Full-automatic feeding and discharging mechanism for semiconductor chip substrate

Abstract

The utility model provides a full-automatic feeding and discharging mechanism for a semiconductor chip substrate, and the mechanism comprises a support frame which is provided with a first installation platform; a feeding layer, a transition layer, a discharging layer, a first moving module and a second moving module are sequentially arranged from bottom to top, movable magazines are arranged on the feeding layer, the transition layer and the discharging layer, the moving directions of the magazines on the feeding layer and the discharging layer are the same, and the moving directions of the magazines on the feeding layer and the transition layer are opposite. The first moving module is arranged on one side of the feeding layer, the second moving module is arranged on the other side of the feeding layer, and the first moving module and the second moving module are both used for lifting the magazine. By the adoption of the structure, utilization of the empty magazine after feeding is completed is achieved, manual intervention is not needed, the whole process is automatic, feeding and discharging transfer time is saved, and efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor chip substrate packaging, in particular to a fully automatic loading and unloading mechanism for semiconductor chip substrates. Background Art

[0002] Over time, semiconductor technology has continued to advance, gradually developing more complex semiconductor devices such as integrated circuits and large-scale integrated circuits. These technological developments have greatly promoted progress in fields such as computers, communications, and medicine, making our lives more convenient and efficient.

[0003] The loading and unloading process of chip substrates is an indispensable step. In traditional equipment, when the loading of a fully loaded magazine is completed, it cannot be directly used in the unloading place. The packaged chip substrates need to be recycled and stored. Manual transfer operations are required. The manual operation process is relatively complicated and the risk factor of manual operation increases. At the same time, it is impossible to accurately control the complete packaging cycle of the chip substrate and cannot realize automatic loading and unloading. This loading and unloading method wastes a certain amount of time, resulting in complicated processes and low production efficiency. Utility Model Content

[0004] The utility model provides a fully automatic loading and unloading mechanism for semiconductor chip substrates, which solves the safety and precision problems caused by the need for manual loading assistance in traditional packaging equipment in the above technical background, as well as the complex and low efficiency problems of transferring chip substrates and resin to a press.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A fully automatic loading and unloading mechanism for semiconductor chip substrates, comprising:

[0007] a support frame, on which a first mounting platform is provided;

[0008] At least one loading layer is disposed near the first mounting platform, the loading layer is provided with a plurality of magazines, the magazines are provided with a plurality of interlayers, the interlayers are provided with chip substrates, and the magazines are movable relative to the loading layer;

[0009] At least one transition layer is provided above the upper material layer, the upper material layer may be provided with a plurality of the magazines, and the magazines may be movable relative to the transition layer, and

[0010] at least one lower material layer, the lower material layer being disposed above the transition layer, wherein a plurality of magazines may be disposed on the lower material layer, wherein the magazines on the upper material layer move in the same direction as the magazines on the lower material layer, and the magazines on the upper material layer move in opposite directions to the magazines on the transition layer;

[0011] a first movable module, movably disposed on the first mounting platform, the first movable module being disposed on one side of the loading layer, and being used for lifting the magazine;

[0012] The second movable module is movably arranged on the first mounting platform and is arranged on the other side of the loading layer. The second movable module is used for lifting the magazine.

[0013] In some embodiments, the material loading layer is provided with a first translation assembly, the first translation assembly is provided with a first translation push block, and the first translation push block can perform reciprocating linear movement on the material loading layer.

[0014] In some embodiments, the first translation assembly also includes a first translation motor, a first translation driving pulley, a first translation driven pulley and a first translation synchronous belt, the first translation motor is arranged on the support frame, the first translation driving pulley and the first translation driven pulley are both rotatably arranged on the bottom plate of the loading layer, the first translation synchronous belt is wound around the first translation driving pulley and the first translation driven pulley, and the first translation push block is connected to the first translation synchronous belt.

[0015] In some embodiments, the first translation assembly also includes two mutually parallel first translation guide rods fixedly provided on the bottom plate of the loading layer and a first translation slider movably mounted on the first translation guide rods, the first translation guide rods and the first translation push block have the same moving direction, a first yielding slot is provided on the loading layer, and the first translation slider is connected to the first translation push block through the first yielding slot.

