Wafer grinding fluid control device

Abstract

The utility model relates to the technical field of grinding fluid control, in particular to a wafer grinding fluid control device, which comprises a main body, a storage box is arranged in the main body, a first electromagnetic valve is arranged on one side of the storage box, a second booster pump is arranged on one side of the first electromagnetic valve, and the second booster pump is arranged on the other side of the storage box. A flow detection device is arranged on one side of the second booster pump and connected with a spray head through a pipeline, a plurality of supporting rods are arranged on the side wall in the main body, a filter screen is arranged on the upper portions of the supporting rods, a collecting box is arranged on the lower portion of the filter screen, and the bottom of the collecting box supports the collecting box by arranging a base. And a groove is formed in the bottom of the collecting box. The storage box is arranged for storing the grinding fluid, the flow detection device is arranged for detecting the spraying flow of the grinding fluid, and the booster pump is arranged for controlling the spraying quantity of the grinding fluid.

Description

Technical Field

[0001] The utility model relates to the technical field of grinding liquid control, in particular to a wafer grinding liquid control device. Background Art

[0002] Grinding fluid is mainly suitable for grinding and polishing hard materials such as superhard materials and cemented carbide. It can not only increase the grinding rate, but also quickly dissipate the large amount of heat generated during the grinding process, thereby avoiding burns on the workpiece surface. Most existing processing equipment cannot filter the recovered grinding fluid, and cannot cool the recovered grinding fluid.

[0003] After searching, it was found that a grinding liquid supply device for wafer processing was disclosed in the Chinese patent application number 202120236123.0, which can only filter the grinding liquid but cannot cool the grinding liquid. Utility Model Content

[0004] (1) Technical problems solved

[0005] In view of the shortcomings of the existing technology, the utility model provides a wafer polishing liquid control device, which solves the problem that the polishing liquid can only be filtered but cannot be cooled.

[0006] (2) Technical solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: it includes a main body, characterized in that: a storage box is provided inside the main body, a first solenoid valve is provided on one side of the storage box, a second booster pump is provided on one side of the first solenoid valve, a flow detection device is provided on one side of the second booster pump, the flow detection device is connected to a nozzle through a pipeline, a plurality of support rods are provided on the inner side wall of the main body, a filter is provided on the upper part of the support rod, a collection box is provided on the lower part of the filter, the bottom of the collection box supports the collection box by providing a base, a groove is provided at the bottom of the collection box, a second solenoid valve is provided on one side of the groove, a first booster pump is provided on one side of the second solenoid valve, one side of the first booster pump is connected to the lower part of the side of the cooling box through a pipeline, a third booster pump is provided on the upper part of the other side of the cooling box, and the third booster pump is connected to the storage box through a pipeline.

[0008] As a preferred embodiment of the present invention, a first fixed beam is fixed inside the main body by bolts, a storage seat is provided at the upper end of the first fixed beam, and a door panel is hinged at the front end of the main body.

[0009] As a preferred embodiment of the present invention, heat dissipation fins are provided on both sides of the cooling box, and a plurality of heat dissipation fans are provided on both sides of the heat dissipation fins.

[0010] As a preferred embodiment of the present invention, a second temperature sensor is provided on one side of the groove, and a first temperature sensor is provided on the upper end of the third booster pump.

[0011] As a preferred embodiment of the present invention, a second fixed beam is provided on one side of the storage box, and a controller is provided on the upper end of the second fixed beam.

[0012] As a preferred embodiment of the present invention, a liquid level sensor is provided on one side of the storage box, and the liquid level sensor is electrically connected to the controller.

[0013] As a preferred embodiment of the present invention, a liquid inlet is provided at the upper end of the storage box, and a pressure relief valve is provided at the upper end of the storage box.

[0014] As a preferred embodiment of the present invention, a display operator is provided at the front end of the main body, and the display operator is electrically connected to the controller.

[0015] (3) Beneficial effects

[0016] The utility model provides a wafer polishing liquid control device, which has the following beneficial effects:

[0017] 1. The utility model provides a wafer polishing liquid control device which is used to store the polishing liquid by setting a storage box, is used to detect the polishing liquid spray flow rate by setting a flow detection device, and is used to control the polishing liquid spray volume by setting a booster pump.

[0018] 2. The utility model provides a wafer polishing liquid control device that is used to filter the sprayed polishing liquid by setting a filter screen and to collect the sprayed polishing liquid by setting a collection box, thereby realizing the reuse of the polishing liquid.

