by the motor 201, the threaded column will push the support platform 3 to slide along the surface of the slide column 203 under the action of the thread, so that different test sockets 4 are aligned with the chip positioning assembly 6.

[0027] The chip positioning assembly 6 includes a mounting frame 601, which is fixedly connected to the frame 1. The front end of the mounting frame 601 is fixedly connected to the test bench 602. The top surface of the mounting frame 601 is rotatably connected to an adjusting screw 603. The surface of the adjusting screw 603 is threadedly connected to a connecting column 604. The end of the connecting column 604 is fixedly connected to a clamping plate 606. The top surface of the mounting frame 601 is fixedly connected to a limiting rod 605, and the limiting rod 605 is slidably connected to the connecting column 604. More specifically, after the test socket 4 is inserted into the test bench 602, the chip to be tested is placed into the test bench 602. By rotating the adjusting screw 603, the connecting column 604 is driven to slide along the surface of the limiting rod 605 under the action of the thread, thereby pushing the clamping plate 606 down, so that the clamping plate 606 contacts the top surface of the chip, clamping and positioning the chip.

[0028] The lifting assembly 5 includes an electric push rod 501, which is fixedly mounted on the surface of the frame 1. The telescopic end of the electric push rod 501 is fixedly connected to the lifting frame 502. A positioning hole 504 is formed through the surface of the support table 3. A slot 505 is formed on the bottom surface of the test socket 4. The inner wall of the positioning hole 504 and the inner wall of the slot 505 are both movably connected to the end of the lifting frame 502. It should be noted that the operation of the electric push rod 501 drives its telescopic end to shorten, thereby pulling the lifting frame 502 up. The end of the lifting frame 502 will pass through the inner wall of the positioning hole 504 and insert into the slot 505, lifting the test socket 4 so that the test socket 4 can be inserted into the interior of the chip positioning assembly 6, thereby facilitating testing.

[0029] A spring 503 is fixedly connected to the bottom of the inner wall of the support platform 3, and the free end of the spring 503 is fixedly connected to the bottom surface of the test socket 4. More specifically, the provision of the spring 503 can limit the position of the test socket 4, so that the test socket 4 is stably maintained on the top surface of the support platform 3, and when the test socket 4 is reset from the chip positioning assembly 6, it can be ensured to return smoothly.

[0030] Support blocks are fixedly connected to the left and right sides of the bottom surface of the frame 1, and rubber pads are fixedly connected to the bottom surface of the pressure plate 606. It should be noted that the support blocks create a gap between the bottom of the frame 1 and the placement surface, thereby accommodating the installation of the lifting assembly 5. The rubber pads on the bottom surface of the pressure plate 606 make the contact surface with the chip softer, avoiding pressure damage to the chip surface.

[0031] In summary: by moving the adjustment component 2, the support platform 3 is driven to move horizontally, so that different test sockets 4 are aligned with the chip positioning component 6, and the test socket 4 required for this test is selected so that the test socket 4 is located directly below the chip positioning component 6. By operating the lifting component 5, the test socket 4 is pushed up, so that the test socket 4 is stuck in the chip positioning component 6, and the chip to be tested is placed in the chip positioning component 6. It is pressed and limited by the chip positioning component 6, so that the chip and the test socket 4 are tightly connected. At this time, the chip can be tested, and the effect of facilitating rapid testing of the chip is achieved during use. The corresponding test socket 4 can be selected for testing according to different chips, thereby expanding its scope of application and making it more convenient and flexible to use.

[0032] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions merely illustrate the principles of the present invention. Various changes and improvements are possible without departing from the spirit and scope of the present invention. Such changes and improvements are intended to fall within the scope of the present invention. The scope of protection claimed for the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-purpose semiconductor chip test fixture, characterized in that: The invention comprises a frame (1), wherein a support platform (3) is provided on the inner side of the frame (1), a moving adjustment component (2) for controlling the movement of the support platform (3) is provided on the surface of the frame (1), a plurality of test seats (4) of different specifications for testing chips are placed on the top surface of the moving adjustment component (2), the test seats (4) are electrically connected to the test equipment, a chip positioning component (6) for limiting the chip is provided above the support platform (3), and a lifting component (5) for controlling the docking of the test seat (4) and the chip positioning component (6) is also provided on the surface of the frame (1).

2. The multi-purpose semiconductor chip test fixture according to claim 1, characterized in that: The movable adjustment component (2) comprises a motor (201), and the motor (201) is fixedly mounted on the inner wall of the frame (1); the output end of the motor (201) is fixedly connected to a threaded column (202), and the threaded column (202) is threadedly connected to the support platform (3); the inner wall of the frame (1) is fixedly connected to a sliding column (203), and the sliding column (203) is slidably connected to the support platform (3).

3. The multi-purpose semiconductor chip test fixture according to claim 1, characterized in that: The chip positioning assembly (6) includes a mounting frame (601), and the mounting frame (601) is fixedly connected to the frame (1); the front end of the mounting frame (601) is fixedly connected to the test bench (602); the top surface of the mounting frame (601) is rotatably connected to an adjusting screw rod (603); the surface of the adjusting screw rod (603) is threadedly connected to a connecting column (604); the end of the connecting column (604) is fixedly connected to a pressing plate (606); the top surface of the mounting frame (601) is fixedly connected to a limiting rod (605), and the limiting rod (605) is slidably connected to the connecting column (604).

4. The multi-purpose semiconductor chip test fixture according to claim 1, characterized in that: The lifting assembly (5) includes an electric push rod (501), and the electric push rod (501) is fixedly mounted on the surface of the frame (1); the telescopic end of the electric push rod (501) is fixedly connected to the lifting frame (502); a positioning hole (504) is provided through the surface of the support platform (3); a slot (505) is provided on the bottom surface of the test seat (4); and the inner wall of the positioning hole (504) and the inner wall of the slot (505) are both movably connected to the end of the lifting frame (502).

5. The multi-purpose semiconductor chip test fixture according to claim 4, characterized in that: A spring (503) is fixedly connected to the bottom of the inner wall of the support platform (3), and a free end of the spring (503) is fixedly connected to the bottom surface of the test seat (4).

6. The multi-purpose semiconductor chip test fixture according to claim 3, characterized in that: Support blocks are fixedly connected to the left and right sides of the bottom surface of the frame (1), and a rubber pad is fixedly connected to the bottom surface of the pressing plate (606).

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