[0016] In some embodiments, the first moving module includes a first X-axis module and a first Z-axis module, the first X-axis module is provided with a first X-axis slider that moves back and forth linearly, the first Z-axis module is arranged on the first X-axis slider, and the first Z-axis module is provided with a first support block that moves back and forth linearly, the moving direction of the first X-axis slider is consistent with the moving direction of the first translation push block, and the moving direction of the first support block is consistent with the distribution direction of the upper material layer, the transition layer and the lower material layer.

[0017] In some embodiments, a chip substrate pushing mechanism is further provided on the same side as the first movable module, the chip substrate pushing mechanism is provided on the support frame, and a reciprocating pushing claw is provided on the chip substrate pushing mechanism, and the moving direction of the pushing claw is consistent with the interlayer direction of the magazine.

[0018] In some embodiments, the second mobile module has the same structure as the first mobile module.

[0019] In some embodiments, a second translation assembly is provided on the transition layer, and the second translation assembly includes a second translation motor arranged on the support frame, a second translation active synchronous pulley arranged at the output end of the second translation motor, and multiple second translation synchronous belts and multiple second translation driven synchronous pulleys arranged on the support frame. The second translation active synchronous pulley is provided with multiple second mounting grooves distributed at intervals, and multiple second translation synchronous belts are wound around the second mounting grooves and around the corresponding second translation driven synchronous pulleys, so that the multiple second translation synchronous belts are arranged in parallel.

[0020] In some embodiments, a third translation assembly is provided on the lower material layer, and the third translation assembly has the same structure as the second translation assembly.

[0021] In some embodiments, two adjustment baffles with adjustable spacing are provided on the upper material layer, the transition layer, and the lower material layer, and the spacing between the adjustment baffles is adapted to the size of the magazine.

[0022] Compared with the prior art, the beneficial effects brought by the present invention are:

[0023] The present application sets up a loading layer, a transition layer and a lower loading layer, wherein the loading layer, the transition layer and the lower loading layer are set one after another from bottom to top, and the magazines on the loading layer, the transition layer and the lower loading layer can all be moved, and the magazines on the loading layer and the lower loading layer move in the same direction, while the magazines on the lower loading layer and the transition layer move in opposite directions, so that after the chip substrate on the fully loaded magazine is pushed and loaded, it is moved to the transition layer with the help of the first moving module, and then moved to the loading layer through the second moving module, thereby realizing the repeated use of the magazine, and the moving distance of the first moving module and the second moving module is minimized, saving loading time and improving loading efficiency.

[0024] Additional aspects and advantages of the present application will be given in part in the following description, which will become apparent from the following description, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a first perspective view of the fully automatic loading and unloading mechanism for semiconductor chip substrates of the present invention;

[0026] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0027] Figure 3 This is a second perspective view of the fully automatic loading and unloading mechanism for semiconductor chip substrates of the present invention;

[0028] Figure 4 for Figure 3 Enlarged view of point B in the middle;

[0029] Figure 5 This is a third perspective view of the fully automatic loading and unloading mechanism for semiconductor chip substrates of the present invention;

[0030] Figure 6 for Figure 5 Enlarged view of point C in the middle;

[0031] Figure 7 This is a cross-sectional view of the transition layer transmission structure of the fully automatic loading and unloading mechanism for semiconductor chip substrates of the present utility model;

[0032] Figure 8 for Figure 1 Enlarged view of 206; DETAILED DESCRIPTION

[0033] The present application is further described in detail below with reference to the accompanying drawings. In the description of this embodiment, unless otherwise specified, the terms "left" and "right" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present application and simplify the description. They do not indicate or imply that the present application must have a specific direction, be constructed, or operate in a specific direction. Therefore, they should not be construed as limiting the present application.