[0019] 3. The wafer grinding liquid control device of the present invention is used to cool the collected grinding liquid by setting a cooling box, and is used to cool the grinding liquid by setting a heat dissipation fan. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0021] Figure 1 This is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 This is a schematic diagram of the internal structure of the oblique side of the utility model;

[0023] Figure 3 This is a schematic diagram of the main internal structure of the utility model;

[0024] In the figure: 1. Main body; 2. Display operator; 3. Storage box; 4. Liquid inlet; 5. Pressure relief valve; 6. Fixed bracket; 7. Nozzle; 8. Storage seat; 9. First fixed beam; 10. Filter; 11. Door panel; 12. Protective net; 13. Cooling fan; 14. Cooling fins; 15. Cooling box; 16. Second fixed beam; 17. Controller; 18. Liquid level sensor; 19. First solenoid valve; 20. First booster pump; 21. Support rod; 22. Collection box; 23. Base; 24. Flow detection device; 25. Second booster pump; 26. First temperature sensor; 27. Third booster pump; 28. Second solenoid valve; 29. ​​Groove; 30. Second temperature sensor. DETAILED DESCRIPTION

[0025] The following is a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0026] See also Figures 1 to 3 The utility model provides a technical solution: a wafer polishing liquid control device, comprising a main body 1, a storage box 3 is arranged inside the main body 1, a first solenoid valve 19 is arranged on one side of the storage box 3, a second boosting pump 25 is arranged on one side of the first solenoid valve 19, a flow detection device 24 is arranged on one side of the second boosting pump 25, and the flow detection device 24 is connected to the nozzle 7 through a pipeline. The inner side wall of the main body 1 is provided with several support rods 21, a filter screen 10 is arranged on the upper part of the support rod 21, and a collection box 22 is arranged on the lower part of the filter screen 10. The bottom of the collection box 22 supports the collection box 22 by providing a base 23. A groove 29 is provided at the bottom of the collection box 22, a second solenoid valve 28 is provided on one side of the groove 29, a first boosting pump 20 is provided on one side of the second solenoid valve 28, one side of the first boosting pump 20 is connected to the lower part of the side of the cooling box 15 through a pipeline, and a third boosting pump 27 is provided on the upper part of the other side of the cooling box 15, and the third boosting pump 27 is connected to the storage box 3 through a pipeline.

[0027] In a specific embodiment of the present utility model, a storage box 3 is provided inside the main body 1 for storing the added grinding liquid. A first solenoid valve 19 is provided on one side of the storage box 3 for controlling the circulation of the grinding liquid. A second booster pump 25 is provided on one side of the first solenoid valve 19 for pressurizing and spraying the grinding liquid. A flow detection device 24 is provided on one side of the second booster pump 25 for detecting the spraying rate of the grinding liquid, preventing excessive spraying from wasting grinding liquid, and preventing insufficient spraying from causing damage to material processing. The flow detection device 24 is connected to a nozzle 7 through a pipeline for spraying grinding liquid, increasing the grinding rate, and quickly taking away the large amount of heat generated during the grinding process, thereby avoiding burns on the workpiece surface. Several support rods 21 are provided on the inner side wall of the main body 1, and a filter screen 10 is provided on the upper part of the support rod 21 for filtering the sprayed grinding liquid, filtering out impurities, and reusing the grinding liquid. A collection box 2 is provided at the lower part of the filter screen 10. 2. It is used to collect the sprayed grinding liquid. The bottom of the collection box 22 is supported by a base 23. A groove 29 is provided at the bottom of the collection box 22. The groove 29 is lower to facilitate the recovery of the grinding liquid. A second solenoid valve 28 is provided on one side of the groove 29 to control the circulation of the grinding liquid. A first booster pump 20 is provided on one side of the second solenoid valve 28 to pressurize and transport the collected grinding liquid. One side of the first booster pump 20 is connected to the lower part of the side of the cooling box 15 through a pipeline, and a third booster pump 27 is provided on the upper part of the other side of the cooling box 15. The recovered grinding liquid enters the bottom of one side of the cooling box 15 and is output from the upper part of the other side, which is beneficial to increase the residence time of the grinding liquid inside the cooling box 15 and facilitates sufficient cooling. The third booster pump 27 is connected to the storage box 3 through a pipeline to realize the repeated recycling of the grinding liquid. At the same time, a valve and a pipeline are provided at the rear end of the groove 29, and the grinding liquid can be discharged and replaced when necessary.

[0028] Specifically, a first fixing beam 9 is fixed inside the main body 1 by bolts, a storage seat 8 is provided at the upper end of the first fixing beam 9, and a door panel 11 is hinged at the front end of the main body 1.

[0029] In order to solve the problem of material placement and processing, such as Figure 1 As shown, a first fixed beam 9 is fixed inside the main body 1 for mounting a storage seat 8. A storage seat 8 is provided at the upper end of the first fixed beam 9 for placing materials to be processed. The storage seat 8 of the main body 1 is used to accommodate external processing equipment for processing materials. A door panel 11 is hinged at the front end of the main body 1 for easy placement of processed materials and for easy replacement of the filter 10.