[0034] In one embodiment, Figure 1 As shown, a fully automatic loading and unloading mechanism 200 for semiconductor chip substrates provided by the present invention mainly includes a support frame 100, on which a first mounting platform 101 is provided; at least one loading layer 201, at least one transition layer 202 and at least one unloading layer 203, wherein the loading layer 201, the transition layer 202 and the unloading layer 203 are arranged in sequence from bottom to top, as shown in FIG. Figure 3 As shown, multiple magazines 2010 can be placed in the upper material layer 201, transition layer 202, and lower material layer 203. Magazines 2010 can move relative to the upper material layer 201, transition layer 202, and lower material layer 203. Each magazine 2010 has the same structure, with multiple interlayers evenly spaced. Chip substrates are placed on the interlayers of the magazines 2010. Under external force, the chip substrates can be separated from or inserted into the interlayers for storage. In this embodiment, the upper material layer 201 is used to store magazines 2010 filled with unpackaged chip substrates, the transition layer 202 is used to store empty magazines 2010, and the lower material layer 203 is used to store magazines 2010 containing packaged chip substrates.

[0035] Furthermore, in order to facilitate the chip to basically enter the interlayer of the magazine 2010, a guide structure is provided at both ends of the interlayer, and the guide structure is a guide slope or arc surface with an opening larger than the width of the interlayer, or a combination of the two. Figure 1As shown, in order to make the magazine 2010 move in a specific direction, two adjustment baffles 2021 are provided on the upper material layer 204, the transition layer 202 and the lower material layer 203. The magazine 2010 is movably arranged between the two adjustment baffles 2021. The spacing between the two adjustment baffles 2021 is adjustable so that the spacing between the two adjustment baffles 2021 is adapted to magazines of different sizes. The adjustment means of the adjustment baffles 2021 is the existing hole-slot combined with screw adjustment and fixing method, which will not be described in detail here.

[0036] In one embodiment, Figure 6 As shown, the loading layer 201 is provided with a first translation assembly, and the first translation assembly is provided with a first translation push block 20151. The first translation push block 20151 can perform reciprocating linear movement relative to the bottom plate of the loading layer 201, thereby pushing the magazine 2010 carrying the unpackaged chip substrate and pushing the magazine 2010 onto the first support block 2055 of the first moving module. Specifically, the first translation assembly also includes a first translation motor 2011, a first translation driving pulley 2012, a first translation synchronous belt 2013, a first translation driven pulley 2014, a first translation slider 2015 and two first translation guide rods 2016. The first translation driving pulley 2012 is rotatably set on the output shaft of the first translation motor 2011, the first translation driven pulley 2014 is rotatably set on the bottom plate of the loading layer 201, and the first translation synchronous belt 2013 is wound around On the first translation driving pulley 2012 and the first translation driven pulley 2014, the first translation slider 2015 is passed through the first translation guide rod 2016 and is fixedly connected to the first translation synchronous belt 2013. A first yielding groove is provided on the loading layer 201 so that the first translation push block 20151 is fixedly connected to the first translation slider 2015. The two first translation guide rods 2016 are provided in parallel, and the first translation synchronous belt 2013 is parallel to the first translation guide rod 2016.

[0037] Optionally, the first translation guide rod 2016 can also be set as a guide rail structure, and the first translation slider 2015 is clamped on the guide rail; the transmission structure of the first translation driving pulley 2012, the first translation synchronous belt 2013 and the first translation driven pulley 2014 can also be a screw slider structure.

[0038] Further, if Figure 1 and Figure 2As shown, there is also a first movable module on one side of the loading layer 201, and the first movable module is arranged on the first mounting platform 101. The first movable module includes a first X-axis module 204 and a first Z-axis module 205. A first X-axis slider 2044 that moves back and forth is provided on the first X-axis module 204, and the first Z-axis module 205 is provided on the first X-axis slider 2044. A first supporting block 2055 that moves back and forth linearly is provided on the first Z-axis module 205, wherein the moving direction of the first X-axis slider 2044 is consistent with the moving direction of the first translation push block 20151, so that the first supporting block 20151 can hold and take away the fully loaded magazine 2010 from the loading layer 201 or move the empty magazine 2010 to the loading layer 201. In this embodiment, since the first supporting block 2055 has a certain length in the horizontal direction, that is, Figure 4 As shown in the direction, a through second paving groove is provided on the upper material layer 201, the transition layer 202 and the lower material layer 203, which is adapted to the first supporting block 2055 so that the first supporting block 2055 can completely lift the magazine 2010; the moving direction of the first supporting block 2055 is consistent with the distribution direction of the upper material layer 201, the transition layer 202 and the lower material layer 203, that is, Figure 1 In this embodiment, the first supporting block 2055 is composed of two L-shaped supporting arms.

[0039] Furthermore, in order to secure the magazine 2010 relative to the first support block 2055, a locking claw 2057 is provided on the first support block 2055. The locking claw 2057 is raised and lowered by a pneumatic cylinder. When the first support block 2055 is lifted onto the magazine 2010, the cylinder controls the movement of the locking claw 2057, causing the locking claw 2057 to abut against the upper surface of the magazine 2010, thereby securing the magazine between the first support block 2055 and the locking claw 2057. It should be noted that the structure of the locking claw 2057 and its corresponding driving mechanism are not limited by the present invention, as long as the magazine 2010 is secured relative to the first support block 2055.

[0040] Specifically, if Figure 2As shown, the first X-axis module 204 also includes a first X-axis motor 2041, a first X-axis screw rod 2042, a first X-axis nut, two parallel first X-axis guide rails 2043 and two first X-axis sliders 2044. The first X-axis motor 2041 is arranged on the first mounting platform 101, and the first X-axis screw rod 2042 is rotatably arranged on the first mounting platform 101 through a bearing. The first X-axis screw rod 2042 is directly connected to the output shaft of the first X-axis motor 2041 through a coupling to achieve rotation. The first X-axis nut is matched with the first X-axis screw rod 2042, the first X-axis slider 2044 is connected to the first X-axis nut and the two first X-axis sliders 2044, and the first X-axis slider 2044 is set in a mounting position. The bottom plate of the first Z-axis module 205 is arranged on the two first X-axis sliders 2044, thereby driving the first Z-axis module 205 to adjust close to or away from the loading layer 201.

[0041] Optionally, the transmission structure of the first X-axis screw rod 2042 and the first X-axis nut can be implemented as a synchronous belt and synchronous wheel structure or a push rod cylinder structure.

[0042] Further, if Figure 3 and Figure 4 As shown, the first Z-axis module 205 also includes a support 2056, a first Z-axis motor 2051, a first Z-axis screw rod 5052, a first Z-axis nut, a first Z-axis guide rail 2053, a first Z-axis slider 2054 and a first Z-axis connecting block. The first Z-axis motor 2051 is fixedly arranged on the support 2056, and the first Z-axis screw rod 2052 is rotatably arranged on the support 2056 through a bearing. One end of the first Z-axis screw rod 2052 is connected to the output end of the first Z-axis motor 2051, and the first Z-axis nut is sleeved on the first Z-axis screw rod 2052 through a threaded fit. 52, the first Z-axis guide rail 2053 is arranged on the support 2056 and is parallel to the axis of the first Z-axis screw rod 2052, and the first Z-axis slider 2054 is slidably set on the first Z-axis guide rail 2053, wherein the first Z-axis connecting block connects the first Z-axis nut and the first Z-axis slider 2054, and a mounting position is set on the first Z-axis connecting block for the installation of the first support block 2055. In this embodiment, the first Z-axis connecting block and the first support block 2055 are arranged as one body, that is, the first support block 2055 is directly connected to the first Z-axis nut and the first Z-axis slider 2054.

[0043] Optionally, the transmission structure of the first Z-axis screw rod 2052 and the first Z-axis nut can also be replaced by a synchronous wheel and synchronous belt structure, or a combination of gears and racks, or a push rod cylinder structure for lifting action.