[0030] Specifically, heat dissipation fins 14 are provided on both sides of the cooling box 15 , and a plurality of heat dissipation fans 13 are provided on both sides of the heat dissipation fins 14 .

[0031] In order to solve the problem of heat conduction cooling of the grinding fluid inside the cooling box, Figure 2As shown, cooling fins 14 are provided on both sides of the cooling box 15 for conducting heat to the grinding fluid collected inside, and a plurality of cooling fans 13 are provided on both sides of the cooling fins 14 for cooling the cooling fins 14, thereby cooling the grinding fluid.

[0032] Specifically, a second temperature sensor 30 is provided on one side of the groove 29 , and a first temperature sensor 26 is provided on the upper end of the third booster pump 27 .

[0033] In order to solve the problem of grinding fluid temperature detection, such as Figure 3 As shown, a second temperature sensor 30 is provided on one side of the groove 29 for detecting the current temperature of the collected grinding fluid. A first temperature sensor 26 is provided on the upper end of the third booster pump 27 for detecting the temperature of the grinding fluid after heat dissipation, so as to ensure that the grinding fluid can increase the grinding rate while quickly taking away the large amount of heat generated during the grinding process, thereby avoiding burns on the workpiece surface.

[0034] Specifically, a second fixed beam 16 is provided on one side of the storage box 3 , and a controller 17 is provided on the upper end of the second fixed beam 16 .

[0035] In order to solve the problem of device control, such as Figure 2 As shown, a second fixed beam 16 is provided on one side of the storage box 3 for installing a controller 17. The controller 17 is provided on the upper end of the second fixed beam 16. The controller 17 is electrically connected to the electronic equipment inside the device and controls it.

[0036] Specifically, a liquid level sensor 18 is provided on one side of the storage box 3 , and the liquid level sensor 18 is electrically connected to the controller 17 .

[0037] In order to solve the problem of liquid level detection inside the storage tank, such as Figure 2 As shown, a liquid level sensor 18 is provided on one side of the storage box 3 . The liquid level sensor 18 is electrically connected to the controller 17 and is used to detect the solution capacity inside the storage box 3 .

[0038] Specifically, a liquid inlet 4 is provided at the upper end of the storage box 3 , and a pressure relief valve 5 is provided at the upper end of the storage box 3 .

[0039] In order to solve the problem of easy solution filling, such as Figure 1 As shown, a liquid inlet 4 is provided at the upper end of the storage box 3 to facilitate the filling of the solution, and a pressure relief valve 5 is provided at the upper end of the storage box 3 to balance the pressure inside and outside the storage box 3.

[0040] Specifically, a display operator 2 is provided at the front end of the main body 1 , and the display operator 2 is electrically connected to the controller 17 .

[0041] In order to solve the problem of device operation data display and user-friendly operation and control, such as Figure 1 As shown, a display operator 2 is provided at the front end of the main body 1. The display operator 2 is electrically connected to the controller 17 and is used to display the device operation data and facilitate the user to operate and control the device.

[0042] The specific implementation methods disclosed herein omit detailed descriptions of known functions and components. To ensure the compatibility of the equipment, the operating methods adopted are consistent with the parameters of commercially available equipment.