[0044] In one embodiment, Figure 1 and Figure 8As shown, it also includes a chip substrate pushing mechanism 206 arranged on the same side as the first movable module, which is fixedly arranged on the support frame 100. A reciprocating pushing claw 2065 is set on the chip substrate pushing mechanism 206. The direction of the pushing claw 2065 is consistent with the interlayer direction of the magazine 2010. In this embodiment, its moving direction is perpendicular to the moving direction of the first X-axis slider 2044 of the first X-axis module 204 and perpendicular to the moving direction of the first support block 2055 of the first Z-axis module 205. Specifically, the chip substrate pushing mechanism 206 includes a first pushing base 2061 fixedly arranged on the support frame 100, a first pushing cylinder 2062 arranged on the first pushing base 2061, a second pushing base 2063 arranged at the free end of the first pushing cylinder 2062, and a second pushing cylinder 2064 arranged on the second pushing base 2063. The pushing claw 2065 is arranged at the free end of the second pushing cylinder 2064, and the pushing direction of the first pushing cylinder 2062 and the pushing direction of the second pushing cylinder 2064 are consistent with the moving direction of the pushing claw, wherein the width of the pushing claw 2065 is smaller than the width of the magazine 2010, and the thickness of the pushing claw 2065 is slightly larger than the thickness of the chip substrate, so that the pushing claw 2065 can only push one chip substrate to move at a time.

[0045] In one embodiment, a second movable module 207 is further included, which is disposed on the other side of the loading layer 201. The second movable module 207 is primarily used for lifting and lowering the empty magazine 2010 and adjusting the magazine 2010 fully loaded with chip substrates. The second movable module 207 has the same structural principle as the first movable module, and its specific structure is as described above, which will not be described in detail here. The working process of the second movable module 207 is to lift the empty magazine 2010 from the transition layer 202 and align it with the unloading conveying port 3048 of the unloading conveying mechanism 304. When the magazine 2010 is fully loaded with packaged chip substrates, the fully loaded magazine 2010 is lifted and moved to the unloading layer 203, and then lowered to the transition layer 202 to remove the empty magazine 2010 and load the next round of packaged chip substrates.

[0046] In one embodiment, Figure 5-7As shown, a second translation assembly is provided on the transition layer 202, and a third translation assembly is provided on the lower material layer 203. The second translation assembly includes a second translation motor 2021 arranged on the bottom plate of the transition layer 202, a plurality of second translation active synchronous pulleys 2022 arranged at the output end of the second translation motor 2021, and a plurality of second translation synchronous belts 2023 of matching number and a plurality of second translation driven synchronous pulleys 2024 of matching number arranged on the bottom plate of the transition layer 202. The plurality of second translation synchronous belts are wound around the corresponding second translation active synchronous pulleys 2022 and the corresponding second translation driven synchronous pulleys 2024, so that the plurality of second translation synchronous belts 2023 are arranged in parallel. Specifically, in this embodiment, there are three second translational synchronous belts 2023, three second translational active synchronous pulleys 2022, and six second translational driven synchronous pulleys 2024, each of which is a set of two, and are respectively arranged at both ends of the bottom plate of the transition layer 202. Each second translational synchronous belt 2023 is wound around two second translational driven synchronous pulleys 2024 and one second translational active synchronous pulley 2022. It should be particularly noted that the second translational synchronous belt 2023 of the second translational assembly rotates in the opposite direction to the third translational synchronous belt 2033 of the third translational assembly, as shown in FIG. Figure 6 In the direction shown, the second translation synchronous belt 2023 rotates counterclockwise, and the third translation synchronous belt 2033 rotates clockwise. The magazine 2010 is placed on the second translation synchronous belt 2023 or the third translation synchronous belt 2033 and is moved by the second translation synchronous belt 2023 or the third translation synchronous belt 2033.