[0043] In summary, the working principle and use process of the utility model are as follows: a storage box 3 is provided inside the main body 1 for storing the added grinding liquid, a first solenoid valve 19 is provided on one side of the storage box 3 for controlling the circulation of the grinding liquid, a second booster pump 25 is provided on one side of the first solenoid valve 19 for pressurizing and spraying the grinding liquid, a flow detection device 24 is provided on one side of the second booster pump 25 for detecting the spraying rate of the grinding liquid, to prevent excessive spraying and waste of grinding liquid, and to prevent insufficient spraying and damage to material processing, the flow detection device 24 is connected to the nozzle 7 through a pipeline, for spraying grinding liquid, increasing the grinding rate, and quickly taking away the large amount of heat generated during the grinding process, thereby avoiding burns on the workpiece surface, and a number of support rods 21 are provided on the inner side wall of the main body 1. A filter screen 10 is provided on the upper part of the support rod 21 to filter the sprayed grinding liquid, filter out impurities, and reuse the grinding liquid. A collection box 22 is provided at the lower part of the filter screen 10 to collect the sprayed grinding liquid. The bottom of the collection box 22 is supported by a base 23. A groove 29 is provided at the bottom of the collection box 22. The groove 29 is low to facilitate the recovery of the grinding liquid. A second solenoid valve 28 is provided on one side of the groove 29 to control the circulation of the grinding liquid. A first booster pump 20 is provided on one side of the second solenoid valve 28 to pressurize and transport the collected grinding liquid. One side of the first booster pump 20 is connected to the lower part of the side of the cooling box 15 through a pipeline. A third booster pump 27 is provided on the upper part of the other side of the cooling box 15. The bottom of one side of the cooling box 15 enters the return The collected grinding liquid is output from the upper part of the other side, which is beneficial to increase the residence time of the grinding liquid inside the cooling box 15 and facilitate sufficient cooling. The third booster pump 27 is connected to the storage box 3 through a pipeline to realize the repeated recycling of the grinding liquid. A first fixed beam 9 is fixed inside the main body 1 for installing a material seat 8. A storage seat 8 is provided on the upper end of the first fixed beam 9 for placing the material to be processed. The upper part of the storage seat 8 of the main body 1 is used to accommodate external processing equipment for processing the material. Heat dissipation fins 14 are provided on both sides of the cooling box 15 for heat conduction of the grinding liquid collected inside. Several heat dissipation fans 13 are provided on both sides of the heat dissipation fins 14 for cooling the heat dissipation fins 14, thereby realizing the cooling of the grinding liquid. A second temperature sensor is provided on one side of the groove 29. A sensor 30 is provided for detecting the current temperature of the collected grinding liquid. A first temperature sensor 26 is provided on the upper end of the third booster pump 27 for detecting the temperature of the grinding liquid after heat dissipation. A second fixed beam 16 is provided on one side of the storage box 3 for installing a controller 17. The upper end of the second fixed beam 16 is provided with a controller 17. The controller 17 is electrically connected to the electronic equipment inside the device and controls it. A liquid level sensor 18 is provided on one side of the storage box 3. The liquid level sensor 18 is electrically connected to the controller 17 for detecting the solution capacity inside the storage box 3. A liquid inlet 4 is provided on the upper end of the storage box 3 to facilitate the filling of the solution. A pressure relief valve 5 is provided on the upper end of the storage box 3 to balance the pressure inside and outside the storage box 3. A display operator 2 is provided at the front end of the main body 1.The display operator 2 is electrically connected to the controller 17 and is used to display the device operation data and facilitate the user to operate and control the device.

[0044] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer polishing slurry control device, characterized by: The invention comprises a main body (1), wherein a storage box (3) is provided inside the main body (1), a first electromagnetic valve (19) is provided on one side of the storage box (3), a second booster pump (25) is provided on one side of the first electromagnetic valve (19), a flow detection device (24) is provided on one side of the second booster pump (25), the flow detection device (24) is connected to a nozzle (7) through a pipeline, a plurality of support rods (21) are provided on the inner side wall of the main body (1), a filter screen (10) is provided on the upper part of the support rod (21), and a collection box ( 22), the bottom of the collecting box (22) is supported by a base (23), the bottom of the collecting box (22) is provided with a groove (29), one side of the groove (29) is provided with a second solenoid valve (28), one side of the second solenoid valve (28) is provided with a first boosting pump (20), one side of the first boosting pump (20) is connected to the lower part of the side of the cooling box (15) through a pipeline, the other side of the cooling box (15) is provided with a third boosting pump (27), and the third boosting pump (27) is connected to the storage box (3) through a pipeline.

2. The wafer polishing liquid control device according to claim 1, characterized in that: A first fixed beam (9) is fixed inside the main body (1) by bolts, a storage seat (8) is provided at the upper end of the first fixed beam (9), and a door panel (11) is hinged at the front end of the main body (1).

3. The wafer polishing liquid control device according to claim 2, characterized in that: The cooling box (15) is provided with heat dissipation fins (14) on both sides, and a plurality of heat dissipation fans (13) are provided on both sides of the heat dissipation fins (14).

4. The wafer polishing liquid control device according to claim 3, characterized in that: A second temperature sensor (30) is provided on one side of the groove (29), and a first temperature sensor (26) is provided on the upper end of the third booster pump (27).

5. The wafer polishing liquid control device according to claim 4, characterized in that: A second fixed beam (16) is provided on one side of the storage box (3), and a controller (17) is provided on the upper end of the second fixed beam (16).

6. The wafer polishing liquid control device according to claim 5, characterized in that: A liquid level sensor (18) is provided on one side of the storage box (3), and the liquid level sensor (18) is electrically connected to the controller (17).

7. The wafer polishing liquid control device according to claim 6, characterized in that: The upper end of the storage box (3) is provided with a liquid inlet (4), and the upper end of the storage box (3) is provided with a pressure relief valve (5).

8. The wafer polishing slurry control device according to claim 7, characterized in that: A display operator (2) is provided at the front end of the main body (1), and the display operator (2) is electrically connected to the controller (17).

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