[0047] The above is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention. Such improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A fully automatic loading and unloading mechanism for semiconductor chip substrates, characterized in that: include: a support frame, on which a first mounting platform is provided; At least one loading layer is disposed near the first mounting platform, the loading layer is provided with a plurality of magazines, the magazines are provided with a plurality of interlayers, the interlayers are provided with chip substrates, and the magazines are movable relative to the loading layer; At least one transition layer is provided above the upper material layer, the upper material layer may be provided with a plurality of the magazines, and the magazines may be movable relative to the transition layer, and at least one lower material layer, the lower material layer being disposed above the transition layer, wherein a plurality of magazines may be disposed on the lower material layer, wherein the magazines on the upper material layer move in the same direction as the magazines on the lower material layer, and the magazines on the upper material layer move in opposite directions to the magazines on the transition layer; a first movable module, movably disposed on the first mounting platform, the first movable module being disposed on one side of the loading layer, and being used for lifting the magazine; The second movable module is movably arranged on the first mounting platform and is arranged on the other side of the loading layer. The second movable module is used for lifting the magazine.

2. The fully automatic loading and unloading mechanism for semiconductor chip substrates according to claim 1, characterized in that: The material loading layer is provided with a first translation assembly, and the first translation assembly is provided with a first translation push block, and the first translation push block can perform reciprocating linear movement on the material loading layer.

3. The fully automatic loading and unloading mechanism for semiconductor chip substrates according to claim 2, characterized in that: The first translation assembly also includes a first translation motor, a first translation driving pulley, a first translation driven pulley and a first translation synchronous belt. The first translation motor is arranged on the support frame. The first translation driving pulley and the first translation driven pulley are both rotatably arranged on the bottom plate of the loading layer. The first translation synchronous belt is wound around the first translation driving pulley and the first translation driven pulley. The first translation push block is connected to the first translation synchronous belt.

4. The fully automatic loading and unloading mechanism for semiconductor chip substrates according to claim 2, characterized in that: The first translation assembly also includes two mutually parallel first translation guide rods fixedly arranged on the bottom plate of the loading layer and a first translation slider movably mounted on the first translation guide rods. The first translation guide rods and the first translation push block have the same moving direction. A first yielding slot is provided on the loading layer, and the first translation slider is connected to the first translation push block through the first yielding slot.

5. The fully automatic loading and unloading mechanism for semiconductor chip substrates according to claim 2, characterized in that: The first moving module includes a first X-axis module and a first Z-axis module. The first X-axis module is provided with a first X-axis slider that moves back and forth linearly. The first Z-axis module is arranged on the first X-axis slider. The first Z-axis module is provided with a first supporting block that moves back and forth linearly. The moving direction of the first X-axis slider is consistent with the moving direction of the first translation push block. The moving direction of the first supporting block is consistent with the distribution direction of the upper material layer, the transition layer and the lower material layer.

6. The fully automatic loading and unloading mechanism for semiconductor chip substrates according to claim 1, characterized in that: It also includes a chip substrate pushing mechanism arranged on the same side as the first mobile module, the chip substrate pushing mechanism is arranged on the support frame, and the chip substrate pushing mechanism is provided with a reciprocating pushing claw, and the moving direction of the pushing claw is consistent with the interlayer direction of the magazine.

7. The fully automatic loading and unloading mechanism for semiconductor chip substrates according to claim 5, characterized in that: The second mobile module has the same structure as the first mobile module.

8. The fully automatic loading and unloading mechanism for semiconductor chip substrates according to claim 1, characterized in that: A second translation assembly is provided on the transition layer, and the second translation assembly includes a second translation motor provided on the support frame, a second translation active synchronous pulley provided at the output end of the second translation motor, a plurality of second translation synchronous belts, and a plurality of second translation driven synchronous pulleys provided on the support frame. The second translation active synchronous pulley is provided with a plurality of second mounting grooves distributed at intervals, and a plurality of second translation synchronous belts are wound around the second mounting grooves and around the corresponding second translation driven synchronous pulleys, so that the plurality of second translation synchronous belts are arranged in parallel.

9. The fully automatic loading and unloading mechanism for semiconductor chip substrates according to claim 8, characterized in that: A third translation assembly is provided on the lower material layer, and the third translation assembly has the same structure as the second translation assembly.

10. The fully automatic loading and unloading mechanism for semiconductor chip substrates according to claim 1, characterized in that: The upper material layer, the transition layer and the lower material layer are each provided with two adjustment baffles with adjustable spacing, and the spacing between the adjustment baffles is adapted to the size of the magazine.

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